Computer-on-Modules 2015

Industrial Automation ....................................................................................................................................................................................................................24

Medical .........................................................................................................................................................................................................................................26

Transportation ...............................................................................................................................................................................................................................28

Infotainment ..................................................................................................................................................................................................................................30

COM ExpressType 6 Modules ........................................................................................................................................................................................................................32

Type 2 Modules ........................................................................................................................................................................................................................35

Type 10 Modules .......................................................................................................................................................................................................................36

Carrier Boards ...........................................................................................................................................................................................................................37

Starter Kits ................................................................................................................................................................................................................................38

Engineering Test Tools ..............................................................................................................................................................................................................39

SMARC Full and Short Size modules .....................................................................................................................................................................................................40

Carrier Board and Starter Kit .....................................................................................................................................................................................................41

Qseven Standard Size Modules, Carrier Board and Starter Kit ..............................................................................................................................................................42

ETX Modules, Carrier Board and Starter Kit .....................................................................................................................................................................................43

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About ADLINK

Technology

Applications

Product Selection Guides

Table of ContentsADLINK, A Global Company ..........................................................................................................................................................................................................02

ADLINK Computer on Modules Introduction .................................................................................................................................................................................06

IoT Solutions with Proven Building Blocks, Intelligent Gateways, and Cloud-Based Remote Management .................................................................................10

SEMA Cloud, An Intelligent Cloud Solution for Remote Monitoring, Management and Control .....................................................................................................14

Ideal Small Form Factor Choices Require Consideration of both Technical and Strategic Options ...............................................................................................18

Designed for Extreme Ruggedness ...............................................................................................................................................................................................22

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About ADLINK

ADLINK, a manufacturer of embedded computing technology, leads the field with integration of computing power, rugged design, high availability, and industrial I/O. Dedicated to test & measurement, industrial automation, defense and aerospace, gaming, communications, medical, and transportation applications, ADLINK has made a name for itself providing reliable products of superior quality for cost-effective solutions, allowing our customers around the world to significantly reduce time-to-market burdens while increasing their competitive edge.

By providing leading-edge application-ready platforms and industrial building blocks, ADLINK empowers our customers, allowing them to minimize total cost of ownership (TOC) with customization and system integration advantages, keeping manufacturing costs low and extending product lifecycles.

ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations, including the PCI Industrial Computer Manufacturers

Group (PICMG), the PXI Systems Alliance (PXISA), and the Standardization Group for Embedded Technologies (SGET).

ADLINK is a global company with headquarters in Taiwan; manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and

Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000

certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).ADLINK products are currently available in

over 40 countries across 5 continents, supported by worldwide distribution networks and offices and over 1600 employees.

A Global Company

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A Global Company

Products and Services

Measurement and AutomationADLINK’s is dedicated to providing reliable, top quality products for industrial I/O control, motion control, digital imaging, data acquisition, and modular instrument applications. Our comprehensive portfolio of measurement and automation products, application ready platforms, and easy-to-use software packages, with integrated value-added service, continually meet and exceed customer requirements for industrial automation systems, machine vision systems, and automated test and measurement equipment.

PXI & Modular InstrumentsData AcquisitionGPIB & Bus ExpansionMachine Vision

Modular & SFF Computing With the combined experience and technical knowledge of ADLINK, Ampro Computers and LiPPERT Embedded Computers, ADLINK is able to provide a wide range of Computer-on-Modules and Small Form Factor (SFF) Single Board Computers. Our Extreme Rugged™ product lines have wide operating temperature ranges and meet MILSTD shock and vibration specifications.

Computer-on-Modules

COM Express SMARC Qseven ETX

Embedded ComputingADLINK works closely with Intel® to ensure that we develop and introduce innovative computing technologies by implementing embedded computing roadmaps and selecting computer solutions that best fit our target markets. This enables ADLINK to provide the highest quality and performance products with the long life cycles required by our embedded computing customers.

Network AppliancesOutdoor Rugged Servers Media Cloud ServersAdvancedTCA 6U/3U CompactPCI Platforms VPX Blades and Development KitsExtreme Rugged SystemsEmbedded Flash Storage

Mobile and Panel ComputingADLINK is dedicated to providing rugged mobile and panel computing products for industrial applications, including industrial automation, logistics management and medical. We specialize in meeting the needs of harsh and demanding environments, as well as mobile deployments in industrial settings.

Tablet PCsHandheld ComputersIndustrial Monitors and Panel ComputersMedical Monitors and Panel Computers

Motion ControlDistributed I/OIntelligent Computing Platforms

Rugged Small Form Factor Single Board Computers

PC/104 PC/104-Plus PCI/104 PCI/104-Express Mini-ITX

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To fulfill your requirement of high quality, cost-effective products, with quick time to market in product development, ADLINK has established and assembled an Design and Manufacturing Services team to cater to the specific demands that off-the-shelf products could not meet.

From embedded computers, data acquisition cards, and CompactPCI systems to related software packages, our DMS design team has the expertise to rapidly prototype upon the approval of finalized specifications. In addition, the winning of ISO-9001 certification ensures the exactitude of our research and development procedures with the highest product quality.

ADLINK owns and operates the manufacturing facilities in our Asia headquarters. Complete capabilities include our own PCB layout teams, SMT lines, system integration, and test capabilities. In short, ADLINK controls the whole manufacturing process, from layout and design to prototyping and volume production.

eRMAADLINK customers can send their RMA requests via our eRMA system. After obtaining an RMA number, you can track your RMA status online at any time.

Ask An ExpertThis is the place to get help for ADLINK products. 'Ask an Expert' provides answers to commonly asked questions, or you can click on the 'Ask a Question' tab to contact ADLINK's knowledgeable staff about a specific product or issue. ADLINK AAE (Ask an Expert) is available 24/7 online and is staffed by dedicated professionals who are available to address customers' needs and answers question. All issues and comments are recorded into a database and can be tracked/reviewed at anytime. ADLINK customers are invited to access the AAE system at: http://www.adlinktech.com/AAE

Partner CenterThe ADLINK Partner Center is specifically designed for worldwide sales and marketing support to allow our global sales representatives and distributors access to real-time product and marketing information and materials as soon as they are released at ADLINK headquarters. More than a resource database, the ADLINK Partner Center will also facilitate your business in serving customers.

Customer ServicesADLINK is not only devoted to providing local service worldwide, but also to providing convenient online service, The following services are available around the clock on the Internet.

About ADLINK

Design and Manufacturing Services

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RoHS Compliant ComputingADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive, which restricts the use of harmful substances such as lead, mercury and cadmium in new equipment.

Most end-user applications in which ADLINK products are used do not require RoHS compliance. However, ADLINK will actively work with customers whose products are not RoHS exempt under category 8 or category 9 classifications. Our lead-free production line and process, including solder paste, solder bar and process control parameters, has been developed and standardized in our manufacturing system.

Conflict Free Minerals PolicyADLINK will not knowingly procure material supplies and components that contain minerals that directly or indirectly finance or benefit armed groups in the Democratic Republic of Congo (DRC) or an adjoining country.

We urge our suppliers to support this policy in their own procurement guidelines and provide us with accurate country of origin information.

ADLINK shall:

• Comply fully with requests from EICC-GeSI.

• Conduct a reasonable country of origin inquiry to clarify the origins of the Gold, Tantalum, Tungsten and Tin used in our products.

• Establish reasonable objectives and targets with a goal of ascertaining and minimizing ADLINK's risk. With a goal of continuous improvement for our Conflict Free Minerals Program, develop a means to measure objectives and targets. ADLINK will also review, revise and report these measures, and overall program updates, on an annual basis.

• Empower all employees, suppliers, vendors and contractors to take ownership in complying with the Conflict Free Minerals Policy and to escalate risks in the supply chain to management's attention.

• Effectively communicate to all employees this Conflict Free Minerals Policy and our Conflict Free Minerals Program.

Management FlowThe management flow of ADLINK's Green Policy begins during the development stage of a product. Only parts and raw materials that meet RoHS requirements are sourced. Our engineers specifically design products using only qualified components. A lead-free process ensures that manufactured products are "green." Green products do not contain environmentally hazardous elements and can easily be recycled.

REACH DeclarationThe Registration, Evaluation, Authorization and Restriction of Chemicals Regulation 1907/2006, commonly referred to as "REACH", is Europe's new chemicals legislation. The products that we supply are non-chemical products and under normal and reasonable use, they will not release harmful substance. Furthermore, we will immediately inform you in correspondence to REACH-Article 33 if any substance of content (as from a content of >0.1%) in our products will be classified alarming by the European Agency for Chemicals ECHA.

Environmental Protection PolicyADLINK implemented a Green Product Policy in May 2004 to align the purchasing and use of green products meeting requirements from international environment protection statutes. Environmental protection is a top priority for the management at ADLINK. Measures have been taken to ensure that our products have little impact on the environment. In addition to planning a leadless process, the affect on the environment of components and raw materials will also be reduced. The Green Product concept has been built into our new product development system to ensure protection of the environment and continued business success.

A Global Company

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About ADLINK

Computer-on-ModulesCOM ExpressA computer-on-module (COM) is a complete computer built on a single circuit board. However, unlike a single-board computer, the COM lacks the standard interfaces for input/output and connection to peripherals. These signals are brought out through standardized connectors to a custom carrier board which is designed for the specific embedded application.

The COM on carrier board concept:Reduces development time by eliminating the need to design core components of the systemDeveloper can focus on core competency in the design of the custom carrier boardAllows easy upgrades without a complete board redesignLowers the threshold for total project quantitiesReduces time-to-market for the final product

Right Size for the Right JobsThe COM Express standard (PICMG COM.0) is based on serial interfaces including

PCI Express, SATA, USB, LVDS, and SDVO, allowing designers to utilize the latest technologies for future applications. ADLINK offers Extreme Rugged™ COM

Express modules in Basic (125 x 95 mm), Compact (95 x 95 mm) and Mini (84 x 55 mm) sizes that are suited for high-end graphics applications,

military computers, high speed communications and other embedded applications.

