Data brief - EVALSTGAP2HSM - Demonstration board for … · components in order to ease driver...
Transcript of Data brief - EVALSTGAP2HSM - Demonstration board for … · components in order to ease driver...
Features• Board
– High voltage rail up to 1200 V– Negative gate driving– Onboard isolated DC-DC converters to supply high-side and low-side gate
drivers, fed by VAUX = 5 V, with 5.2 kV maximum isolation– 3.3 V VDD logic supply generated onboard or 5 V (externally applied)– Easy jumper selection of driving voltage configuration:
+15/0 V; +15/-3 V; +19/0 V; +19/-3 V;• Device
– Driver current capability: 4 A source/sink @ 25°C– Separate sink and source for easy gate driving configuration– 6000 V Galvanic isolation– Short propagation delay: 75 ns– UVLO function– Gate driving voltage up to 26 V– 3.3 V, 5 V TTL/CMOS inputs with hysteresis– Temperature shutdown protection– Standby function
DescriptionThe EVALSTGAP2HSM is an isolated single gate driver.
The gate driver is characterized by 4 A current capability and rail-to-rail outputs,making the device suitable also for high power inverter applications such as motordrivers in industrial applications equipped with MOSFET / IGBT power switch.
The separated source and sink outputs allow to independently optimize turn-on andturn-off by using dedicated gate resistors.
The device integrates protection functions: UVLO and thermal shutdown are includedto easily design high reliability systems. Dual input pins allow choosing the controlsignal polarity and also implementing HW interlocking protection in order to avoidcross-conduction in case of controller's malfunction.
The device allows implementing negative gate driving, and the onboard isolated DC-DC converters allow working with optimized driving voltage for MOSFET/IGBT.
The EVALSTGAP2HSM board allows evaluating all the STGAP2HSM features whiledriving a half-bridge power stage with voltage rating up to 1200 V in TO-220 orTO-247 package.
The board allows easily selecting and modifying the values of relevant externalcomponents in order to ease driver performance evaluation under differentapplicative conditions and fine pre-tuning of the final application’s components.
Product status link
EVALSTGAP2HSM
Demonstration board for STGAP2HSM isolated 4 A single gate driver
EVALSTGAP2HSM
Data brief
DB4269 - Rev 1 - September 2020For further information contact your local STMicroelectronics sales office.
www.st.com
1 Schematic diagram
Figure 1. EVALSTGAP2HSM circuit schematic – gate drivers
TO247
TO220
GNDPWR
OUT
HV
GNDISO_H
GND
VDD
IN+_L IN-_L GND
IN-_H IN+_H
IN+_L
VDD
IN-_H
GND IN-_L
IN+_H
EVALSTGAP2HSVersion: R1.0
2HSM2HSCM
GNDISO_L
VAUX
VAUX
10-20R
TO247
TO220
VDD
VDD
VDD VH_H
VDD
VH_L
VH_HVH_L
VH_L
VH_HVAUX
HV
GNDISO_L
GNDISO_H
OUT
C3
1uF 50V
C4
N.M.
TP2
R9 100R
Q2AN.M.
3
1
2
Q1N.M.
3
1
2
C1100nF/50V
TP9
C7 1uF 50V
C12220pF/25V
CN1 TE 928814-1
11
22
TP3
J21234567
R7 100R
R4 100R
C11
N.M.
TP10
TP11
R2 2R2
TP4
JP9CLOSED
R3 100R
C6220pF/25V
CN3 TE 928814-1
11
22
TP8
R1 22R
TP5
VP1 FULL
D2
STTH112A
2 1
U2 STGAP2HSM
VDD1
IN+2
IN-3
GND4 GNDISO 8
GOFF 7
GON 6
VH 5
C8100nF/50V
D1STPS2L40ZFY
12
C9100nF/50V
TP12
U1 STGAP2HSM
VDD1
IN+2
IN-3
GND4 GNDISO 8
GOFF 7
GON 6
VH 5
TP6
VP2 EMPTY
R5
N.M.
JP8 OPEN
Q2N.M.
3
1
2
C14 1uF 50V
JP4 CLOSED
R6 22R
D3STPS2L40ZFY
12
JP2 OPEN
R8 2R2
VP3 EMPTY
JP7CLOSED
J11234567
TP1
Q1AN.M.
