Herbert Reichl (Editor)

CRO SYSTETechnologies 2001International Conference & Exhibitionon Micro Electro, Opto, Mechanical Systemsand Components

Diisseldorf, March 27 - 29, 2001

incl. CD-ROM

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VDE VERLAG • Berlin • Offenbach

Table of Contents

Opening Plenary SessionChairman:Herbert Reichl, Fraunhofer-lnstitut fur Zuverlassigkeit u. Mikrointegration IZM, Berlin,Germany

Safety Relevant Microsystems for Automotive Applications 29

Helmut Seidel, TEMIC Telefunken Mikroelektronik GmbH, Munchen, GermanyMatthias Aikele, TEMIC Telefunken Mikroelektronik GmbH, Munchen, GermanyMatthias Rose, TEMIC Telefunken Mikroelektronik GmbH, Munchen, GermanySebastian Toelg, TEMIC Telefunken Mikroelektronik GmbH, Munchen, Germany

Microsensor Packaging 37

Oliver Brand, Physical Electronics Laboratory, ETH Zurich, SwitzerlandHenry Baltes, Physical Electronics Laboratory, ETH Zurich, Switzerland

Fuel Cell Using Micro-structured Flow Fields 43

Markus Milller, Institute for Microsystem Technology IMTEK, Albert-Ludwigs-Universitat,Freiburg, GermanyClaas Miiller, Institute for Microsystem Technology IMTEK, Albert-Ludwigs-Universitat,Freiburg, GermanyWolfgang Menz, Institute for Microsystem Technology IMTEK, Albert-Ludwigs-Universitat,Freiburg, GermanyChristopher Hebling, Fraunhofer Institute for Solar Energy Systems ISE, Freiburg, GermanyAngelika Heinzel, Fraunhofer Institute for Solar Energy Systems ISE, Freiburg, Germany

From Microsystems to Biosensors:The Key to Medical and Clinical Diagnostics 49

Andrew Campitelli, IMEC vzw, Leuven, Belgium

Characterization and Testing

Chairman:Klaus D. Muller-Glaser, Universitat Karlsruhe, Germany

New Dimension in Radioscopic Quality Inspectionfor Microelectronics and Packaging 55

Tilo Baumbach, Fraunhofer Institute for Nondestructive Testing, Dresden, Germany

Lukas Helfen, Fraunhofer Institute for Nondestructive Testing, Dresden, Germany

Randolf Hanke, Fraunhofer Development Center for X-Ray Technology, Erlangen/Saarbriicken, Germany

9

A Testing Stage for the Assessment ofRotating Micro Electro-mechanical components 59

Gerhard Abraham, MTE Messgerate Entwickl.- u. Vertriebs GmbH, Wien, AustriaYannick Ansel, Institut fur Mikrotechnik Mainz GmbH, Mainz-Hechtsheim, GermanyRoland Duffait, Centre de Transfert des Microtechniques, Besancon, FranceSergio Monux, Institut fur Mikrotechnik Mainz GmbH, Mainz-Hechtsheim, GermanyMatthias Nienhaus, MyMotors&Actuators, Wendelsheim, GermanyStephan Kleen, MyMotors&Actuators, Wendelsheim, GermanyPeter Wurmsdobler, Centre de Transfert des Microtechniques, Besancon, France

Symbolic Analysis of Electromagnetic Interference inElectronic Circuits for Sensor Applications 65

Jurgen Kirchhof, Fraunhofer Institute for Reliability and Microintegration, Paderborn,GermanyWerner John, Fraunhofer Institute for Reliability and Microintegration, Paderborn, GermanyHerbert Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Component and System Design, Reliability Modelling

Chairman:Werner John, FhG-IZM, Paderborn, Germany

Simulation and Modeling of a Chamber of Analysis ofan IR-Gas Sensor 71

Ingo Sieber, Forschungszentrum Karlsruhe, Eggenstein-Leopoldshafen, GermanyHorst Eggert, Forschungszentrum Karlsruhe, Eggenstein-Leopoldshafen, GermanyKarl-Heinz Suphan, MicroHybrid, Hermsdorf, GermanyStephan Bechtold, ITEM, Universitat Bremen, Germany

Optical Surface-Profiling with Half a Million Micromirrors 77

Frank Bitte, Fraunhofer Institute of Production Technology, Aachen, GermanyGerd Dussler, Fraunhofer Institute of Production Technology, Aachen, GermanyTilo Pfeifer, Fraunhofer Institute of Production Technology, Aachen, Germany

Co-simulation of Packaging and MEMS within aMEMS System Design Suite 83

Ridha Hamza, MEMSCAP S.A., Saint Ismier, FranceMary-Ann Maher, MEMSCAP S.A., Saint Ismier, FrartceMarta Rencz, MicRed, Budapest, HungaryVladimir Szekely, MicRed, Budapest, HungaryGer Kelly, NMRC, Cork, IrelandGerold Schropfer, SensoNor, Horten, NorwayBernard Courtois, TIMA, Grenoble, France

Modern Design Tools for Microsystems - User Needs and Examples . . . 89

Patric Salomon, MEMSCAP GmbH, Berlin, Germany

10

Advanced MST Packaging and Interconnections I

Chairmen:Rolf Aschenbrenner, FhG-IZM, Berlin, GermanyFranco A. Mori, Magneti Marelli, Italy

Diode Laser Bar Packaging and Cooling with CVD-diamond 95

Dirk Lorenzen, Jenoptik Laserdiode GmbH, Jena, Germany

Smart Optical Interconnect Solution 101

Karl Gerdom, HARTING KGaA, Espelkamp, GermanyUlrich Wallenhorst, HARTING KGaA, Espelkamp, Germany

