21

The World Leader In Magnetron Sputtering Technology

2

Controlling Atoms

The process of “sputtering” has comea long way since it was first used to silverthe backs of mirrors in 1877.

Of course, even then, scientistsrecognized it as a superior method ofapplying thin films.

But the problem has always beencontrol.

Without a way to direct the flowof atoms in the process, sputtering justwasn’t practical for mass production.

Applying Magnetics

Fortunately, the introduction ofmagnetrons in the 1960s changed all that.

And now, thanks to the increasinglysophisticated magnetic controls developedover the past 30 years, sputtering hasbecome one of the fastest-growingtechniques in modern manufacturing.

Adding New Value

In fact, today’s technologists are using itto coat more surfaces in more industriesthan ever before.

From semiconductors to credit cards —from compact discs to auto parts — fromtools, packaging, and optics to medical anddental applications — magnetron sputteringis adding new value to a growing list ofproducts every day.

Because, in additional to being moreenvironmentally friendly than other coatingtechnologies, sputtering provides a uniquecombination of advantages that they justcan’t equal.

Building A Strong

And Versatile Bond

First and foremost, magnetron sputter-ingcreates one of the thinnest, most uniform,most cost-effective films possible.

(And it builds a virtually unbreakablebond between the film and its substrate,because it locks them together at themolecular level.)

Second, it offers much greater versatilitythan other approaches because, as a cold,momentum-transfer process, it can be usedto apply either conductive or insulatingmaterials to any type of substrate —including metals, ceramics, and heat-sensitive plastics.

And third, recent advances in magnetronsputtering (see the next page) now provideeven more control over the applicationprocess — greater control than any othermethod of thin-film deposition.

So, given the right tools, researchers andengineers can use this technique to create awhole new generation of smaller, lighter,more durable products — products that willnot only revolutionize our industries, butour lives as well.

Providing A Broad Range

Of Solutions

And that’s where Angstrom Sciencescan help.

Because, unlike other magnetronsuppliers, we’ve designed not only ourproducts, but our entire business, to serveyour specific coating needs.

That’s why we make the industry’smost comprehensive line of precisionmagnetrons for all applications.

That’s why we provide computermodeling and expert consulting to optimizeyour sputtering operations.

And that’s also why we stand ready todesign and build the world’s finest custom

magnetrons, when necessary, to make yourprocess as productive as possible.

Pioneering New Advances

Most important of all, that’s why we’vepatented our own revolutionary break-throughs in magnetron technology —advances that give you a whole new levelof control over the sputtering process.

Because, that control can help youcreate higher quality films more cost-effectively than ever before.

TheProcess

technology

2

3The AngstromAdvantagesGreater Control

All reputable makers of magnetronsources use permanent rare-earth magnetsto direct the flow of atoms during thesputtering process.

But that’s where the similarity betweentheir products and ours ends.

Because, to optimize performance forany application, you have to be able tocontrol the shape of the magnetic field.

And even the most carefully calculatedplacement of conventional magnets can’tdo that as well as the advanced new methodwe’ve developed and patented.

Profiled Magnets

Simply put, we profile our magnets.That is, we grind them into contours

which optimize the shape of the field theygenerate. Because, the shape of that fielddetermines everything from film uniformityand deposition rate to target utilization.

This approach allows us to use computermodeling to match your application with themagnetic profile that will work best for you.We can even custom-engineer magnetics tomeet your specific requirements.*

Optimized Performance

The result is, you get exactly the kindof performance you need — whether it’shigh uniformity and target utilization, highrate and throughput, or a perfect balancebetween the two.

And you get that performance in astate-of-the-art device that provides manyother advantages as well (includingthe option of balanced or unbalancedmagnetron fields).

More Efficient Cooling

Turbulent water flow is another advancewe’ve pioneered, patented, and built intoevery one of our magnetrons.

It’s superior to old-fashioned laminarwater flow because it distributes coolingmore evenly across the cathode, to helpminimize “hot spots” and eliminate bothgrain boundary dissociation and crackingof thermally sensitive materials.

Faster, Easier Target Change

Angstrom Sciences magnetrons alsoincorporate our patented threaded targetclamping system, which helps minimizedowntime by providing the fastest, easiestmethod available for changing targets (plus,it adjusts to variable target thickness withoutextra tools or devices).

Stronger Magnetrons & Magnets

Unlike most manufacturers, we machineeach of our standard magnetrons out ofsolid blocks of 304 stainless steel andOFHC copper. And we use NdFeB magnets— which are 30% more powerful than otherrare-earth magnets. So you can count ongetting maximum magnetic integrity, encasedin the most robust precision-fitted assemblyyou can buy.

More Comprehensive Service

Angstrom Sciences designs, engineers,and manufactures a complete line ofsputtering sources for everything fromresearch and development to full-scaleproduction applications.

And we offer a comprehensive arrayof targets, evaporation materials, backingplates, and bonding techniques, too.

But we also pride ourselves on the abilityto rise to any occasion. So if you don’t findwhat you’re looking for in our literature,please don’t hesitate to call.

We’ll be happy to work with you, tohelp you incorporate the latest advancesin magnetron technology into your ownsputtering applications.

* Note: Some manufacturers try to achieve similar results by

installing secondary magnets to alter the shape of the field.

