byFred C. Lee

Director, Center For Power Electronics SystemsAn Engineering Research Center

CPES OverviewCPES Seminar Series – Fall 2015

November 13, 2015

Power Electronics Research Group (PERG)

Fred Lee was hired To fix the broken-down of a

Electric Vehicle

Leo Grigsby

1977

SponsoredResearchPERG

VPEC

VIRGINIA POWER ELECTRONICS CENTER

NSF-ERC

University

Partnership

VPEC/CPES Funding Growth (1977 – present)

VPEC

VIRGINIA POWER ELECTRONICS CENTER

5 Faculty members1 Affiliate Faculty6 Research faculty4 Full-time Staff2 Part-time Staff

20 Visiting Scholars39 Doctoral Students

6 Masters Students

The Beginning: Aerospace

VLF Transmitter Power AmplifierFunded under NAVY (1978)

Sponsored by Naval OceanSystem Center, San Diego

Modular multi-cell converter for VLF Transmitter Power Amplifier

DC-to-Sinusoidal Inverter Using Vector Summation Scheme Inverter for Medium Voltage Drives

250V

4KV

cpes-7

1st Decade: Information Technologies

DesktopLaptop

Network

Telecom

Server

VPECCIT/TDC

Prof Dan Chen (1979-2005)

National TaiwanUniversity

(2005- present)

Prof. Vatché Vorpérian

Virginia 1984-1991JPL

Prof. Bo Cho(1985-95)

Ph.D.(1985)1995- Present,

Prof. Seoul National University

Member, of KAE

VPES Faculty Members

Soft Switching

vds

id

Energy

transfer

“Zero-Voltage Switching Techniques in DC/DC Converter Circuits,” K.H. Liu and

F.C. Lee, (IEEE Power Electronic Specialists Conference 1986); US Patent

4,720,668

ZVS Cell

Over 25 US patents

Quasi-Resonant ConverterMulti-Resonant ConvertersZVS/ZCS PWM converters

世界第一篇提出零電壓切換技術專利。

ZVS MRC

Soft-Switching Technologies

Soft Switching

ZCS QRC

ZVS QRC

ZVS PWM

ZCS PWM

25 US patents

Zero-voltage switchingQuasi-Resonant

Converter

Transformational change of power conversion technologies With significant reduction of switching losses and increase in

conversion efficiency and power density

Wojciech Tabisz

Kwang-Hwa Liu

Gary Hua

MilanJovanovic

Soft-Switching Techniques

ZVS Resonant Converter

ZVS Quasi- ResonantConverters

ZVS PWM Converter

Server Data Center

cpes-12

2nd Decade: Infrastructure Technologies (IT)

VPEC

13

HEV Propulsion

Sponsors:Ford

General MotorsDaimler-ChryslerUS Army TACOMPNGV

14

DC/DC converterpowering the

fuel cell

Powering the Fuel Cell Vehicles

Fuel Cell vehicle

FordDaimler-Chrysler

Ballard

15

Aircraft Electric Power Systems

Internal Engine Electric Starter/

Generators

Electrically DrivenFlight Actuators

Avionics

270 V DCPower Distribution

System

Solid StatePower Controllers

Batteries

SmartActuators

Cabin Pressure andTemperature ControlThales

16

All Electric Ship

Concept

17

Deployment

Newport News Shipbuilding

2002

CVN 75

Aircraft Electric Service Station

Concept1995 Technology

1998

PowerElectronics

BuildingBlock

(PEBB)

Product2001

AircraftElectricService Station

18

VA VB VC

NHBBB

1

HBBB2

HBBB3

Active power flow

STATCOM

CPES Faculty Members

19

Prof. Dushan BoroyevichPh.D. (1982-85)

Professor (1990- present)

Prof. Jason LaiFuture Energy

Electronics Center

Prof. Alex Huang(1994-2004)