Multichip Module with Free-Space Optical Interconnects andVCSELs Buried into the Solder Joints 107

Christiane Gimkiewicz, Universitat Hagen, GermanyDetlev Hagedorn, Universitat Hagen, Germany

Spiral Inductors and Couplers in Thin Film 113

Jurgen Wolf, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyJ. Schmiickle, Ferdinand-Braun-lnstitut, Berlin, GermanyD. Petter, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyT. Kasap, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyW. Heinrich, Ferdinand-Braun-lnstitut, Berlin, GermanyH. Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Advanced MST Packaging and Interconnections II

Chairmen:Rolf Aschenbrenner, FhG-IZM, Berlin, GermanyFranco A. Mori, Magneti Marelli, Italy

3D Packaging for High Performance Computing and Microsystems . . . 119

Christian M. Val, 3D PLUS, Buc, France

Eco-analysis of Wafer Level Bumping 125

Karsten Schischke, Technische Universitat Berlin, GermanyHansjorg Griese, Fraunhofer Institut fur Zuverlassigkeit und Mikrointegration, Berlin,GermanyJutta Muller, Fraunhofer Institut fur Zuverlassigkeit und Mikrointegration, Berlin, Germany

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Investigation of UBM (Under Bump Metallurgy) Systems forElectroplated Sn/37Pb and Sn/3.5Ag Solder Bumps 131

Se-Young Jang, Korea Advanced Institute of Science and Technology, Taejon, South KoreaJurgen Wolf, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyOswin Ehrmann, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyHerbert Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyKyung-Wook Paik, Korea Advanced Institute of Science and Technology, Taejon, SouthKorea

High Density Bumping for Advanced Packaging - An Industrial View

Tom Ritzdorf, Semitool, Kalispell, USA[For technical reasons you will find this manuscript at the end of the proceedings.]

Microfluidical DevicesChairmen:Steffen Hardt, IMM - Institut fur Mikrotechnik Mainz GmbH, GermanyVolker Saile, Forschungszentrum Karlsruhe GmbH, Germany

Simulation of Capillary Driven Flows in Structured Microchannels 137

Silke Halstenberg, Universitat Karlsruhe, Eggenstein-Leopoldshafen, GermanyAlexander Quinte, Forschungszentrum Karlsruhe, GermanyHorst Eggert, Forschungszentrum Karlsruhe, Germany

Microfabrication of Single-Use Plastic Microfluidic Devices forHigh-Throughput Screening and DNA Analysis 143

Andreas Gerlach, Greiner Bio-One GmbH, Frickenhausen, GermanyGiinther Knebel, Greiner Bio-One GmbH, Frickenhausen, GermanyAndreas E. Guber, Forschungszentrum Karlsruhe, Institut fur Mikrostrukturtechnik,Karlsruhe, GermanyMathias Heckele, Forschungszentrum Karlsruhe, Institut fur Mikrostrukturtechnik,Karlsruhe, GermanyDirk Herrmann, Forschungszentrum Karlsruhe, Institut fur Mikrostrukturtechnik, Karlsruhe,GermanyAlban Muslija, Forschungszentrum Karlsruhe, Institut fur Mikrostrukturtechnik, Karlsruhe,GermanyThomas Schaller, Forschungszentrum Karlsruhe, Hauptabteilung Versuchstechnik,Karlsruhe, Germany

Analytical Chemistry: A New Application Field forMicrostructured Devices 149

Holger Bartos, STEAG microParts GmbH, Dortmund, GermanyManfred Berndt, Agilent Technologies GmbH, Waldbronn, GermanyMario Hempel, STEAG microParts GmbH, Dortmund, GermanyRalf-Peter Peters, STEAG microParts GmbH, Dortmund, Germany

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NanoSynTest™: An Integrated Platform for Chemical Synthesis andBiological Testing in Nanotiterplates 151Andreas Schober, Institute of Physical High Technology, Jena, GermanyGregor Schlingloff, Institute of Physical High Technology, Jena, GermanyDirk Tomandl, Institute of Physical High Technology, Jena, GermanyAndreas Grofi, Institute of Physical High Technology, Jena, GermanyJohann-Michael Kohler, Institute of Physical High Technology, Jena, GermanyThomas Henkel, Institute of Physical High Technology, Jena, GermanyJens Albert, Institute of Physical High Technology, Jena, GermanyGiinther Mayer, Institute of Physical High Technology, Jena, GermanyHolger Deppe, Merck KGaA, Darmstadt, GermanyAndras Willems, Merck KGaA, Darmstadt, GermanyHanns Wurzinger, Merck KGaA, Darmstadt, GermanyMichael Doring, Microdrop GmbH, Norderstedt, GermanyHans Tietz, Video and Image Processing, Gauting, Germany

Microoptical DevicesChairman:Wolfgang Kowalski, TU Braunschweig, Germany

High Speed Electrostatic Micro-optical Switches 157

Stephan Gonseth, Colibrys SA, Neuchatel, SwitzerlandPatrick Debergh, Colibrys SA, Neuchatel, SwitzerlandGregoire Perregaux, Colibrys SA, Neuchatel, SwitzerlandYves Dupraz, Colibrys SA, Neuchatel, SwitzerlandHenri Vuilliomenet, Colibrys SA, Neuchatel, SwitzerlandMichel Depraz, Colibrys SA, Neuchatel, Switzerland

