CVP-360 Solder Paste - Alpha · 2013. 6. 3. · CVP-360 Solder Paste ... You can count on...

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1

CVP-360 Solder Paste

ALPHA®

CVP-360 Solder PasteProduct guide

A high performance low silver SACX® capable paste, designed to outperform SAC alloy paste in spread, wetting and in circuit pin test yield


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CVP-360 Solder PasteCVP-360 Solder Paste

Welcome to theALPHA® CVP-360 Product Guide

Introduction 3Performance Summary 4Print Performance 5-17Reflow Performance 18-40

In-Circuit Pin Testing 41-44

Reliability 45-58

Contents Page #

Summary 59-63


3


Introduction

Introducing ALPHA® CVP-360, a SACX® capable solder paste with a best in class combination of solder paste print volume and volume repeatability, reduced print cycle time, solder spread and wetting on OSP pad finishes, with maximum in circuit test yield.

The result is a more first time right assemblies, that are easier to test, PLUS the inherent economy of SACX® low silver solder alloy, along with resistance to thermal cycling that you would expect from higher silver SAC alloys.

Cookson’s world class phase gate product development process began with a rigorous set of product specifications based on the voice of our customers. Exhaustive lab and field testing have resulted in a robust, high yield product that can solve one or more of your challenges associated with lead free, surface mount assembly.

You can count on Cookson’s complete support with our global team of technical experts, whenever and however you need us. It’s the kind of support you would expect from a company that’s remained dedicated to serving the needs of the Global circuit assembly market for over 50 years.


4


Performance SummaryProcess Benefit CVP-360 Property Performance Capability

Fine Feature Print DefinitionExcellent print definition and consistant volumetric performance to 0.30mm(12 mil) circles and 0.4mm (16 mil) pitch rectangular QFP pads.

Tack Life >24 hours at 25%, 50% and 75% Relative Humidity

Temperature Window Capable of printing in temperatures from 20°C to 30°C (68°F to 86°F)

Print Consistancy Repeatable volume deposition and low volume variability on 0.30mm (12 mil) circles with 125 micron (5mil) thick stencil.

Print Speed Range25mm/second to 150mm/second (1 inch/second to 6 inches/second) down to 0.30mm (12 mil) circles and .4mm (16 mil) pitch QFP pads.

Peak Reflow Temperature 235º C to 245º C

Resistance to VoidsExceeds requirements of IPC 7095 Class lll using soak reflow profile. Class III with straight ramp profile and 1% Ag BGA alloy spheres.

Resistance to Hot and Cold Slump

Exceeds the requirements of IPC J-STD-005 for hot and cold slump.

Flux Residue Cosmetics Clear, colorless residue.SIR Meets/Exceeds JIS, IPC and Bellcore Requirements

Electromigration Resistance Meets/Exceeds JIS, Bellcore and HP EL-EN 861-00 Requirements

J-STD-004 Classification ROM0Halide Content Halide Free

Inspection In Circuit Pin Testing 100% first pass yield virtually eliminating false negatives during in circuit pin testing.

Print Process Window

Reflow Yield

Electrical Reliability

Performance Summary


5


Printing: Smallest Printed FeaturePrint Performance

High Volume and Volume Repeatability with 12 mil (0.3mm) Diameter Circles Using 5 mil (125µ) Thick Stencil

CpK 2.76 @ 0.60 Area Ratio

630540450360270180900

LSL USL

LSL 225Target *USL 621.5Sample Mean 425.827Sample N 3600StDev(Within) 23.6507StDev(Overall) 31.0524

Process Data

Cp 2.79CPL 2.83CPU 2.76Cpk 2.76

Pp 2.13PPL 2.16PPU 2.10Ppk 2.10Cpm *

Overall Capability

Potential (Within) Capability

PPM < LSL 1666.67PPM > USL 0.00PPM Total 1666.67

Observed PerformancePPM < LSL 0.00PPM > USL 0.00PPM Total 0.00

Exp. Within PerformancePPM < LSL 0.00PPM > USL 0.00PPM Total 0.00

Exp. Overall Performance

WithinOverall

BGA225-12mil


6


Printing: Print Speed Process WindowPrint Performance

SpeedBoard

6 in/sec4 in/sec2 in/sec1 in/sec4321432143214321

1000

800

600

400

200

0

Vol

ume

(cub

ic m

ils)