That method not only costs more to manufacture,

but provides less flexibility than profiling, and generates stray

field lines which reduce uniformity.

patents

Other Magnetrons

Ordinary Magnets(Minimal use of targetat center and edges)

Angstrom Sciences

Profiled Magnets(Maximum use of target

throughout)

Primary

Field Lines

Targets

Magnets

The Advantage Of Profiled Magnets

.12 .20 .28 .37 .45 .53 .61 .69 .77 .86 .94 1.0 1.1

Tesla

4

More Advanced,

And More Efficient

Angstrom Sciences circular magnetronshave become recognized as the newstandard of the sputtering industry.

Because in addition to their advancedfeatures — such as profiled magnets,turbulent water flow, and solid stainlesssteel construction — they offer a host ofother performance advantages as well.

Versatile, Compact Design

Their ultra-compact design makes themideal for virtually any new or retrofitapplication — including the most complexmultiple-cathode deposition clusters or thesmallest vacuum chambers. And they areavailiable configured for either internal orexternal mounts.

Total Power Compatibility

Their low-impedance heads provide RF,DC, mid-frequency DC, pulsed DC, andmicrowave power compatibility.

The NewStandardOf TheIndustry

4

Ordinary Magnetron

Examples Of 8” Circular Target Erosion

Angstrom Sciences Magnetron

Standard Fittings

Angstrom Sciences uses ISO NWstandard fittings, as well as ConFlat® metalseal flanges. All utilities are maintained atatmosphere, and are accessed throughstandard “O”-ring compression fittings forease of installation in any vacuum system.

Full Range Of Sizes

Angstrom Sciences circular magnetronsources are available in 1”, 2”, 3”, 4”, 5”, 6”,8”, 10”, 12”, and 16” target sizes.

Quick, Easy Target Change

Our patented threaded clamp and anodeshield allow you to change targets (sizes 1”to 6”) quickly and easily without specializedtools. And their built-in adjustability letsyou fit targets of varying thickness withoutresorting to spacing devices.

Lower Pressure, Higher Power

Our cathodes can operate at extremely lowpressure — down to the 10-4 Torr range — andour directly-cooled designs can deliver powerdensities up to 250 watts/in2 (39 watts/cm2).

Higher Rates And Performance

That means you can coat a substratefaster with Angstrom Sciences magnetrons.

So you can maximize both your coatingzone and your target utilization without thekind of trade-off in rate that other magne-trons force you to make.

Greater Target Utilization

Yet these same advanced magnetrons cangive you target utilization typically in therange of 40%.

Greater Uniformity

And, thanks to our patented profiledmagnets, our magnetrons also deliver muchgreater uniformity of deposition— routinely in the ± 3-to-5% range.

(One of our research customers haseven documented uniformity of ± .1% withAngstrom Sciences magnetrons.)

5

circular magnetrons

* For further details, please see pages 16 and 17.

Example Of Deposition Uniformity*

Angstrom Sciences 8” Circular Cathode150 mm-Diameter Silicon Wafer

Uniformity: ± 3%

Material: Tungsten Titanium

(W90

Ti10

) 99.99%

Power: 2 kW DC

Pressure: 3.2 mtorr

Total Commitment

At Angstrom Sciences, we design,engineer, and manufacture our owncomplete line of magnetron sputteringcathodes for thin film deposition.

It’s our core business, and we’re totallycommitted to making sure it’s done right,every step of the way.

So, we can assure you of the quality andreliability of every product you buy fromus. And we stand ready to provide you anyhelp you may need in specification,installation, start-up, and service.

Guaranteed

All Angstrom Sciences magnetrons areguaranteed against defects in workmanshipand materials for two full years.

Circular Magnetron Performance*

1” ± 5% —— 0.5”2” ± 5% ± 10% 1.5”3” ± 5% ± 10% 2.0”4” ± 5% ± 10% 3.0”5” ± 5% ± 10% 4.0”6” ± 5% ± 12% 5.0”8” ± 5% ± 12% 6.0”

10” ± 5% ± 12% 8.0”12” ± 5% ± 15% 10.0”16” ± 5% ± 15% 300 mm

TARGETDIAMETER

ANGSTROMSCIENCES

UNIFORMITY

SUBSTRATESIZE

OTHERDESIGNS

6

NewCapacityForProduction

Expanding Horizons

As more and more industries discoverthe speed, controllability, and bottom-linebenefits of magnetron sputtering, produc-tion professionals are reaching out for waysto apply these advantages to larger, fastermanufacturing processes.

Broader Solutions

For many, particularly those who have tocoat broad physical substrates or achieveextremely high throughput, rectangular

magnetrons offer the perfect solution.

Growing Applications

That’s why use of rectangular magne-trons is growing so rapidly in industriessuch as:

• Aerospace• Architectural Glass• Authentication• Automotive• Decorative Coating• Defense• Flat Panel Displays• Magnetic Storage Media• Medical/Dental• Optical• Packaging• Semiconductors/Microelectronics• Solar• Wear-Resistant Coating

rectangular magnetrons

Shaping The Future

And that’s also why Angstrom Sciencesis reshaping the future of sputtering tech-nology with a complete line of rectangularmagnetrons for every application.

Patented Advantages

Just like our circular magnetrons,Angstrom Sciences rectangular magnetronsincorporate our patented profiled magnets,turbulent water flow, solid stainless steelconstruction, and fully-encased NdFeBrare earth magnets.