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Computer-on-Modules

We Know COM ExpressAlthough many companies develop COM Express modules, most are not actively involved in the development of the COM Express specification. In contrast, ADLINK has heavily invested in the development and maintenance of the PICMG COM Express specification since its creation. ADLINK was chair of the PICMG subcommittee that was tasked with defining the COM Express COM.0 Revision 2.0. specification update As a leading participant in the creation of the specification, ADLINK is in a unique position to influence its direction. By doing so, ADLINK has a deep understanding of the meaning and intention of the specification and applies this knowledge in the design of our COM Express products.

Comparison of Type 2, 6 and 10 PinoutsThe release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies. The new Type 10 pinout is based on the Type 1 pinout with only the A-B connector that is used in the “Mini” form factor. The Type 10 pinout provides additional flexibility for developers by freeing up pins reserved for SATA and PCIe for future technologies and using the second LVDS channel, VGA and TV-out pins to support SDVO (via DDI). Both Type 6 and Type 10 pinouts support the SPI Interface, which was unavailable in COM.0 Rev. 1.0.

Above connector assignments comply with PICMG® COM.0 COM Express® Module, Basic Form Factor

One Gigabit Ethernet port

LPC interface

Four Serial ATA channels

High Definition Audio

Eight USB 2.0 ports

Six PCI Express® Lanes x1

Dual 24-bit LVDS channels

Analog VGA

TV-out ports (SDTV/HDTV)

Eight GPIO pins

Keyboard

+12 V primary power input

+5 V standby and 3.3 V RTC

CD ConnectorAB Connector

Parallel ATA, IDE portAlternatedefinition assigns this to two additional Gigabit Ethernet ports

32-bit PCI™ v2.3 busAlternate definition assigns this to ten additional PCI Express® x1 lanes

PCI Express® x16 for GraphicsThese pins can also be assigned to two SDVO extensions (multiplexed)

SMB and I2C bus

Power / Thermal control

+12 V primary power input

95 m

m

125 mm

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AdvantagesSMARC has been adopted by multiple vendors and promises to form the basis of a successful commercial ecosystem. The connection system employed by SMARC offers a number of benefits over competing systems. SMARC is based on the new 314-pin MXM-III connector qualified for PCI Express Gen3. The MXM-III connector guarantees a high degree of signal integrity, required by high frequency serial interfaces that are commonly supported by ARM SoCs. For example, on 2.5 GHz signals as employed by PCI Express Gen2, the insertion loss of the MXM-III connector is just 0.5 dB. In comparison, the insertion loss encountered on the connection scheme used by older generation MXM connectors such as the 200 pin MXM-II connector is significantly higher at 3 dB.

Ideal Solution for Mobile DevicesBy choosing SMARC, systems integrators can take full advantage of the user-interface options available to mobile device OEMs; options that are not usually found in x86-based embedded-computing systems. For example, SMARC not only supports a direct parallel display bus for low-cost connection to a wide variety of thin-film transistor LCDs, but also supports a display interface compatible with the MIPI specification. This provides access to the smaller, low cost display modules employed in smartphones and tablets as they find their way into the embedded market.

Ultra-low Power ConsumptionA further advantage of SMARC over other small module formats is its support for a wider input voltage range, reducing the need to use additional DC/DC converters on the core module and resulting overall power dissipation. A SMARC module can support input voltages from 3 V to 5.25 V. Many other formats originally designed to support PCclass hardware are restricted to a nominal 5 V input. To take advantage of the greater I/O diversity of ARM-based SoCs, SMARC uses a different mix of connection options than those offered by COM Express or Qseven. In contrast to the PCI Express focus of COM Express, SMARC provides options for different types of video and graphics output, serial buses such as I2C and I2S, both USB host and client, serial and parallel camera interfaces and support for standard flash-memory card formats such as SD and eMMC. Future SMARC modules will also support fieldbuses such as EtherCat, ProfiBus and Sercos.

Based on the proven MXM-III connector that has been successfully 3employed on MXM video modules for several years, SMARC defines two sizes of module: a full-size module that measures 82 mm x 80 mm, and a short module for more compact systems that measures 82 mm x 50 mm. The edge connector supports 314 electrical contacts, supports up to PCI Express Gen3 transfer rates, and has a temperature range extending from -45°C to +85°C. For systems that are to be used in harsh environments, shock- and vibration-proof versions of the connector are available.

SMARCSupported by a number of embedded computing module vendors, the Smart Mobility ARChitecture (SMARC) specification provides an open-standard definition for ARM and x86-based embedded computing solutions, optimized for low power, cost efficiency and high performance. SMARC also provides support for systems that need more compact solutions than are offered by PC-oriented form factors.

About ADLINK

A Green Solution for Embedded ConnectivityAs ARM SoCs do not need the support chips of a PC platform and draw less power, the amount of board space required for power converters and power supply lines is greatly reduced. This allows the use of a smaller form factor, facilitating applications of SMARC-based modules in low-power portable equipment. SMARC CPU modules generally have an actual power intake between 2W to 6W, allowing for passive cooling, thus, further reducing subsequent design effort and overall cost. The standard allows for up to 9W continuous power draw for more demanding scenarios.

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QsevenQseven® is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application-specific carrier board.

Small Footprint, Low Power EnvelopeQseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for PCI Express graphics cards in notebooks.

The Qseven footprint is smaller than that of COM Express or ETX, responding to system designers’ needs for minimal space. Qseven’s power consumption envelope is below a 12 target, whereas SMARC’s target is below 6 and COM Express can be well above 20. Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express. The Qseven pincount is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs with lower board-to-board pin requirements.

ETXThe ETX® modules includes most generic functions needed for almost any application, such as graphics, Ethernet, audio, IDE, FDD, keyboard/mouse, parallel, serial, and USB ports. ETX modules are available in different performance levels with CPU speeds to match your requirements. A custom designed carrier board complements the ETX core module with additional functionality that is required for a specific application. The carrier board provides the interface to connect the module to peripherals such as hard disk, mouse, and display. Connectors on the carrier board can be placed exactly where needed to optimize the final package and minimize cabling. This results in a more reliable product and simplified system integration. A single carrier board can be used with different ETX modules when the same functionality is required at different performance levels, allowing great ease in end product diversification.

Software SupportTo ensure software development does not lag behind hardware development, we provide a full set of BSPs to get you up and running in no time. BSPs for the following operating systems are provided:

Embedded Linux Development KitLinux BSPWindows CE .Net BSPVxWorks BSPWindows XP Embedded support

Fastest Time to MarketThe concept of using custom carrier boards combined with off-the-shelf Computer-on-Modules is an excellent solution when you need to customize, but lack the time or quantity for a complete design from the ground up. The average time to design a carrier board is less than half of that for a full custom OEM board. ETX is economically feasible for system integration projects with production volumes in the range of 500 to 10,000 pcs per year.

The ETX concept is well accepted and has numerous advantages over full custom designs. It reduces engineering complexity, lowers the threshold for total project quantity, and last but not least, brings your product to the market in no time.

Computer-on-Modules

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About ADLINK

IoT Solutions with Proven Building Blocks, Intelligent Gateways, and Cloud-Based Remote Management

Embedded platforms are in transformation, evolving from standalone compute systems to becoming part of the Internet of Things (IoT). More than just Internet-enabled, these intelligent systems are networked and communicating, gathering and sharing information that enables insight and solves problems. Improving healthcare, enabling intelligent transportation systems, and modernizing manufacturing, intelligent IoT devices are delivering benefits to a wide range of industries, empowering business transformation all over the world.

While the concept of sharing and analyzing business information is not new, the IoT leapfrogs piecemeal, proprietary data applications by enabling time-sensitive data capture, access, analytics and action with standards-based third-party vendor solutions. Software, hardware and end-user applications work together in real-time to expand network access, functionality and intelligent performance to unlock data that was previously hidden. Now capitalizing on the business value of real-time data analytics is no longer limited to enterprises with the resources to develop their own proprietary systems. Through proven, standardized system components, today's IoT is flexible, widely deployable, and already enabling intelligent data applications in the mainstream business world.

ADLINK's standards-based building blocks enable compact, rugged devices for non-stop data gathering; high performance gateways for securely connecting devices and

systems for effective real-time communication of data; and secure cloud services for ensuring system health and performance.

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IoT Solutions

End-to-end solutions to build your IoT ADLINK offers a full range of products for the IoT ecosystem from edge devices to cloud control centers, including I/O modules, embedded modules, embedded systems based on industry standard form factors, mobile computers, network infrastructure, and cloud services to help you to create your own IoT. We provide Application Ready Intelligent Platforms and services to support and distinguish you with fast time-to-market and reduce development efforts of new applications. ADLINK also works closely with our customers to understand their unique requirements for individual devices or end-to-end solutions, and helps customers to solve the development challenges of their particular market.

High bandwidth network infrastructure for big data processes The network infrastructure plays a critical role as the connectivity platform for control and operational systems, sensors, machines, and devices in the Industrial IoT. It must provide secure and high bandwidth pathways able to support billions of connected devices, people, processes. ADLINK's industrial networking products for network infrastructure offer the outstanding communications capabilities that are necessary to handle the needs of big data for today and into the future.

Remote Management Has Broad Business ValueRemote management through the SEMA Cloud delivers broad business value; ready access to system health is now available to all industries, and can be implemented in nearly any embedded arena. For example, a telecommunications base station can be serviced prior to failure or key parts to refrigeration equipment can be replaced upon prediction of performance issues. Likewise, HVAC maintenance can be scheduled according to the actual system usage, rather than being performed on a fixed schedule.

