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Cost Savings and Energy Efficiency Improvements Using Best Practices in Semiconductor Fabs

Singapore EENP Conference 2011 Andreas Neuber

Applied Materials

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Agenda Eco efficiency engineering

Goals and challenges

Solutions

– Synchronization subfab / equipment operation – Exhaust recycling – High temperature process cooling water – Resource reduction

Summary

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Energy use in a fab

APPLIED GLOBAL SERVICES

Power

Equipment

Subfab

Process utilities UPW, CDA, N2, PCW, Exhaust

Infrastructure chiller, boiler, cooling tower, air handling

Cleanroom

Natural gas

Power

Natural gas

Utilities Process utilities

15…20%

25…30%

10…40%

20…25%

Note: The data are calculated based on estimates. The wide range is caused by the impact of the climatic conditions on the overall energy balance

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Direct power consumption Indirect power consumptionPower Litho

Thin Film

Diffusion

Implant

Epi

Etch

Clean

Metrology

CMPCleanroom

CDA N2 UPW Exhaust PCW Others Process facilities

Recirc air Lighting Boiler

Make-up air Chiller Infrastructure

Cooling tower

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Equivalent energy consumption of semicondcutor manufacturing based on SEMI S23 – Example

Power 52%

Exhaust 14%

Heat 7%

CDA 5% N2

6%

Hot UPW 4%

PCW 6%

UPW 6%

Note: The values are typical values calculated based on estimates as an average over all tool types (actual values may vary).

Equipment power and relevant utility consumption

Note: Does not include chemical and gas consumption and energy consumption of infrastructure, such as cleanroom

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ITRS Goals 2010

2009 2010-2012 2013-2015 2016-2024Power Eq/cm2 Si kWh/cm2 Si 0.5 0.43 0.36 0.30...0.25

Power Total site/cm2 Si kWh/cm2 Si 1 0.85 0.7 0.6...0.5

Reduction 25%/5 yr 2009 2012 2015 20200.5 0.43 0.36 0.27

1 0.85 0.72 0.54

Source: ITRS, 2010

Average YoY reduction path (new fab construction) ITRS 5%

Note: ITRS represents organizations, such as SIA, ESIA, KSIA, TSIA, JEITA

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Eco Efficiency Engineering Toolbox

1. Improve primary process

2a. Improve critical cleans

2b. Improve non-critical cleans

3. Reduce idle flows 4. Use resources with lower environmental footprint

5. Recycle, Reclaim, Reuse

6. Increase usefull lifetime

7. Renewable energy and materials

8. Optimize process / facility interface

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Power consumption reduction opportunities – Examples

General utilities External supply Facility systems - Supply Subfab - Supply Manufacturing

equipment Subfab - Disposal Facility systems - Disposal External disposal

Cleanroom RF Generator Man. Equipment Vacuum pumps Exhaust Ambient airMake-up air Remote plasma Abatement Acid

Recirc air CausticSolvent

Facility chiller Heat (General)(Boiler)

Local chiller Heat Ambient airCogen/Trigen Electrival cabinet Cooling tower

Power HV transformerWater Sewer

Raw water UPW plant UPW heater Neutralization DirectHF treatment Indirect

Air separation CMP treatmentCDA generation Cu treatment

Bulk gases Gas farm Gas blending Special systemsSpecialty gases Gas distribution

Precursors (Central distribution) Distribution Solid waste Waste disposal

Collection DepositionProcess chems Chem distribution Chem blending Incineration

Liquid waste ReuseCollection

Support utilities:House N2Compressed airPowerCity waterProcess cooling waterExhaust

Exhaust recycling and reduction

High temperature PCW

Smart idle mode

Resource consumption reduction

Energy efficient subfab components

Heat recovery hot UPW

1 2

3 4

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SEMI E37 Generation Tool Platforms Enable Energy Saving

ABATEMENT

PROCESS TOOL MAINFRAMES

CHILLERRF

Energy Saving InterfacePhase 1:Determine state of Process Tool.Control energy state for abatement and pumps.Monitor and Trend SubFab data.

Phase 2:Totalize total Gas flow and CO2 equivalent emission.Provide link to other Host services (MAS, FAS etc.) and ExpertConnect.Utilize E3 services (Predictive maintenance, Fault Detection and Classification).