60% of Theoretical Volume (530 cubic mils)

1 in/sec

2 in/sec

4 in/sec

6 in/sec

Speed

CVP-360 Lot# 90203005M Print Volume Repeatability ChartBGA36 (15 mil circles)

Consistent print deposit volume at speeds from 1 inch (25mm)/second to 6 inches (150 mm)/second


7


Printing: Response to pausePrint Performance

ConditionBoard

After 2 hr PauseAfter 100 KneadsOut of Jar432143214321

1200

1000

800

600

400

200

0

Vol

ume

(cub

ic m

ils)


Out of Jar

After 100 Kneads

After 2 hr Pause

Condition

CVP-360 Lot# 90203005M Out of Jar/ Response to Pause Volume ChartBGA36 (15 mil circles)

No knead stroke required after 2 hour pause in printing


8


Print Performance

Using SIX Sigma DOE technique, with print volume and print volume variation as response variables, ranges for squeegee speed (25 to 150mm/sec.),

squeegee pressure (0.22 to 0.36 kg/cm) and stencil release speed (3 to 10 mm/sec.) have been established.

600000

400000

200000

0.100.060.02

2.01.40.8

600000

400000

200000

6.03.51.0

600000

400000

200000

Print Speed

Print Pressure

Stencil Release

1.0

3.56.0

Speed

Print

1.0

3.56.0

Speed

Print

0.81.4

2.0

Pressure

Print

0.81.42.0

PressurePrint

0.02

0.060.10

Release

Stencil

0.020 06

Release

Stencil

Interaction Plot for Std. Deviation-12mil BGA225Data Means


9


Print PerformancePrinting – Resistance to Dog Ears

.05 in.(1.3mm)/sec Snap Off Speed

.10 in.(2.6mm)/sec

Increasing Stencil Snap Off Speed Reduces Occurrence of “Dog Ears”

Recommended Window .12-.4 in. (3-10mm)/sec


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Print Performance

Wipe Frequency

Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%)1 0 0 0 02 0 0 0 03 0 0 0 04 0 0 0 05 >10 0 0 06 7 0 0 07 4 0 0 08 >10 0 0 09 >10 0 1 010 4 0 0 0

CVP-360 #081202-P1QFP Pitch

Number of Bridges

Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%)1 0 0 0 02 0 0 0 03 0 0 0 04 >10 0 0 05 7 0 0 06 0 0 0 07 10 0 1 08 >10 1 0 09 7 0 0 010 6 0 0 0

Leading SAC305 BrandNumber of Bridges

QFP Pitch

Equal or better than Leading SAC305 Brand-Reducing Average Print Cycle Time


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Stencil Life – Volume DataPrint Performance

T-8T-7T-6T-5T-4T-3T-2T-1T-0

1000

800

600

400

200

0

Time (hrs)

Vol

ume

(cub

ic m

ils)

Theoretical Volume (884 cubic mils)


CVP-360 Lot# 90203005M Stencil Life DataBGA36 (15 mil circles)

The solder paste is printed continuously for 8 Hours. Volume measurements are taken every hour to confirm

paste’s stencil life.


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Stencil Life – Volume DataPrint Performance

T-8T-7T-6T-5T-4T-3T-2T-1T-0

4000

3000

2000

1000

0

Time (hrs)

Vol

ume

(cub

ic m

ils)

Theoretical Volume (3150 cubic mils)


CVP-360 Lot# 90203005M Stencil Life DataQFP120-1 (16 mil pitch, 63x10x5 mils)

Minimal volume change over 8 hours of continuous printing using 5 mil (125µ) thick stencil


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Stencil Life: Malcom Viscosity MethodPrint Performance

No increase in viscosity over 24 hours at 25ºC

Continuous viscosity: CVP-360

0

500

1000

1500

2000

0 5 10 15 20 25 30

Time(s)

Pois

e @

10

rpm


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Stencil Life – 12 mil pitch QFP

Reflowed after 0 hours of continuous printing

Print Performance




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Print Performance

Stencil Life – Rheology

1

10

100

1000

1 10Shear rate (1/s)

Log

Visc

osity

(pas

)

t=0 t=1 t=2 t=3t=4 t=5 t=6 t=7t=8 t=9 t=10 t=11t=12 t=13 t=14 t=15t=16 t=17 t=18 t=19

ALPHA CVP-360 SACX Lot90304020M

Stable Rheology over 19 hours


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Acceptable viscosity after 2 weeks at 25 °C:10 days at 32 ºC.