System monitoring and management services also add a revenue-generating opportunity to the IoT. Instead of end-users handling system management in-house, IoT providers can outsource monitoring, management and maintenance of devices and systems to provide greater convenience and higher efficiency for their customers. IoT value extends even further as data can be used to improve business operations beyond equipment maintenance. With real-time data, operators understand how machines are used and can apply appropriate actions. Machines can be shut down during periods of low of user activity, rerouted to support increased demand, or restocked quickly to meet customer preferences.

Create business value with intelligent and central management ADLINK's embedded building blocks and systems have ADLINK's Smart Embedded Management Agent (SEMA) and SEMA Cloud capabilities built-in to enable those devices for remote management and the data exchange to and from the cloud. SEMA Cloud allows you to securely and remotely monitor system status, diagnose problems and handle system management tasks from anywhere at any time over the Internet. With the convenience of integrated remote monitoring, control and configuration using SEMA Cloud, you can collect and analyze all the data on a unified platform and transform it into business insights to drive operational efficiency.

Centralized Cloud Access Adds Business ValueIntelligent middleware and web-based services, such as ADLINK’s Smart Embedded Management Agent (SEMA) remote management interface working together with the SEMA Cloud, facilitate the pushing and pulling of data in real-time for anytime, anywhere access.

Pushing data to the cloud enables operators to verify, monitor and manage system performance from a single, central location - improving reliability and reducing management costs. For example, the M2M stack in SEMA Cloud pushes system data to the cloud server via any kind of TCP/IP connection. System managers have easy and secure access to data and analytics through any commercial cloud portal, using any device (e.g., PC, tablet, smart phone).

Cloud-based remote management furthers system management by enabling observation anytime, anywhere. Embedded management agents continuously upload data through an encrypted Transport Layer Security (TLS, the successor protocol of Secure Sockets Layer or SSL) connection. This information can be displayed on the user's information dashboard, for example temperature and power consumption for different parts of the embedded system.

SEMA Cloud and the always-on IoT framework together enable a new level of system reliability, preventing downtime more effectively than previously possible for offline devices. Operators can proactively interact with the system, detecting potential issues in advance, as well as responding quickly to system failures.

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IoT Enables More Intelligent Application of DataThe Internet of Things is enabling devices and systems to collect and share data to enable real-time business value. Yet, the IoT’s complexity and cost have been daunting enough to restrict deployments to only those firms who can afford to develop their own proprietary systems for data analytics. To date, the market has remained fragmented, costly and without standards-based solutions.

Connected systems can do more by using the intelligence produced by embedded processing in real-time. With centralized data and sophisticated analytics, volumes of previously unused or archived data can now add immediate business value. IoT end-user data can fuel modern applications like smart cities, automated factories, in-vehicle safety systems, intelligent transportation, energy grid automation, and connected health services. Using ADLINK’s comprehensive framework for standards-based IoT functionality, more industries can embrace IoT business advantages. IoT development and deployment are much simpler, devices and systems get to market much more quickly, and risk is removed from the equation. Allied with Intel and supported by both a rugged design pedigree and real-world IoT experience, ADLINK is superbly poised to help developers and OEMs innovate high performance IoT designs.

Standards-based Technology Enables Mainstream IoTIntelligent data-gathering devices are enabled by small, high performance building block components; intelligent gateways provide ready-made platforms to ensure connectivity that effectively moves the data; and innovative

cloud services optimize non-stop data access and system health analytics.

About ADLINK

IoT GatewaysThe IoT requires effective communication between distributed intelligent devices and the network or cloud infrastructure. ADLINK’s gateway solutions provide a pre-validated hardware and software platform for sharing data from device-to-cloud - enabling device security, smart connectivity, rich network options, and powerful device management.

ADLINK’s embedded IoT gateway platforms provide an extremely compact footprint, with options based on the Intel® Quark™ SoC X1000 Series and Atom™ SoC E3800 processors. Communications options are flexible, and ADLINK’s platform supports a spectrum of options such as Wi-Fi, 3G and LTE. Integration with McAfee Embedded Control provides complete protection from unwanted applications, including comprehensive change policy enforcement and compliance management. This simple, lightweight software technology is essential to securing IoT and also makes IoT devices resilient to malware infections and attacks. Combined with ADLINK’s Smart Embedded Management Agent (SEMA) Cloud, system operators have both the remote manageability and security critical to IoT deployments.

ADLINK’s new family of intelligent gateway solutions supports Intel® Gateway Solutions for IoT, a family of platforms designed to connect a wide range of devices. What makes them intelligent? ADLINK’s gateway solutions are built on open architecture to ensure interoperability between systems, enable wide application development, and allow easy services deployment. These platforms include scalable Intel-based microprocessors for low power performance, and integrate a Wind River operating system and middleware that provides all critical elements to manage and communicate with IoT devices. Developers are enabled with a sustainable and secure software development environment based on the Wind River Intelligent Device Platform XT. This development tool features pre-integrated components that are fully tested and ready-to-use in securing, managing and connecting intelligent gateways. Factory Performance Optimization and Process Control Monitoring

ADLINK's embedded IoT gateway platform with rich IO interfaces, allowing connection to a wide variety of devices for automated data collection and analysis enables active early warning systems to avoid unexpected downtime in industrial

automation.

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Enabling IoT Devices with Proven Building BlocksMore than a standalone system or typical handheld device, IoT systems and devices function as part of a larger application. These smart devices gather data through sensors and user applications and can vary dramatically in terms of form and function. A handheld device used to track fleet management activities, an intelligent safety system within a smart vehicle, a computer-integrated manufacturing (CIM) solution capturing production data on a factory assembly line - these “things” and many more like them all have a potential role in bringing IoT value to global business.

An IoT device does not have to be handheld or mobile, and is essentially any computing engine in an endpoint solution that enables that solution to be intelligent and connected. An IoT device can be the hardware/software solution inside the dashboard of a car that enables automation via a mobile app. A device can live inside a pharmaceutical vending machine, accessing a cloud database to retrieve secure patient data required to dispense prescriptions. For developers, the challenge depends on the application. IoT devices and systems may need to be low power or high performance. For cost effectiveness, they consistently need to be flexible, upgradable, rugged, manageable, and standards-based.

Computer-on-Modules Small IoT devices are often based on Computer-on-Modules (COMs), enabling performance and versatility in a very small footprint. ADLINK’s COMs address a spectrum of power and performance options in standards that include COM Express®, Qseven® and SMARC® (Smart Mobility ARChitecture). These solutions provide solid options for graphics-intensive, mobile, applications, such as medical imaging and emergency response.

Processor BladesADLINK offers rugged, blade-based technology in multiple form factors to serve a variety of industries: CompactPCI® for intelligent transportation applications such as networked security and safety, or vehicle control and diagnostics; AdvancedTCA® for next-generation telecom and datacom applications such as video transcoding, packet processing and 4G/LTE backup; and a VPX product line to meet the demands of rugged environments in military applications where size, weight, and power (SWaP) matter.

Industrial Tablets ADLINK's industrial tablets enable faster time-to-market and reduced development costs for system integrators. With integrated WWAN or WLAN capability, real-time IoT data can be accessed easily anywhere to monitor and control equipment and optimize operation performance in factories, asset tracking and building automation.

Computer BoardsADLINK’s single board computers (SBCs) encompass a variety of form factors (e.g., PC/104 and variations, EPIC, EBX, and Mini-ITX), processors, clock speeds, memory configurations, I/O options and operating systems. These diverse options service the IoT’s varied design and budget requirements, bringing field-proven reliability and performance to connected, intelligent platforms such as in-vehicle and infrastructure applications in transportation applications.

Industrial I/O and Control Systems ADLINK has extensive field experience and works closely with customers to understand their requirements in industrial automation design. The IoT data acquired by ADLINK’s various I/O modules and systems, including data acquisition (DAQ) cards, remote I/O modules, and digital imaging, are designed for all manner of industrial settings and keep production running smoothly and safely.

IoT Solutions

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SEMA CloudAn Intelligent Cloud Solution for Remote Monitoring, Management and ControlDowntime of devices or systems is not acceptable in today’s industries. To help customers to analyze their systems and take counter measures for preventive maintenance, ADLINK has developed a tool which is able to monitor and collect system performance and status information from the hardware in a timely, flexible and precise manner: the Smart Embedded Management Agent (SEMA).

By combining SEMA intelligent middleware with cloud connectivity, ADLINK takes remote management technology a step further than previous generations. By employing full connectivity, from edge to cloud to end application, SEMA-enabled embedded devices can connect to the cloud without additional design requirements. Pushing data to the cloud enables operators to verify, monitor and control system performance from a single, central location – improving reliability and reducing management costs.

ADLINK has developed a Graphical User Interface for Linux and Windows operating systems. The SEMA GUI is based on the standard Qt Library and offers the following functions and information:

• Board Controller API Library

• Power Consumption Graph

• User Area Access

• Alerts for Power and Temperature Consumption

• I2C Bus Control

• Temperature Graphs(CPU and Board)

• Board Information (Serial Number, Part Number, Firmware Version...)

• Fan Control

• GPIO Control

Technology

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SEMA Cloud at a Glance"Out of Order!" The worst case scenario for every supplier. If a device isn’t working, sales figures go down, customer confidence is shaken and troubleshooting may require extra effort and high costs.

To prevent this, ADLINK has connected its proven SEMA architecture with today’s cloud technology. Consisting of a board management controller and dedicated software, the integrated solution provides comprehensive control options and a wealth of information and data on the deployed system via the internet. ADLINK’s SEMA Cloud solution is capable of monitoring the deployed hardware, autonomously analyzing the status, and triggering appropriate actions. Moreover, all collected data, including sensor measurements and management commands, are available any place at any time via encrypted data connection.

Manage and Control All Devices with One ClickIn principle, an unlimited number of devices can be integrated into the SEMA Cloud service. Users are able to monitor all devices and react as soon as the slightest irregularities are identified. Downtime is significantly reduced and the reliability of the entire system is increased.