Professor, NCSU(2004-present)

cpes-20

CPES Research Program

IPEM-Based PowerConversion Systems

(IPEM-PCS)D. Boroyevich, VTEn

gine

ered

Syst

ems

IntegratableMaterials

(IM)G. Q. Lu, VT

Advanced Power Semiconductors

(APS)T. P. Chow, RPI

High-DensityIntegration

(HDI)J. D. van Wyk, VT

Fund

amen

tal

Kno

wle

dge

Electro-Magneto-Thermo-Mechanical Integration Technology (EMTMIT)T. M. Jahns, UW T. A. Lipo, UW

Enab

ling

Tech

nolo

gy

Microprocessorand Converter

Integration

Standard-CellActive IPEMs

Standard-CellPassive IPEMs

Motor andConverterIntegration

Center DirectorF. C. Lee, VT

Control & SensorIntegration

(CSI)R. D. Lorenz, UW

Thermal-MechanicalIntegration

(TMI)E. P. Scott, VT

cpes-21

Product Specifications

More Automation Less Labor

Automatic Assembly Line

Active IPEM

Passive IPEM

Daan Van Wyk Joined CPES(1999-2008)

Active IPEM

1-23

Integration of LCT-- Passive IPEM --

Integrated EMI Filter

Integrated Motor & Drive System

Modular 5-PhasePM Motor

Modular Phase-Drive Inverter IMMD

Prof T A LipoProf R D Lorenz Prof T M Jahns

Advanced Packaging without Wire-BondMuch Reduced Packaging Inductance

Renesas

Great Wall

MOSFET Substrate

Metalization (trace)

50 % reduction of

Device losses

Commercialization of IPEMs

Intelligent Power Modules

CPES IPEMs

g ered

Sy

ste

m

Current CPES Research AreasEmerging Applications

CarsShips

Airplanes

CarsShips

Airplanes

Technology Areas

High Density Integration

Modeling and Control

EMI and Power Quality

Power Electronics

Components

Power Conversion Topologies and Architectures

Application Areas

Renewable Energy Systems

VehicularPower Converter

Systems

Point-of-Load Conversion

Power Management for Computers &

Telecommunications

PortableDataCom

Dec. 10th, 2012 27

CPES Industry Members Worldwide84 members

44 – N. America

27 – Asia

13 – Europe

PRINCIPAL MEMBER PLUS ($50 K/year)  (3 new)‐‐ 40 graduate fellowships ‐‐

3M Company ABB, Inc. (2 fellowships) ALSTOM TransportAltera – Enpirion Power Chicony Power Technology Co., Ltd. Crane Aerospace & ElectronicsCSR Zhuzhou Institute Co., Ltd. Delta Electronics (3 fellowships) Dowa Metaltech Co., Ltd.Eltek Emerson Network Power  GE Global ResearchGE Power Conversion  General Motors Company Groupe SAFRANHuawei Technologies Co., Ltd. (3 fellowships) International Rectifier Keysight TechnologiesLinear Technology Macroblock, Inc. Mitsubishi Electric CorporationMurata Manufacturing Co., Ltd. NEC TOKIN Corporation Nissan Motor Co., Ltd.NXP Semiconductors Panasonic Corporation  Richtek Technology CorporationRolls‐Royce Siemens Corporate Research Sonos, Inc.Sumitomo Electric Industries, Ltd. Texas Instruments (2 fellowships)  The Boeing Company Toyota Motor Engineering & Mfg. N. America United Technologies Research Center

PRINCIPAL MEMBER ($30 K/year) (2 new)AcBel Polytech, Inc. Analog Devices China National Electric Apparatus Research InstituteFairchild Semiconductor Corporation Halliburton  Infineon TechnologiesMaxim Integrated Products MKS Instruments, Inc. ON SemiconductorPower Integrations, Inc.  Toshiba Corporation ZTE Corporation