And, naturally, they also feature industry-standard fittings, total power-supplycompatibility, and internal and externalmounting options.

Rectangular Magnetron

Performance*

1.5” 43% —— ±5%3.5” 44% 22% ±5%4” 46% 21% ±5%5” 47% 22% ±5%6” 47% 23% ±5%8” 46% 23% ±5%

12” 45% 22% ±5%

TARGETWIDTH

ANGSTROMSCIENCES

UTILIZATION

UNIFORMITYOTHER

DESIGNS

Ordinary Magnetron

Angstrom Sciences Magnetron

Examples Of 4” Wide

Rectangular Target Erosion

7

Proven Performance

But, most important of all, thesemagnetrons deliver the unparalleledperformance that has made AngstromSciences the new standard of the industry– operating at very low pressure andexceptionally high power, and providingthe perfect balance of uniformity,utilization, and rate for any application.

Going To Any Length

Angstrom Sciences rectangularcathodes are available in a full range oftarget widths from 1.5 to 12 inches – andin target lengths from 1 to over 12 feet.

And, of course, we’re fully-equippedto design and build custom magnetronstoo, if necessary, to meet your productionneeds.

Just contact an Angstrom Sciencesrepresentative to discuss your specificoperational requirements.

-15 -10 -5 0 5 10 15

700

600

500

400

300

200

100

0

FIL

M T

HIC

KN

ES

S (

Å)

LOCATION ON SUBSTRATE (INCHES)

Example Of Deposition Uniformity*

Angstrom Sciences Rectangular Cathode

SPUTTERING CONDITIONS

Target Size: 3.5” x 28”

Material: Copper (Cu)

Track Zone: -14” to +14”

Power: 1 kw DC

Process Gas: 35.0 sccm Ar;

5.17 millitorr

Presputter: 1 minute

Sputter Time: 1800 seconds

Source to Substrate: 2 inches

* Specific uniformity and utilization will vary based upon

system design and process parameters.

8

Meeting TheToughestChallenges

More Gold On The Bottom Line

This not only saves you initial startupcosts, it keeps on saving — by extending runtimes, reducing downtime, and raising yourproduc-tivity. And that means you depositmore gold where it belongs — on yourbottom line.

MAGNETIC MATERIALS

A Special Challenge

Sputtering highly coercive magneticmaterials, such as Cobalt, Iron, and Nickel,can pose a special challenge

These metals absorb a portion of themagnetron’s magnetic field , and thatrestricts target thickness and/ordeposition rate.

Standard And Custom Solutions

Some of our customers have found thatthey can achieve satisfactory results in suchcases by using our standard magnetrons andsimply decreasing the thickness of theirtargets. But, for those who want to optimizetheir magnetic material deposition opera-tions, Angstrom Sciences offers a selectionof magnetrons with special magnetic arraysdesigned to sputter these materials in eventhe most challenging applications. Pleasesee our target selection guide on page 17,or contact one of our specialists for adviceabout the best configuration for yourapplication.

ULTRA HIGH VACUUM

Ultra Clean

For applications that require anextremely high degree of cleanliness,Angstrom Sciences offers a complete

COMPACT DISK & DVD

From Aluminum To Gold

Today’s compact disc industry facesan increasingly complex productionchallenge.

Because, although the demand forfilm uniformity remains a constant, theeconomics of the rest of the equationchange dramatically with the coatingmaterial. Sputtering CDs with inexpensivealuminum requires that you fine-tune youroperation for the highest possible rate.But sputtering with costlier materials —such as silver, gold, and compound metaloxides — demands maximum targetutilization to minimize material loss.

For many disk manufacturers, that usedto mean designing, engineering, andinstalling two significantly different systems— with all the duplicate costs that entails.But now, thanks to the unique constructionof Angstrom Sciences magnetrons,technologists can standardize on a singlesystem, and simply change magnetic arraysto optimize performance for each material.

specialized

9

selection of circular and rectangular UHVmagnetrons. These designs make excellentresearch tools, because they allow you tochange magnets quickly and easily tofacilitate unbalanced sputtering or workwith magnetic materials.

Their magnetic arrays can be completelyde-mounted while the source and targetremain in situ and under vacuum. Thatmeans contaminants won’t condense on thetarget surface as you bake the chamber,because you don’t have to run coolantwater through the source.

Full Compatibility

Angstrom UHV magnetrons areavailable in target diameters up to 8,”and they feature 100% welded construc-tion, with no metal or elastomer “O”-ringseals that can lead to out-gassing. Theyare also fully compatible with all DC andRF power supplies, and are equippedwith a wire mesh shield for use in RFapplications.

And, naturally, they can be providedwith a complete range of options,including a variety of insertion lengths,shutters, and gas inlets to suit yourspecific requirements.

BALANCED & UNBALANCED

Balanced Magnetrons

Balanced Magnetrons create a symmetri-cal magnetic field in which the primary linesof force remain close to the target surface,confining the plasma to this area andtrapping secondary electrons and ions – sothey are less likely to strike the substrate anddamage or overheat the surface.

Unbalanced Magnetrons

Unbalanced Magnetrons providea more open magnetic field, in whichthe primary lines of force extend furtherout into the chamber. Electrons andions are therefore less tightly bound tothe target region, and can readily reachthe substrate, heating it to a highertemperature and allowing surfacecharging, for forming films with specialproperties.

