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Defining The Future Through Partnerships
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Defining The Future Through Partnerships
Content
➢ SPEL Overview
➢ Capability & Capacity
• Technology
• Equipment
• Process capability
• Capacity and expansion plans
➢ Quality Systems and procedures
• Quality Focus
• SPC
• PCN Implementation Systems
• Best Known Methods / Fan-Out
• Corrective Action System
➢ Continuous Improvements
• Equipment Automation-Investment Plan
• Auto Recipe of Bonding diagrams
• Bar code System
• Continuous Improvements – Cu wire Bonding
• OCAP
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Defining The Future Through Partnerships
The Valingro Group & Natronix
Valingro builds Businesses that transcends time
Presence in Semiconductor Packaging & Design, IC Test Engineering, Engineering & Consultancy, Life Sciences, Enterprise IT, Trading-Farming, Leadership Development
Natronix is an esteemed member of the Valingro Group
N-Sg Promoters hold 60% of SPEL-India shares, planned further acquisitions of OSAT across APAC, Japan, USA
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Defining The Future Through Partnerships
About SPEL
• First IC Assembly & Test facility in India
• IPO company listed in Bombay Stock Exchange (BSE), India
• Commenced commercial production in 1989
• ISO 9001, ISO 14001 & IATF (TS) 16949 Certified
• 100% Export Oriented – Tax incentives & Easy logistics
• Customer covering major application segments which includes Computing,
Consumer electronics, Communication, Automotive, Aerospace & Industrial
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Defining The Future Through Partnerships
OSAT Services
Full Turnkey Solutions
• Wafer sort
• Assembly
• Testing & Packing
Value Added Services
• Package design
• Lead frame design
• Failure analysis & Reliability testing
• Test Program Development & Product Characterization
• Drop shipments across the globe
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Defining The Future Through Partnerships
Infrastructure
▪ 8 Acres campus
▪ 350+ Employees
▪ Daily production capacity of 1Mln units of QFN’s and leaded
packages
▪ Copper wire package capacity – 25% scalable to 50% in 6 weeks
time
▪ 100% Power back up
▪ Land area available for future expansion
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Defining The Future Through Partnerships
Technical Capability
• Package & Process capability
• Equipment capability
• Technology – Existing
• Technology – Roadmap
• Facility Infrastructure
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Defining The Future Through Partnerships
QFN
Cap
abili
ty
ProcessPackage Thickess
Body Sizein mm
Lead-Pitch Lead-Count
Saw SingulatedQFN / DFN
0.40 mm0.50 mm0.75 mm0.90 mm
0.6 x 1to
12 x 12
0.40 mm0.50 mm 0.65 mm
4 ~ 156 pins
Test
Pla
tfo
rms
PAC
KA
GE 150 MIL ; 300 MIL SOIC
150 MIL QSOP ; VSOP
173; 240 MIL TSSOP
300 MIL SSOP
150 MIL MILLIPAQ
300 MIL PDIP
225 MIL SIP
LEA
D C
OU
NT 7/8/14/16; 16/2016/20/24/28; 40/48
8/20/24/38; 48/56/64
48/56
80
8/14/16
8
JED
EC
STA
ND
AR
D MS-012 ; MS-013
MS-137 ; MS-154
MO-153
MO-118
MO-154
MS-001
NA
Lead
ed
TEST PLATFORM
Credence ASL 1000
Eagle ETS 364 / 88 Verigy 93K / V50
DIGITAL
MIXED SIGNAL
ANALOG
Package Portfolio
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Defining The Future Through Partnerships
Process Capability▪ Wafer Probing – Max 8 “ Wafers
▪ Wafer Back grind – Max 8 “ Wafers
▪ Die size handling : 10 Mils square Min
▪ 12” wafer assembly capability (Dicing / Die Attach)