ASSOCIATE MEMBER  ($15 K/year) (2 new)Calsonic Kansei Corporation Crown International Cummins, Inc.Delphi Electronics & Safety Dyson Technology Ltd. Eaton Corporation, Innovation CenterEfficient Power Conversion Ford Motor Company GHO Ventures, LLCInventronics (Hangzhou) Inc. Johnson Controls, Inc. Lite‐On Technology CorporationLS Industrial Systems Co., Ltd. Metamagnetics, Inc. Microsoft CorporationNetPower Technologies, Inc. OSRAM Sylvania, Inc. Rockwell AutomationSchaffner EMV AG Shindengen Electric Mfg. Co., Ltd. Silergy TechnologyTDK‐Lambda Corporation  Toyota Motor Corporation United Silicon Carbide, Inc.Universal Lighting Technologies, Inc.

AFFILIATE MEMBER (in‐kind or <$10 K/year) (1 new)

ANSYS, Inc. CISSOID Electronic Concepts, Inc.Mentor Graphics Corporation Plexim GmbH Powersim, Inc.Rohde & Schwarz SIMPLIS Technologies, Inc. Synopsys, Inc.Tektronix, Inc. Transphorm, Inc. VPT, Inc.

CPES Industry Consortium 84 Members – April 2014 – April 2015 (8 new members)

Industry Membership Funding Growth

CPES Intellectual Property Management

Industry Consortium

Principal Members

Principal Plus Members IPPF

Associate Members

Affiliate Members

CPES Intellectual Property Protection Fund (IPPF):

• IPPF members finance the IP protection cost• IPPF members are granted royalty-free, non-exclusive, non-

transferable IP rights

CPES IP portfolio: 86 USPatents

40 sponsored by IPPF since 2002

312010.12.16

Power Management Consortium (PMC)

32

Work Scope:• High performance VRM/POL converters• High efficiency power architectures for laptops,

desktops and servers• High frequency magnetics characterization and

design• Digital control • EMI• Solid state lighting• Power management for PV system• Power management for battery system• High-Efficiency and High-Power Density Power

Supplies with Wide-Band-Gap Power Devices

cpes-33

00 01 02 0398 99

-

Fuji

VRM Control IC

VRM

Fairchild (BGA)

Siliconix(“Polar PAC”) ST Microelectronics*

Fairchild (BGA)

Siliconix(“Polar PAC”) ST Microelectronics*

Ron2

L

Vo

R

Vc

Control

Vin C

Vc

ILDCR Current Sensing

4 Channel VRM

Intel Processor1.5V30A1GHz

Multi-Phase VRM

IM

M

i1

i2

L1

L2

IM

M

IMIM

MM

i1

i2

L1

L2

i1

i2

L1

L2

Coupled Inductor

A Billion -Dollar Industry!

Telecom POL

DCX

VRVR+

Co RLQ2Q1 io1

Q4Q3 io2

Q6Q5 io3

io

- nd

Co RLQ2Q1 io1

Q4Q3 io2

Q6Q5 io3

io

--

** -

Isolation

-

*U.S. Patent, No.7,254,047

LateralPower IC

C

Channel 1 Buck

Channel 2 Buck

CPES

IPEM

CPES Research & Impacts-on VRM and POL Converters

Industry Products

CPES Research060504 07 08

3-D POL

Impact of Wide-Band-Gap Devices

Silicon @100KHz50W/in3

GaN @ 1MHz800W/in3 10X

400V/12V

95.0%

96.0%

97.0%

98.0%

99.0%

100.0%

VIN

L1

S12

C R VO

+

-

S11

L2

SN2

SN1

S22

S21

Totem-Pole Bridgeless PFC

GaN Module

Smaller footprint, better thermal performance

0 200 400 600

98.7%98.8%98.5%

Output Power (W)

Effic

ienc

y (%

)

fs >1MHz

Mini-Consortium forHigh Density Integration (HDI)

Work Scope:• Material and component

characterization (interconnect, dielectrics, magnetics, SiC, GaN)

• Active module integration• Passive component integration• Converter integration• Wide power range (10 W – 100 kW)• High frequency (100 kHz – 10 MHz)