DUAL & CUSTOM

Angstrom Sciences’ magnetrons canalso be custom-configured to meet themost demanding process requirements,including magnetic storage media,electro-optical applications like DWDMfilters, and dual magnetrons to eliminatethe “disappearing anode effect” whensputtering insulators. And, of course,all of our magnetrons can be usedwith DC, RF, MF and pulsed powersupplies.

magnetrons

UHV Magnetron

With Insertion

10

DesignedTo MeetYourSpecificNeeds

Building From

Our Standards To Yours

Angstrom Sciences offers a broad lineof state-of-the-art magnetrons, with modelsto serve virtually every standard sputteringprocess in the industry.

But we know that each application isdifferent. So if you find that you havespecial requirements, please don’t hesitateto call on us.

We not only have all the in-housecapabilities necessary to design, engineer,and manufacture the most advancedmagnetron technology in the world —

custommagnetrons &engineering

we’ve developed our unique, modularapproach specifically so that we can adaptto any situation you may encounter.

And we love a challenge.So whether you need custom magne-

trons, mounting hardware, flanges, shutterassemblies, gas manifolds, or a completevacuum chamber, we’ll be happy to help.

You can count on our lab to provide anydiagnostics, testing, or prototyping yourequire. And you can rely on our staff todesign and engineer the solutions you need.We can also build to specifications youprovide. The choice is yours.

11

FromMagnetsTo FullAssemblies

Repair And Rebuilding

Angstrom Sciences also offers completerepair and rebuilding services for obsoletecathode assemblies.

Flexible Upgrades

Our engineers can retrofit your existingmagnetrons with our high-strength rareearth magnets, our patented magneticprofiling, our turbulent-water-flow cooling— or all three advanced components.

Improved Performance

The results will substantially increaseyour system’s power, uniformity, targetutilization — and the overall efficiency ofyour sputtering operation.

Replacement Parts

And, of course, we can also providereplacement parts on an express basis,when you need them.

retrofits

MANUFACTURER MODELSBOCCT All SizesIVT All SizesLeybold All SizesMaterials Science All SizesMRC 900/600 & 8600Perkin Elmer 2400 & 4400Sloan All SizesUlvac All SizesVAC-TEC All SizesVarian 3125 & 3180Angstrom Sciences is not affiliated in any way with the above

manufacturers.

12

YourCompleteSputteringSource

High-Purity Materials

In addition to a complete line ofmagnetrons and custom developmentservices, Angstrom Sciences also offersa comprehensive selection of high-purityvacuum-deposition materials.

These are available in either prefab-ricated sputtering targets or bulk-formevaporation materials — and we supplywire, rods, electron-beam evaporationcones, and hearth liners, as well.

Using a variety of specialized processes(including hot pressing, vacuum sintering,hot/cold isostatic pressing, and vacuummelting), we can provide the kind ofhomogenous, fine-grained, high-densitymaterials that conform to the strictestquality control.

The result is technically superiormaterials for all your thin film applications.

Backing Plates And Bonding

To complete your sputtering require-ments, Angstrom Sciences offers bothbacking plates and bonding services.

We can manufacture a full range oftarget backing plates to either original

targets, materials & bonding

equipment specifications or customcathode dimensions.

And we can apply specialized bondingtechniques (such as high-temperaturemetallic or conductive-epoxy) to eitherour own targets and backing plates orthose you supply.

All materials are specially cleaned,inspected, chemically tested, and packedunder inert gas for immediate use in yourvacuum system upon arrival at your facility.

X-ray and ultrasound verification areavailable upon request.

13

High PurityTarget andEvaporationMaterials

Angstrom Sciences also provides additional metals, ceramics, and alloys which are not listedabove. Please contact Angstrom Sciences to discuss your requirements.

MATERIAL SYMBOL MATERIAL SYMBOLAluminumAluminum CopperAluminum FluorideAluminum NitrideAluminum OxideAluminum SiliconAntimonyBariumBarium Strontium TitanateBismuthBoronBoron CarbideBoron NitrideCadmiumCadmium OxideCadmium SelenideCadmium SulfideCadmium TellurideCalcium FluorideCarbonCeriumCerium OxideChromiumChromium DiborideChromium OxideChromium SilicideCobaltCopperCopper OxideDysprosiumErbiumEuropiumGalliumGermaniumGoldGold BerylliumGold GermaniumHafniumHafnium CarbideHafnium OxideIndiumIndium OxideIndium Tin OxideIridiumIronIron OxideLanthanumLeadLithiumMagnesiumMagnesium OxideMagnesium FluorideManganeseMolybdenum