▪ Epoxy screen print capability (Wafer backside coating – Max 8” Wafers)
▪ Copper wire bonding (Bare Cu & Pd Coated) – 0.8 mil to 2.0 mil
▪ Wire Bond Pad Pitch : 40 microns
▪ Low loop bonding : 4 mils
▪ Ultra Thin packages : 0.4mm
▪ Fan in type QFN : 156L 12x12
▪ Wafer mapping at Die Attach
▪ Multi-die package assembly
▪ Saw QFN
▪ 100% Pure tin and 85%:15% Tin:Lead plating
▪ Multi-site Test capability (up to Octal site)
▪ Strip Testing feasibility for QFN
▪ Die bank capability with N2
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Defining The Future Through Partnerships
Minimum Wafer Thickness• 8 Mils for 8-inch wafers
• 6 Mils for 6-inch wafers
Wafer Diameter• 4 inches ~ 8 inches
• 12 inch – Capability by Q1”2016
Material & Ink Thickness• Wafers – Silicon, SOI (silicon on insulator)
• Wafers with bumps, ink can be processed
Wafer Back-grind
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Defining The Future Through Partnerships
Minimum Wafer Thickness
• 10 Mils for 12-inch wafers
• 8 Mils for 8-inch wafers
• 6 Mils for 6-inch wafers
Wafer Diameter
• 4 inches ~ 12 inches
Material & Surfactant
• Wafers – Silicon, SOI (Silicon on Insulator)
• Surfactant mixing capability as per Customer requirements
Wafer Saw
Minimum scribe line –
50µm
Shuttle Wafer with multi-
dies / multi-index
Wafers with Au/Ag Back
metal
Wafers with polish back
and TTV < 10µm preferred
Minimum die size – 10 x 10
mils
UV irradiation capability
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Defining The Future Through Partnerships
• Wafer backside coating capability
• Used for COL (Chip on Lead) QFN
• Conductive and Non-Conductive screen print adhesive options
• Wafer size capability – 4” ~ 8” wafers
• Customer to provide wafer flat / notch dimension particulars
Wafer Backside Coating
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Defining The Future Through Partnerships
• In-house leadframe design capability
• Open tool leadframes
• Semi-closed tool for leaded packages subject to Customer investment
• Closed tool for Leadless packages (NRE charges payable by Customer)
• All existing leadframes for QFN’s are of etched type.
• Plating options – NiPdAu Preplated finish (PPF) or Ag plated Copper
leadframe (Spot silver / Selective Ring plating etc.,)
• Leadframe material – A194, C7025 & EFTEC
Lead-frames
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Defining The Future Through Partnerships
• Wafer diameter – 4” ~ 12”
• Inked wafers & Inkless die attach (Preferred format is ASCII)
• Conductive / Non conductive epoxy, Dispense / B-stage epoxy.
• Minimum die size – 10 * 10 mils & Maximum die size – 300 mils sq
• Wafers with back metal can be processed
• Shuttle Wafers ( with multiple devices ) can be handled.
• Multiple dies in single die pad
Die Attach
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Defining The Future Through Partnerships
Die edge to Package edge – 10 Mils min clearance
Chip on Lead
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Defining The Future Through Partnerships
• Used for MCM
• Encapsulant material FP4451 for Damming
• Encapsulant material FP4450 for Filling
• Package Singulation using Saw
DIE ATTACH
WIRE BONDING
DAMMING FILLER CURING SINGULATION
Dam & Fill
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Defining The Future Through Partnerships
• Wire dia handling capability – 0.8 mils to 2.0 mils in both Au & Cu wire
• Bond pad pitch – 40 Microns
• Min metallization thickness – 0.8 Microns (TiW barrier layer)
• Maximum pin count handled in Cu wire – 64 wires for leaded and 72 wires for QFN packages.