Reducing the Total Cost of OwnershipMoreover, SEMA Cloud enables users to concurrently run common tasks for predefined groups of devices. An example is remotely applying concurrent firmware updates, eliminating the need for service technicians to visit each site to perform manual updates. ADLINK’s SEMA Cloud minimizes maintenance efforts and reduces costs.

How does SEMA Cloud work?Being a holistic solution, ADLINK’s SEMA cloud offers users the entire infrastructure required. Customers do not need to develop their own cloud solution, avoiding laborious checking of hardware compatibility, finding a suitable cloud server, implementing data encryption or developing proprietary communication protocols.

SEMA Cloud is based on ADLINK products. In addition to individual devices, it includes encrypted data transfer to our cloud infrastructure and an intuitive graphical user interface (GUI) to monitor and/or control devices from any location at any time via the Internet.

ADLINK DevicesAll SEMA-enabled ADLINK products feature a Board Management Controller (BMC). The BMC collects all relevant data from the chipset and other sources and provides it to a software layer, which prepares the data and transfers it to the cloud via encrypted communication (SSL, TLS) or provides it to users locally through its GUI. There are various transmission paths available. In addition to wired Ethernet and Wireless LAN, transmission via 3G/4G cellular networks is also available. For enhanced data collection, external sensors can be integrated using the MQTT protocol. Additional customer data can also be transferred to the cloud.

While Embedded Computing and Measurement and Automation Solutions form ADLINK’s core offerings for many vertical markets, ADLINK is also focused on developing gateways to implement the Internet-of-Things (IoT). Smart gateways collect data from sensors, which are not capable of autonomously transferring information to the cloud. These gateways require a wide range of different interfaces and the relevant communication protocols to provide the connection between sensors and the cloud infrastructure. So that legacy devices can be included, rarely used and uncommon may need to be accommodated. Intelligent filtering of data by gateways reduces the bandwidth required.

SEMA Cloud

MXE-200i Intel® Atom™ Processor-Based Embedded IoT Gateway Platform

LEC-BTSSMARC® Short Size Module with Intel® Atom™ Processor E3800 Series SoC

IMT-BT10.1" Industrial Mobile Tablet with Intel® Celeron® Processor N2807

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Technology

ADLINK´s Cloud ServerADLINK SEMA Cloud services meet the highest security standards and the highest demands on reliability. All processes are handled by ADLINK's secure cloud server, but the service can in principle be implemented on the customer’s intranet. Customers have the following key functions at their disposal:

User InterfaceDevice information and sensor data are available on any terminal with an HTML capable browser. A web interface provides access to ADLINK’s SEMA GUI. Web APIs are available to support customer-specific HTML or mobile app development allowing complete customization of the information to be displayed. The SEMA GUI also allows users to control and manage all connected end devices.

At the edge, intelligent machines and IoT gateways are protected by security mechanisms based on Secure Boot and TXT capabilities. Furthermore, McAfee-based application whitelists and change controls are enforced at gateways to guard against software tampering and malicious code. Data and control messages between the SEMA Agent on the device and SEMA Cloud are transported over TLS connections. On the SEMA Cloud server, dashboard access requires login credentials, and SEMA Web API calls are controlled via authorization and authentication.

Device Management of connected devices. Each device is uniquely identified and the connection is monitored for quality and reliability. If the data connection goes down (e.g. due to poor 3G reception), collected data is buffered and a connection retry is initiated. Once a stable connection has been re-established, the buffered data is transferred to the cloud.

Data Management controls traffic and ensures server availability, even during periods of high concurrent accesses. This guarantees smooth, trouble-free 24/7 operation.

Event Processing includes the analysis of the transferred device and sensor data. Rules can be defined for each device and data type. When preset threshold values are reached, the appropriate actions are triggered. For instance, threshold values for CPU temperature of a device may be defined. If the threshold is exceeded due to an unforeseen event (e.g. a defective or dirty fan), a SEMA call will be issued. This could be a notification (e.g. SMS or email) to the system administrator, a command to initiate a system shutdown to protect hardware, or triggering a GPIO signal to start a system backup.

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SEMA Cloud

SEMA Cloud Use CasesThe following scenario demonstrates the various functions of ADLINK’s SEMA Cloud services, highlights potential savings and illustrates its benefits.

Use Case: Vending MachinesVending machines have been in use by retailers for many years as self-serve solutions to sell beverages, snacks, and tickets to consumers. In recent years, vending machines have proliferated both in numbers and diversity. They can be found in many public locations as well as private facilities, selling different types of goods and services. They are also becoming more and more intelligent, supporting better user interfaces and offering more selection.

With vending machines widely deployed, retailers are faced with operational challenges. Maintenance and support costs are high as on-site visits are often required to perform software upgrades, troubleshooting, and repairs. Additional revenue loss occurs when a vending machine goes out of order as it may be days before the problem is discovered and resolved.

These challenges can be met with an Internet of Things (IoT) solution enabled through two-way communication between vending machines and a cloud server. In the machine-to-cloud direction, hardware status information and business data are periodically sent to the cloud server. Hardware status information is processed in real-time for health assessment and failure detection. Data is stored in a database for further analysis and modeling. In the cloud-to-machine direction, commands and data can be sent to manage, control, and configure the vending machines. This includes performing remote diagnostics as well as pushing software updates to all devices as required.

Solution ArchitectureShown below is the end-to-end architecture of the Vending Machine Management and Analytics solution based on hardware, software, and cloud technologies from ADLINK. In this solution, new and/or legacy vending machines are connected to the internet via broadband or wireless connection. Data from vending machines are then aggregated and stored on the cloud. From there, the data can be accessed via web-based dashboard, or retrieved by external applications for analytics purposes. Commands and data can also be sent from the cloud to remotely manage and control the vending machines.

The key building blocks of the solution are:

Intelligent vending machines based on ADLINK board/module or custom solution, collecting device data and supporting remote management, control and configuration

ADLINK IoT Gateways, aggregating data from multiple vending machines and connecting securely to the cloud.

ADLINK SEMA Cloud solution, enabling edge-to-cloud integration and supporting cloud-based management of vending machines and real-time monitoring of machine data.

ADLINK SEMA Cloud API, exporting device data and control points for use by external applications.

IoT Solution BenefitsRetailers have the most to benefit from this IoT solution for vending machine management and analytics. Operational expenses are significantly lowered due to reduced resources directed at on-site care, maintenance and repairs. Moreover, Internet based monitoring helps to optimize delivery schedules and streamline logistics.

Business performance will also greatly benefit from an increase in vending machine uptime. Pricing of sold goods can be dynamically adjusted and simplified inventory tracking helps optimize the range of available goods. Last but not least, increased transparency improves business insights into the entire sales process.

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Ideal Small Form Factor Choices Require Consideration of both Technical and Strategic Options

Balance Risk by Prioritizing Power Consumption, Architecture, Software Design and Cost Embedded systems are by nature diverse and ubiquitous. Controlling production lines and rail systems, enabling high resolution medical imaging, or facilitating in-vehicle entertainment systems – these high performance applications are just a few examples of how indispensable computing systems span all aspects of modern life and business. Understandably, the design process is becoming increasingly complex. Connected embedded systems must often support specific interfaces required by end-use applications, handle extreme temperature ranges, and deliver low power consumption with high performance in remote, rugged deployments.

It is the system developer’s task to navigate the complicated world of technical and strategic options that impact design in order to choose the small form factor that both enables and

improves structure and function. Asking the right questions will help developers evaluate design requirements and priorities, ultimately guiding the process to the ideal form factor for

the application. The following material examines various aspects of the complex question and answer process, illustrating how developers must reflect on differences between

PC/104 single board computer (SBC) and computer-on-module (COM) options and their architectures. There is no single path to creating the ideal small form factor

design – only a logical balance of considerations that address performance and price while distinguishing innovative, competitive designs.

Technology

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Evaluating Technical Choices Technical and strategic issues may have equal weight in determining a design path; each impacts the other and must be considered in tandem. Technical factors – for example, CPU performance and interface set – as well as strategic considerations of development time, recurring and non-recurring engineering costs, and upgrade options help the developer balance essential choices. The field narrows only slightly by assuming the baseline requirements of your project or RFP have guided you toward a small form factor option. From there, the criteria could vary in importance depending on the end-use application; careful evaluation and key questions will validate the recommended form factor for the job.

Which form factor best suits the intended application? COMs and SBCs may offer similar capabilities, but each takes a very different design path to enable performance. Long-term impact of this decision is significant, binding the solution to the chosen form factor and its associated product lifecycle. If the system is limited by legacy concerns, upgrades or connecting to existing systems, options may be less flexible than if the system is a new, blank slate.

PC/104 SBCs enable modules to stack together like building blocks, a highly modular solution that avoids use of a backplane. Boards are commonly suited for designs using up to 25 watts, a high thermal design point (TDP) for higher power systems. As standards-based components, developers have access to boards that are consistently interchangeable from vendor to vendor, adding flexibility and value to the purchase process. No baseboard is needed either, and the system simply requires its power supply and cable set. I/O connectors can be placed at all four corners of the board, both top and bottom. Although the interface set is not specified, typically CPU/chipset interfaces are routed to IDC headers, standard PC connectors or special high density connectors. For designers, this is a matter of evaluating time, cost and expertise. Is time-to-market delayed by accommodating the development of a baseboard? And is there a high degree of confidence in the technical know-how required to perfect a baseboard quickly and cost-effectively? Can the application readily afford a two-board design? If these are roadblocks to using a baseboard, then PC/104 is an effective solution.

Is your design characterized by low or ultra low power consumption? CPU performance is directly related to power consumption; in general, smaller form factors warrant lower power consumption and therefore lower performance. When designs are limited to passive cooling due to physical space or other design restrictions, performance trade-offs must be considered in the form of a lower performance CPU.