AlAlCuAIF3

AlNAl 2O3

AlSiSbBaBaSrTiO 3

BiBB4CBNCdCdOCdSeCdSCdTeCaF2

CCeCeO2

CrCrB2

Cr2O3

Cr2Si3CoCuCuODyErEuGaGeAuAuBeAuGeHfHfCHfO2

InIn2O3

ITOIrFeFe2O3

LaPbLiMgMgOMgF2

MnMo

MoS2

MoSi2

NdNiNiCrNiFeNiVNbOsPdPtReRhRuSmScSc2O3

SeSiSiCSiO2

SiOSi3N4

AgSrSrTiO 3

TaTaSi2

TaS2

TeTbTbFeThO2

SnSnO2

TiTiCTiB 2

TiNTiOTiSi 2

TiS2

TiWWWCWSi2VYY2O3

ZnZnOZrZrO2

ZrSi2

Molybdenum DisulfideMolybdenum SilicideNeodymiumNickelNickel ChromiumNickel IronNickel VanadiumNiobiumOsmiumPalladiumPlatinumRheniumRhodiumRutheniumSamariumScandiumScandium OxideSeleniumSiliconSilicon CarbideSilicon DioxideSilicon MonoxideSilicon NitrideSilverStrontiumStrontium TitanateTantalumTantalum SilicideTantalum SulfideTelluriumTerbiumTerbium IronThorium OxideTinTin OxideTitaniumTitanium CarbideTitanium DiborideTitanium NitrideTitanium OxideTitanium SilicideTitanium SulfideTitanium TungstenTungstenTungsten CarbideTungsten SilicideVanadiumYttriumYttrium OxideZincZinc OxideZirconiumZirconium OxideZirconium Silicide

14

We’veGot YouCovered

Experience

Angstrom Sciences has been providingcathodes, coating materials, and expertconsultation to scientists and engineers ina wide range of industries for over adecade. So, whether you’re upgrading yourexisting operation or creating a whole newsystem from scratch, we can help.

Expertise

Because, no matter how unusual theapplication, chances are we’ve seen itbefore (or something like it). And thatmeans we can draw on our staff’s broad-based, practical knowledge to help youmeet the kind of challenges you may nothave encountered or anticipated.

Resources

In fact, if you like, we can even doa lot of the up-front work for you. We haveour own, in-house application lab, completewith high-vacuum sputtering systems andan extensive selection of coating, backing,and bonding materials. So we stand readyto provide any technical services you mayneed — including prototyping, testing,diagnostics, etc. — all at surprisinglyreasonable rates.

References

Angstrom Sciences has corporate andinstitutional customers all over the world— customers who call on us for help witha broad spectrum of technological issues.So, if you’d like to discuss our capabilitieswith them, please give us a call. We’ll behappy to put you in touch.

Worldwide

And, if you want more information,or the location of the Angstrom Sciencesrepresentative near you, just call+1-412-469-8466. Or visit our web siteat www.angstromsciences.com.

processoptimization

15

referenceguide

SputteringYields*

Ag 10.50 3.4 380Al 2.70 1.2 170Al 98Cu2 2.82 170Al 2O3 3.96 40Al 99Si1 2.66 160Au 19.31 2.8 320Be 1.85 0.8 100B4C 2.52 20BN 2.25 20C 2.25 0.2 20Co 8.90 1.4 190Cr 7.20 1.3 180Cu 8.92 2.3 320Fe 7.86 1.3 180Ge 5.35 1.2 160Hf 13.31 0.8 110In 7.30 800In2O3 7.18 20ITO 7.10 20Ir 22.42 1.2 135Mg 1.74 1.4 200MgO 3.58 20Mn 7.20 1.3 180Mo 10.20 0.9 120MoS2 4.80 40MoSi2 6.31 110Nb 8.57 0.6 80Ni 8.90 1.5 190Ni81 Fe19 8.80 110Ni80Cr20 8.50 140Ni93V7 8.60 100

Os 22.48 0.9 120Pd 12.02 2.4 270Pt 21.45 1.6 205Re 20.53 0.9 120Rh 12.40 1.5 190Ru 12.30 1.3 180Si 2.33 0.5 80SiC 3.22 50SiO2 2.63 70Si3N4 3.44 40Sn 5.75 800SnO 6.45 20Ta 16.60 0.6 85TaN 16.30 40Ta2O5 8.20 40Th 11.70 0.7 85Ti 4.50 0.6 80TiN 5.22 40TiO2 4.26 40U 19.05 1.0 155V 5.96 0.7 85W 19.35 0.6 80W90Ti10 14.60 80WC 15.63 50Y 4.47 0.6 85YBCO 5.41 10Zn 7.14 340ZnO 5.61 40ZnS 3.98 10Zr 6.49 0.7 85ZrO2 5.60 40

* The above rates are provided as a comparison. Specific

deposition rates will vary based upon system design and

process parameters.

TARGET DENSITY YIELD RATEMATERIAL (g/cc) 600 ev (Å/sec.)

TARGET DENSITY YIELD RATEMATERIAL (g/cc) 600 ev (Å/sec.)

The following table of common target materials is useful in making comparisons betweendeposition processes. The first column lists the material, and the second shows its maximumtheoretical density. While density has no bearing on rate, higher density targets (as close as possibleto the theoretical maximum) last longer, have fewer voids or inclusions, and therefore providebetter films.

The “YIELD” data in the third column represents the number of target atoms sputtered (orejected from the target) per argon ion striking the target with a kinetic energy of 600 ev. Thisenergy is typical of an argon plasma. Magnetron design factors such as magnetic field strength— and process parameters such as gas composition and pressure — will affect these data.However, they remain useful for comparison purposes.

The “RATE” data in the fourth column are representative of the film deposition rate atmaximum power density (i.e. about 250 w/in2, with direct cooling) and a 4” source-to-substratedistance. Rates will decrease linearly with power levels, and depend on the source-to-substratedistance. A usefule rule of thumb is that the film deposition rate will 1) Decrease by 25% per inchbeyond the 4” substrate distance; 2) Increase by 35% per inch closer than the 4” substrate distance.

16

referenceguide

Power& Cooling

An Ideal Solution

Power and cooling are both criticalfactors in magnetron operation, and they’realways closely interrelated.