3
1
2
C2100nF/50V
JP3CLOSED
C13220pF/25V
TP13
VP4 EMPTY
JP6 OPEN
C5220pF/25V
C10
1uF 50V
JP5 CLOSED
TP7
CN2 TE 928814-1
11
22
JP1CLOSED
GNDPWR
IN+L
IN-L
GL
C_IN+L
C_IN-L
IN-H
IN+H
GNDISO_H
C_IN-H
C_IN+HGH
C_IN+HC_IN-L
C_IN+L C_IN-H
C_IN+HC_IN-HC_IN+LC_IN-L
C_IN-L C_IN-H
C_IN+HC_IN-HC_IN+LC_IN-L
VDD
VDD
GOFCH
GONUH
HV
OUT
OUT
GNDISO_L
GOFCL
GONUL
VAUX
VAUX
GH
GL
EVALSTGAP2HSM Schematic diagram
DB4269 - Rev 1 page 2/12
Figure 2. EVALSTGAP2HSM circuit schematic – supply, connectors and decoupling
GNDISO_HVH_H
GNDISO_LVH_L
3V3
VAUX
Electr. P 7.5/10
SMD 1812
Film P 27.5 Film P 15mmSMD
1812
VH_H
VH_L
VDDVAUXHV
GNDISO_L
GNDISO_H
OUT
C3010uF/25V
JP17CLOSED
C18N.M.
TP17
FB1
BLM21AG471SN1
R121K
C17
1uF/50V
C151uF/50V
C26N.M.
JP15 CLOSED
R14
10M
FB2
BLM21AG471SN1
TP16
TP14
C201uF/50V
JP10 OPEN
D10MMSZ3V3T1G
21
C214.7uF/50V
JP12OPEN
C2933nF/1.25kV
C314.7uF/10V
C27N.M.
C191uF/50V
C22
1uF/50V
R11 0R
R1610M
J3N.M.
1
2
Q42STF1360
3
1
2
C241uF/50V
+ C25N.M.
JP16OPEN
D6BZT585B2V7T
JP18CLOSED 2-3
1
3
2
FB3
BLM21AG471SN1
Q32STF1360
3
1
2
T1 N.M.
2 3
41
FB4
BLM21AG471SN1
R13 0R
D5BZT585B20T
TP15
D8BZT585B16T
D9BZT585B2V7T
R101K
J4N.M.
1
2
JP14 OPEN
U3
MGJ2D051509SC
-Vout 5
+Vin1
-Vin2
0V 6
+Vout 7
JP13CLOSED
T2 N.M.
2 3
41
C28N.M.
R15240R
D7BZT585B20T
C164.7uF/50V
U4
MGJ2D051509SC
-Vout 5
+Vin1
-Vin2
0V 6
+Vout 7
D4BZT585B16T
C23N.M.
JP11
CLOSED
VAUX
GNDISO_HDCDCH-
DCDCL- GNDISO_L
VAUX
VAUX
3V3_REG
GNDPWR
DCDCL+
DCDCH+
EVALSTGAP2HSM Schematic diagram
DB4269 - Rev 1 page 3/12
2 Bill of material
Table 1. Bill of Material – components common to all device variants
Reference Description Value / Generic Part Number
CN1,CN2,CN3 Tab FASTON 250 horizontal TE 928814-1
C1,C2,C8,C9 SMT ceramic capacitor 100 nF/50 V
C3,C7,C10,C14 SMT ceramic capacitor 1 uF/50 V
C4,C11 SMT ceramic capacitor N.M.
C5,C6,C12,C13 SMT ceramic capacitor 220 pF/25 V
C15,C17,C19,C20,C22,C24 SMT ceramic capacitor 1 uF/50 V
C16,C21 SMT ceramic capacitor 4.7 uF/50 V
C18,C23 SMT ceramic capacitor N.M.
C25 THT electrolitic capacitor N.M.
C26,C27 SMT ceramic capacitor N.M.
C28 Film capacitor N.M.