If the design can handle active cooling – necessary to manage more heat generated by a higher performance processor, there are generally a greater number of options in terms of platform, layout, CPU and more. For example, COM Express® remains scalable with a range of different module footprints to accommodate the numerous options for choice of CPU. COM Express® Basic and Compact sizes are the larger footprints within this form factor, which also scales down to a mini footprint, comparable in size to the SMARC® short form factor.

Designs typically require a straightforward look at evaluating power management vs performance requirements, yet there are some fine-grained options that open new doors for ultra low power, higher performance systems. In the area of low power in small, light, and reliable designs, x86 platforms have historically been challenged by ARM processors. Yet evolution continues, and today developers have access to a credible option for low-power x86 designs in a very small footprint. New system-on-chip processors offer higher than previous generation performance in an x86 chip that draws less than 10 Watts. Developers must determine if it is preferable that systems sacrifice performance rather than power. The key here is for designs to be right-sized in key elements of power and performance. For example, if the application requires high CPU performance in a small footprint, COM Express® modules in Basic and Compact sizes may provide the ideal form factor. When lower CPU performance is acceptable, developers have more options and should consider architecture and interface set to help drive their form factor decision.

Is there an overriding argument for one architecture vs. another? Both x86 and ARM have well-developed roles in the embedded marketplace – each ideally suited for a particular set of applications, and each essentially defined by the differences in how they communicate with I/Os. ARM’s three-step communication keeps processes streamlined but reduces power and gets the job done, while x86’s 10-step process is more detailed but also requires more time, power and memory to complete.

In x86, this communication process relies on CISC, or Complex Instruction Set Computing architecture. CISC is a mature technology, with core architecture choices that include instructions to work directly with I/O, as well as memory. ARM’s communication protocol is known as RISC, or Reduced Instruction Set Computing architecture, and does not include the instructions to work directly with I/O. RISC processes operate only on registers with a few instructions for loading and saving data to and from memory.

ARM’s simpler, native 32-bit architecture leads to a small area for silicon and significant power savings features, optimized for handheld devices such as smartphones and tablets. If a comparable application requires an x86 interface set, developers would find the ideal fit in a COM Express® Mini sized module, providing low power and all the commonly required interfaces. When ARM interfaces are required – or perhaps a mix of both, for example in direct camera support or I²S – then SMARC® modules become the clear choice. Both COM Express® and SMARC® are optimal for mobile solutions because of the option for battery powered usage.

Selecting the Right Form Factor

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Designing for Strategic Impact

Are you planning DIY software support, or do you need the help of an established ecosystem? Software support is a strategic element to the design process. Major systems include Windows or Linux – prompting designers to evaluate I/O requirements, ecosystem constraints, and overall ease of development. In general, Windows, VxWorks, and QNX are better suited for x86 architectures, and Linux is the better choice for ARM.

Windows offers mature support of the x86 architecture with comprehensive driver support for all cards; this enables relatively pain-free development when working with SBCs such as PC/104 and COMs in the COM Express® and Qseven® platforms. The ecosystem is highly accessible, and if new drivers are not available, developers can readily use standard drivers as a means of implementing new cards. Familiar x86 environments are well supported by development tools that help implement, debug, and fine tune software.

In regard to drivers, Linux is very similar to Windows, although driver support is more limited and can result in design challenges and extended development timelines. When drivers are unavailable, it is more challenging to improve older versions to accommodate new cards. This is in part because of the open source nature of Linux, with new published drivers requiring consortium review and approval.

In contrast, Android plays a different role and is specifically suited for smaller, smart devices such as smartphones and tablets. Based on Linux and specifically written for ARM architectures, Android today offers limited support of x86 I/Os. The ARM environment is more complex and differentiated, with a singular focus on SoC products often optimized for a particular application. Building standard I/O definitions has not been a primary focus. As a result, the ARM marketplace includes a number of proprietary form factors and connector definitions; designs may be locked to a single vendor that may not support more than a single generation of silicon. Although x86 support is anticipated to expand in the future, today it results in higher development costs and extended software design efforts.

However, the SMARC® standard is enabling some improved crossover between x86 and ARM processors. Originally designed to standardize the use of ARM processors, SMARC® now also supports low power x86 processors. Designers now have more choice and access to backward-compatible, low energy products, as well as the familiarity of working with the x86 ecosystem.

What factors form the basis for system cost? The expectation of cost is often oversimplified, when in reality, actual costs are based on a complex variety of factors. For example, general wisdom may assume that costs depend simply on module size, with a smaller module being more affordable than a larger module. In a real-world design scenario, however, a short module may be more expensive than a full-sized module. Technical specifications, single vs quad-core processor model, and realized I/O interfaces are some of the elements that will determine overall cost of the module itself.

Design expertise and resources add to the cost, as well. Consider a SMARC® module using low power x86 processors in both short and full-sized models; the short module clearly has less space, but the design may require the same features that are present on the full-sized module. The design can be engineered effectively, but will require more PCB layers to implement the I/O. This is a costly and painstaking engineering process; development time increases accordingly, along with the cost of production. When realizing a similar system on the various small form factor platforms, engineering costs are generally highest with PC/104, less with COM Express® and still less with SMARC® or Qseven® – all potentially part of the strategic evaluation that kicks off your platform choice. Engineering costs generally line out this way because of PC/104’s fully-formed, ready-to-go design, contrasted to the scalable design options found within COM Express®. In turn SMARC® and Qseven® have fewer components and are typically lower function than COM Express®, further streamlining overall engineering requirements.

In general, customers tend to think that small form factors should cost less than larger computing platforms. In reality that is only true of small form factors with lower performance, i.e., those without high performance I/Os. However, more often than not, today’s small systems must incorporate sophisticated I/O, and deliver the features and performance of a larger system in a smaller space. The resulting design is more challenging and therefore more costly, creating greater impact on the overall platform choice.

What is the smartest application of time and design resources? Development time depends on various factors, with each platform bringing its own unique challenges and advantages. Software must be adapted for any platform and just takes a different path depending on whether or not the use of a baseboard is required.

SBCs offer ready hardware – for example, PC/104 systems can be completed with the comparatively simple addition of power and a cable set, along with selected I/Os chosen by the designer. Once software is adapted, these systems are generally up and running quickly. COMs integrate a standard off-the-shelf module, but require time and expertise for development of the accompanying baseboard. Depending on their pin-out (for example Type 2, Type 6 or Type 10), modules in the COM Express® standard may rely on a multi-pin connector to connect to the baseboard, SMARC® and Qseven® standards may rely on an edge connector to connect to the baseboard, yet this provides the ability to customize it to the long-term needs of the application.

Architecture, layout, upgradability – what key factor defines your greatest risk?

Mitigating risk is not necessarily a freestanding issue, and likely has impact on every choice made in the design process. For example, from the designer’s perspective, there are no differences between x86 and ARM architectures at the board layout level. Both incorporate standard I/Os, high speed lanes, memory interfaces, and more.

Yet in the initial design phase, as well as troubleshooting that follows, the process is easier when working with x86 architecture. The ARM platform is more complicated to analyze and troubleshoot, an issue that may guide the developer to an alternative architecture. For example, COMs remain upgradable with a module switch; PC/104 requires a new board and may also incorporate different I/O connectors placed at different locations on the board.

Technology

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Achieving Balance in a Competitive Design Developers face a spectrum of technical and strategic choices in determining the ideal small form factor platform for a particular application. Even while there is no right or wrong path, evaluating options from both perspectives enables a smart look at trade-offs, performance and long-term upgradability.

Small form factors, in general, play one of the greatest roles in connected embedded arenas, bringing intelligent systems to new deployments and further advancing performance to match that of larger systems. SBCs enable specific performance ideals for volume production designs, while COMs are a path for cost-effective, customized performance that can last for multiple product generations. Keeping the system right-sized for the chosen application is ideal as a basic strategy, and the fortunate side of the process is that there is usually more than one workable option. x86 and ARM ecosystems continue to evolve, and narrowing design choices will never be a static process.

Selecting the Right Form Factor

2

How much space do you have? limited

Nolimitation

Implement with cableset? yes SBC PC/104

no

Computer-on-Module

Willingness to develop a carrier board? no SBC PC/104

yes

Cooling solution? passiveactive

CPU performance?high

low

Architecture/ Interface set?

ARM/x86Interface set provides camera, I²S

x86Interface set provides LPC, PCIe, SATA, USB

Battery powered(portable)

QsevenSMARC● Full Size● Short Size

SMARC● Full Size● Short Size

active or

passive

COM Express● Basic Size● Compact Size● Mini Size

COM Express● Mini Size

COM Express● Basic Size● Compact Size

How to select the right form factor?

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Designed for Extreme RuggednessMany commercial board manufacturers claim that they offer “ruggedized” products which gives the impression of durability and reliability under tough conditions. The term “ruggedized,” however, often refers to desktop-grade designs which are screened at high temperatures with high yield fallout. ADLINK believes that ruggedness should be inherent in the design. ADLINK products are subjected to extensive voltage and temperature margin tests along with shock and vibration testing and HALT testing during the new product development process to ensure an extremely reliable product in all environments for decades of mission-critical service.

ADLINK HALT Test ProgramIn order to maximize product reliability and durability, ADLINK subjects to a comprehensive Highly Accelerated Life Test (HALT) program during the product development process.

The HALT process consists of progressively increased extremes of temperatures (both high and low), rapid thermal transitions, six-axis vibration, and finally, combined temperature and vibration stress. At each stress dwell extreme, power to the unit is margined at ±5 percent. During each

test, stress is progressively increased while the unit is operating in a continuous functional test loop that exercises key subsystems such as the CPU, I/O ports, disk controllers and

video. If a failure is detected, the failure is evaluated and immediate fixes are made and the test continues until destruct limits are reached. Failures and the physical damage

found at the destruct limits provide data which is used to improve the ruggedness of the product design.