Because, although the amount of poweryou apply can directly affect deposition rate,approximately 80% of that power rapidlyconverts to heat — which must be removed bycooling water before it damages not only yourtarget, but your magnets and substrate as well.

To help you find the ideal solution foreach application, we provide two types ofmagnetron cooling designs:

Direct Cooling

Our “Direct Cooling” designs bring waterinto direct contact with the target (if it’s ametal) or with the target backing plate (if youare using an insulator or “tiled” target that isbonded to such a plate). This is the mostefficient approach to cooling, but it requiresthat you change targets more carefully, toavoid getting excess water in the chamber.

Indirect Cooling

Our “Indirect Cooling” designs removeexcess heat from the target by conducting itaway through the cathode body to which itis attached. Because this is less efficientthan direct cooling, an indirectly cooledmagnetron usually has a lower maximumpower limit, and hence a lower maximumsputtering rate.

But both cooling methods offer distinctadvantages for specific operations.

Maximum Power Limits

Cooling Requirements

We strongly suggest that the magnetronpower supply be interlocked with a waterflow switch. Power should not be appliedto a magnetron unless water is flowing. Thewater should be introduced at or slightlybelow room temperature, flowing at 1 gal/min (3.78 L/min) for every 4 Kilowatts ofapplied DC power. And the pressure shouldbe less than 60 psi with an open drain (atone atmosphere) to prevent leakage ordistortion of the cathode body.

Water Flow:

• 1 Gallon / minute (3.78 Liter / minute)per 4 kW Power

• 6 to 8 pH level recommended• Water pressure should not exceed:

60 psi (4.2 Kg cm2) maximum inlet0 psi maximum outlet

• Resistivity should be greater than50K Ohms (relative to ground)

• Water should be sub micron filtered forparticulates, especially for magneticparticles.

Water Temperature:

• 65° F (18° C) inlet recommended.• Range 55°-75° F <(13°-24° C)>• Rise in outlet should not exceed 10° F (6° C)• Inlet temperature should remain above

local dew point to prevent condensation.

Cooling Max. DC Power Max. DC Power(watts/in2) (watts/cm2)

INDIRECT 100 16

DIRECT 250 39• Pulsed (or Medium Frequency –MF-) maximum power is

the same as the DC level.

• Maximum RF power is 1/3 the values in the above table.

• Power limits for indirectly cooled magnetrons can be

increased about 15% by using a thermally conductive

paste to enhance heat transfer.

17Target

Thickness

Numbers reflect recommended material thickness for optimal performance and are not indicative of maximum thickness capability.

Magnetic material calculations are optimized with Nickel targets.

Target Thickness Guide

The following table provides recommended target thickness values (in inches and millimeters)for nonmagnetic and magnetic targets (Ni used as an example) for our Standard, Magnetic StageI, Magnetic Stage II, UHV Standard, and UHV Magnetic circular magnetrons.

For materials that are more coercive than Nickel, the recommended thickness will decrease inproportion to the relative coercivity. Similarly, thicker targets of less coercive materials can besputtered.

Angstrom Sciences rectangular magnetrons are designed with application-specific magnetics.That’s why it’s important that we thoroughly understand your requirements. Our “applicationquestionnaire,” available on our website or via fax, has been designed for this purpose.

referenceguide

Standard (STD)

ONYX 1 2 3 4 5 6 8

Non-Magnetic 0.0625” 0.250” 0.250” 0.250” 0.250” 0.250” 0.250”

1.588 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm

Magnetic 0.005” 0.020” 0.020” 0.020” 0.020” 0.020” 0.020”

0.127 mm 0.508 mm 0.508 mm 0.508 mm 0.508 mm 0.508 mm 0.508 mm

Stage I Magnetic (MAG I)

ONYX 1 2 3 4 5 6 8

Non-Magnetic X 0.250” 0.250” 0.250” 0.250” 0.250” 0.250”

6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm

Magnetic X 0.060” 0.060” 0.060” 0.060” 0.060” 0.060”

1.524 mm 1.524 mm 1.524 mm 1.524 mm 1.524 mm 1.524 mm

Stage II Magnetic (MAG II)

ONYX 1 2 3 4 5 6 8

Non-Magnetic 0.125” 0.250” 0.250” 0.250” 0.250” 0.250” 0.250”

3.175 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm

Magnetic 0.060” 0.125” 0.125” 0.125” 0.187” 0.250” 0.250”

1.524 mm 3.175 mm 3.175 mm 3.175 mm 4.75 mm 6.35 mm 6.35 mm

Ultra High Vacuum (UHV)

ONYX 1 2 3 4 5 6 8

Non-Magnetic 0.125” 0.125” 0.125” 0.250” 0.250” 0.250” 0.250”

3.175 mm 3.175 mm 3.175 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm

Magnetic 0.005” 0.020” 0.020” 0.020” 0.020” 0.020” 0.020”

0.127 mm 0.508 mm 0.508 mm 0.508 mm 0.508 mm 0.508 mm 0.508 mm

UHV Stage II Magnetic (UHV MAG II)

ONYX 1 2 3 4 5 6 8

Non-Magnetic 0.125” 0.250” 0.250” 0.250” 0.250” 0.250” 0.250”

3.175 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm

Magnetic 0.030” 0.060” 0.060” 0.125” 0.125” 0.125” 0.125”

0.762 mm 1.524 mm 1.524 mm 3.175 mm 3.175 mm 3.175 mm 3.175 mm

18

magnetronspecifications

* Typical performance. Results may vary

with process parameters such as

pressure, flow rate, target material,

and substrate rotation, etc.

