CUSTOM ELECTRONICS ENGINEERING - Zekeng€¦ · - Fine pitch BGA layout (0.4 mm and below)...

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CUSTOM ELECTRONICS ENGINEERING & PROTOTYPING SERVICES www.zekeng.com Turning your ideas into products!

Transcript of CUSTOM ELECTRONICS ENGINEERING - Zekeng€¦ · - Fine pitch BGA layout (0.4 mm and below)...

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CUSTOMELECTRONICSENGINEERING &PROTOTYPINGSERVICES

www.zekeng.com

Turning your ideas into products!

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Products We Develop:- Wearable- Battery-powered- Wireless Solutions / IoT- Industrial Controllers- Sensors and Actuators- Consumer Electronics- System on Module (SoM)

We turn visions into winning products...With our technical knowledge and manufacturing experience, accumulated over the years, we turn visions into winning products by providing full turnkey solutions. Thus we can help you from assessment of your idea to manufacturing and delivery of pre-production prototypes and small scale manufacturing.

…through efficient development,…We are among the few design service providers where electrical engineers, industrial designers and firmware developers sit and work together, which allows cost and time efficient product development. In addition to this, we may perform as your company’s virtual hardware design team or as a helping hand for your design department during peak periods.

...doing the right thing, the very first timeWe recognize the mutual exchange of value through our client collaboration and never fail to listen to the voice of our customer. Our design center, provides our clients with innovative engineering solutions tailored to suit any specific need. Our internal management procedures ensure that your product is in safe hands at every step of the development process. That’s why we have a reputation of creating designs for which revision A is directly released into production.

Overview

Services We Provide- Idea Feasibility Check- Research & Development- Prototyping & MVP- Manufacturing Assistance- Project Management- Component Sourcing- Design Optimization- Firmware & Software- Performance Simulations

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Made from entrepreneurial engineers for entrepreneurs, intrapreneurs, inventors, engineers, and alike!

Our StoryEstablished in 2007 in Sofia, Bulgaria, Zekeng initially operated as a custom PCB layout design studio. Over the years we gradually expanded our team and added more services to our portfolio like PCB assembly, rapid prototyping, firmware development, industrial design and feasibility studies. Our clients come mainly from Europe and North America.

Our MissionIn an age of exponential growth in technology, hardware products are becoming extremely popular. We provide solid expertise and sophisticated engineering practices for turning your ideas into ready-for-market products. Our mission is two-fold: make hardware development accessible and provide a full suite of prototyping and startup services. You can confidently rely on Zekeng to take care of it all.

People BehindZekeng team is built of electronic engineers, industrial designers and firmware developers, most of them with 15+ years of experience in their respective field. Some of the companies they worked for before joining us are: Google, Kostal, Nokia, Dellorto, Datecs.

About Us

9YEARSServicing

Customers

173PROJECTSSuccessfullyCompleted

72,386HOURSResearch

Development

13,143CUPS

ofCoffee

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In the last 10 years of work experience, our design processes have matured to reflect the best practices and practical knowledge applicable across industries. We have successfully completed projects with diverse requirements such as shorter time-to-market for consumer electronics, portable ultra-low power communication devices, and industrial controllers, to name a few.

We continuously learn while fulfilling such diverse requirements. Our core team members discuss and implement possible improvements in our hardware designing process after the completion of each project. We are proud of this tradition as this has been our savior in this cutthroat competition.

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Mature and Scalable Process

RequirementsSpecification

SystemArchitecture

Design &Prototyping

Verification &Validation

Manufacturing

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Defining your requirementsNo matter whether you want a brand new product developed or redesign of an existing one, during the initial consultation, our team will help you define your requirements by figuring out your exact needs. With our technical experience and your market knowledge we can define the development and product costs.

Research and architecture developmentOnce we have defined your needs we are ready to move on. Our technical department will carefully analyze your requirements and conduct research of possible solutions, best technologies and components. As a result we build an architecture design that is the backbone of your product.

Design and rapid prototypingWe are ready to turn your concept into reality. Schematics are drawn, PCBs are layered up and embedded firmware is written. With the help of our network of partners we will provide rapid prototyping services. This will give you the huge advantage of having your product in your hands before you make further decisions.

Verification and testsDuring this phase we verify that the product is aligned with your requirements by performing customized manual and automated tests. This way we guarantee what leaves our design studio is of high quality, certifiable and ready for production.

Mature and Scalable Process

ManufacturingYou’re looking to manufacture more prototypes or small to medium initial production runs?. We save you the hassle to organize that yourself. Our expert manufacturing partners will draw on their wealth of experience and build your product to the highest of standards.

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Zekeng is unique in its service offerings as we are able to provide turnkey solutions from ideation to product launch. We can act as collaborator or as your full source development resource.

Our design engineers are able to step into the creative process at any point to define the problem and optimize alternatives to discover the best solution for your design. This seamless integration into the design process enables Zekeng to become an extension of your in-house engineering group.

