data acquisition card for Labview

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T.E. Project Report On Data Acquisition Card forLabVIEW Submitted by, Gayatri Gote (T80023053) Megha Pardhi (T80023120) Sayali Shirode (T80023174) Project Guide: Prof. Alwin Anuse ( Internal Guide) TE Div :I Year: 2013-2014 Maharashtra Institute of Technology, Pune – 38. Department of Electronics and Telecommunication 1

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Transcript of data acquisition card for Labview

T.E. Project Report

On

Data Acquisition Card forLabVIEW

Submitted by,Gayatri Gote (T80023053)Megha Pardhi (T80023120)Sayali Shirode (T80023174)

Project Guide:Prof. Alwin Anuse ( Internal Guide)TE Div :I

Year: 2013-2014

Maharashtra Institute of Technology, Pune 38.

Department of Electronics and Telecommunication

CERTIFICATEMAEERsMAHARASHTRA INSTITUTE OF TECHNOLOGY, PUNE.

This is to certify that the project entitled

Data Acquisition Card forLabVIEW

has been carried out successfully by

Gayatri Gote (T80023053)Megha Pardhi (T80023120)Sayali Shirode (T80023174)

during the Academic Year 2013-2014 in partial fulfillment of theircourse of study for third year in Electronics andTelecommunication asper the syllabus prescribed by theUniversity of Pune.

Prof. Alwin Anuse Prof. Dr. G. N. MulayInternal Guide Head Of Department(Electronics & Telecommunication)MIT, Pune

Project AbstractIndustrial PC I/O interface products have becomeincreasingly reliable, accurate and affordable. PC-baseddata acquisition and control systems are widely used in industrial andlaboratory applications like monitoring, control, data acquisition andautomated testing.Selecting and building a DA&C (Data Acquisition and Control) systemthat actually does what you want it to do requires some knowledge ofelectrical engineering.It includes Transducers and actuators, Signal conditioning, Data acquisition and control hardware,Computer systems software.Thus, through this project we have processed, analyzed, stored, and displayed the acquired data with the help of software.

INDEXLIST OF CONTENT Page No1] Title 1 Certification 2 Project Abstract 3 Index 4 List of figure5

2] CHAPTER 1 :- 1.1 Introduction 8 1.2 Scope 93] CHAPTER 2 :- 2.1 Review of Literature 10 2.2 Present Scenario 104] CHAPTER 3 :-System Development3.1 Specification 113.2 Block Diagram & Description 123.3 Complexities Involved 133.4 Circuit Diagram& Description 145] Modular Design Hardware Component Selection 15 System Algorithm 17 System Flowchart 1826]CHAPTER 4Testing and simulated waveforms

7] Component List with ratings & Bill of Materials 19 7.1 Conclusion 198] Appendix8.1 Artwork/Layout20 8.2 Datasheet 21

LIST OF FIGURES

1. Data Acquisition System 72. NI DAQ 93. Pin outDiagram of DAQ 104. Circuit Board 115. Block Diagram 146. Circuit Diagram 157. Pin diagram of LM7805 178. OP07 179. MAX232 IC 1810. DAC0808 1811. System Flowchart 20 12. Front Panel and Back Panel-VI2113. Testing waveforms 22, 2314. Artwork Layout 26

CHAPTER 1:Introduction

Traditionally, measurements are done on stand alone instruments of various types-oscilloscopes, multi meters, counters etc. However, the need to record the measurements and process the collected data for visualization has become increasingly important.

There are several ways in which the data can be exchanged between instruments and a computer. Many instruments have a serial port which can exchange data to and from a computer or another instrument. Use of GPIB interface board (General purpose Instrumentation Bus) allows instruments to transfer data in a parallel format and gives each instrument an identity among a network of instruments.

Another way to measure signals and transfer the data into a computer is by using a Data Acquisition board. A typical commercial DAQ card contains ADC and DAC that allows input and output of analog and digital signals in addition to digital input/output channels.

Scope

Project can be used in the areas where data acquisition is necessary like in greenhouse controller, medical systems.With further development,can be used for complex and specific industrial applications.

Advantages of using LabVIEW

CHAPTER 2:

Review of Literature

IEEE papersExperimental Characterization of the MIMO wireless channel:Data acquisition and analysisThe AVR Microcontroller and embedded system using assembly and C -Muhammad Ali MazidiSarmad NaimiSepehr NaimiProgramming and Customizing the AVR microcontroller-Dhananjay.V.Gadre

Websiteswww.avrfreaks.com Study of ATmega32 literature and its codingwww.datasheetcatalog.com Datasheet of components

PRESENT SCENARIO: At present there is a DAC card available from National instruments named as NI ADC 6008/6009 series. But these cards are so costly that they cannot be made part of low cost projects. NI DAC 6009

CHAPTER 3

SYSTEM DEVELOPMENT:

ANALOG INPUT

Converter type Successive approximation

Analog input 4 channel , single ended

Input range0-5 Volts

Working voltage 9 Volts, 500mA

ANALOG OUTPUT

Analog output 2

Output range 0-5 Volts

PHYSICAL CHARACTERISTICS

Dimensions 18cm x 12.5cm

CONNECTIVITY

RS232 Serial Communication

3.1.SPECIFICATIONS:-

A.POWER SUPPLY:-1. Operating voltage for sensors- 9 V2. Operating voltage for microcontroller,DAC,MAX232- 5 VB.SENSORS:-For voltage range 0-1 V apply a gain of 3.For range exceeding above 1 V apply the output directly.