Electrostatic Microshutters Array for Display Applications 163

Marco Pizzi, Centra Ricerche Fiat, Orbassano, ItalyValerian Koniachkine, Siberian Branch of Russian Academy of Sciences, Sobolev Institute,Novosibirsk, RussiaMarco Nieri, Centra Ricerche Fiat, Orbassano, ItalySabino Sinesi, Centra Ricerche Fiat, Orbassano, ItalyPietro Perlo, Centra Ricerche Fiat, Orbassano, Italy

Automatic Assembly of Lenses in Front ofMiniature Flexible Fibre-scopes 169

Gerd Dussler, Aachen University of Technology, Laboratory for Machine Tools andProduction Engineering, Aachen, GermanyTilo Pfeifer, Aachen University of Technology, Laboratory for Machine Tools and ProductionEngineering, Aachen, GermanyS. Driessen, Aachen University of Technology, Laboratory for Machine Tools andProduction Engineering, Aachen, GermanyT. Lan, Aachen University of Technology, Laboratory for Machine Tools and ProductionEngineering, Aachen, GermanyM. Week, Fraunhofer Institute of Production Technology IPT, Aachen, GermanyBernd Petersen, Fraunhofer Institute of Production Technology IPT, Aachen, Germany

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Plenary Session

Chairman:Giinter Zimmer, FhG IMS, Duisburg, GermanyEwald Pettenpaul, Infineon Technologies AG, Munchen Germany

Microsystems: Development in a Changing Environment 175

Gisele Roesems, CEC

Micromachine System Technologies: Wireless Link and ManagementTechnologies 177

Naoki Mitumoto, Micromachine Center, Tokyo, JapanKiyoshi Nemoto, Micromachine Center, Tokyo, JapanKimihide Nakatsu, Micromachine Center, Tokyo, Japan

Home Automation, an Appealing Starting Point for Intelligent Home

Walter P. von Pattay, Siemens AG, Miinchen.Germany[For technical reasons you will find this manuscript at the end of the proceedings.]

Micro Materials and Properties I

Chairmen:Robert Mertens, IMEC vzw, Leuven, BelgiumBernd Michel, FhG-IZM, Berlin, Germany

Interface Cracks and Reliability Issues in Microsystems 183

Bernd Michel, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyJurgen Auersperg, AMIC GmbH, Berlin, GermanyAndreas Schubert, Fraunhofer Institute for Reliability and Microintegration, Berlin,GermanyRolf Kuhnert, Image Vision GmbH, Chemnitz, Germany

Dynamic Behaviour of Micro Materials Under Low VelocityImpact Loading 187

Thomas Auzanneau, Precision and Intelligence Laboratory, Tokyo Institute of Technology,Yokohama, JapanChiaki Sato, Precision and Intelligence Laboratory, Tokyo Institute of Technology,Yokohama, Japan

Three-dimensional Metrology for Microsystem Components 193

Uwe Brand, Physikalisch-Technische Bundesanstalt, Braunschweig, GermanyThomas KleineBesten, Physikalisch-Technische Bundesanstalt, Braunschweig, GermanyShizhi Cao, Physikalisch-Technische Bundesanstalt, Braunschweig, GermanyWolfgang Hoffmann, Physikalisch-Technische Bundesanstalt, Braunschweig, GermanyHeinrich Schwenke, Physikalisch-Technische Bundesanstalt, Braunschweig, Germany

14

Determination of Coefficients of Thermal Expansion andPoissons Ratios on Micro Material Specimens 199

Dietmar Vogel, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyAstrid Gollhardt, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyHans Walter, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyKarl-Friedrich Becker, Fraunhofer Institute for Reliability and Microintegration, Berlin,GermanyTanja Braun, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyBernd Michel, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Micro Materials and Properties II

Chairmen:Robert Mertens, IMEC vzw, Leuven, BelgiumBernd Michel, FhG-IZM, Berlin, Germany

Cyanate Ester Based Resin Systems for Snap-Cure Applications 205

Jorg Bauer, Fraunhofer Institute for Reliability and Microintegration, Teltow, GermanyMonika Bauer, Fraunhofer Institute for Reliability and Microintegration, Teltow, Germany

The Effect of Side Reactions on the Optical Loss ofPolycyanurate Thermosets Used in Integrated Optics 211

Christian Dreyer, Fraunhofer Institute for Reliability and Microintegration, Teltow, GermanyMonika Bauer, Fraunhofer Institute for Reliability and Microintegration, Teltow, GermanyJorg Bauer, Fraunhofer Institute for Reliability and Microintegration, Teltow, GermanyNorbert Keil, Heinrich-Hertz-lnstitut fur Nachrichtentechnik GmbH, Berlin, GermanyHuihai Yao, Heinrich-Hertz-lnstitut fur Nachrichtentechnik GmbH, Berlin, GermanyCrispin Zawadzki, Heinrich-Hertz-lnstitut fur Nachrichtentechnik GmbH, Berlin, Germany

Development of Fe-Co-based Ferromagnetic Films forApplications in High Frequency - Microinductors 217

Klaus Seemann, Forschungszentrum Karlsruhe GmbH, Karlsruhe, GermanyA. von der Weth, Forschungszentrum Karlsruhe GmbH, Karlsruhe, GermanyI. Fergen, Forschungszentrum Karlsruhe GmbH, Karlsruhe, Germany

Pb-free Laser-beam Soldering with an Advantageous Substitutionof PbSn60 223

Fritz Herbert, TU Berlin, Institutsbereich fur Fugetechnik und Beschichtungstechnik,GermanyLutz Dorn, TU Berlin, Institutsbereich fur Fugetechnik und Beschichtungstechnik, GermanyShiva Shrestha, TU Berlin, Institutsbereich fur Fugetechnik und Beschichtungstechnik,Germany