• Maximum dies per package handled in Cu wire – 4 dies
• Die to Die bonding (Bond stitch on Ball)
• Leadframes – Both Ag/Cu and PPF leadframes
• Capable of handling Low K and Devices with CUP
• Staggered bonding
• Plasma cleaning capability with Ar-H2 Mix gas
Technical CapabilitiesWire Bonding
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Defining The Future Through Partnerships
WB Process Characterization
Pro
cess
Ch
ara
cte
rizati
on
Wire pull monitor
Stitch pull monitor
Ball shear monitor
No bond pad crater & Pad peeling
Ball diameter, height, aspect ratio
Minimize Aluminium splash
Visual criteria monitoring
Minimum Aluminium Thickness
Ball flatness
Output Target ResponsesInput variables
Bond parameters
Efo Parameters
Process gas flow
Bond tool
Bond wire
Aux Parameters
Special features
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Defining The Future Through Partnerships
• Two stage Build Sheet verification
• Colour coded Traveller & Build sheet for Cu wire
• Shelf / Floor life tracking system for bond wire to prevent oxidation
• Tool life monitoring for bonding tool (Capillary) & used capillary retained by
QC for future reference
• Assembly Traveller lot # ends with suffix ‘C’ to denote Cu wire lot.
• No rework is permissible at Wire bond
• No capillary cleaning and re-use is permissible
• Wire sweep at molding controlled less than 10%
In-Process Checks
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Defining The Future Through Partnerships
WB In-Process Controls
Material
Preparation
WB Machine
Set upProcess
Monitor
Production
Run
Gas flow
control
Bond wire life
tracking
Bond tool
selection &
Tool life
tracking
Colour coding for Assy.
Traveller and build sheet
Bond parameter window
control
Wire
Pull
Ball
Shear
SPC
monitor
Bond Quality
monitoring
Online Inspection
Pad Crater
monitor
Defects – Pareto
Analysis and Yield
improvement
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Defining The Future Through Partnerships
Existing
CU
Leaded Package QFN / DFN
Planned
2019-20BGAWLCSP
Package Roadmap
MEMSFC-QFN
Package Type Capacity/Month Remarks
Leaded 10 20 lead Equivalent
Leadless (QFN / DFN) 30 3 mm Equivalent
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Defining The Future Through Partnerships
Process / Technology Road Map
2019
• High Density QFN Frame
• QFN Lead-frame Taping
• 12” Wafer Back-grinding
• Flip Chip Die Attach
2020
• DBG Process
• Punch QFN
• DAF
• Stacked Die
• Copper Clip Attach
2021
• Wafer Bumping
• Stud Bumping
• Low K Wafers
• BGA Ball Attach
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Defining The Future Through Partnerships
Capacity Expansion
QFN/Gullwing Packages
350Mln Annual Capacity
25% capacity for Cu Wire scalable to 50% in 4weeks time
Expansion in QFN, Flip-chip TDFN & BGA
$15Mln Investment
WB BGA & FC BGS Capability
Expansion in WLCSP, MEMS & BGA
Target 2Bln Annual Capacity
2018
2019
2020-21
More than 500M units of Copper wire shipped until Dec 2017
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Defining The Future Through Partnerships
Quality Focus
• Quality methodologies are guided by International standards
• Quality endeavour is to deliver best in high-class, defect-free solutions
and services
• Standardizing development activities to align with Customers
requirements
• Process robustness are built through ISO 9001:2008 standards
accreditation
• Zero Customer Return
• Continuous Improvements through Industry Benchmarking
• Effectively Implement PPAP, APQP, MSA, SPC & FMEA to ensure
Outgoing Product Quality
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Defining The Future Through Partnerships
• Wafer back grind thickness
• Saw kerf width
• Die shear strength & Bond line
• thickness
• Wire pull & Ball shear (Au & Cu)
• Wire Sweep
• Co-planarity
• Plating thickness
SPC Monitoring
• Mean – Range charts plotted
• CpK Min – 1.67
• CpK calculations done monthly
• Review of UCL and LCL for
continuous improvement
• Auto alert system for abnormal
trends
• Data grouping done based on
Customer / Machine / Package
Process Characteristics Monitoring
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Defining The Future Through Partnerships
Engineering Controls
• Tool life monitoring & Control: Wafer saw – Cut wheel Die attach – Ejector needle Wire bond – Capillary Trim & Form – Cutting &
• QFN saw – Cut wheel
• Design of Experiments – Bond Parameter validation
