Current Standards Flex-Rigid - WE Home · IPC Standards 19.04.2018 Seite 9...

Current Standards Flex-Rigid

Würth Elektronik Circuit Board Technology

www.we-online.com page 1 19.04.2018

Webinar April 17th, 2018

Speaker: Andreas Schilpp

agenda

1• WHY Flex-Rigid?

2• Hierarchy of Specifications

3• WE Standards Flex-Rigid

4• Standards for EDA Tools

19.04.2018 Seite 2 www.we-online.de

Introduction: Integration of Module Wiring

The Advatages of Flex-Rigid

Miniaturisation

Signal Integrity

ReliabilitydynamicalBending

19.04.2018Seite 3www.we-online.de

Application

Starting Situation

www.we-online.com Product Management

Power Board

8 layers

FR4

Connector

Board10 layers

FR4

contr. Impedance

FPGA Board

16 layers

high Tg FR4

contr. Impedance

Sensor Board

10 layers

FR4

contr. Impedance

€ €

picture as

example


Power Board

14 layers

high Tg FR4

contr. Impedance

Connector

Board14 layers

high Tg FR4

contr. Impedance

FPGA Board

14 layers

high Tg FR4

contr. Impedance

Sensor Board

14 layers

high Tg FR4

contr. Impedance

Application

Approach: Flex-rigid xRi-4F-xRi


Power Board

12 layers

high Tg FR4

contr. Impedance

Connector

Board12 layers

high Tg FR4

contr. Impedance

FPGA Board

12 layers

high Tg FR4

contr. Impedance

Sensor Board

12 layers

high Tg FR4

contr. Impedance

Application

Solution: Flex-rigid 4Ri-4F-4Ri

Miniaturization, Performance, Testability

source: ANDOR

agenda






Hierarchiy of Specifications


Customer PCB Specification

General Customer Specification

IPC Standards

WE Standard: class 2

General WE PCB Specification

for example:• Acceptability of Printed Boards: IPC-A-600

• Material

• Design: IPC-2223

• Qualification and Performance Spec: IPC-6013

IPC Standards


Classification according IPC

Class1 — includes limited life products suitable for

applications where the requirement is function of the

cpmpleted product.

Class 2 — includes products where continued

performanceand extended life is required; and for

which uninterrupted service is desired but not critical.

Class 3 — includes products where continued high

performanceor performance-on-demand is

critical, product down-time cannot be tolerated, and

the product must function when required.

Design Chain electronic system development

19.04.2018 page 10 www.we-online.com

stated conditions Specification

„a pcb is a complex construction made out of

many different materials, produced using a variety of processes for getting tailored

functionality!“

agenda







General WE PCB Specification

Flex-Rigid

Design

Guide

Design

Rules

Stack-up Plans

- Standards

- customerspecific

SemiflexFlex /

TWINflex1F-xRi xRi - ≥2F - xRi 2F-xRi

Overview Standards

IPC Standards

New Revision IPC Standard


NEW in IPC-2223D

- with a grey background

- complicated formula before

- now estimation „bend ratio“

radius : thickness

- flex-to-install:

- new Revision Design Guide

- new Revisions Design Rules

use B: dynamic bending

- 1F: 100:1

- 2F: 150:1

- Multilayer: not recommended!

New Revision „Flex-Rigid Design Guide“


Corrected and extended Formula:

New Revision „Flex-Rigid Design Guide“


NFP – Non Functional Pads added

NFPR – Non Functional Pad Removal

WHY?

VdL-Publication

„Fertigungsgerechtes Design“, 1998

FED / VdL Recommendation, 2006


Why do we need annular rings?

Layout / Screen:

Real life

IPC-A-600H:



WHY?

Reduction of crosstalk

more place on inner layers for

routing

?


NO!

NFPR does NOT spend

more place on inner

layers!

Design Rule Check

must be performed

prior to NFP Removal!


Special case Flex-Rigid:

Drilling of Polyimide

Cleaning and Plating of Polyimide

Examples with flexible layers inside


Application definition,

stack-up examples

Basic Information

Bending Radii

Processing Conditions

Material Specifications

Link to Standard Stack-up´s

Definition Standard

specific Layout Parameters

additionally for Semiflex:

– Tipps for Bending and Fastening

all Design Rules

– have been revised Internet

– as guided DocumentsRevision!

Structure of 3D Design Rules


http://www.we-online.com/web/en/leiterplatten/produkte_/3d_starr_flexible_leiterplatten/design/design_rules_1/Design_Rules_7.php

Most common Mistake: Standard Rules Item „G“ not regarded

– Spacing Vias to Flex-Rigid Transition

Distance to the Via Pad!

IPC-2223:


Design Rules Flex-Rigid – Spacing Vias / Pads

Design Rules Flex-Rigid – Distance Vias / Pads

19.04.2018 Seite 22www.we-online.de

Base material Standard 1F-xRi stack-up

– Rigid: FR4 Tg 150°C, halogen free, filled

– Flex: Polyimide Tg > 200°C, – typ. 50µm thick

– soldermask, flexible soldermask partially in bending area

– Inner layer copper thickness: 18µm

19.04.2018

Seite 23

www.we-online.de

Standard Stack-up Flex-Rigid

Base material Standard xRi-2F-xRi stack-up

– Rigid: FR4 Tg 150°C, halogen free, filled

– Flex: Polyimide Tg > 200°C – typ. 50µm thick

– soldermask, Polyimide Coverlay partially in bending area (BIKINI)

– Inner layer copper thickness: 18µm

19.04.2018

Seite 24

www.we-online.de

Standard Stack-up Flex-Rigid

Standard Stack-up plans Flex-Rigid


Internet

http://www.we-online.com/web/en/leiterplatten/produkte_/3d_starr_flexible_leiterplatten/design/aufbauten/3D_Aufbauten.php

agenda






Design Guide and Design Rules

Rules from Flex-Rigid Design guide and

from Design Rules must be transferred

into Constraint Manager

– time consuming

– risk of error

Current Project:

Implementation of Flex-Rigid Design

Rules into several EDA-Tools

– Start with Allegro / OrCAD

– Altium


Project: Templates for EDA Tools

– Allegro / OrCAD until May 2018

– Altium

IPC-2581 Data Format for Import

into additional EDA Tools

19.04.2018 www.we-online.de

Standard Stack-up Plans Flex-Rigid

Seite 28

WE Layer Stack-up Allegro / OrCAD Cross Section Editor

Summary

Improvement of Reliability by using Flex-Rigid

But also:

Improvement of Reliability of Flex-Rigid PCBs

– by using Standards

– Regarding Design Rules saves Manufacturability and

Reliability

– Implementation of Stack-ups and Design Rules in EDA Tools

will reduce Risk of Failures and will improve Productivity

More Information in our June-Webinar (EDA Tools) and

in our Webinar Archive!


Thank you very much for your attention!

19.04.2018 www.we-online.com

Current Standards Flex-Rigid - WE Home · IPC Standards 19.04.2018 Seite 9...

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