High temperature (≥ 200 ºC)

High-Power-Density, High-Temperature Modules

+

• High-temperature SiC modules• Sensorless control• Soft start• Fan load application

70 kHz 40 kHz

M

Ø = 21.5 cm

High-temp. converter:1.27 kW/lb

26.5 mm

Inverter current (40A/div)

Rectifier current (40 A/div)

DC link voltage (200 V/div)

Input voltage (500 V/div)

Dec. 10th, 2012 37

Inductor

GaN Driver Cin

3-D Integrated Point-of-Load

GaN, 20A, 5MHz, 1100W/in3

By Optical Microscope 

Vin = 12V, Vout = 1.2~1.8V, Iout = 10~20A,

Silicon, fs = 1~2 MHz, 10-20A, 800W/in3

High-Temperature, High-Power-DensityPower Converter for Embedded Generators

High-power, high-temperature, high-power-density bidirectional three-phase ac-dc power converter unit

required to operate in the temperature range of 200-250 C.

High-temp. motherboard

SOI gate driver

50 kW unit

• SiC MOSFETs & SBDs

• All materials > 200 C

High Density Motor ControllerSponsor: The Boeing Company

Monday, November 23, 2015 40

Objective:Reduce weight through integration and high-temperature operation

• 250 ºC junction operation at 10 KW RL load

• SiC diodes and switches for high temperature and high frequency operation

• Integrated motor and drive

Ia_recIa_inv

Vg_inv1Vg_inv2

Mini-Consortium forRenewable Energy and Nanogrids (REN)

Work Scope• DC- and AC- nanogrid

operation and performance

• Modular multi-level converters for nanogrids

• Power electronics applications for enhanced T&D grid performance and resource integration

DC Nanogrid

• Wireless communication

• Load management• DG management• Data acquisition

Time

kWh

Web-based GUI

ECC:Energy ControlCenter

380V

48V

Nanogrid / Microgrid Hybrid AC/DC System

µECC

AC bus

480 V, 3-phase, 60Hz

SYNCHRONOUS GENERATOR

Renewable energy

ENERGYSTORAGE

High power DC bus

VDC bus

360 – 400

nECC

480 V / 240 V,

-

Washer/DryerStove/Range

48 V

TV, ComputerLED light

Z o

IMPEDANCE MEASUREMENT

Z i

Living Lab

200KVA

200KVA

10-200KVA

800V DC

O

0° 180°

DC/ACN

P

0

Grid Interfaced 3-Level Inverter

High Density On-Board Battery Charger

Power Density 495W/in3

GaN Version @ 500kHzIGBT Version @ 20kHz

Power Density: 95W/in3 5X

CPES-VT Faculty

Dushan Boroyevich Co-Director

Fred C. Lee Center Director

Khai Ngo

Guo-Quan Lu (Affiliate Faculty)

Qiang LiRolando Burgos

CPES-VT Research Faculty

David Gilham

47

Igor Cvetkovic

Wenli Zhang

Mingkai Mu

Zhiyu Shen Xuning Zhang

CPES Visiting Scholarsfrom industry

Chaofeng CaiDelta Electronics, China

Kenichiro TanakaPanasonic Corporation, Japan

48

Seiya YukiDowa Metaltech, Japan

Kenta EmoriNissan Motor, Japan

David ReuschEfficient Power Conversion,

USA

Akihiro JonishiFuji Electric, Japan

CPES Visiting Professors

Zeng LiuXi’an Jiaotong University, China

49

Li WangNanjing University of Aeronautics and

Astronautics, China

CPES Visiting Scholarsfrom academia

50

Weijing DuZhejiang University, China

Yan-Cun (Daniel) LiTaiwan

Dennis KarwatzkiLeibniz Universität Hannover,

Germany

Furong XiaoBeijing Institute of Technology, China

Xiaolong YueXi’an Jiaotong University, China

Thank You

51