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Micro Materials and Properties IIIChairmen:Robert Mertens, IMEC vzw, Leuven, BelgiumBernd Michel, FhG-IZM, Berlin, Germany

Piezoelectric Properties of PZT Thin Film 229

Hidetoshi Kotera, Kyoto University, Kyoto, Japan

Thermo-Electro-Mechanical Analysis ofPiezoelectric Microcomponents by Harmonic Oscillations 237

Ruben Keoschkerjan, llmenau Technical University, llmenau, GermanyMichael Harutyunyan, State Engineering University of Armenia, Erevan, ArmeniaHelmut Wurmus, llmenau Technical University, llmenau, Germany

Sub-micron Coatings with Low Friction andWear for Micro Actuators 243

Ralf Bandorf, Fraunhofer Institute for Thin Films and Surface Engineering, Braunschweig,GermanyH. Luthje, Fraunhofer Institute for Thin Films and Surface Engineering,Braunschweig, GermanyK. Schiff mann, Fraunhofer Institute for Thin Films and Surface Engineering, Braunschweig,GermanyTh. Staedler, Fraunhofer Institute for Thin Films and Surface Engineering, Braunschweig,GermanyA. Wortmann, Fraunhofer Institute for Thin Films and Surface Engineering, Braunschweig

Material Parameters for Microsystems Collected in a PC-Database . . . 249Jiirgen Villain, University of Applied Sciences Augsburg, GermanyThorsten Muller, University of Applied Sciences Mittweida, Mittweida, GermanyWerner Totzauer, University of Applied Sciences Mittweida, Mittweida, GermanyBernd Michel, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Sensors IChairman:Thomas GeBner, Technische Universitat Chemnitz, Germany

Uncertainty in Measurement of Semiconductor Piezoresistive Sensors. 255

Phan Le Phuong Hoa, Technische Universitat Dresden, GermanyGerald Gerlach, Technische Universitat Dresden, GermanyGunnar Suchaneck, Technische Universitat Dresden, Germany

Packaged Single Crystalline Microresonator for Force Sensing 261

M. Haueis, ETH Zurich Institute of Mechanical Systems, Zurich, SwitzerlandJ. Dual, ETH Zurich Institute of Mechanical Systems, Zurich, SwitzerlandC. Cavalloni, Kistler Instrumente AG, Winterthur, SwitzerlandM. Gnielka, Kistler Instrumente AG, Winterthur, SwitzerlandRudolf Buser, Interstate University of Applied Science, Buchs, Switzerland

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Silicon Vibration Sensor Arrays withElectrically Tunable Band Selectivity 267Jan Mehner, Technische Universitat Chemnitz, GermanyDirk Scheibner, Technische Universitat Chemnitz, GermanyJurgen Wibbeler, Technische Universitat Chemnitz, Germany

Design and Development of a Piezoresistive Pressure Sensor onMicromachined Silicon for High-temperature Application andof the Signal Conditioning Electronics 273Angelo Borgese, Universita degli Studi di Brescia, ItalyD. Crescini, Universita degli Studi di Brescia, ItalyV. Ferrari, Universita degli Studi di Brescia, ItalyZs. Kovacs Vajna, Universita degli Studi di Brescia, ItalyD. Marioli, Universita degli Studi di Brescia, ItalyA. Taroni, Universita degli Studi di Brescia, ItalyM. Marinelli, Universita di Roma "Tor Vergata"E. Milani, Universita di Roma "Tor Vergata"A. Paoletti, Universita di Roma "Tor Vergata"A. Tucciarone, Universita di Roma "Tor Vergata"G. Verona-Rinati, Universita di Roma "Tor Vergata"

Sensors IIChairman:Thomas GeBner, Technische Universitat Chemnitz, Germany

Fibre Optical Sensors for Monitoring Chemical Attackson Concrete Structures 279

Walter Grahn, Technische Universitat Braunschweig, GermanyWolfgang Kowalsky, Technische Universitat Braunschweig, GermanyJurgen Wichern, Technische Universitat Braunschweig, GermanyStefan Wiese, Technische Universitat Braunschweig, Germany

Bulk Micromachined and Wafer Bonded Resonators forVacuum Pressure Measurement 285

Karla Hiller, Technische Universitat Chemnitz, GermanyS. Kurth, Technische Universitat Chemnitz, GermanyN. Zichner, Technische Universitat Chemnitz, GermanyT. Gessner, Technische Universitat Chemnitz, GermanyW. Dotzel, Technische Universitat Chemnitz, GermanyT. Iwert, u-Sen Mikrosystemtechnik GmbH, Rudolstadt, GermanyH. Fritsch, u-Sen Mikrosystemtechnik GmbH, Rudolstadt, GermanyS. Biehl, u-Sen Mikrosystemtechnik GmbH, Rudolstadt, Germany

Design and Optimizationof a Capacitive Micro-electromechanical Gyroscope 291

Rainer Schmid, Fraunhofer Institut IMS, Munchen, GermanyLars VoBkamper, Dolphin Integration GmbH, Duisburg, GermanyGeorg Pelz, Gerhard-Mercator-University-GH, Duisburg, Germany

17

Modeling, Optimum Design and Fabricationfor a Biaxial Frequency-Shifted Microaccelerometer 297Yi-Chung Lo, Synchrotron Radiation Research Center, HsinChu, TaiwanDeng-Huei Hwang, National Chiao-Tung University, HsinChu, TaiwanKanping Chin, National Chiao-Tung University, HsinChu, Taiwan