0

500

1000

1500

2000

2500

0 5 10 15 20Time (# of days)

Visc

osity

(poi

se)

Room Temperature & 32oC Stability

CVP-360 @ 25oCCVP-360 @ 32oC

Print Performance


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Print Performance

Tack / Tack Life

0.00.51.01.52.02.53.03.5

0 5 10 15 20Time (hours)

Tack

(g/m

m2)

Requirement:IPC – Measure and report up to 24 hours.

Requirement:JIS – Tack force > 100 g after 24 hours.

IPC

0

20

40

60

80

100

120

140

0 5 10 15 20Time (hours)

Tack

(gf)

JIS


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Reflow Performance

Reflow Process GuidelinesParameter GuidelineAtmosphere Air Preferred

SnAgCu alloy melting ranges. Lower temperature=solidus;

higher temperature = liquidus

SACX® 0807: 217 – 225°CSACX® 0307: 217 – 228°C

Profile General Guideline

Setting Zone Optimal Dwell Period40°C to 228°C 60 s – 260 s

Above 225°C 45 - 90 sec.

Peak temp. < 240°C for Entek Plus OSP finish

Joint cool down rate from 170°C > 3°C – 6°C


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Reflow Performance

Example Reflow Profile P1

Top Side Setting(ºC) 150 180 210 240 260 260Bottom Side Setting(ºC) 150 180 210 240 260 260

Conveyor Speed 60mm/sec


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Reflow Performance

Example Reflow Profile P2

Conveyor Speed 70cm / minuteTop Side Setting(ºC) 150 180 200 210 230 260Bottom Side Setting(ºC) 150 180 200 210 230 260


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Reflow Performance

Example Reflow Profile P3Conveyor Speed 60cm / minute



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Reflow Performance

Example Reflow Profile P4Conveyor Speed 60cm / minute



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Reflow Performance

Example Reflow Profile Summary

Profile

Average Time to Reach

130ºCmin:sec


170ºCmin:sec

Average Time Above

220ºCmin:sec


220ºCmin:sec

Average Time Above

225ºCmin:sec


225ºCmin:sec

P1 01:09.5 01:37.5 01:31.0 02:27.5 01:14.5 02:38.0P2 01:11.0 01:45.0 01:36.0 02:37.0 01:20.5 02:46.0P3 01:23.5 02:05.0 01:25.5 03:25.0 01:10.5 03:32.5P4 01:09.0 01:50.5 01:34.0 03:19.0 01:20.0 03:26.0


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Reflow Performance

Cross Print Wetting Test

One of the spread/wetting test included on the CERF board involves printing pairs of solder paste stripes

over equally spaced traces on the board. The spacing between the solder paste stripes range from 0.3mm up to 1.0mm (increasing by 0.1mm increments) and the stripes are printed perpendicular to the traces on the

board as shown above.

Wetting test cross-print pattern, Prior to reflow.

Upon reflow, the solder melts and since it does not wet to the masked surface between the traces, it pulls back to the metal and spreads out along the

traces. If there is enough spread, the gap between the two adjacent solder spots is bridged. There are a

maximum number of 20 bridges possible for each gap size. The bridges are counted, percentages computed and plotted for each profile against the

gap size.

Wetting test cross-print pattern, post reflow.


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Cross Print Spread Reflow Performance

0%

20%

40%

60%

80%

100%

0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

Gap size (mm)

% o

f Gap

s B

ridg

ed

CVP-360 (lot# 81202P1) SACX0807

Leading SAC305 Brand

Profile: Straight ramp 1.5C/s 245ºC peakBetter spread than Leading SAC305 Brand


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Reflow Performance

Spread per JIS Z-3284

Oxidized Cu, Solder bath at alloy MP + 50 °C

86.7% 87.9%

Leading SAC 305

CVP-360 SACX0807

Better than Leading SAC305 Brand


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Reflow Performance

Self Alignment During Reflow

16 mil pitch QFP after placement, before reflow 16 mil pitch QFP after placement, after reflow