Some custom-engineered and

specialty magnetrons may not

meet standard specifications.

1 All Angstrom Sciences NdFeB magnets

are totally encapsulated and protected

from degradation

by water.

+ All “Direct Cooled” magnetrons are

equipped with removalble backing

plates for operation in indirect mode.

All sources available in various

internal and external configurations.

Specifications are subject to change

without notice.

Circular Magnetrons(Internal Mount)

D A

BC

SPECIFICATIONS* ONYX-1 ONYX-2 ONYX-3 ONYX-4 ONYX-4 Direct + ONYX-5

Maximum Sputtering Power DC 150 W 1000 W 1.5 kW 2 kW 3.5 kW (2 kW Indirect) 2 kW

Maximum Sputtering Power RF 75 W 600 W 700 W 800 W 1.2 k W (700 W Indirect) 800 W

Cathode Voltage 100 to 1000 volts 100 to 1500 volts 100 to 1500 volts 100 to 1500 volts 100 to 1500 volts 100 to 1500 volts

Discharge Current 0.1 to 1 amp 0.1 to 2 amp 0.1 to 3 amp 0.1 to 4 amps 0.1 to 7 amps 0.1 to 4 amps

Operating Pressure 1 to 50 milliTorr 0.5 to 50 milliTorr 0.5 to 50 milliTorr 0.5 to 50 milliTorr 0.5 to 50 milliTorr 0.5 to 50 milliTorr

COOLING REQUIREMENTS

Flow Rate @ Max. Power 0.2 GPM 0.75 GPM 0.75 GPM 1.0 GPM 2.0 GPM 1.0 GPM

Maximum Input Temperature 20° C 20° C 20° C 20° C 20° C 20° C

Max. Input Pressure [open drain] 60 psig 60 psig 60 psig 60 psig 60 psig 60 psig

TARGET

Form Circular/Planar Circular/Planar Circular/Planar Circular/Planar Circular/Planar Circular/Planar

Diameter 1.0"/25.4mm” 2.0"/50.8mm 3.0"/76.2mm 4.0"/101.6mm 4.0"/101.6mm 5.0"/127.0mm

Thickness 0.010" - 0.125" 0.010" - 0.375" 0.010" - 0.375" 0.010" - 0.375" 0.010" - 0.500" 0.010" - 0.375"

(.254mm - 3.175mm) (.254mm - 9.525mm) (.254mm - 9.525mm)” (.245mm - 9.53mm) (.254mm - 12.7mm) (0.254mm - 9.53mm)

Cooling Indirect Indirect Indirect Indirect Direct/Indirect Indirect

Magnetic Enhancement Profiled NdFeB Profiled NdFeB Profiled NdFeB Profiled NdFeB Profiled NdFeB Profiled NdFeB

Weight (Approx; w/o options) 1 Pound 3 Pounds 4 Pounds 10 Pounds 26 Pounds 16 Pounds

MOUNTING

Source 0.75" OD Tubing 0.75" OD Tubing 0.75" Tubing 0.75" OD Tubing 1.0" OD Tubing 1.0" OD Tubing

Water 0.190" OD Tubing 0.250" OD Tubing 0.250" Tubing 0.250" OD Tubing 0.375" OD Tubing 0.375" OD Tubing

Power Connector, DC Type N, Ext. Threads Type N, Ext. Threads Type N, Ext. Threads Type N, Ext. Threads Type HN, Ext. Threads Type HN, Ext. Threads

Power Connector, RF Type N, Ext. Threads Type HN, Ext. Threads Type HN, Ext. Threads Type HN, Ext. Threads Type HN, Ext. Threads Type HN, Ext. Threads

Power Cable, DC RG 142 RG 393 RG 393 RG 393 RG 393 RG 393

Power Cable, RF RG 142 RG 393 RG 393 RG 393 RG 393 RG 393

Maximum Temperature 100° C 100° C 100° C 100° C 100° C 100° C

Source of Substance Distance 2 - 12" 2 - 12" 2 - 12" 2 - 12" 2 - 12" 2 - 12"

CONSTRUCTION

Cathode Body OFHC Copper OFHC Copper OFHC Copper OFHC Copper OFHC Copper OFHC Copper

Anode 304/316 Stainless Steel 304/316 Stainless Steel 304/316 Stainless Steel 304/316 Stainless Steel 304/316 Stainless Steel 304/316 Stainless Steel

Insulator CTFE CTFE CTFE PTFE PTFE PTFE

DIMENSIONS [See Below]

A 1.5"/38.1mm 2.8"/71.1mm 3.8"/96.5mm 5.0"/127.0mm 6.420"/163mm 6.0"/152.4mm

B 1.4"/35.6mm 2.24"/56.9mm 2.25"/57.15mm 3.0"/76.2mm 4.375"/111.1mm 3.38"/85.9mm

C N/A 0.060"/1.5mm 0.060"/1.52mm 1.00"/25.4mm 0.397"/10.08mm 2.38"/60.3mm

D 0.75"/19mm Typical 0.75"/19mm Typical 0.75"/19mm Typical 0.75"/19mm Typical 1.0"/25.4mm Typical 1.0"/25.4mm Typical