• Equipment set up buy-off
• Preventive & Predictive maintenance
• Gage repeatability & reproducibility studies
• Calibration control
• Statistical Process control
• FMEA – Design & Process
• Pareto analysis
Quality Controls
• Shelf life monitoring (Epoxy,mold compound, Cu wire,Adhesive tapes – Wafer backgrind, saw, QFN singulationtape, cover tape)
• 8D problem solving approach
• Vendor ranking
• Corrective action procedure
• Material board review
• Process change notification
• Engineering change notification
• Internal audit
• ESD Checks & Controls
• Environmental monitoring &control
• Vendor / Material /Machinequalification
Operational Controls
• Thawing control (Silver epoxyand Mold compound)
• Floor life monitoring (Silverepoxy, Cu wire, Moldcompound)
• Error Proofing Techniques
• Color coding for traveler – Goldwire bonding & Copper wirebonding ; Lead Vs Leadfreelots
• Lot identification punch @ dieattach
• QFN Leadframe map – Tosegregate process rejects
• Test lot – tally summary
• FIFO Monitoring
• Operator certification
Best Known Method / Fan Out
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Defining The Future Through Partnerships
The following are considered as Major changes and without Customerapproval no changes will be implemented with respect to copper wire bondprocess.
• Change in Cu wire type or Cu wire manufacturer
• Introduction of New model of wire bonder
• Introduction of New wire bonding techniques
• Changes in Forming gas nozzle design
• Change in Leadframe supplier
• Changes in Capillary profile or material
• Change in die attach curing process
• Change in Forming gas specification tolerance
• Change in Process monitor specs or monitoring frequency (Wire pull, ball shear or bond pad crater)
Process Change Notification
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Defining The Future Through Partnerships
PCN Flow - Major
Drop the proposal
Submit to Customer
Yes
Customer
Approval
No
Revise the relevant
documents and Train the
operators
Implement actual
change
Inform customer on Lot
no, work week after
implementing the change
Run engineering
lot by ED/QC
Engineering Change
proposal by
ED/QC/Customer
Prepare internal quality/
reliability data and
submit to QA for
approval
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Defining The Future Through Partnerships
Prepare and submit
internal quality/ reliability
data for QA for approval
Yes
No
Drop the proposal
QA approval
Engineering Change
proposal by ED
Run Engineering
lot by ED
Revise the relevant
documents and Train
the Operators
Implement actual
change
Record the Lot no,
work week after
implementation
PCN Flow - Minor
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Defining The Future Through Partnerships
FA Flow
Start
Visual Inspection Optical/SEMDecapsulation
Bench confirmation on the test result
Device Test @ Die level using micro probe
Visual Inspection @ High Magnification
CSAM Inspection (If required))
X-Ray Inspection
External Inspection
Internal Inspection
(Non –destructive)
Internal Inspection
(destructive)
A B
AA
Failure confirmation in Tester & Bench
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Defining The Future Through Partnerships
SEM Inspection on the failure
area (if required) Fix the root causes of the problem
Issue CAR (Corrective Action Report) to
Process Assembly / Test
Prepare FA report
Internal
Inspection
(destructive)
C
CB
Wire pull test (if required)
Ball shear test (if required)
Implement the Internal & External
containment actions
Implement the error proof
permanent corrective actions
Verify the Implementation of the
implemented corrective action
Update FA Log
Close the CAR
End
FA Flow (Cont..)
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Defining The Future Through Partnerships
CAS Flow
Acceptance of complaint /
feedback to the customer
A
No
Yes
Validity?
B
Form a Team & classify the nature
of the complaint (Product / Process
related or Documentation related)
Do initial FAR (Visual inspection, X-
ray inspection, electrical test if any,
decapping etc. for products related).
B
A
No
Yes
If the FAR results
revealed the valid
complaint?
Raise internal CAR & log the details
in the customer complaint status
log.
Customer
C
Quality Incident
CAS Flow
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Defining The Future Through Partnerships
Implement the internal & external
containment actions and Submit 3D
report within 24 Hrs.