Whether you require complete design solutions or stand alone services, Zekeng can meet your needs.

With the right hardware engineering partner firm you can tap unlimited

possibilities. We offer you this experience with the help of our

network of global manufacturing partners and original design manufacturing agreements

Our Services

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RF ElectronicsAnalog ElectronicsDigital ElectronicsPower Electronics

High Speed LayoutHigh Density Layout

Enclosure DesignAesthetic Design

3D Modeling3D Rendering

Requirements AnalysisIdea Feasibility CheckProduct Cost EstimationDesign Cost EstimationSignal Integrity ValidationThermal PerformanceTechnology ResearchComponent ResearchPCB Manufacturing & Assembly

3D Enclosure PrintingDie casting & Milling

Enclosure Detailing & FinishDesign For Manufacturing

Rapid prototypingProduction Transition

ProjectComponent DeliveryVendor SelectionProduct Life-cyclePrototyping

High Speed Design SimulationsPower Integrity SimulationsAnalog Signal Simulations

Certification Oriented Design Design Verification & Validation

Circuit Behavior

Firmware DevelopmentReal-time Operating Systems Embedded LinuxCloud / Web / Mobile Development

Our Services

Electronic Design Software Development

Research & Analysis

Industrial Design

Quality & Reliability

Manufacturing

Management

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OverviewFrom wearable electronics to on-board electronics of spacecrafts, Printed Circuit Boards (PCBs) are the backbone of every electronic system. To design PCBs that fulfill such diverse systems’ requirements, our designers adopt a scalable and systematic approach. At Zekeng, we design PCBs by using the latest tools and technologies to guarantee compliance with the international quality standards.

Electronics & PCB Design

Capabilities- Review of ready design- PTH/SMT and HDI layout designs- 100% manual design and routing- Flex/rigid and non-standard geometries- High speed and high density digital, analog, RF, power, and mixed signal designs- Complex high-speed systems for low power and noise sensitive devices- Intrinsically safe PCB designs- EMI protection- Single ended and differential impedance control- Fine pitch BGA layout (0.4 mm and below)

Specification & Requirements

Marketing RequirementsProduct Requirements

Subsystem Requirements

Architecture DesignSelecting Core Components

Technology ResearchPower & Signal Simulations

Schematic DesignConnecting components and signals

PCB LayoutBill of Materials

Footprint Library DevelopmentMechanical Outline

Form-factor ConstraintsComponent Placement & Routing

DFM AnalysisGerbers export

PCB Manufacturing &Assembly

FinalizationBoard bring-upFunction test

DocumentationShipping

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Zekeng’s hardware engineering team architects a diverse array of power control and conversion designs to realize the optimum balance among reliability, cost, and time-to-market requirements.

Capabilities● Power supply and analog conversion circuit topologies● Energy metering and remote monitoring● Digital control and digital power conversion● Multi-chemistry battery charger and fuel gauge circuits

Solution● Using high quality Programmable Gain Amplifiers● Using 24bit over 100 kHz, Sigma-Delta Analog to Digital Converter● No voltage transformers used● Rogowski Coil for current sensing● High speed Digital Galvanic Isolation

Key Accomplishments● Galvanic separation between mains and signal processing● Successful high voltage & high current design

Power Electronics

Featured project: Power Quality Monitor

Design Challenges● Automatic range adjustment ● High resolution and high sampling rate analog to digital conversion● No components that kill high frequency

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Precision of the design can make or break analog electronics. On the other hand, analog designs are inherently complex. To balance functionality and efficiency amid this complexity is the work of an imaginative engineer. Our engineers build precise analog electronic designs that are employed in power supplies, audio signal processing systems, sensor interfaces, and data acquisition systems. We combine our design services with prototyping and simulation services to deliver a complete solution to our clients.

Capabilities● Low noise amplifiers design● Circuit modeling, simulations and analysis● Analog sensors with digital interfacing● High speed & high resolution analog conversions● ADC and DAC● Class D power amplifier circuit designs● Low power designs● Wide band designs

Featured project: Modular Guitar Effect

Design Challenges● Low noise analog signal electro-mechanical switching (true bypass)● Low noise hot plug audio interface● Impedance matching● Reducing not desired audio feedback● Low noise from power supply

Solutions● Using high quality signal relays● Advanced power supply filtering

Key Accomplishments● All requirements fulfilled

Analog Electronics

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The creation of a standard compliant product requires accuracy in each development phase and seamless integration from one phase to another. Starting from product and subsystem requirements, our hardware engineering team adds value to each subsequent phase until a successful production transition. Some of the major industries that use our designed equipment are: tracking devices, healthcare and instrumentation.

