Control Monitor Protect Communicate · • Reduce new product design time –Developers can move to...

1/4/2016 CONFIDENTIAL (c) 2015 AgileSwitch, LLC 1

Control • Monitor • Protect • Communicate

Topics

• Overview

• AgileSwitch Stack Electronics

• AgileSwitch IPMs (Intelligent Power Modules)


AgileSwitch Designs Power Electronics Products for Renewable Energy & Energy Conversion Markets


PV / Solar Wind EV/HEV

UPS/Data Centers

Rail

Motor Drives Induction Heating Welding

AgileSwitch Product Line-Up


AgileSwitch IPMs

AgileSwitch Stack Electronics

AgileSwitch Gate Drivers (see separate presentation)

…Inverter Design and Supply Chain Uncertainty

- Inverter designs can be challenging and timescales

to develop difficult to predict

- Power Stacks need to be developed before

inverter design and software can start

- Supply chain management can be effected

with the sourcing of key components

5

Power Stack

CONFIDENTIAL (c) 2015 AgileSwitch, LLC 1/4/2016

What Do We Do Differently?

AgileSwitch products bring a “digital mindset” to the traditional “analog” approach to inverter components

Our FPGA/ CPLD firmware-based products offer:

1. Improved sensing, monitoring and controls at the point of DCAC and DCDC power conversion in an inverter

2. Ability to change functionality in software versus expensive hardware changes

3. Modular design based on industry standard components and AgileSwitch control electronics


How Does This Translate into Value for our Inverter Manufacturer Customers?

Addressing the problems of inverter design and supply chain uncertainty enables our customers to:

• Reduce new product design time

– Developers can move to software development, vs. hardware development, 3-6 months faster, shortening product development time by at least 1/3

– Software diagnostics of key parameters improves new product modeling and diagnostics

– Configurable gate driver performance

• Reduce supply chain risk

– Enabling multi-sourcing of IGBTs to reduce shutdowns and lead times


Analog Stack Electronics for EconoDualTM and PrimepackTM

CONFIDENTIAL (c) 2015 AgileSwitch, LLC 9 1/4/2016

AAS2E3 with advanced features

Includes an Interface Board and up to 3 Gate Drivers. Each Gate Driver can be used on a variety of IGBT modules that can be controlled, monitored and protected by the Interface Board. The configuration can provide power conversion for DC-AC, DC-DC, AC-AC, or AC-DC applications.

For EconoDual For PrimePack

L

O

A

D

Customers Choice of IGBT and manufacturer

Customer Flexibility for Component Choices

3 x Current Sensors feeding back into Stack Electronics

interface board

Air cooled with DC link Cap

Liquid cooled

Customer Inverter

Controller

Customers Choice of Heat sink manufacturer


Customers Choice of Capacitor Advanced high

density ring film or Electrolytic

Stack Examples using EconoDual package

EconoDual

PrimePack

Customers Choice of Current Sensor

CONFIDENTIAL (c) 2015 AgileSwitch, LLC 1/4/2016

System Overview


Basic topology of Interface and GDB (Gate Drive Board)

Schematic of INEX3A3 Analog Interface Board

To Host

Schematic of a EDEM2-EconoDual IGBT driver for each GDB (1,2,3)

AgileSwitch IPMs (Intelligent Power Modules)


AgileSwitch IPM Stack Product Options

CONFIDENTIAL (c) 2015 AgileSwitch, LLC 13

• Analog SmartPower Stack • Digital AgileStack

• AgileStack Evaluation Kit with Optional NI General Purpose Inverter Controller (GPIC)

With Advanced high density DC link

Capacitor

SmartPower Stack : 50 - 100kW Inverter

• IGBTs: Customers choice of EconoDual Manufacturer

• Gate Drive Boards: AgileSwitch

• Interface Board: AgileSwitch

• Current Sensors: LEM


SmartPower Stack Definitions


SmartPower Stacks™

Level 1 Level 2S Level 2M Level 3S Level 3M

Dimensions (mm) LxWxH

280x215x165 280x285x165 280x215x432 280x285x185 280x245x432

DC Link Capacitors

N/A Power Ring Film Capacitors™

Capacitor Bank Power Ring Film Capacitors™

Capacitor Bank

Controller N/A N/A N/A National Instruments – (GPIC)

National Instruments – (GPIC)

Level 1 Level 2S Level 2M Level 3S Level 3M

30 Fault Conditions + 5 Additional Sensors


FAULTS HB1 HB2 HB3 DSAT HI IGBT X X X DSAT LO IGBT X X X ACTIVE CLAMP HI IGBT X X X ACTIVE CLAMP LO IGBT X X X UVLO HI IGBT X X X UVLO LO IGBT X X X CROSS LATCH (SHOOT-THRU) X X X DC LINK OVERVOLTAGE X X X OVER CURRENT X X X OVER TEMP 125C X X X

MONITOR SENSORS TEMPERTATURE X CURRENT X X X DC LINK VOLTAGE AVE AVE AVE

SmartPower Stack Pin-Out (“Industry Standard”)

Pin No Signal Pin No Signal

1 GND 2 BOT-HB1-IN

3 ERROR-HBI-OUT 4 TOP-HB1-IN

5 BOT-HB2-IN 6 ERROR-HB2-OUT

7 TOP-HB2-IN 8 BOT-HB3-IN

9 ERROR-HB3-OUT 10 TOP-HB3-IN

11 OVERTEMP-OUT 12 NC

13 VDC-LINK MONITOR 14 VCC - Supply Voltage

15 VCC - Supply Voltage 16 +15V

17 +15V 18 GND

19 GND 20 TEMP-SENSE-OUT

21 GND 22 I-SENSE1-OUT




Data sheets available for various configurations


AgileStack, a fully software configurable power conversion Stack that features:

• SwitchStream™ technology to control, protect, and monitor over 40 points of operating and fault conditions

• Stack BlackBox™ technology to

store on-board fault data should there be a catastrophic failure.