MouldingChairmen:Peter Bley, Forschungszentrum Karlsruhe GmbH, GermanyAntonio Paoletti, Universita degli Studi di Roma Tor Vergata", Roma, Italy

New Plastification Concepts for Micro Injection Moulding 303

Walter Michaeli, Institut fur Kunststoffverarbeitung, Aachen, GermanyAlrun Spennemann, Institut fur Kunststoffverarbeitung, Aachen, GermanyRalf Gartner, Institut fur Kunststoffverarbeitung, Aachen, Germany

Micro Assembly Injection Moulding for the Generation of HybridMicrostructures 309

Walter Michaeli, Institut fur Kunststoffverarbeitung, Aachen, GermanyChristian Ziegmann, Institut fur Kunststoffverarbeitung, Aachen, Germany

Injection Molding for Micro Structures Controlling Mold-CoreExtrusion and Cavity Heat-Flux 315

Chin Yan, R & D Center, MATSUI MFG.Co., Ltd., Itabashi-ku, Tokyo, JapanMasayuki Nakao, University of Tokyo, Tokyo, JapanTaihei Go, University of Tokyo, Tokyo, JapanKiyoshi Matsumoto, University of Tokyo, Tokyo, JapanYotaro Hatamura, University of Tokyo, Tokyo, Japan

Laser Micromachining & Light Induced Reaction InjectionMolding as Suitable Process Sequence for the Rapid Fabrication ofMicrocomponents 321

Thomas Hanemann, Forschungszentrum Karlsruhe, Germany

Assembly and Microintegration IChairmen:Toshio Fukuda, Nagoya University, JapanRandolf Schliesser, VDI/VDE Technologiezentrum Informationstechnologie GmbH, Teltow, Germany

Current Developments of Ultrathin RFID Systems 327

Rudolf Leutenbauer, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyS. Cichos, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyCh. Kallmayer, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyK. Buschick, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyH. Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

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Monolithic Integration of Vibration Sensors inNear Surface Bulk Silicon Micromachining with Microelectronics 333

Carmen Steiniger, Zentrum fur Mikrotechnologien, TU Chemnitz, GermanyAndreas Bertz, Zentrum fur Mikrotechnologien, TU Chemnitz, GermanyThomas Gessner, Zentrum fur Mikrotechnologien, TU Chemnitz, Germany

Contactless Feeding of Microparts by Means of anElectrostatic Conveyor 339

Ulrich Gengenbach, Forschungszentrum Karlsruhe GmbH, Karlsruhe, GermanyBernd Kohler, Forschungszentrum Karlsruhe GmbH, Karlsruhe, GermanyJames Boole, The University of the West of England, Bristol, Great Britain

High Precision Assembly for a Novel Miniaturised ElectronLens System 345

Yannick Ansel, Institut fur Mikrotechnik Mainz GmbH, Mainz-Hechtsheim, GermanyF. Schmitz, Institut fur Mikrotechnik Mainz GmbH, Mainz-Hechtsheim, GermanyL. Singleton, Institut fur Mikrotechnik Mainz GmbH, Mainz-Hechtsheim, GermanyR. Baron, Institut fur Mikrotechnik Mainz GmbH, Mainz-Hechtsheim, GermanyA. Schmidt, Institut fur Mikrotechnik Mainz GmbH, Mainz-Hechtsheim, GermanyM. Nienhaus, Institut fiir Mikrotechnik Mainz GmbH, Mainz-Hechtsheim, GermanyG.K.L. Marx, Johannes-Gutenberg-Universitat Mainz, GermanyG. Schonhense, Johannes-Gutenberg-Universitat Mainz, Germany

Assembly and Microintegration II

Chairmen:Toshio Fukuda, Nagoya University, JapanRandolf Schliesser, VDI/VDE Technologiezentrum Informationstechnologie GmbH, Teltow,Germany

Electrostatic Gripper with Part Holding and Releasing Mechanism inMicroassembly 351

Hyeon-Seok Oh, LG Production Engineering Research Center, Kyunggi-Do, KoreaJurgen Hesselbach, Technische Universitat Braunschweig, Germany

A Concept for Modular Fabrication Equipment forFluidic Microsystems 357

Andreas Hofmann, Forschungszentrum Karlsruhe GmbH, GermanyFriedhelm Engelhardt, Forschungszentrum Karlsruhe GmbH, GermanyUlrich Gengenbach, Forschungszentrum Karlsruhe GmbH, GermanyRudolf Scharnowell, Forschungszentrum Karlsruhe GmbH, GermanyManfred Bar, IEF Werner GmbH, Furtwangen, Germany

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Development of an Assembly Process and Reliability Investigationsfor Flip-Chip LEDs Using the AuSn Soldering 363Rolf Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration, Berlin,GermanyGordon Elger, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyMatthias Hutter, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyErwin Jager, EPIGAP Optoelektronik GmbH, Berlin, GermanyHermann Oppermann, Fraunhofer Institute for Reliability and Microintegration, Berlin,GermanyHerbert Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Motion from the Nanoscale World 369

Volker Klocke, Fa. Klocke Nanotechnik, Aachen, Germany

Plenary SessionChairmen:Werner John, FhG-IZM, Paderborn, GermanyWolfgang Karthe, FhG I0F, Jena, Germany

Opportunities for Microsystems in Telecommunications

Mary-Ann Maher, MEMSCAP Inc., Oakland, USA[For technical reasons you will find this manuscript at the end of the proceedings.]