Component Self Alignment = Fewer Reflow Defects


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Reflow Performance

DPAK

Reflow / Pad WettingLeading SAC 305 Brand CVP-360

LQFP120 16 mil pitch

Profile: 1.5C/sec soak 250 C peak (Air)Reflow better/equal to Leading SAC 305 Brand-

No de-wetting observed


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Reflow / Fillet Wetting Reflow Performance

Leading SAC 305 Brand CVP-360

QFP120 (16 mil pitch)Profile: 1.5C/sec soak 250 C peak (Air)


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Reflow Performance

IPC Cold & Hot Slump Test Results

CVP-360 Lot# 081202-P1, SACX0807 88.5%

Pad Size 00.63 x 2.03mm

0.33 x 2.03mm

0.63 x 2.03mm

0.33 x 2.03mm

Largest Gap Bridged No Bridges 0.1 0.33 0.2

IPC max gap 0.48 0.2 0.56 0.25bridge allowed Pass Pass Pass Pass

Cold Slump 25C / 50% / 75% RH

Hot Slump Oven 150C / 10mins

PASSES Hot/Cold Slump per IPC J-STD-005


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Reflow Performance

DIN SlumpDIN - 1 hr @ RT + 20 min @ 80 C

Small: 0.2 mm OKLarge: 0.3 mm OK

DIN Requirement: - Large/Small - No bridge ≥0.3/0.2 mm (PASS)


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Reflow Performance

JIS Slump Resistance JIS 20 sec @ 150 C

Large: 0.4 mm OK Small: 0.4 mm OK

Both Pass


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Paste In Hole Performance2.5 mm overprint 7.5 mm overprint

Before reflow

3.75 mm overprint


Reflow Performance

After reflow

Excellent Pin in Paste Performance


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Reflow Performance

Paste In Hole PerformanceRCA Jack – Bottom side after reflow

Complete wetting down barrel No dripping or excess solder on pins

on bottom side.

3.75 mm overprint w / connector – bottom

side after reflow


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Residue Tackiness

Residue Tackiness Procedure:

Reflow paste in air, let cool. Sprinkle talc & store 24 hours.Brush with paintbrush.

Requirement: Talc removed by brush - PASS

Reflow Performance


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Random Solder ball – Straight Ramp 1.5oC/sec, peak 245oC

Meets IPC visual criteria for solder balling

4 hours @ 50 % RHInitial

Reflow Performance

CVP-360 CVP- 360

Equal / better than Leading SAC305 Brand on maskOM360SAC305 CVP- 360


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Random Solder ball – High Soak 160oC/60sec, 240oC peak

Meets IPC visual criteria for solder balling

Initial

OM360OM338PT PNC0808A

PNC0808A

4 hours @ 50 % RH

CVP-360CVP-360


Reflow Performance


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Resistance to Voiding

OM338PT

Reflow Performance

Soak profile reduces voiding versus straight ramp profile (20 mil circles, SAC 305 alloy BGA spheres)

Void Size DistributionBGA256 20 mil circles

0.00%

10.00%

20.00%

30.00%

40.00%

50.00%

60.00%

70.00%

80.00%

90.00%

100.00%

ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%

% of Joint area

% o

f Joi

nts

CVP-360 Cerf 1.5c_s 245c Peak60s TAL_SACX

CVP-360 Cerf 160c_60s Soak240c Peak 60s TAL


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Resistance to VoidingReflow Performance

10% Aperture reduction also reduces voiding

Void Size DistributionBGA256 90%

0.00%

10.00%

20.00%

30.00%

40.00%

50.00%

60.00%

70.00%

80.00%

90.00%

100.00%

ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%

% of Joint area

% o

f Joi

nts

CVP-360 Cerf 1.5c_s 245cPeak 60s TAL_SACX

CVP-360 Cerf 160c_60s Soak240c Peak 60s TAL

OM338PT


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Reflow Performance

Resistance to Voiding4 hours @ 50 % RHInitial

OM338PT

Void Size Distribution - SACX0807 CVP-360 Paste, SAC105 CBGA84 (12 mil spheres on 20 mil pitch)

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%

% of Joint area

% o

f Joi

nts

Ramp: 0.7 C/sec, 240 Peak,TAL - 85 s

Ramp: 1.5 C/sec, 245 Peak,TAL - 45 s

Best results with 1% Silver BGA spheres


41


Pin Testability (Flying Probe Method)Pin Testability

Pad type: A B C D

A – 1.0 mm sq pads B – 1.0 mm sq pads with 0.33 mm vias C - 0.7 mm round pads D – 0.7 mm round pads with 0.33 mm vias

All pads coated with Cu-OSP (Entek Plus 106A)Data is average of 3 boards with 1000 pads of each type / board.