Technology

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Extended Temperature Testing of BoardsThe Extended Temperature Test verifies that all boards will operate at extreme temperatures, typically from –40° to +85°C. ADLINK uses a leading-edge, fully-automated, custom-designed modular card cage system in a state-of-the-art environmental chamber to test ADLINK Rugged by Design products over the entire extended temperature range.

100% ADLINK QualityEach ADLINK Rugged by Design product is fully functionally tested during the entire range of extended temperature operation. All test results are archived at ADLINK by product serial number. This data is used for internal quality assurance audits. Customers who require this level of detail may request summarized test results. All boards are ramped to the specific temperature profile and allowed time to soak. This insures that high-density components have fully reached testing temperature before power is applied. This process distinguishes ADLINK from other companies that rely on a single power cycle while testing at extended temperatures. ADLINK identifies each board that passes testing with a label that indicates the boards fulfill ADLINK’s stringent quality standards.

Lifecycle SolutionsSM for ADLINK ProductsFor almost 20 years, ADLINK contributed to the success of many companies, large and small, by designing products for long product lifetimes and by providing comprehensive lifecycle support and management assistance to customers. To support your ongoing production needs, the Lifecycle SolutionsSM program has been created for ADLINK Rugged by Design products. From component selection to strategic partnerships to component lifecycle management, ADLINK ensures that standard, semi-custom and custom boards can be produced with no more than minor changes for years to come. When changes are necessary, ADLINK provides advance notification and guidance through the transition to new hardware or BIOS extensions. And our dedication to industry standards enables us to provide new products and product roadmaps that enable smooth resolution of end-of-life EOL migration issues.

Conformal Coating Protects Your Computers in the Harshest ConditionsHarsh environments found in many industrial, military, naval and airborne applications often expose embedded single board computers to corrosive conditions including humidity, salt spray, fungus and other contaminants. Conformal coating, a protective material applied over the board, can prevent short circuits by inhibiting corrosion and electromigration. On products which have been deployed for many years, studies show these coatings retard denritic growth (so called “tin-whiskering”), and prevent any such growth from short-circuiting conductors by providing a double barrier of insulation.

Conformal coating from ADLINK is applied by spraying, dipping, vacuum depositing, or flow coating the circuit board assembly. Coatings are typically three mils (0.003”) thick. ADLINK uses acrylic, epoxy, urethane, paraxylylene and silicone based coatings. Acrylic coatings are fast drying and offer high moisture resistance, excellent flexibility and superior dielectric properties. Most coatings are removable and contain a UV safety tracer which glows under ultraviolet light for ease of quality inspection and repair.

Designed for Extreme Ruggedness

Random VibrationADLINK products are vibration-tested in accordance with the specifications of MIL-STD-202F, Method 214A, Table 214-1, Condition D for Random Vibration for five minutes on each axis. This equates to a RMS value of 11.95G of random vibration between 100Hz and 1000Hz along each axis. The units under test are operational during the tests, performing functional diagnostics on all hardware subsystems. The test routine runs continuously to verify functionality of the system and catch any intermittent failures. External peripherals (Ethernet Server, hard drive, etc.) are mounted adjacent to the vibration table and are not subjected to the test conditions.

Mechanical ShockMechanical Shock testing is performed on ADLINK products per MIL-STD-202F, Method 213B, Table 213-1, Condition A. This specifies three 50G shocks (peak value, 11ms duration, half-sine waveform) along each of the three axes. The unit under test is mounted on a shock machine and subjected to shock pulses of 50g-peak value, 11 ms duration with half-sine waveforms. Three shocks in each direction, for a total of 18 shocks, are applied along the three mutually perpendicular axes. After shocks in both directions (+ and –) along each axis, the products are tested for functionality.

Voltage and Temperature Margin Test SuiteDuring the margin test suite, the Unit Under Test (UUT) is subjected to temperatures well outside the “Extended” (–40° to +85°C) operating temperature range offered for ADLINK Rugged by Design products. The UUT is simultaneously subjected to minimum and maximum rated voltages (±5%). This process verifies that products are functional and stable over combined extremes of both temperature and voltage. In also ensures wide design margins resulting in long-term reliability under all specified operating conditions.

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Industrial AutomationIntelligent Platforms for Rugged Industrial SystemsIndustrial automation applications rely on efficient, rugged embedded platforms. By utilizing ADLINK’s embedded systems based on the optimum microprocessor architecture and the interworkings between the automated processes and embedded computers, the requirements for industrial automation applications can be effectively fulfilled.

Robotics, Test and Measurement, Manufacturing Control and Visual applications all require real-time capability, image recognition, and a networked infrastructure. ADLINK's computer-on-modules meet these requirements, include standard interfaces such as Ethernet, PCI, PCIe, and MiniPCI expansion slots, and are expandable with ADLINK I/O and peripheral modules. ADLINK’s wide ranging product portfolio offers a complete solution ideal for your specific industrial automation applications.

Benefits

Applications

Application

Easily integrated with standard IPC and motion, vision control boards

Industrial quality with high accelerated life

Validation for hard environment

Fast time to market

Best price/performance

Long life support

Welding Robots

Machine Automation

Textile Manufacturing

Test, Measurement and Control

Signal Acquisition and Generation

Factory Automation and Environmental

Intelligent Building Automation

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Going to Extremes to Ensure Industrial PerformanceDevelopment of Rugged by Design embedded computing solutions is at the core of ADLINK’s long company history, strengthened by the integration of industry leader Ampro Computers. ADLINK’s Rugged by Design process subjects all rugged and Extreme Rugged™ products to MIL-STD shock, vibration and temperature testing during the product development process, rather than requalification after the fact.

ADLINK’s Extreme Rugged™ boards and systems surpass industrial performance requirements vand meet or exceed MIL specifications. Component selection, circuit design, printed circuit board (PCB) layout and materials, thermal solutions, enclosure design and ISO- and TUV-certified development processes are handled with precision and validated by robust test methods including MIL-STD-810 or MIL-STD-202 shock and vibration testing, as well as Highly Accelerated Life Testing (HALT).

Combining Power and Data for Streamlined DeploymentADLINK's computer-on-modules are ideal for a wide spectrum manufacturing environments, and are deployed in severe computing settings such as coal mining, materials handling, wafer processing, scanning and printing, 3D vision and robotics guidance and a broad range of machine vision implementations. By offering innovative single cable solutions that deliver power over the data or communication cable, ADLINK simplifies installation, diminishes maintenance requirements and reduces total cost-of-ownership (TCO) for a broad range of industrial end-users.

Cloud-based Remote System Monitoring and MaintenanceADLINK’s proprietary Smart Embedded Management Agent (SEMA) was developed to address the need for better housekeeping tasks in the context of systems based on complex processors and chipsets. At the box-level, SEMA monitors BIOS, power, temperature, watchdog and board information, and is distinguished by being able to manage systems that are standalone, connected or remote.

ADLINK’s sophisticated preventive maintenance features add significant value for industrial customers, enabling advanced functionality in contrast to typical third party toolkits or utilities. SEMA allows users to monitor their systems in real-time, stores important data such as up-times and maximum temperatures, can call for help when needed, and can be easily managed and monitored from a cloud-based interface.

Compact Vision Systems Enable 3D Guided RoboticsAdvancements in 3D robot guidance have improved accuracy and speed in automated assembly and pick-and-place operations. 3D calibration is the essential first step, establishing the relationship between the robot, camera and object coordinates. Pattern matching follows, allowing the robot to acquire object position and orientation, and then determine trajectory based on the collected 3D data.

Industrial Design Leadership and ExpertiseFor industrial contractors and integrators, ADLINK is your complete supplier of Rugged by Design products, including systems that provide robust, fault-free connectivity, as well as the wide, high speed I/O required to support the broad and growing spectrum of industrial automation.

Industrial Automation

cExpress-BTCOM Express® Compact Size Type 6 Module with Intel® Atom™ E3800 Processors

Express-HL2COM Express® Basic Size Type 2 Module with Intel® Celeron® Processors

Related Products

Q7-BTQseven® Standard Size Module with Intel® Atom™ E3800 Series Processors

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MedicalOptimized Patient Treatments from the Cores, Computer-on-ModulesADLINK’s intelligent platforms and Rugged by Design technologies are purpose-built for healthcare settings, improving patient diagnosis and treatment options, and giving designers a competitive edge with scalable, reliable solutions optimized for the rigors of modern medicine. For medical device developers and manufacturers, ADLINK is your complete supplier of intelligent embedded products. Development time is reduced, and medical device manufacturers can focus on their core competencies in creating competitive, high performance healthcare applications.

Benefits

Applications examples:

Application

Saving lives in real-time

Flexible and robust

Long lifecycle support

Accelerate time-to-market

Ultrasound

Operating room

Ambulance-based telemedicine

Patient’s Information System

Mobile medical devices

Bed-side care and entertainment

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Enabling Longevity with Extended Product Lifecycles and Predictable RoadmapsMedical designers are driven by the need for rapid product development that includes well-defined products that also offer extended lifecycles. Medical design expertise and industry knowledge are key factors in achieving such product attributes. Trusted partnerships support the competitive designs through shared engineering knowledge and expertise. The extended lifecycles are achieved by combining careful component selection, BOM screening and, if necessary, our supply chain manages the end-of-life (EOL) materials to meet product needs. Our in-house design and development capabilities expertly support engineers in long-life solutions, including product planning and managing EOL transitions. Product lifecycles of seven years are typical for most products, and event longer on a case-by-case basis.

Flexible, Robust Platforms Create Medical Market AdvantageWith a strong understanding of how to design for patient safety, ADLINK's medical industry offerings range from low power, battery-driven, portable diagnostic systems to fixed-installation systems delivering extreme processing for high-definition imaging. ADLINK's market advantage is our ability to facilitate the right solution at the right level of performance, including design and development expertise. Our customers are expertly supported by our highly skilled team of hardware and software engineers, trained and knowledgeable in the applications and concerns facing medical designers.Our SMARC modules are designed for portable or small stationary systems with application scenarios especially for medical diagnoses and are especially designed suited for medical systems requiring high performance graphics.