Capabilities● ARM9, ARM Cortex● SDRAM, DDR, DDR2 and DDR3● NOR flash and NAND flash interfaces● Gigabit Ethernet interfaces● High speed interfaces (1+ GHz)● High Density Interconnect Design● PCI, PCle, and PCl-x interfaces● HDMI and LVDS● Low power designs

Featured project: BeagleBone Black Copy

Design Challenges● A Copy of BeagleBone Black with few modifications● Should not crash!

Solution● Better routing of high speed signals to DDR3● High speed design simulations

Key Accomplishments● Successfully manufactured board● Additional features integrated● Speed and stability improved (compared to BBB)

Digital Electronics

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The hallmarks of today’s electronic systems are their high density, complexity, and miniaturized size. To support such competitive list of features in a system, the packaging designs have to meet all technical challenges arising as a result of these requirements. In fact, high quality packaging assists the system performance by facilitating thermal management, signal distribution, serviceability, manufacturing, and power distribution.

Zekeng hardware engineering team includes 3D engineers dedicated to oversee the electronic packaging aspects of the projects. Our electronic packaging services incorporate reliability engineering and industrial design best practices to deliver the best quality packaging. Our expertise includes sheet metal and plastic enclosures, tooling, 3D printing, thermal management, and design. The successful track record of our team in electronic packaging ranges from space constrained wearable electronics design to thermally critical power electronics modules and everything in-between.

Capabilities● Sheet Metal and Plastic Enclosures● 3D Modeling● Metal & Plastic Casting● Plastic 3D Printing● Thermal Analysis● Prototyping● Ergonomics● Concept and Graphics Generation● Photo-realistic Images

Electronic Housing

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Featured Project: Industrial Controller

ChallengeDeveloping a robust, cost effective casing, with screening features for industrial controller.● Robust● Cost Effective● Screening / Grounding● Thermal Durability

Solution● Sheet metal technology used

Key Accomplishments● Cost effectiveness● Easy to produce● Production Ready Design

Featured Project: Modular Guitar Effect

ChallengeHigh aesthetics for low cost. For creating pre-production prototype of a product that has no proven market demand, molding is unthinkable.

Solution● 3D printed plastic enclosure● Sanded, Pasted and Painted

Key Accomplishments● Cost Effective Premium Finish● Ergonomics Verification

Electronic Housing

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Our engineers have expertise in simulating all complex mixed-signal designs containing both analog and digital circuits. The challenge of high speed designs is to maintain the quality of the signals over long distances on printed circuit boards and wire-harnesses. We employ signal integrity simulation to check the effectiveness of the steps taken to ensure signal integrity. Simulation of the routed board verifies the standard compliance of design and saves the manufacturing costs in the long run.

Capabilities● Circuit Behavior● Signal Integrity● Power Integrity● Thermal Performance● RF Performance

Featured project: Flood Detector

Design Challenges● Immediate Flood Detection● Low Power Consumption● 2 x AA Battery Powered● Small size● Low cost

Solution● Custom built, precise flood detection sensor● Low power consumption op-amps

Key Accomplishments● Small size● Battery life over 24 months`

Simulations and Analysis

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Component SourcingWith Zekeng as your global component sourcing partner, you will never have to worry about completing a project in time or fret over the varying quality of components from shipment to shipment. Our dedicated component sourcing team plans your inventory supply with the future requirements in sight. This future oriented planning ensures that your project lead time is minimized while the quality and cost are optimized for the most competitive markets. Our working relationships with component suppliers from across the globe guarantee that you never run out of quality components during any phase of your hardware project. So, whether you require materials for a few prototypes or a supply chain for high-volume manufacturing operations, we are prepared to support you.

PCB FabricationZekeng’s global partnership network of high quality PCB fabrication houses systematically meets our client’s hardware project needs. From few prototyping boards to high volume manufacturing, no job is too small or too big for us.

PCB AssemblyFor PCB assembly Zekeng has a global network of quality contract manufacturers. All PCBA adhere to world-class quality and acceptance standards for electronic assemblies.

Electronic Manufacturing Services

Capabilities

PCB Thickness: 0.2 – 5.0 mm

Base material: Standard FR4, FR4 Halogen Free, FR4 HTg, Rogers RO 4000® series

Finished Copper thickness: 35 (55) µm; 70 µm; 105 µm; 140 µm; 210 µm; 235 µm; 435 µm

Surface finish: HAL Lead Free, Electroplated nickel/gold, Electroplated Gold connectors

Solder resist mask: Photosensitive lacquers, Color : green,red, blue, black, white

Drill diameter: 0.1mm (minimum)

Aspect Ratio: 1:8 (Standard), 1:25 (Special)

Trace width: 150µm (standard), 35µm (minimum)

Micro Via Technology: buried, blind, stacked vias

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Disclaimer:

The logos, trade names, and product names used in this publication are owned by their respective owners. © ZEK ENGINEERING LTD. All Rights Reserved.

With Zekeng you’re in safe hands from concept development to product design. Get in touch today to discuss your project.www.zekeng.com

[email protected]

+359 88 531 2217