Fix the root causes of the problem
Implement the permanent corrective
and preventive actions
Verify the effectiveness of
implemented corrective &
preventive actions.
Customer
accepts
8D report?
Yes
STOP
Update Complaint Status Log
C
No
Translate the findings of CAR in to
8D report and submit 8D corrective
action report to the customer within
10 working days.
CAS Flow
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Defining The Future Through Partnerships
Manpower
• Technically qualified operators & technicians
• Skilled engineers & experienced Management
• Low attrition rate (< 6%). Developed second-in-line in all functions starting from
Supervisor level
• Strong engineering database ensures that any attrition will not affect any process
• Over 55% of the employees have over 15 years of service with SPEL
• Low direct labor cost & management provides various Employee welfare schemes
as a motivational activity through Employee Welfare Committee
• Training cell providing comprehensive training (including soft skill & Customer
focus) to all level at regular interval & conducts test to ensure the capability
• Talent pool available from Local universities with electronics/semiconductor
background
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Defining The Future Through Partnerships
Logistics
▪ One Stop Turnkey Destination :
Probe → B/G → Assembly → Test → T&R → Drop shipment
▪ Turnaround time
➢ Assembly 5 days with Linear Loading
➢ Testing : 2 days
➢ Fast Track Assembly in 2 days with Premium Charge
▪ Factory Schedule : 24 x 7
▪ Drop Ship to End-Customers
▪ Daily Direct Flights to US, Europe & Asia Pacific :
➢ 2 days Transit (Inbound / Outbound)
▪ STAR eWIP - an online Semiconductor Tracking And Resourcing Software for
regular Customer WIP update
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Defining The Future Through Partnerships
Continuous Improvement
• Periodic review and update Quality objectives of all functions
• Internal audit review and focus on improvements
• Customer audit review and implement appropriate improvements
• Corrective and Preventive measures
• Implementation of actions discussed during Management reviews.
• Adopting Error proofing techniques (Poka-Yoke) in all Processes
• More Focus on Quality, Cost, Cycle time & Customer service
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Defining The Future Through Partnerships
• In-house forming gas mixer plant
• Barcode system for auto-download of WB recipe
• Procurement of Wire bonders with advanced features (bond
accuracy, lower wire dia handling, etc.) dedicated exclusively for Cu
wire
• In-house leadframe taping machine for QFN
• High density leadframes for QFN packages
Improvement plans
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Defining The Future Through Partnerships
Customers
http://www.silabs.com/pages/default.aspxhttp://www.vishay.com/http://www.holtic.com/http://www.syrmatech.com/index.htmhttp://www.meticom.com/http://www.google.co.in/imgres?q=idt&um=1&hl=en&sa=N&tbo=d&biw=1366&bih=674&tbm=isch&tbnid=MVuQO7rWiUWT8M:&imgrefurl=http://www.ncomm.com/new_site/IDT/idt_drivers.htm&docid=6lnqlyJ1C9soYM&imgurl=http://www.ncomm.com/new_site/images/idt_logo_c.jpg&w=1200&h=600&ei=OnsgUeGQNInUrQeuw4GoBg&zoom=1&ved=1t:3588,r:15,s:0,i:141&iact=rc&dur=1559&sig=104375703950772084557&page=1&tbnh=154&tbnw=289&start=0&ndsp=16&tx=71&ty=60http://www.militaryaerospace.com/articles/2014/10/te-american-acquisition.html
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Defining The Future Through Partnerships
End Customers
Customers
Customer Audits
http://www.google.co.in/url?sa=i&rct=j&q=sony&source=images&cd=&cad=rja&docid=EJAA6exDksRv_M&tbnid=r0taLRrSD6PhFM:&ved=0CAUQjRw&url=http://blogs.sonymobile.com/press-resources/&ei=taVbUd-EKI6zrAfzw4GgBA&psig=AFQjCNGwi3X94WFF1MbJeMHM4U3XEaaVsw&ust=1365047073693184http://www.pericom.com/index.phphttp://www.silego.com/http://www.bourns.com/Default.aspx
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Defining The Future Through Partnerships