Optical and RF Telecommunication Development Tools andServices 375

Joost van Kuijk, Conventor BV, Amsterdam, The Netherlands

Art Morris III, Conventor Inc. Cary, NC, USA

Process Technologies IChairman:Wilfried Mokwa, RWTH, Aachen, Germany

Photo Initiated Adhesives - High Performance Adhesivesfor Microelectronics 379

Torsten Uske, DELO Industrieklebstoffe GmbH & Co. KG, Landsberg, Germany

High Quality Laserbeam Soldering 387

Liidger Bosse, Fraunhofer Institute Lasertechnology, Aachen, GermanyArmin Schildecker, Fraunhofer Institute Lasertechnology, Aachen, GermanyArnold Gillner, Fraunhofer Institute Lasertechnology, Aachen, GermanyReinhart Poprawe, Fraunhofer Institute Lasertechnology, Aachen, Germany

A Simple Method for the Characterization of Thin Films DuringHeat Treatment 393

Chi Hsiang Pan, National Chin-Yi Institute of Technology, Taichung, Taiwan

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Wear Resistant Tools for Reproduction Technologies Produced byMicro Powder Metallurgy 395

Astrid Rota, Fraunhofer Institut fur Fertigungstechnologie und AngewandteMaterialforschung, Bremen, GermanyThomas Hartwig, Fraunhofer Institut fur Fertigungstechnologie und AngewandteMaterialforschung, Bremen, Germany

Process Technologies II

Chairman:Wilfried Mokwa, RWTH, Aachen, Germany

Polymer Microfabrication Technologies 401

Holger Becker, MILDENO GmbH, Jena, GermanyWilfried Ropke, MILDENO GmbH, Jena, GermanyOliver Rotting, MILDENO GmbH, Jena, GermanyClaudia Gartner, Applikationszentrum Mikrotechnik Jena, Jena, Germany

Investigation of the Deposition Process and the Microdeposits ofNiFe Electrolytes in Dependence of their Composition 407

Gunter Engelmann, Fraunhofer Institute of Reliability and Microintegration, Berlin, GermanyV. Schulz, Fraunhofer Institute of Reliability and Microintegration, Berlin, GermanyJ.K. Dohrmann, FB Biologie, Chemie, Pharmazie der Freien Universitat Berlin, GermanyJ. Wolf, Fraunhofer Institute of Reliability and Microintegration, Berlin, Germany0. Ehrmann, Fraunhofer Institute of Reliability and Microintegration, Berlin, GermanyH. Reichl, Fraunhofer Institute of Reliability and Microintegration, Berlin, Germany

Chemical Mechanical Polishing as a Toolbox forThin Film Magnetic Heads Manufacturing 413

Henne van Heeren, OnStream B.V., Eindhoven, The NetherlandsFrans Prank, OnStream B.V., Eindhoven, The NetherlandsTheo Bertens, OnStream B.V., Eindhoven, The Netherlands

Sacrificial Mask FAB Etching for Hologram Diffraction Gratingwith Triangular Grooves 419

Kiyoshi Matsumoto, University of Tokyo, Tokyo, JapanMasayuki Nakao, University of Tokyo, Tokyo, JapanYuki Sakamaki, University of Tokyo, Tokyo, JapanYotaro Hatamura, University of Tokyo, Tokyo, JapanShuji Tanaka, Tohoku University, Miyagi, JapanTakeshi Miyawaki, Engineering Center, Asahi Glass Co., Ltd., Kanagawa, Japan

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Advanced Etch Tool for High Etch Rate Deep Reactive Ion Etchingin Silicon Micromachining Production Environment 425Andrea Schilp, Robert Bosch GmbH, Stuttgart, GermanyMartin Hausner, PerkinElmer Optoelectronics GmbH, Wiesbaden, GermanyMichel Puech, Alcatel Vacuum Technology France, Annecy, FranceNicolas Launay, Alcatel Vacuum Technology France, Annecy, FranceHermann Karagoezoglu, PerkinElmer Optoelectronics GmbH, Wiesbaden, GermanyFranz Laermer, Robert Bosch GmbH, Stuttgart, Germany

Ultra-thin SystemsChairman:Heinrich Brenninger, Texas Instruments Deutschland GmbH, Freising, Germany

New Process Scheme for Wafer Thinning and Stress-free Separationof Ultra Thin ICs 431

Christof Landesberger, Fraunhofer Inst. fur Zuverlassigkeit und Mikrointegration, Munchen,GermanyS. Scherbaum, Fraunhofer Inst. fur Zuverlassigkeit und Mikrointegration, Munchen,GermanyG. Schwinn, Fraunhofer Inst. fur Zuverlassigkeit und Mikrointegration, Munchen, GermanyH. Spohrle, Fraunhofer Inst. fur Zuverlassigkeit und Mikrointegration, Munchen, Germany

I n t e r c o n n e c t i o n T e c h n i q u e s fo r Ul t ra Th in ICs a n d M E M S E l e m e n t s . . . . 4 3 7Michael Feil, Fraunhofer Institute for Reliability and Microintegration, Munich, GermanyCliff Adler, Fraunhofer Institute for Reliability and Microintegration, Munich, GermanyGerhard Klink, Fraunhofer Institute for Reliability and Microintegration, Munich, GermanyMartin Konig, Fraunhofer Institute for Reliability and Microintegration, Munich, Germany

Ultra Thin Chips for Miniaturized Products 443

Erik Jung, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyA. Ostmann, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyD. Wojakowski, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyC. Landesberger, Fraunhofer Institute for Reliability and Microintegration, Munich,GermanyR. Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration, Berlin,GermanyH. Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