E N/A N/A N/A N/A N/A NA

Circular Magnetrons(External Mount)

Fla

nge

DIA

Mag

netr

on D

IA

MagnetronHeight

19

Rectangular Magnetrons(External Mount)

A

B

C

A

E

C

BD

Rectangular Magnetrons(Internal Mount)

ONYX-6 ONYX-6 Direct + ONYX-8 Direct + ONYX-12 Direct + ONYX-16 Direct + LINEAR+

3 kW 7 kW (3 kW Indirect) 12 kW (5 kW Indirect) 30 kW (11 kW Indirect) 50 kW (20 kW Indirect) To 250 W/Sq. Inch Direct Cooled (100W/Sq. Inch Indirect)

1 kW 2.5 kW (1 kW Indirect) 4 kW (1.6 kW Indirect) 10 kW (4 kW Indirect) 16 kW (7 kW Indirect) To 100 W/Sq. Inch Direct Cooled (20W/Sq. Inch Indirect)

100 to 1500 volts 100 to 1500 volts 100 to 1500 volts 100 to 1500 volts 100 to 1500 volts 100 to 1500 volts

0.1 to 5 amps 0.1 to 12 amps 0.1 to 20 amps 0.1 to 50 amps 0.1 to 80 amps 0.4 amps/Sq. Inch

0.5 to 50 milliTorr 0.5 to 50 milliTorr 0.5 to 50 milliTorr 0.5 to 50 milliTorr 0.5 to 50 milliTorr 0.5 to 50 milliTorr

1.5 GPM 3 GPM 4 GPM 8 GPM 13 GPM 1 GPM/4KW

20° C 20° C 20° C 20° C 20° C 20° C

60 psig 60 psig 60 psig 60 psig 60 psig 60 psig

Circular/Planar Circular/Planar Circular/Planar Circular/Planar Circular/Planar Rectangular/Planar

6.0"/152.4mm 6.0"/152.4mm 8.0"/203.2mm 12.0"/304.8mm 15.0"/381mm Standard widths 1.5" to 12", Length. To 240"

0.010" - 0.500" 0.250" - 0.500" 0.125" - 0.500" 0.250" - 0.500" 0.250" - 0.500" Typical .250"/6mm, to 1.0"/25.4mm

(0.254mm - 12.7mm) (6.35mm - 12.7mm) (3.175mm - 12.7mm) (6.35mm - 12.7mm) (6.35mm - 12.7mm)

Indirect Direct/Indirect Direct/Indirect Direct/Indirect Direct/Indirect Direct/Indirect

Profiled NdFeB Profiled NdFeB Profiled NdFeB Profiled NdFeB Profiled NdFeB Profiled NdFeB

22 Pounds 40 Pounds 60 Pounds 120 Pounds 220 Pounds Size Specific

1.0" OD Tubing 1.0" OD Tubing 1.5" OD Tubing 2.0" OD Tubing 2.0" OD Tubing Customer Specified

0.375" OD Tubing 0.375" OD Tubing 0.375" OD Tubing 0.500" OD Tubing 0.500" OD Tubing Customer Specified

Type HN, Ext. Threads Type HN, Ext. Threads Type HN, Ext. Threads Type HN, Ext. Threads Process/System Specific Customer Specified

Type HN, Ext. Threads Type HN, Ext. Threads Type HN, Ext. Threads Type HN, Ext. Threads Process/System Specific Customer Specified

RG 393 RG 393 RG 393 RG 393 Process/System Specific Customer Specified

RG 393 RG 393 RG 393 RG 393 Process/System Specific Customer Specified

100° C 100° C 100° C 100° C 100° C 100° C

2 - 12" 2 - 12" 2 - 12" 2 - 12" 2 - 12" 2 - 12"

OFHC Copper OFHC Copper OFHC Copper OFHC Copper OFHC Copper OFHC Copper

304/316 Stainless Steel 304/316 Stainless Steel 304/316 Stainless Steel 304/316 Stainless Steel 304/316 Stainless Steel 304/316 Stainless Steel

PTFE PTFE PTFE PTFE PTFE PTFE

Internal Mount External Mount

7.13"/181.0mm 8.45"/214.6mm 10.06"/255.4mm 14.5"/368.3mm 18.5"/470mm Target Length +2.0"/50.8mm Target Length +3.5"/88.9mm

5.0"/127.0mm 5.17"/131.3mm 6.32"/160.5mm 4.0"/101.6mm 4.0"/101.6mm Target Width +2.0"/50.8mm Target Width +3.5"/88.9mm

1.38"/34.9mm 1.38"/34.9mm 2.38"/603.3mm 2.500"/63.5mm 2.500"/63.5mm 3.5" Typical 3.5" Typical

1.0"/25.4mm Typical 1.0"/25.4mm Typical 1.5"/38.1mm Typical 2.0"/50.8mm Typical 2.0"/50.8mm Typical N/A Target Width +2.0"/50.8mm

N/A N/A N/A N/A N/A N/A Target Length +2.0"/50.8mm

20

40 South Linden Street

Duquesne, PA 15110

U.S.A.

Phone: +1.412.469.8466

Fax: +1.412.469.8511

www.angstromsciences.com

The World Leader In Magnetron Sputtering Technology

© Copyright 2001 Angstrom Sciences Inc.

LS020107