C.OP07:-Gain for sensors operating at 0-1 V is obtained by selecting input resistance R1=100ohms and feedback resistance Rf=300ohms.Thus,gain=Rf/R1=300/100=3.

D.ATmega32:-Operating voltage is 5 V.32Kbytes-flash memoryInternal 10 bit ADC

E.DAC 0808:-8 bit DAC

F.Serial Communication:-RS232 with baud rate as 4800bps.

LabVIEW

Laboratory Virtual Instrumentation Engineering Workbench Platform independent nature. LabVIEW can communicate with any instrument that connects to your computer if you know the interface type Use the Measurement & Automation Explorer (MAX) to detect, configure, and test your GPIB interface and instruments Graphical approach allows non-programmers to build program easily For complex algorithm expertise in LabVIEW syntax is needed. LabVIEW runtime engine Reduces compile time Provides consistent interface to various OS Acquire, Analyze , PresentLabVIEW ProgrammingStrings Front Panel ObjectsNumeric NumericsWaveforms ThermometerDynamic data types GagesLoops ControlWhile loops IndicatorFor loops GraphsAccessing previous node data ChartsArraysClustersDecisionsSelect functionCase structuresConstants

3.2 BLOCK DIAGRAM:

Block diagram consist of sensors, signal conditioning system, microcontroller-atmega32, Max232,DAC0808 and power supply. Basically the sensor is a device which converts physical quantity in electrical signal like voltage and current. In this project the output of sensor is given to signal conditioning system which consists of amplifier (OP07) of gain 3 . And further it is given to microcontroller (ATmega32) which consists of internal ADC(10Bit).After conversion of this electrical signal into digital , it is transmitted serially via max232.

Circuit Diagram:

CIRCUIT DIAGRAM DESCRIPTION:-Above fig. shows the circuit diagram for data acquisition card. Basically we have considered 4 channels out of which 2 of them are used for sensors providing voltage range as 0-1 V which requires to be amplified. So they are applied to OP07 which provides gain of 3.For sensors exceeding range of 1 V are directly applied to ATmega32.OP07 operates at 9 V provided by battery which is further applied to LM7805 i.e a regulator IC since the operating voltage of the remaining circuitry is 5 V.The output of sensor is applied to port A which is converted to digital data at port B since ATmega32 consists of internal ADC. Digital data obtained from port B is applied to DAC0808 so as to get analog output. Further the data is serially transmitted to PC by serial communication circuitry.

3.3 Complexities involved

We face the challenge of implementing unique sensor interface designs everytime a new and different sensor is selected which is troublesome because every sensor provides output in parameters like voltage, current, resistance and it involves universal signal conditioning.Universal Signal Conditioning IC SSP1492 is not easily available.So the solution for this problem is that we have considered the sensors which provide voltage output only. If we want to use sensors that provide output in parameter other than voltage then user has to use special circuitry which converts output parameter into voltage.

Modular Design

A.POWER SUPPLY9 V through battery for sensors. Operating voltage for remaining circuitry is 5 V so it is obtained by regulator IC 7805.

C.SIGNAL CONDITIONINGAD620

AD620AN - AD620 Ins

OP07

Low VOS: 75 V MaxLow VOSDrift: 1.3 V/C MaxUltrastable vs. Time: 1.5 V/Month MaxLow Noise: 0.6 V p-p MaxWide Input Voltage Range: 14 VWide Supply Voltage Range:3 V to 18 VFits 725, 108A/308A, 741, AD510 Sockets125C Temperature-Tested Dice

D.MAX232:

For Low-Voltage, +3.0V to +5.5V, Low-Power, Up to 1Mbps, True RS-232 Transceivers Using Four 0.1F External Capacitors

Battery-Powered RS-232Systems Interface Translation Low-Power Modems Multidrop RS-232 Networks Portable Computing

:

E. DAC0808:

Relative Accuracy: 0.19% error maximumFull scale current match: 1 LSB typicalFast Settling Time: 150 ns typicalNoninverting digital inputs are TTL and CMOS compatiblePower Supply Voltage Range: 4.5V to 18VLow power consumption: 33 mW @ 5V

SYSTEM ALGORITHM 1. Start1. Initialize ADC and USART. Enable serial transmission 1. Check for any input from signal conditioning circuit to channel 1-channel 4 of ADC1. If any data is present on channel convert it into digital form1. Store the converted data in a variable1. Check if UDR register is ready to transmit 1. Send data to UDR register for serial transmission1. Receive data in LabVIEW through serial transmission1. Display data of selected channel

SYSTEM FLOWCHART

FRONT PANNEL AND BACK PANNEL OF LabVIEW VI

CHAPTER 4:Testing and waveforms

Output waveforms for Testing done for temperature sensor LM 35. For Room Temperature ,increasing temperature and decreasing temperature respectively.