A New Approach for Handling and Transferring ofThin Semiconductor Materials 449

Matthias Petzold, Fraunhofer Institute for Mechanics of Materials, Halle, GermanyDieter Katzer, Fraunhofer Institute for Mechanics of Materials, Halle, GermanyJorg Bagdahn, Johns Hopkins University, Baltimore MD, USAMaik Wiemer, Fraunhofer Institute for Reliability and Microintegration, Chemnitz, GermanyMarin Alexe, Max-Planck-Institute of Microstructure Physics, Halle, GermanyViorel Dragoi, Max-Planck-lnstitute of Microstructure Physics, Halle, GermanyUlrich Gosele, Max-Planck-lnstitute of Microstructure Physics, Halle, Germany

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Actuators

Chairman:Eberhard Kallenbach, Technische Universitat llmenau, Germany

Optimization of an Electro-Thermally andLaterally Driven Microactuator 455

Cheng-Chang Lee, National Chiao Tung University, Hsinchu, TaiwanWensyang Hsu, National Chiao Tung University, Hsinchu, Taiwan

An Electro-Thermally Driven Microactuator withTwo Dimensional Motion 461

Chien-Tai Wu, National Chiao Tung University, Hsinchu, TaiwanWensyang Hsu, National Chiao Tung University, Hsinchu, Taiwan

A Novel Out-of-plane Electrothermal Microactuator 467

Chiungcheng Lo, Walsin Lihwa Corp., Taipei, TaiwanHung-Yi Lin, National Tsing Hua University, Hsinchu, TaiwanWeileun Fang, National Tsing Hua University, Hsinchu, Taiwan

A Linear Microactuator with Enhanced Design 473

Jens Edler, Institute for Driving Systems and Power Electronics, Hanover University,GermanyMartin Fohse, Institute for Microtechnology, Hanover University, GermanyHans Heinrich Gatzen, Institute for Microtechnology, Hanover University, GermanyHans-Dieter Stolting, Institute for Driving Systems and Power Electronics, HanoverUniversity, Germany

Mechatronic Drive Systems with Integrated Microsystem TechnologyComponents 479

Veit Zoppig, Technische Universitat llmenau, GermanyKarsten Feindt, Technische Universitat llmenau, GermanyHarald Kube, Technische Universitat llmenau, GermanyEberhard Kallenbach, Technische Universitat llmenau, Germany

Markets and Product Visions I

Chairman:Christine Neuy, IVAM NRW e.V., Dortmund, Germany

Competitive Position of the Microsystem Technologies forWavelength Handling in all-optical Networks for Telecom 485

Eric Mounier, Yole Developpement, Lyon, FranceMichel Provence, Yole Developpement, Lyon, France

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Technical Trends, Potential Applications and Market Development inOptical Fibre Sensor Technology 491

Reinhardt Willsch, Institute for Physical High Technology (IPHT), Jena, Germany

NEXUS Task Force MST Market Analysis -Evaluation and Update of the 1998 Report 497

Reiner Wechsung, STEAG microParts GmbH, Dortmund, Germany

Markets and Product Visions II

Chairman:Christine Neuy, IVAM NRW e.V., Dortmund, Germany

From Research to Industry: Start-up Companies inMicrosystems Technology (MST) 501

Henning Wicht, WTC - Wicht Technologie Consulting, Munchen, GermanyJeremie Bouchaud, WTC - Wicht Technologie Consulting, Munchen, GermanyCyrille Le Floch, WTC - Wicht Technologie Consulting, Munchen, Germany

Commercialization Issues of MEMS/MST/Micromachines:An Updated Industry Report Card on the Barriers toCommercialization with a Focus on the US Market 507

Roger H. Grace, Roger Grace Associates, San Francisco, USA

EUROPRACTICE Microsystem Design and Foundry Services -Status and Overview 515

Patric Salomon, MEMSCAP GmbH, Berlin, Germany

Poster Presentations

Electroless NiSn - a Low Cost Solution for Flip Chip Bumping 521

Petra Gratz, Technische Universitat Dresden, GermanyG. Sadowski, Technische Universitat Dresden, GermanyM. Bertram, Technische Universitat Dresden, Germany

Chemical Resistance of Thin Plasma Polymerized FluorocarbonFilms in Inorganic Etching Solutions Used inMicrostructure Technology 523

Vassil lanev, Technische Universitat llmenau, GermanyNorbert Schwesinger, Technische Universitat Munchen, GermanyHelmut Wurmus, Technische Universitat llmenau, Germany

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Variants of Micro Injection Molding 527Volker Piotter, Forschungszentrum Karlsruhe, Inst. f. Materialforschung III, GermanyThomas Hanemann, Forschungszentrum Karlsruhe, Inst. f. Materialforschung III, GermanyJuergen Hausselt, Forschungszentrum Karlsruhe, Inst. f. Materialforschung III, GermanyKlaus Mueller, Forschungszentrum Karlsruhe, Inst. f. Materialforschung III, GermanyRobert Ruprecht, Forschungszentrum Karlsruhe, Inst. f. Materialforschung III, Germany

A New Approach to Anisotropic EtchPing-Zou Huang, National Chiao Tung University, Hsin-Chu, Taiwan[For technical reasons you will find this manuscript at the end of the proceedings.]