Reflow: 238 °C peak, sharp chisel, 6.5 oz. force

PNC0802A 12000 contacts


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Pin Testability

Pin Testability (Flying Probe Method)

Equal to or better than Leading, Pin Testable SAC305 Paste

Dramatically reduced level of residue from

CVP-360

A B C DPaste

Leading SAC Paste 100% 91.60% 100% 72.40%CVP-360 100% 97.80% 99.40% 99.80%

Pad Type

Pin Test Yield %

Flying Probe Pin Test Yields


43


Pin Testability

Clamshell Fixture Pin Test

3 Pin Shapes

4 Pin Probe Pressures


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Similar or Better Resistance to ICT False Failures vs. Leading Pin Testable SAC Paste

% Open % Open

2 0 04 0 06 0 08 0 02 0 18.14 0.6 1.36 0 08 0 02 0 04 0 06 0 08 0 02 0 12.54 0 06 0 08 0 0

Crown

Spear

Crown

Pin Shape

Force (oz)

Blade

Leading SAC Paste

CVP-360

In Circuit Testing Results: Clam Shell

Pin Testability


45


Reliability

IPC Compliance

Cu Mirror: Pass (flux & paste)

CVP-360


46


Reliability

IPC Compliance

Ag Chromate paper: Pass

Paste is halide free ROM0WER: 8.8 × 104 Ω-cmHalogen content: <700 ppm (flux)


47


Bellcore SIR- PassReliability

SIR TEST REPORT - BELLCORE Request: (per GR-78-CORE Issue 1, Sept 97)

Test #: 0806-44b Date: 12/5/2008 T/H/B:35/85/-48Tested by: K. Tellefsen Reported by:K. TellefP/F limit:1E11 Ohms_________________________________________________________________MATERIAL TESTED/ SIR SIR COMMENTSCONDITION (1 day) (4 days) -------- --------CVP-360 4.7E+12 2.8E+12 Visually OKReflowed Paste SACX0807 5.0E+12 3.7E+12uncleaned 2.7E+10 4.5E+10 5.3E+11 4.8E+11 9.0E+11 9.9E+11 6.2E+12 5.0E+12 1.4E+12 1.7E+12 1.0E+10 1.3E+10 2.4E+10 4.1E+10 2.9E+10 4.5E+10 4.0E+12 4.8E+11 3.7E+10 5.3E+10 ----- -----Geometric mean: 3.4E+11 3.2E+11_________________________________________________________________

Control boards 1.1E+14 1.1E+14 1.1E+14 1.1E+14 5.0E+13 5.0E+13 8.3E+12 7.6E+12 7.6E+12 1.1E+13 9.9E+13 9.9E+13 5.0E+13 3.3E+13 2.5E+13 2.2E+12 1.1E+14 7.1E+12 9.9E+12 5.0E+12 1.6E+12 5.7E+11 4.7E+12 7.6E+12 ----- -----Geometric mean: 2.4E+13 1.4E+13