C29 Film capacitor 33 nF/1.25k V
C30 SMT ceramic capacitor 10 uF/25 V
C31 SMT ceramic capacitor 4.7 uF/10 V
D1,D3 Automotive low drop power Schottky rectifier STPS2L40ZFY
D2 High voltage ultrafast rectifier STTH112A
D4,D8 Surface mount precision Zener diode BZT585B16T
D5,D7 Surface mount precision Zener diode BZT585B20T
D6,D9 Surface mount precision Zener diode BZT585B2V7T
D10 Zener voltage regulator 500 mW MMSZ3V3T1G
FB1,FB2,FB3,FB4 Ferrite beads BLM21AG471SN1
JP1,JP3,JP4,JP5,JP7,JP9,JP11,JP13,JP15,JP17 SMT jumper Closed
JP2,JP6,JP8,JP10,JP12,JP14,JP16 SMT jumper Open
JP18 SMT jumper Closed 2-3
J1 Connector terminal block T.H. 7 POS 3.5 mm MORSV-350-7P_screw
J2 Strip connector 7 POS, 2.54 mm STRIP 1x7
J3,J4 Connector terminal block T.H. 2 POS 5.08 mm N.M.
Q1,Q2 N-channel IGBT or MOSFET up to 1700 V N.M.
Q1A,Q2A N-channel IGBT or MOSFET up to 1700 V N.M.
Q3,Q4 Low voltage fast-switching NPN power transistors 2STF1360
R1,R6 SMT resistor 22R
R2,R8 SMT resistor 2R2
R3,R4,R7,R9 SMT resistor 100R
R5 SMT resistor N.M.
R10,R12 SMT resistor 1K
R11,R13 SMT resistor 0R
EVALSTGAP2HSM Bill of material
DB4269 - Rev 1 page 4/12
Reference Description Value / Generic Part Number
R14,R16 SMT resistor 10M
R15 SMT resistor 240R
TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,TP11,TP13,TP14,TP15,TP16,TP17
Test point - PCB 1.5 mm diameter T POINT R
TP9,TP10,TP12 THT Ring test point TPTH-ANELLO-1MM
T1,T2 Common mode choke, SMD 4.7x4.5 mm N.M.
U1,U2 Galvanically isolated 4 A single gate driver STGAP2HSM
U3,U4 5.2KVDC isolated 2W Gate Drive DC-DC converters MGJ2D051509SC
VP1 PCB assembly version solder dot Full
VP2,VP3,VP4 PCB assembly version solder dot Empty
P.C.B. EVALSTGAP2HS Rev.1
EVALSTGAP2HSM Bill of material
DB4269 - Rev 1 page 5/12
3 Layout and component placements
Figure 3. EVALSTGAP2HSM – Layout (component placement top view)
Figure 4. EVALSTGAP2HSM – Layout (component placement bottom view)
EVALSTGAP2HSM Layout and component placements
DB4269 - Rev 1 page 6/12
Figure 5. EVALSTGAP2HSM – Layout (top layer)
Figure 6. EVALSTGAP2HSM – Layout (bottom layer)
EVALSTGAP2HSM Layout and component placements
DB4269 - Rev 1 page 7/12
Revision history
Table 2. Document revision history
Date Version Changes
08-Sep-2020 1 Initial release.
EVALSTGAP2HSM
DB4269 - Rev 1 page 8/12
Contents
1 Schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Bill of material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
3 Layout and component placements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
EVALSTGAP2HSM Contents
DB4269 - Rev 1 page 9/12
List of tablesTable 1. Bill of Material – components common to all device variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Table 2. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
EVALSTGAP2HSM List of tables
DB4269 - Rev 1 page 10/12
List of figuresFigure 1. EVALSTGAP2HSM circuit schematic – gate drivers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Figure 2. EVALSTGAP2HSM circuit schematic – supply, connectors and decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . 3Figure 3. EVALSTGAP2HSM – Layout (component placement top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Figure 4. EVALSTGAP2HSM – Layout (component placement bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Figure 5. EVALSTGAP2HSM – Layout (top layer). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 6. EVALSTGAP2HSM – Layout (bottom layer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
EVALSTGAP2HSM List of figures
DB4269 - Rev 1 page 11/12
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to STproducts and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. STproducts are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design ofPurchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or servicenames are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2020 STMicroelectronics – All rights reserved
EVALSTGAP2HSM
DB4269 - Rev 1 page 12/12