50 - 125kW Inverter

Key objectives

• Key objective

- A fully configurable power conversion Stack.

- Ability to optimise performance for a given load via software.

- A stack with continuous monitoring of the performance and health of the switching.

- Advanced fault monitoring.


To provide:- - Predictive analytics. - Adjusts overall system performance accordingly. - Reduced Development time and cost

Definitions


AgileStack™ P.No AEK-001 AEK-002, AEK-003, AEK-004 AEK-005, AEK-006, AEK-007

Dimensions (mm) LxWxH 280x215x165 280x215x432 280x245x432

DC Link Capacitors N/A AEK-002 450V/ 1000uF AEK-005 700V/600uf

N/A AEK-003 700V/ 600uf AEK-006 900V/375uf

N/A AEK-004 900V/ 375uf AEK-007 450V/1000uf

Controller N/A N/A National Instruments – (GPIC)

AEK-001 AEK-002, AEK-003, AEK-004

AEK-005, AEK-006, AEK-007

Air cooled or Liquid chill plate available

40 Unique Points of Fault Controls, Monitoring and Reporting Down to the HB and IGBT Level


FAULT CONDITIONS HB1 HB2 HB3

DSAT HI IGBT X X X

DSAT LO IGBT X X X

UVLO HI IGBT X X X

UVLO LO IGBT X X X

GATE ACKNOWLEDGE HI X X X

GATE ACKNOWLEDGE LO X X X

CROSS LATCH/SHOOT-THRU X X X

DC LINK OVERVOLTAGE X X X

OVERCURRENT X X X

OVER TEMPERATURE X X X

MONITOR SENSORS

DC LINK VOLTAGE X X X

CURRENT X X X

TEMPERATURE X X X

New Serial Communications Protocol is the Backbone of the System New

23

Pin # Description Pin # Description

1 BOT-HB1 TRIG (+) 2 BOT-HB1 TRIG(-)

3 GND 4 TOP-HB1 TRIG (-)

5 TOP-HB1 TRIG (+) 6 GND

7 BOT-HB2 TRIG (+) 8 BOT-HB2 TRIG (-)



13 BOT-HB3 TRIG (+) 14 BOT-HB3 TRIG (-)



19 RESET 20 GND

21 Tx(+) 22 Tx(-)

23 Fault 24 GND

25 Rx(+) 26 Rx(-)

CONFIDENTIAL (c) 2015 AgileSwitch, LLC

Serial Interface Lines (21,22,25,26) which transmits up to 10MHz data rate

Highly Configurable to the End Use Application


Fault

Condition/Action

Generic Sample Default

Trigger Values

Action on IGBT if Active

Desat - HI >7 Volts for 6.1 µs* Turn off HI side

Desat – LO >7 Volts 6.1 µs* Turn off LO side

UVLO – HI <12 Volts Turn off HI side

UVLO - LO <12 Volts Turn off LO side

Cross Latch/Shoot

Through

Attempt to turn on both

IGBTs simultaneously

Does not allow turn on of

inactive IGBT until active is

off for 2 µs*

DC Link Overvoltage 900 Volts* Shut down all IGBTs

Overcurrent 900 A* Shut down all IGBTs

Over Temperature >125C* Shut down all IGBTs

Fault Recording – Stack BlackBox™

25

The AgileSwitch Stack continually stores the state of the system in a buffer.

– The last 8 states are stored in EEPROM.

– Each time a fault occurs the data is stored. Up to 1,000 fault occurrences can be stored.

– It takes 5ms to store and occurs even with loss of power.

– The information can be retrieved for failure analysis.


AgileStack Compared to Other Stacks

26 1/4/2016 CONFIDENTIAL (c) 2015 AgileSwitch, LLC

Stacks Today (e.g. SemiKron)

New AgileSwitch Stack Benefits

One, or more, of five potential “faults happened.”

Exactly which, of 40 potential faults “happened.”

• Power Stacks can be driven more efficiently.

• Deteriorating conditions can be identified and predicted quicker and failures avoided.

• First time for true analysis of catastrophic failures.

Temperature monitored at one location in the system

Temperature monitored at three locations in the system

High temperature is the main cause of failure. Three times the level of measurement precision.

Development time requires complex code for interpreting Stack conditions

Stack conditions are interpreted in the Stack and presented as simple values to the controller

Development time, and Stack qualification time, can be reduced by at least 25%.

Stack controllers need expensive circuitry to protect against voltage spikes from the Stacks

Spikes are isolated at the Stack, providing safe clean signals to the controller

Cost and complexity of controller hardware can be reduced by at least 20%.

Evaluation Kit


• AgileStack • National Instruments

Single-Board RIO GPIC Evaluation Kit

• GPIC to AgileStack Breakout Board

• SBE Power Ring Film Capacitor Bank

• Flexible platform

• Faster analysis of an application

• Optimisation for a given application

• Lower development costs

• Improved performance :

The AgileStack is 1% accuracy for voltage/ current ......The beauty of using digital.


How to Reach Us

• Website: www.AgileSwitch.com

• Email: [email protected]

• Phone: +1 484-483-3256 (US)

+44 (0)7882 758982 (Europe)

Cliff Robins: [email protected]

Rob Weber: [email protected]


http://www.agileswitch.com/

mailto:[email protected]



Thank you


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