48


Reliability

IPC SIR- Pass SIR TEST PER J-STD-004 Request: **********************Test #:0806-44i Date: 11/24/2008 T/H/B 85C/85%RH/-48VTested by: K. Tellefsen P/F limit:Reported by: K. Tellefsen 1.0E+08 ohms_____________________________________________________________________________MATERIAL TESTED/ Initial SIR(ohms) SIR SIR Final COMMENTSCONDITION ambient (1 day) (4 days)(7 days) ambientCVP-360 SACX0807 >1.0E12 6.4E+08 3.4E+09 4.6E+09 >1.0E12 passed electricalReflowed paste >1.0E12 8.8E+08 7.9E+09 8.5E+09 >1.0E12 and visualuncleaned >1.0E12 8.1E+08 7.4E+09 8.2E+09 >1.0E12 requirements >1.0E12 6.5E+08 4.8E+09 5.6E+09 >1.0E12 >1.0E12 1.7E+09 1.6E+09 2.3E+09 >1.0E12 >1.0E12 1.8E+09 5.4E+09 6.2E+09 >1.0E12 >1.0E12 1.7E+09 2.1E+09 3.5E+09 >1.0E12 >1.0E12 1.8E+09 2.2E+09 3.2E+09 >1.0E12 >1.0E12 1.5E+09 8.6E+08 1.0E+09 >1.0E12 >1.0E12 6.8E+08 3.3E+08 2.5E+08 >1.0E12 >1.0E12 4.9E+08 1.9E+08 1.5E+08 >1.0E12 >1.0E12 1.5E+09 8.8E+08 5.6E+08 >1.0E12 ------- ------- ------- ------- -------Arithmetic mean: >1.0E12 1.2E+09 3.1E+09 3.7E+09 >1.0E12_____________________________________________________________________________Control boards >1.0E12 8.4E+10 4.5E+10 5.0E+10 >1.0E12 >1.0E12 1.0E+11 4.9E+10 5.6E+10 >1.0E12 >1.0E12 2.0E+11 1.2E+11 1.0E+11 >1.0E12 >1.0E12 9.6E+10 4.8E+10 4.1E+10 >1.0E12 >1.0E12 1.5E+11 8.1E+10 7.5E+10 >1.0E12 >1.0E12 9.6E+10 5.6E+10 4.6E+10 >1.0E12 >1.0E12 9.2E+10 5.4E+10 4.3E+10 >1.0E12 >1.0E12 1.4E+11 7.2E+10 8.1E+10 >1.0E12 >1.0E12 5.8E+10 3.1E+10 3.3E+10 >1.0E12 >1.0E12 5.7E+10 2.9E+10 3.0E+10 >1.0E12 >1.0E12 7.6E+10 4.8E+10 4.5E+10 >1.0E12 >1.0E12 1.1E+11 5.7E+10 5.4E+10 >1.0E12 ------- ------- ------- ------- -------Arithmetic mean: >1.0E12 1.0E+11 5.8E+10 5.5E+10 >1.0E12


49


Reliability

IPC SIR- PassIPC SIR CVP-360


50


Reliability

Bellcore EM- Pass Bellcore Electromigration (per GR-78-CORE Issue 1, September 1997) Request:Test #:0806-44e Start dat11/17/08bias = 10 V T/H: 65/85Tested by: K. Tellefsen Reported by: K. Tellefsen________________________________________________________MATERIAL TESTED/ SIR SIR COMMENTSCONDITION 96 hr. 500 hr. bias ------- -------CVP-360 SACX0807 2.3E+09 4.5E+10 passed visual andIPC-B-25 pattern B 2.6E+09 4.1E+10 electrical requirementsreflowed paste 2.0E+09 1.1E+10Uncleaned 2.1E+09 3.7E+10 2.0E+09 3.4E+10 1.1E+09 2.2E+10 2.2E+09 2.9E+10 1.9E+09 3.2E+10 3.2E+09 6.1E+10 3.6E+09 5.7E+10 3.6E+09 4.7E+10 3.0E+09 5.1E+10 Pass/Fail ----- ----- final >Geometric mean: 2.4E+09 3.6E+10 initial/10________________________________________________________Controls 4.7E+11 1.0E+12 7.2E+11 1.0E+12 4.0E+11 7.1E+11 5.7E+11 1.0E+12 3.2E+09 3.1E+11 2.7E+09 3.0E+11 2.5E+09 2.0E+11 2.5E+09 3.0E+11 3.4E+11 1.0E+12 6.4E+11 9.4E+11 4.7E+11 9.0E+11 7.6E+11 4.9E+10 Pass/Fail ----- ----- final >Geometric mean: 9.1E+10 4.8E+11 initial/10


