David Nelson SQP E-board November 4, 2010 1 Pixel nSQP E-board Presented by David Nelson

5
David Nelson SQP E-board November 4, 2010 1 Pixel nSQP E-board Presented by David Nelson [email protected]

description

David Nelson SQP E-board November 4, 2010 Layout of current opto-board 3 VDCs & DORICs 80 pin connector Mounting holes

Transcript of David Nelson SQP E-board November 4, 2010 1 Pixel nSQP E-board Presented by David Nelson

Page 1: David Nelson SQP E-board November 4, 2010 1 Pixel nSQP E-board Presented by David Nelson

David Nelson

SQP E-board

November 4, 20101

Pixel nSQPE-board

Presented by

David [email protected]

Page 2: David Nelson SQP E-board November 4, 2010 1 Pixel nSQP E-board Presented by David Nelson

David Nelson

SQP E-board

November 4, 2010

StatusArrangement of wires on board

Determined during board layout. Bundle organization/wire gauges

Base line is 28 CCAL for data & 36 Cu for Cmd&ClkHopefully can migrate to 34AWG for all signals

More studies needed on wire selection

PP1 penetration and connector to opto-boards

No progress – need help from opto-chassis folks

2

Page 3: David Nelson SQP E-board November 4, 2010 1 Pixel nSQP E-board Presented by David Nelson

David Nelson

SQP E-board

November 4, 2010

Layout of current opto-board

3

VDCs & DORICs80 pin connector

Mounting holes

Page 4: David Nelson SQP E-board November 4, 2010 1 Pixel nSQP E-board Presented by David Nelson

David Nelson

SQP E-board

November 4, 2010

E-boardWire bond LVDS chips

8 chips on connector side

4

8 LVDS buffers

Wire surface mount

interface

Page 5: David Nelson SQP E-board November 4, 2010 1 Pixel nSQP E-board Presented by David Nelson

David Nelson

SQP E-board

November 4, 2010

LVDS Chip wire bond diagram

5

Received 12 LVDS die

LVDS die