VACUUM PUMPS

ETHERNET HSMS

RS232 / TCP_IP REQUEST AND

ACKNOWLEDGE

FACTORY MANAGEMENT

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Disconnected Subfab Equipment Wastes Energy

PROCESS CHAMBER

ABATEMENT ENERGY

Deposition (SiH4)

Clean (NF3)

VACUUM PUMP ENERGY

Subfab equipment operation stays constant no matter what the process chamber is doing

Deposition (SiH4)

Clean (NF3)

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PROCESS CHAMBER

Deposition (SiH4)

Clean (NF3)

Deposition (SiH4)

Clean (NF3)

Subfab equipment operation synchronized with process to save energy

Synchronizing subfab Matches Energy Need to Operation

Energy Savings

Energy Savings

ABATEMENT ENERGY

VACUUM PUMP ENERGY

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Solution: Exhaust recycling - Implant exhaust

Implanter

Toxic exhaust

Heat exhaust

Acid exhaust

Exhaust recycling

Implanter

Toxic exhaust

Heat exhaust

Switchover and/or abate potential contaminants

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Solution: High temperature PCW

CT

Fab

Eq

ualiz

er

tank

F PCW Supply 17 °C

PCW Return: 23°C

Refrigeration chiller

CHW Supply 12 °C

CHW Return 18°C

CT Refrigeration chiller

Dehumidification MAHU

CHW Supply 4°C

CHW Return 11 °C

Site Raw water tank Pre-treatment

UPW make-up

Heat Recovery *1

UPW Polishing

Cooling *1

Heating

Cooling *1

Other users Central Scrubber, etc.

Note: The drinking water system is a separate system

Air washer

5...35°C

40°C

5...35°C

40°C

80...90%

MAHU condensate

RAHU or sensible cooling coils

Note: Closed loop PCW

Air

General (heat) exhaust

*1 Also possible in CHW system, depending on location

Process service water

UF concentrate recycling

Cold and Hot UPW

Hot water

Eq

ualiz

er

tank

F

CT 5...35°C

40°C

PCW Supply 35 °C

PCW Return: 41°C Add separate

loop

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High temp PCW saving potential: Calculated by JEITA

0

10

20

30

40

50

60

70

80

90

100

Case 1 Case 20

10

20

30

40

50

60

70

80

90

100

Case 1 Case 2

Tons

-CO

2/yea

r

Tons

CO

2 / Y

ear

Source: JEITA, 2007

• We could reduce 20% of CO2 emission from facility • In fab this is 9% reduction of energy consumption

Utility standard could get big benefit

Case 1 Current Case 2 This Case

Cooling water inlet temperature 20°C Chiller cooling 32°C Free cooling

Cooling water difference between in and out T=3K T=5K

100%

80%

-20% -9%

43%

34%

57%

57%

Facilities

Equipment

Facilities

Source: JEITA, Semicon Japan 2007

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Solution: Reduction of resource consumption

Compare chambers that perform well for resource usage differences

Check for wasteful cleaning and idle set points

Source: Semiconductor International, Dec 2008

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300 mmPower in kW 2011 2012 2013 2014 2015

Delta in kW

Energy saving measure 2011 2012 2013 2014 2015

Proc. Equipment 47.2% 11,213 10,692 10,396 9,630 8,965 8,965 2,248 Proc. EquipmentDry Pumps 19.1% 4,535 4,308 4,172 3,855 3,628 3,628 907 Dry Pumps Idle mode 25% 40% 75% 100% 100% % of pumps with idle mode

Turbo pumps 4.3% 1,019 1,009 999 978 958 958 61 Turbo pumps 5% 10% 20% 30% 30% Efficiency improvement

Heaters 5.9% 1,391 1,321 1,252 1,113 974 974 417 HeatersEfficiency, idle mode 5% 10% 20% 30% 30% Efficiency improvement

Misc. 5.4% 1,284 1,220 1,156 1,027 899 899 385 Misc. Efficiency 5% 10% 20% 30% 30% Efficiency improvementNon-Process Pumps 4.1% 963 867 867 770 674 674 289 Non-Process Pumps Efficiency 10% 10% 20% 30% 30% Efficiency improvement

RF Generators 2.7% 642 629 629 616 603 603 39 RF Generators Eff improvement 10% 10% 20% 30% 30% Efficiency improvementUPS Control 1.8% 428 419 419 411 402 402 26 UPS Control Eff improvement 10% 10% 20% 30% 30% Efficiency improvement