51


Reliability

Bellcore EM- PassBellcore EM CVP-360


52


Reliability

Thermal Cycling- CERF Board Test VehicleBGA 256 Package


53


Reliability

Thermal Cycling- CERF Board Test Vehicle

1,500 Cycles -40ºC to +100ºC BGA 256

Joints from 2 ends and middle were cross-

sectioned


54


Reliability

After 1,500 Cycles -40ºC to +100ºC BGA 256Copper Component Pad

Copper Pad

Tin/Copper Intermetallic

Bulk BGA

Tin/Copper Intermetallic in Tact


55


Reliability


Surface Mount 1206 Resistors


56


Reliability

After 1,500 Cycles -40ºC to +100ºC 1206 Resistor

Surface Mount 1206 Resistor





57


Reliability


LQFP 120


58


Reliability

After 1,500 Cycles -40ºC to +100ºC LQFP 120 Copper Lead


Copper Pad




59


Summary

•High performance paste with the economy of low silver SACX alloyDelivers excellent print deposit volume consistencyPrints speed window from 1 to 6 in. (25 to 150 mm)/secondExcellent stencil life – reducing paste scrapBetter spread and wetting than leading SAC 305 brandBest in Class in circuit pin test yieldExceeds IPC and Bellcore electromigration and surface insulation resistance requirementsSolder joints survive 1500 thermal cycles (-40ºC to +100ºC)


60


Summary

Leading Products:

No Clean, SnPb• ALPHA OM-6106

•ALPHA OM-5100

No Clean, Lead-free• ALPHA OM-338 T

•ALPHA OM-338 PT

•ALPHA OM-340

•ALPHA OM-350

•ALPHA CVP-360

•ALPHA CVP-520

Water Soluble, SnPb• ALPHA WS-809

Water Soluble, Lead-free• ALPHA WS-820


61


AMERICAS

California, USAFlorida, USAIllinois, USANew York, USAPennsylvania, USAMexico City, MexicoMonterrey, MexicoManaus, BrazilSao Paulo, Brazil

EUROPE

Woking, EnglandTurnhout, BelgiumCholet, FranceBudapest, HungaryHatar, HungaryNaarden, NetherlandsEast Kilbride, Scotland

ASIA-PACIFIC

Hong Kong, ChinaGuangxi, ChinaShenzhen, ChinaShanghai, ChinaChennai, IndiaHiratsuka, JapanSihung City, KoreaSingaporeTaoyuan, Taiwan

Global Manufacturing Sites Summary


62


AMERICAS

California, USAGeorgia, USAIllinois, USANew Jersey, USAPennsylvania, USAOntario, CanadaGuadalajara, MexicoBuenos Aires, ArgentinaSao Paulo, Brazil

EUROPE

Woking, EnglandTurnhout, BelgiumCholet, FranceLangenfeld, GermanyHatar, HungaryDublin, IrelandMilano, ItalyNaarden, NetherlandsEast Kilbride, Scotland

ASIA-PACIFICHong Kong, ChinaShenzhen, ChinaBeijing, ChinaChengdu, ChinaGuangxi, ChinaNanjing, ChinaShanghai, ChinaSuzhou, ChinaTianjin, ChinaXiamen, ChinaBangalore, India

Global Sales Support

Chennai, IndiaHiratsuka, JapanSihung City, KoreaPenang, MalaysiaMuntinlupa, PhilippinesSingaporeTaoyuan, TaiwanBangkok, ThailandThomastown, AustraliaAuckland, New ZealandVietnam

Summary


63


AMERICAS

California, USANew Jersey, USAGeorgia, USAGuadalajara, MexicoMonterrey, MexicoBuenos Aires, ArgentinaSao Paulo, BrazilManaus, Brazil

EUROPE

Woking, EnglandTurnhout, BelgiumCholet, FranceLangenfeld, Germany

ASIA-PACIFIC

Hong Kong, ChinaShenzhen, ChinaBeijing, ChinaShanghai, ChinaSuzhou, ChinaTianjin, ChinaBangalore, India

Global Customer Technical Support

Chennai, IndiaHiratsuka, JapanSihung City, KoreaPenang, MalaysiaSingaporeTaoyuan, Taiwan

Summary

CVP-360 Solder Paste - Alpha · 2013. 6. 3. · CVP-360 Solder Paste ... You can count on...

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Transcript of CVP-360 Solder Paste - Alpha · 2013. 6. 3. · CVP-360 Solder Paste ... You can count on...