COM-based Mobile Platforms Enable Healthcare AnywhereAdvancements in medical imaging are broadly improving diagnosis and treatment options, with particular value in mobile healthcare applications. As performance-to-power ratios advance with processor improvements, a wider range of mobile and visual applications can capitalize on advanced graphics in portable devices, enabling better real-time analysis and diagnostics.

ADLINK’s latest COM Express products incorporate the latest processors, enabling significant improvements over previous processor generations. Advanced power capabilities allow designers to customize power-to-performance ratios to suit specific applications. New low power states extend battery life and improve cooling options for mobile applications, allowing passive cooling with no venting or fans.

Quality through CertificationsADLINK employs a state-of-the-art quality assurance system and all facilities are ISO-9001 certified. Many of the products have received 60601-1 as well as UL, FCC, CSA and CE certifications. In addition, ADLINK's own manufacturing site is ISO 13485 certified, providing the necessary documentation and processes for medical products.

Medical

LEC-iMX6SMARC Short Size Module with Freescale i.MX6 Processors

Express-HLCOM Express® Basic Size Type 6 Module with Intel® Core™ Processors i3/i5/i7 with ECC

Express-BECOM Express® Basic Size Type 6 Module with AMD® Embedded R-Series APU

Related Products

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TransportationFlexible System Solutions for Intelligent Transportation SystemsADLINK delivers specialized embedded systems for railways, public transportation, heavy vehicles and marine applications. Besides delivering hardware solutions, Besides delivering hardware solutions, ADLINK supports specific software environments that the transportation field that the transportation field that the transportation field requires such as: WEC 7/8, WES 7/8, VxWorks, QNX, RealTime Linux and Windows NT/2000.

Benefits

Application examples:

Application

Guaranteed long-life product availability and system compatibility

Fast integration of the traditional IBIS bus with the latest GPS and RF communication systems in a limited space

High reliability against shock and vibration

Easy management of remote boot by Intel Pre-boot Execution Environment (PXE)

System development cycle is significantly reduced and facilitates later system upgrades and maintenance

Advances Public Transportation Systems (APTS)

Wireless Communications Systems based on GPS and GSM

Traffic Light Synchronization

Platform Synchronization Management

Passenger Information Systems

P 29

Remote Monitoring Solution with Reliability, Scalability and ManageabilityAchieving robust and reliable connections between devices in a real-time monitoring & control system to ensure undisrupted and accurate data transmission to and from the moving and vibrating railway environment is of supreme importance and poses a challenge for engineers or system developers. Considering the particularities of the operating environment of rolling stock, all devices onboard must be capable of withstanding harsh and constant shock and vibrations and extreme temperatures in widely varying geographic locations. Systems used for rail transport need to be particularly rugged to deliver higher reliability and stability to maintain non-stop operations.

ADLINK’s computer-on-modules meet the connectivity, ruggedness, manageability, longevity and scalability needs of rail transportation applications. ADLINK’s modules provide high speed serial buses supporting Control Area Network (CAN) protocol, an industrial standard developed for internal networking of automotive and other vehicles to deliver a high degree of data consistency with error detection mechanisms.

Extending Deployments with Planned Product Lifecycles and Predictable RoadmapsADLINK, as one of the most active players in the computer-on-modules market, provides continuing support for the form factor by revamping our product range with upgraded performance and new features enabled by the latest technologies. System developers can use any of our new modules as a drop-in replacement to easily upgrade older systems at minimum cost and maximum scalability to extend service life longevity.

The modules deliver the newest newest available connectivity features, such as two SATA 3Gb/s ports via onboard connectors and ADLINK's Smart Embedded Management Agent (SEMA) to provide remote monitoring and management. Comprised of a hardware board controller and a software suite, SEMA's remote hardware monitoring and control capabilities allow administrators or engineers in the control center to remotely implement real-time management.

Versatile Computer-on-Modules Enable Intelligent Transportation NetworksADLINK’s COM Express products enable transit agencies to communicate with customers and dispatch, maintain fleets and collect and analyze operating data. Intelligent bus networks rely on smart COM-based onboard systems, controlling vehicle run switches, front and rear doors, wheelchair ramps, stop requests, odometers, emergency alarms and more. Integrated GPS enables recording of driving data and supports both wireless and cellular transmission, and Class A-certified devices allow testing against SAE International standards.

Intelligent transportation networks combine an ADLINK rugged COM Express module, incorporating the latest processors, with a custom baseboard. These systems are proven to be tolerant to higher levels of shock and vibration, and integrated Mini PCI Express slots support 802.11 a/b/g/n and cellular modems for robust connectivity. Many of ADLINK’s COM Express products are further validated Extreme Rugged™.

Flexible, Robust Platforms Enhance ITS DevelopmentADLINK’s rugged technologies are optimized for mission-critical train control and operation, networked security and safety, and high performance passenger infotainment. Our extensive roster of Rugged by Design board-level, box-level and user interface solutions provide reliability and flexibility across the spectrum of intelligent transportation systems - enabling high performance, faster time-to-market and reduced development costs for transportation system developers.

ADLINK’s customers are further supported with ongoing access to our team of highly skilled customer hardware and software support engineers, expertly trained and knowledgeable in the applications and concerns facing transportation customers.

Transportation

Q7-BTQseven® Standard Size Module with Intel® Atom™ E3800 Series Processors

Express-HLECOM Express® Basic Size Type 6 Module with Intel® Core™ i3/i5/i7 Processors

ETX-BTETX Module with Intel® Atom™ Processor E3800 Series Processors

Related Products

P 30

InfotainmentEnjoyment in One TouchWorldwide growth of the retail and gaming industry fueled by increased numbers of entertainments and diverse lives along with advancements in technologies has opened up windows of opportunity for system and service providers. New user interfaces such as self-service kiosks have refreshed the user experience and helped create a more efficient and profitable business model for the betting industry by reducing the number of ticketing counters and operating staff, shortening customer waiting times, and maximizing end users’ requested information that can be issued in a limited time period.

Benefits

Applications

Application

Reduce maintenance cost

Increased customer satisfaction

Customer information collecting and sharing

Kiosk (e.g. ATM, POS)

Vending machine

Digital signage

Betting machine

Lottery terminal

Slot machine

P 31

Connecting Digital with Real LivesADLINK Infotainment solution for Gaming and Retail services include ATMs, floor plan guides, lottery & slot machines and supermarket self-service kiosks. ADLINK computer-on-modules provide flexible connection possibilities for system integrators to link and manage multiple peripherals to meet application needs. Video lottery terminal and slot machines must sustain continuous operation; thus, hardware stability and ease of maintenance become essential. ADLINK's extensive and capabilities in hardware design and software development combined with our self-owned manufacturing base allows us to provide reliable products of superior quality for cost-effective solutions.

Providing Personalized Corresponding ServicesIn the retail environment, multimedia digital signage that combines entertainment and information is one of the best ways to communicate with consumers. Intelligent display panels powered by ADLINK products can be installed above checkout counters or in other suitable locations. Supermarket self-service kiosks are stand-alone terminals that integrate environment information, promotional products, membership management and other relevant data through interactive multimedia communication.

Analyzed Big Data Turns to RevenueADLINK's SEMA-equipped computer-on-modules connect seamlessly to our SEMA Cloud solution to enable remote monitoring, autonomous status analysis, custom data collection, and initiation of appropriate actions. All collected data, including sensor measurements and management commands, are available any place, at any time via encrypted data connection. With SEMA Cloud, managers of the infotainment services can monitor the status of their machines from any location and react promptly to events and incidents. The necessity for on-site visits is minimized and mean-time-to-repair is significantly reduced.

SEMA Cloud brings a business value-add by allowing the collection and analysis of “big data” from devices like betting kiosks in the system. Vendors, operators and service providers will be able to acquire valuable information about consumer behavior, helping them to develop a more profound insight into their business and increase their competitive edge.

Infotainment

Express-BECOM Express® Basic Size Type 6 Module with AMD® Embedded R-Series APU

cExpress-HLCOM Express® Compact Size Type 6 Module with Intel® Celeron® Processors

LEC-BTSSMARC Short Size Module with Intel® Atom™ E3800 Series Processors

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P 32

Selection Guide

Model Name Express-BE Express-HL Express-HLE

Form Factor & Compatibillity

PICMG COM.0 R2.1, Type 6Basic size: 95 x 125 mm

PICMG COM.0 R2.1, Type 6Basic size: 95 x 125 mm

PICMG COM.0 R2.1, Type 6Basic size: 95 x 125 mm

CPU

AMD® R-Series APU RX-427BBRX-425BBRX-225FB

4th Generation Intel® Core™ Processors:

i7-4860EQ/4700EQi5-4400E/4402Ei3-4100E/4102E

Intel® Celeron® Processors 2000E/2002E

4th Generation Intel® Core™ Processors:

i7-4860EQ/4700EQi5-4400E/4402Ei3-4100E/4102E

Intel® Celeron® Processors 2000E/2002E

Chipset AMD® A77E Intel® QM87/HM86 Chipset Intel® QM87/HM86 Chipset

Memory Up to 16GB Dual Channel DDR3L at 1600/1333 MHz

Up to 16GB Dual Channel DDR3L at 1600/1333 MHz

Up to 16GB Dual Channel DDR3L at 1600/1333 MHz

Cache* L2: 2MB or 4MB L3: 3MB or 6MB L3: 3MB or 6MB

BIOS Type AMI EFI AMI EFI with Intel® AMT 9.0 support(no AMT support by HM86)

AMI EFI with Intel® AMT 9.0 support (no AMT support by HM86)

TPM support (opt.) Atmel AT97SC3204 Atmel AT97SC3204 Atmel AT97SC3204

Integrated Graphics Support

18/24-bit single/dual LVDS3x DDI ports supporting DP/HDMI/DVI(up to 4 independent display support)

