Design Your Next Generation Product Using 3 D Lds Mid

SelectConnect Technologies3D-Molded Interconnect Device Technical Review

www.selectconnecttech.com

3D MID

• Double-Shot and Laser Direct Structuring Processes

• LDS Materials

• LDS Design Rules

• Applications/Markets

Contents

3D-Interconnects by DS / LDS

Double-Shot Single-Shot LDS

LDS 3-D MID

LDS Summary

LDS Technical Summary

Laser Direct Structuring – LDS

LDS Technical Summary

LDS Pitch for High Yield

8 mil lines

10 mil spaces

(18 mil pitch)

Kavo Dental Tool

Business Drivers for 3D-MID

Business Drivers for 3D-MID

Kavo Dental Tool

LDS Grade Materials

Reflow temperatures

• Pb Free 245 -260° C

• Sn/Pb 225 -235° C

LDS Design Rules

Siemans Hearing Aid Component

LDS Design Rules

LDS Design Rules

Optimum cycle times

LDS Design Rules

Metallization

Electroless Copper Nickel Immersion Gold [Electroless Gold]

Typical builds:

SelectConnect™ Metallization

Copper 100 – 250 micro-inches (2.5 – 5.0 µm)

Nickel 50 – 150 micro-inches (1.2 – 2.5 µm)

Gold Immersion, ~ 8 micro-inches (0.2 µm)

Key Markets / Applications

Medical Devices

OmniPod® Insulin Management System

OEM: Insulet

Molder: Phillips Plastics

Plater: Arlington Plating

Material: PC, PC/ABS (doped)

Process: DS (Double Shot)

3-dimensional PCB for Hearing Aids

Stereo hearing aid component:

Source: Harting / Siemens

process steps

Material: Vectra E820i LDS

Medical Devices

Switch Ring for Caries Diagnostic Laser Pen

Features:

Reduction of assembly time (6s vs. 20s)

Increase of assembly yield

Reduction of parts (3 vs. 8)

Reduction of cost (78%)

Source: KaVo Dental


Medical Devices

Military / Defense

Security Housing

Manufacturer: BournsMaterial: Pocan DP 7102 (PBT)

Multi-function HMI

Source: Kromberg & Schubert GmbH & Co. KGBMW K46 Superbike

Automotive

Material: Ultramid T 4381 LDS

SMD Process Steps:

Source: Kromberg & Schubert GmbH & Co. KG

Automotive

3D Pick and Place Electrical Components

HMI

Tracability:


Data Matrix Code

Automotive

Potential Automotive-Applications

Tracability:


Data Matrix Code

Seat Module

Sensors and Actuators

In-Door Electronics

Lightning

Switches

Automotive

Automotive Steering Wheel

TRW’s “Base-Line” MID after assembly:

Source: I&T 3D-Produktionsgesellschaft mbH

Automotive

ASIC deposited onto MID with LPKF-LDS®

technologyConventional Solution

Sensor ASIC

MID using LPKF-LDS® technologySource: Robert Bosch GmbH

Rotation Sensor for Automotive Brake System (ESP)

Flipped

Positioned

SignalGround

Support bumps

Automotive

Qualification:

Temperature Shock

-40°C…150°C

Realized by Flip Chip on LPKF-LDS® MID

Source: Robert Bosch GmbH


Automotive

Qualification:

Warm-Humidity

85°C/85% rel.H

300 pcs. - no defects after 1000hSource: Robert Bosch GmbH


Automotive

Former deviceDiameter approx. 10mm

Prototype new Sensor Diameter: 5mm Realized by Flip Chip

on LPKF-LDS® MID

Source: Robert Bosch GmbH


Automotive

Final Part

Source: ZMD AG

AMR Sensor (Automotive)


Automotive

Source: Harting

Sensors

LED Lighting

LED Indicator Light


before

after

Automotive

LPKF-LDS® antenna

Cellular Electronics

Hundreds of millions of cell phone, tablet antennas produced annually

Source: Harting Mitronics AG

RFID-Transponder

RFID

LDS 3D-MID

Company Overview

SelectConnect Technologies

Division of Arlington Plating Company

Palatine, Illinois

Company Overview

Source Point Associates

Brentwood, California 94513

Larry Megugorac 925.516.2082

Mobile 650 678 8987

[email protected]

www. SourcePointAssociates.com

LinkedIn:

http://www.linkedin.com/in/larrymegugorac

Twitter: @SourcePointAsso

Design Your Next Generation Product Using 3 D Lds Mid

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