Output Waveform when temperature is constant

Output Waveform for increasing temperature

Output waveform for decreasing temperature

COMPONENT LIST

No.Part NameQuantityAmount

1.LM35150

2.LDR110

3.OP07315

4.Power supply-9 V140

5.LM7805112

6.ATmega321250

7.MAX232140

8.DAC08081100

9.RS232 cable1100

10.USB to serial converter1250

11.USB cable180

12.DB 9 connector118

12.

Capacitors-10uF -100nF -22pF

63245

13.Resistors66

14.XTAL-16Mhz110

15.PCB1350

16.Others200

Total1576

FUTURE SCOPE Wireless module On chip memory Mobile application Continuous operation for various sensors Compatible between hardware and software-no need of drivers since serial transmission.

CONCLUSION:Thus, through this project we have processed, analyzed, stored, and displayed the acquired data with the help of software.

ARTWORK LAYOUT

DATASHEETS

OP07

FEATURES

Low VOS: 75 V maximumLow VOSdrift: 1.3 V/C maximumUltrastable vs. time: 1.5 V per month maxLow noise: 0.6 V p-p maximumWide input voltage range: 14 V typicalWide supply voltage range: 3 V to 18 V125C temperature-tested dice

APPLICATIONS

Wireless base station control circuitsOptical network control circuitsInstrumentationSensors and controls ThermocouplesResistor thermal detectors (RTDs)Strain bridgesShunt current measurements Precision filters

DAC0808

Relative accuracy:0.19% error maximumFull scale current match:1 LSB typFast settling time: 150 ns typNoninverting digital inputs are TTL and CMOScompatibleHigh speed multiplying input slew rate: 8 mA/sPower supply voltage range:4.5V to18VLow power consumption: 33 mW@5V

MAX232

Meets or Exceeds TIA/EIA-232-F and ITURecommendation V.28Operates From a Single 5-V Power SupplyWith 1.0-_F Charge-Pump CapacitorsOperates Up To 120 kbit/sTwo Drivers and Two Receivers30-V Input LevelsLow Supply Current ...8 mA TypicalESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)Upgrade With Improved ESD (15-kV HBM)and 0.1-_F Charge-Pump Capacitors isAvailable With the MAX202ApplicationsTIA/EIA-232-F, Battery-Powered Systems,Terminals, Modems, and Computers

ATmega32

Features High-performance, Low-power Atmel AVR 8-bit Microcontroller Advanced RISC Architecture 131 Powerful Instructions Most Single-clock Cycle Execution 32 x 8 General Purpose Working Registers Fully Static Operation Up to 16 MIPS Throughput at 16 MHz On-chip 2-cycle Multiplier High Endurance Non-volatile Memory segments 32Kbytes of In-System Self-programmable Flash program memory 1024Bytes EEPROM 2Kbyte Internal SRAM Write/Erase Cycles: 10,000 Flash/100,000 EEPROM Data retention: 20 years at 85C/100 years at 25C Optional Boot Code Section with Independent Lock BitsIn-System Programming by On-chip Boot ProgramTrue Read-While-Write Operation Programming Lock for Software Security(1) JTAG (IEEE std. 1149.1 Compliant) Interface Boundary-scan Capabilities According to the JTAG Standard Extensive On-chip Debug Support Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface Peripheral Features Two 8-bit Timer/Counters with Separate Prescalers and Compare Modes One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode Real Time Counter with Separate Oscillator Four PWM Channels 8-channel, 10-bit ADC8 Single-ended Channels7 Differential Channels in TQFP Package Only2 Differential Channels with Programmable Gain at 1x, 10x, or 200x Byte-oriented Two-wire Serial Interface Programmable Serial USART Master/Slave SPI Serial Interface Programmable Watchdog Timer with Separate On-chip Oscillator On-chip Analog ComparatorSpecial Microcontroller Features Power-on Reset and Programmable Brown-out Detection Internal Calibrated RC Oscillator External and Internal Interrupt Sources Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standband Extended Standby I/O and Packages 32 Programmable I/O Lines 40-pin PDIP, 44-lead TQFP, and 44-pad QFN/MLF Operating Voltages 2.7V - 5.5V for ATmega32L 4.5V - 5.5V for ATmega32 Speed Grades 0 - 8MHz for ATmega32L 0 - 16MHz for ATmega32 Power Consumption at 1 MHz, 3V, 25C Active: 1.1mA Idle Mode: 0.35mA Power-down Mode: < 1A

LM7805

3-Terminal RegulatorsOutput Current up to 1.5 AInternal Thermal-Overload Protection

High Power-Dissipation CapabilityInternal Short-Circuit Current LimitingOutput Transistor Safe-Area Compensation

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