Datasheet DIMA Bonding C-Drive - cohpros.com

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C-Drive, the ultimate bonding head series Applications Bonding Dispensing Welding SMT Systems Soldering The DIMA’s bond head series, called C-Drives, are unique concepts and includes the smartest connect block and thermode change over designs, in matter of seconds! The series consist of a range of bonding heads that are used for Hot Bar Reflow Soldering as well as for Heat-Seal Bonding. DIMA developed these heads with key focus on process control and for most reliable production. Using the C-Drives in combination with the C-Flow con- troller, you can easily program and measure temperatu- re, force and time as well as reading simultaneously the displacement while making a connection. In a full color display the monitoring of all these important parameters take place! Of course with alarm settings, process limits, data output etc. options. The C-Drive series was engineered to deliver repeatable and accurate forces for a wider range of applications. Four different models are available: extremely low forces for delicate applications to very high forces for the most challenging heat seal connectors. The provided features and precision can be used in the process equipment, desktop systems and for customized automation projects too! And interposer systems for Kapton, Silicone, Metal tapes can be easily integrated. DIMA Bonding C-Drive Series CD-100/110/120/130 h Heat-Seal Bonding h Reflow soldering h ACF laminating h Heat-Staking Main Features Customer Benefits h Easiest Thermode replacement h Integrated force control h Height displacement sensor h Multiple force ranges h Rigid design, quality components h Variety of options h Saving set up time and costs h Controlled manufacturing process h Monitoring the joint h Most accurate force adjustment h Highest reliability and repeatability h Best fit for the application requirements Smart Watch Flex - PCB LCD modules Processes: C-Drive (with optional interposer)

Transcript of Datasheet DIMA Bonding C-Drive - cohpros.com

C-Drive, the ultimate bonding head series

Applications

Bonding Dispensing Welding SMT Systems Soldering

The DIMA’s bond head series, called C-Drives, are unique concepts and includes the smartest connect block and thermode change over designs, in matter of seconds! The series consist of a range of bonding heads that are used for Hot Bar Reflow Soldering as well as for Heat-Seal Bonding. DIMA developed these heads with key focus on process control and for most reliable production.

Using the C-Drives in combination with the C-Flow con-troller, you can easily program and measure temperatu-re, force and time as well as reading simultaneously the displacement while making a connection. In a full color display the monitoring of all these important parameters take place! Of course with alarm settings, process limits, data output etc. options.

The C-Drive series was engineered to deliver repeatable and accurate forces for a wider range of applications. Four different models are available: extremely low forces for delicate applications to very high forces for the most challenging heat seal connectors. The provided features and precision can be used in the process equipment, desktop systems and for customized automation projects too! And interposer systems for Kapton, Silicone, Metal tapes can be easily integrated.

DIMA Bonding

C-Drive Series CD-100/110/120/130

h Heat-Seal Bonding h Reflow soldering h ACF laminating h Heat-Staking

Main Features Customer Benefits

h Easiest Thermode replacement h Integrated force control h Height displacement sensor h Multiple force ranges h Rigid design, quality components h Variety of options

h Saving set up time and costs h Controlled manufacturing process h Monitoring the joint h Most accurate force adjustment h Highest reliability and repeatability h Best fit for the application requirements

Smart WatchFlex - PCB LCD modules

Processes:

C-Drive (with optional interposer)

For more detailed information, please contact our Sales Representatives. We are very willing to explain you the product application opportunities, all the available system configurations as well as our customized turn-key automation facilities. We are pleased to serve you with the best process technologies and going for the best system fit into your manufacturing processes. Your success is ours too!

Your Local Representative

DIMA Group BV T : +31 (0)493 352 752Beukelsdijk 2 F: +31 (0)493 352 7505753 PA Deurne E: [email protected] Netherlands I: www.dimagrp.comwww.dimagrp.com

Copyright © 2013 by DIMA Group BV, The Netherlands. All rights reserved. Design, features, and specifications are subject to change without notice.

Technical Specifications C-Drive Bonding Heads

Specifications C-Drive SeriesC-Drive Bonding Head and post (M-Base)Dimensions (HxWxD) 370 x 330 cm x 400 mmPower Connection Supplied by C-Flow power supplyWeight 12 kg

C-Drive SeriesCD-100 M-Base with CH-0100 Bonding Head, low force 5 - 100 NCD-110 M-Base with CH-0250 Bonding Head, mid force 20 - 250 NCD-120 M-Base with CH-0700 Bonding Head, low force 50 - 700 NCD-130 M-Base with CH-1750 Bonding Head, mid force 100 - 1750 N

Mounting blocks ThermodesMounting Block 3D 2D Pulsed Heat Metal ThermodesUp to 50 mm UO-3200 UO-3220 PT-xxxyy, up to 50 mm xxx = lenght, yy = 10*width in mmUp to 75 mm - UO-3221Up to 100 mm UO-3202 - PT-xxxyy, up to 100 mm xxx = lenght, yy = 10*width in mmUp to 130 mm UO-3203 UO-3222 PT-xxxyy, up to 130 mm xxx = lenght, yy = 10*width in mm

C-D

rive

Bond

ing

Hea

ds -

CD

-100

/110

/120

/130

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C-Drive Bond Head SeriesThe C-Drive series consist of the standard M-Base with a Bonding head of choice. To prepare the C-Drive for the heating process you also need to choose a mounting block and a ther-mode. And to make the systems run-ning, connect the C-Drive to a C-Flow. Optionally an interposer, displacement sensor, programmable and automated force control are available.

M-Base (post)

M-Base (plate)

Bond Head

Mounting block

Interposer

Thermode

C-Flow

Temperature and System controllerCF-100 C-Flow, Pulsed heat power supply with integrated touchscreen User Interface

OptionsUO-5000 Z-Displacement sensorUO-5220 Programmable Automated Force ControlUO-4010 Interposer Manual for Silicone tapUO-4060 Interposer Automated for Silicone tape