Real Time and In-situ Control of the Etching Depth inDynamic Dry Etching Processes of Micro- and Opto-Electronics 531

Gottfried Frankowski, GFMesstechnik GmbH, Teltow/Berlin, Germany

Aspects of Material Influence and Structure Geometry Regardingthe Dry Hydrofluoric Etching of Sacrificial Layers for Microsystems . . . 533Oliver Krampitz, University of Bremen, GermanyA. Buhrdorf, University of Bremen, GermanyA. Bodecker, University of Bremen, GermanyJ. Binder, University of Bremen, Germany

Design and Prototyping of a Highly Integrated MicropropulsionSystem for Microsatellites Attitude Control and Orbit Correction 537

Giulio Manzoni, Mechatronic GmbH, Villach, AustriaEnzo di Fabrizio, INFM - Elettra Sincrotrone, Trieste, Italy

Integrated High Voltage Amplifiers to Drive CapacitiveMicroactuators 541

Stephan Buschnakowski, Technische Universitat Chemnitz, GermanyGunter Ebest, Technische Universitat Chemnitz, GermanySteffen Heinz, Technische Universitat Chemnitz, GermanyCarsten Schlegel, Technische Universitat Chemnitz, Germany

A New Electromagnetic MicromirrorPing-Zou Huang, National Chiao Tung University, Hsin-Chu, Taiwan[For technical reasons you will find this manuscript at the end of the proceedings.]

Aluminium Temperature Sensors of Resistance 545

Igor Vrublevsky, University of Informatics and Radioelectronics, Minsk, RussiaV. Parkoun, University of Informatics and Radioelectronics, Minsk, RussiaK. Moskvichev, University of Informatics and Radioelectronics, Minsk, Russia

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Reflective Bistable Liquid Crystal Displays on Flexible Products 547Monika Bauer, Fraunhofer Institute for Reliability and Microintegration, Teltow, GermanyChristine Boeffel, Fraunhofer Institute for Reliability and Microintegration, Teltow, GermanyFrank Kuschel, Fraunhofer Institute for Reliability and Microintegration, Teltow, GermanyCarsten Nieland, Fraunhofer Institute for Reliability and Microintegration, Teltow, Germany

Advanced Modular Micro-Production System 551

T. Gaugel, Fraunhofer Inst. Produktionstechnik und Automatisierung, Stuttgart, Germany

New Laboratory Stand for Flip-Chip on Board Assembly 555

Zdzislaw Drozd, Warsaw University of Technology, Warszawa, Poland

Environmental Friendly Plating and Deplating of Goldin PCB Manufacturing 559

K.-H. Zuber, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyH. Griese, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyM. Hannemann, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyJ. Muller, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyR. Schmidt, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Laser Direct Patterning (LPD) - A New Process for the Fast andEfficient Fabrication of Microstructures 565

Dieter Meier, LPKF Laser & Electronics AG, Garbsen, Germany

On a Recipe for SU8-5 Photoresist to Fabricate theElectroplating Micromolds of a Bi-axial Microaccelerometer 567

Yi-Chung Lo, Synchrotron Radiation Research Center, Hsinchu, TaiwanDeng-Huei Hwang, National Chiao-Tung University, Hsinchu, TaiwanKanping Chin, National Chiao-Tung University, Hsinchu, Taiwan

Fabrication of Micro Fluidic Structures byHigh Precision Embossing 571

Andreas Schubert, Fraunhofer IWU, Chemnitz, GermanyThomas Otto, Fraunhofer IZM, Chemnitz, GermanyJuliane Bohm, Fraunhofer IWU, Chemnitz, GermanyReimund Neugebauer, Fraunhofer IWU, Chemnitz, GermanyThomas Gessner, Technische Universitat Chemnitz, Germanys

Special Session: Modular MEMS

Modular Optic Devicecs and Optic Interfaces 577

Achim Stock, Matthias Schuenemann, Gerd Bauer, Wolfgang Schaefer,Fraunhofer Institutefor Manufacturing Engineering and Automation IPA, Stuttgart, GermanyRudolf Leutenbauer, Volker Grosser, Fraunhofer Institute for Mechanical Reliability andMicrointegration IZM, Berlin, GermanyAndreas Braeuer, Christoph Waechter, Ramona Eberhardt, Fraunhofer Institute for AppliedOptics and Precision Engineering IOF, Jena, Germany

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Design Methodology of Modular Micro-systems 583

Kourosh Amiri Jam, Rudolf Leutenbauer, Volker GroBer, Herbert Reichl, Dept. ASE,Fraunhofer Institut FhG/IZM, Berlin, Germany

Reliability and Lifetime of Modular MEMS 589

V. Hillmann, C. Bombach, D. Heinrich, W. Faust, Fraunhofer IZM, Berlin, GermanyE. Kaulfersch, AMIC GmbH, Berlin, Germany

Modular Fluidic Devices and Fluidic Interfaces 595

Gerd Bauer, Matthias Schuenemann, Fraunhofer Institute for Manufacturing Engineeringand Automation, Department of Microfabrication, Stuttgart, GermanyGotz Gunther, Rheinisch-Westfalische Technische Hochschule Aachen (RWTH)Institute of Fluid Power Transmission and Control, Aachen, GermanyVolker GroBer, Volker Hillmann, Fraunhofer Institute for Mechanical Reliability andMicrointegration, Department of Mechanical Reliability and Microtechnology, Berlin,Germany

Modularization of Microsystems 601

Matthias Schuenemann, Gerd Bauer, Achim Stock, Wolfgang Schaefer, FraunhoferInstitute for Manufacturing Engineering and Automation IPA, Stuttgart, GermanyVolker Grosser, Kourosh Amiri Jam, Rudolf Leutenbauer, Herbert Reichl, FraunhoferInstitute for Mechanical Reliability and Microintegration IZM,Berlin, Germany

Messeprogramm 607

Index of Authors 609

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