Remote Plasma Clean 1.4% 321 315 315 308 302 302 19 Remote Plasma Clean Idle mode 10% 10% 20% 30% 30% Efficiency improvementMini Environments 0.5% 107 107 107 107 107 107 0 Mini Environments

Others (Local abatement) 2.2% 523 497 481 445 418 418 105 Others (Local abatement) Idle mode 25% 40% 75% 100% 100% % of abatement with idle mode

Chilled Water 20.0% 4,756 3,490 3,129 2,442 1,820 1,820 2,936 Chilled WaterProcess equipment 13.5% 3,210 1,926 1,605 963 321 321 2,889 Process equipment HTPCW 40% 50% 70% 90% 90%

Others 6.5% 1,546 1,546 1,546 1,546 1,546 1,546 0 Others

Process Exhaust 2.3% 547 520 492 438 383 383 164 Process Exhaust Exhaust recycling Central + local abatement

Scrubbed & general exhaust 1.9% 452 429 407 361 316 316 136 Scrubbed & general exhaust Eco efficiency 10% 20% 30% 40% 40%Exhaust reduction (e.g. by recycling)

VOC abatement 0.4% 95 90 86 76 67 67 29 VOC abatement Eco efficiency 5% 10% 20% 30% 30%

Recirculating Air Handing 4.0% 951 904 904 856 808 808 143 Recirculating Air HandingReduce filer coverage 5% 5% 10% 15% 15%

Lighting 2.2% 523 497 471 445 445 445 78 Lighting Efficiency 5% 10% 15% 15% 15% High efficiency lampsMake Up Air 3.0% 713 713 713 713 713 713 0 Make Up Air See exhaustSteam/Hot Water 0.3% 71 71 71 71 71 71 0 Steam/Hot WaterProcess Cooling Water 2.9% 690 690 690 690 690 690 0 Process Cooling Water See HT PCWDI/UPW 3.1% 737 708 693 663 627 590 147 DI/UPW Eco efficiency 4% 6% 10% 15% 20% Consumption reductionUPW Hot 0.5% 119 114 112 107 101 95 24 UPW Hot Eco efficiency 4% 6% 10% 15% 20% Consumption reductionCompressed Air 4.2% 999 959 939 899 849 799 200 Compressed Air Eco efficiency 4% 6% 10% 15% 20% Consumption reductionBulk Gases 7.9% 1,878 1,803 1,766 1,691 1,597 1,503 376 Bulk Gases Eco efficiency 4% 6% 10% 15% 20% Consumption reductionProcess Vacuum 0.4% 95 91 89 88 88 86 10 Process Vacuum Eco efficiency 4% 6% 8% 8% 10% Consumption reductionIndustrial Waste Collection & Treatment 1.6% 380 365 358 342 323 304 76

Industrial Waste Collection & Treatment Eco efficiency 4% 6% 10% 15% 20% Consumption reduction

Chemical Dispense 0.0% 0 0 0 0 0 0 0 Chemical Dispense Eco efficiency 4% 6% 10% 15% 20% Consumption reductionAutomated Material Handling System AMHS 0.4% 95 91 89 86 81 76 19

Automated Material Handling System AMHS Eco efficiency 4% 6% 10% 15% 20% Consumption reduction

Total 100.0% 23,768 21,708 20,912 19,160 17,560 17,348 6,420Reduction 100% 91.3% 88.0% 80.6% 73.9% 73.0%

1.8 2.5 4.0 5.4 5.6Power cost reduction in Mio US$

Energy Reduction Roadmap – 300 mm (Example)

Note: Does not include EUV Potential savings of 25% in 5 years

Note: The data are calculated based on estimates.

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Summary Energy saving targets as defined in ITRS roadmap are feasible but require

systems integration to maximize energy savings at the lowest technical risk and identified liability.

Subfab and the process / facility interface represent the largest energy consumption per wafer pass reduction opportunities without compromising environmental, health and safety (EHS) standards and have no impact on production.

Integration and synchronization of discrete subfab components and integration with process tool interfaces demonstrated substantial energy and carbon footprint reduction.

Chamber monitoring benefits in quantifying energy, gas and chemical reduction achievements, allowing dynamic energy & resource management and real-time energy as well as GHG (Green House Gas) accounting.