VGA18/24-bit single/dual channel LVDS

3x DDI ports supportingDP/HDMI/DVI

VGA18/24-bit single/dual channel LVDS

3 DDI ports supporting DP/HDMI/DVI

Graphics Features DirectX 11.1, 10.1, 10, 9; OpenGL 4.2, OpenCL 1.2, OpenGLES 2.0, OpenCV

DirectX 11, 10.1, 10, 9;OpenGL 3.0

DirectX 11, 10.1, 10, 9;OpenGL 3.0

LAN Intel® MAC/PHY i210LM, supporting 10/100/1000 GbE

Intel® MAC/PHY i217LM, supporting 10/100/1000 GbE

Intel® MAC/PHY i217LM, supporting 10/100/1000 GbE

USB 4x USB 3.04x USB 2.0

4x USB 3.0 & 4x USB 2.0 (QM87)2x USB 3.0 & 6x USB 2.0 (HM86)

4x USB 3.0 & 4x USB 2.0 (QM87)2x USB 3.0 & 6x USB 2.0 (HM86)

Serial ATA 4x SATA 6Gb/s 4x SATA 6Gb/s (QM87)2x SATA 6Gb/s & 2x SATA 3Gb/s (HM86)

4x SATA 6Gb/s (QM87)2x SATA 6Gb/s & 2x SATA 3Gb/s (HM86)

Audio AMD® Audio Coprocessor,supporting ALC886

HDA integrated in PCH,supporting ALC886

HDA integrated in PCH,supporting ALC886

PCI ExpressPCI Express x16

6x PCI Express x1 (AB)1x PCI Express x1 (CD)

PCI Express x166 PCI Express x1 (AB)1 PCI Express x1 (CD)

PCI Express x166 PCI Express x1 (AB)1 PCI Express x1 (CD)

Management Bus I2C, SMBus I2C, SMBus I2C, SMBus

SEMA Support Yes Yes Yes

Power SupplyWide voltage input support8.5-20V, 5Vsb ±5% (ATX)

8.5-20V (AT)

Wide voltage input support8.5-20V, 5Vsb ±5% (ATX)

8.5-20V (AT)

Wide voltage input support8.5-20V, 5Vsb ±5% (ATX)

8.5-20V (AT)

Operating Temperature 0°C to +60°C 0°C to +60°C

-40°C to +85°C (optional)0°C to +60°C

-40°C to +85°C (optional)

BSP Support Windows 7/8, WES7, WE8 Std.; Linux Windows 7/8, WES7, WE8 Std.; Linux , VxWorks, QNX

Windows 7/8, WES7, WE8 Std.; Linux , VxWorks, QNX

*Cache specification dependent on processor SKU.

COM Express Type 6 - Basic

P 33

COM Express Type 6 - Basic

Model Name Express-IB Express-IBR Express-HR

Form Factor & Compatibillity

PICMG COM.0 R2.1, Type 6Basic size: 95 x 125 mm

PICMG COM.0 R2.1, Type 6Basic size: 95 x 125 mm

PICMG COM.0 R2.1, Type 6Basic size: 95 x 125 mm

CPU

Intel® Core™ Processorsi7-3615QE/3612QEi7-3555LE/3517UE

i5-3610MEi3-3120ME/3217UE

Intel® Celeron® Processors1020E/1047UE/927UE

Intel® Core™ Processorsi7-3615QE/3612QEi7-3555LE/3517UE

i5-3610MEi3-3120ME/3217UE

Intel® Core™ Processorsi7-2715QE

i7-2655LE/2610UEi5-2515E

i3-2310E/2340UE

Intel® Celeron® Processors B810E/847E

Chipset Intel® QM77 Chipset Intel® QM77 Chipset Intel® QM67 Chipset

Memory Up to 16 GB Dual Channel DDR3L at 1600/1333 MHz

Up to 16GB Dual Channel DDR3L at 1600/1333 MHz

with ECC

Up to 16 GB Dual Channel DDR3L at 1333/1066 MHz

Cache* L3: 3MB, 4MB or 6MB L3: 3MB, 4MB or 6MB L3: 3MB, 4MB or 6MB

BIOS Type AMI EFI withIntel® iAMT support

AMI EFI withIntel® iAMT support

AMI EFI withIntel® iAMT support

TPM support (opt.) Infineon SLB9635TT Atmel AT97SC3204 Infineon SLB9635TT

Integrated Graphics Support

VGA18/24-bit single/dual LVDS

3x DDI ports supportingDP/HDMI/DVI (DDI1 supports SDVO)

VGA18/24-bit single/dual channel LVDS

3x DDI ports supporting DP/HDMI/DVI (DDI1 supports SDVO)

VGA18/24-bit single/dual channel LVDS

3x DDI ports supporting DP/HDMI/DVI (DDI1 supports SDVO)

Graphics Features DirectX 11, OpenGL 3.1,OpenCL 1.1

DirectX 11, OpenGL 3.1,OpenCL 1.1 DirectX 10.1 and OpenGL 3.0

LANIntegrated MAC with Intel®

WG82579LM PHY, supporting 10/100/1000 GbE

Integrated MAC with Intel®WG82579LM PHY, supporting 10/100/1000

GbE

Integrated MAC with Intel®WG82579LM PHY, supporting 10/100/1000

GbE

USB 4x USB 3.04x USB 2.0

4x USB 3.04x USB 2.0 8x USB 2.0

Serial ATA 2x SATA 3 Gb/s,2x SATA 6 Gb/s

2x SATA 3 Gb/s,2x SATA 6 Gb/s

2x SATA 3 Gb/s,2x SATA 6 Gb/s

Audio HDA integrated in PCH,supporting ALC886

HDA integrated in PCH,supporting ALC886

HDA integrated in PCH,supporting ALC888

PCI Express1xPCI Express x16

6x PCI Express x1 (AB) 1x PCI Express x1 (CD)

1x PCI Express x16 6x PCI Express x1 (AB) 1x PCI Express x1 (CD)

1x PCI Express x16 6x PCI Express x1 (AB) 1x PCI Express x1 (CD)

Management Bus I2C, SMBus I2C, SMBus I2C, SMBus

SEMA Support - - -

Power Supply 8.5-20V only (AT),8.5-20V and 5Vsb±5% (ATX)

12V only (AT),12V and 5Vsb±5% (ATX)

12V only (AT), 12V and 5Vsb±5% (ATX)

Operating Temperature 0°C to +60°C -20°C to +70°C

-40°C to +85°C (optional) 0°C to +60°C

BSP Support WES 7, Linux, VxWorks WES 7, Linux, VxWorks Windows XPe, WES 7, Linux, VxWorks

Note: All specifications are subject to change without further notice.*Cache specification dependent on processor SKU.

P 34

Selection Guide COM Express Type 6 - Compact

Model Name cExpress-BL cExpress-HL cExpress-BT

Form Factor & Compatibillity

PICMG COM.0 R2.1, Type 6Compact size: 95 x 95 mm

PICMG COM.0 R2.1, Type 6Compact size: 95 x 95 mm

PICMG COM.0 R2.1, Type 6Compact size: 95 x 95 mm

CPU

5th Generation Intel® Core™ Processors i7-5650Ui5-5350Ui3-5010U

lntel® Core™ Processor i7-4650Ui5-4300Ui3-4010U

Intel® Celeron® Processor 2980U

Intel® Atom™ ProcessorsE3800 Series SoC

Intel® Celeron® ProcessorsN2930/J1900

Chipset - - -

DRAM Up to 16 GB DDR3L SDRAM at 1600/1333 MHz Up to 16 GB DDR3L SDRAM at 1600/1333 MHz Up to 8 GB DDR3L SDRAM at 1333/1066 MHz

Cache* L3: 2MB, 3MB or 4MB L3: 2MB, 3MB or 4MB L1: 2MB, 1MB or 512K

BIOS Type AMI EFI with Intel® AMT 9.0 support AMI EFI with Intel® AMT 9.0 support AMI Aptio EFI

TPM support (opt.) Atmel AT97SC3204 Atmel AT97SC3204 Atmel AT97SC3204

Integrated Graphics Support

VGA 18/24-bit single/dual channel LVDS

(4 lane eDP optional) 2x DDI ports supporting DP/HDMI/DVI

VGA18/24-bit single/dual channel LVDS

2x DDI ports supporting DP/HDMI/DVI

VGA2x DDI ports supporting DP/HDMI/DVI

18/24-bit single/dual channel LVDS (optional)

Graphics Features DirectX* 11, 10.1, 10, 9;OpenGL* 3.0

DirectX* 11, 10.1, 10, 9;OpenGL* 3.0

DirectX* 11, OpenGL 1.1, OpenGL ES Halt/2.0/1.1,

OpenGL 3.2

LAN Intel® MAC/PHY i218LM, supporting 10/100/1000 GbE

Intel® MAC/PHY i218LM, supporting 10/100/1000 GbE

Intel® MAC/PHY i210LM, supporting 10/100/1000 GbE

USB 2x USB 3.0 6x USB 2.0

2x USB 3.06x USB 2.0

1 x USB 3.06 x USB 2.0

Serial ATA 4 SATA 6Gb/s 4 SATA 6Gb/s 2 SATA 3Gb/s

Audio HDA integrated in SoC,supporting ALC886

HDA integrated in SoC,supporting ALC886

HDA integrated in SoC,supporting ALC886

PCI Express 4x PCI Express x 1 (AB) 4x PCI Express x1 (AB) 3x PCI Express x1 (AB)PCI Express x4 (AB, optional)

Management Bus I2C, SMBus I2C, SMBus I2C, SMBus

SEMA Support Yes Yes Yes

Power SupplyWide voltage input support

5-20V, 5Vsb ±5% (ATX) 5-20V (AT)

Wide voltage input support5-20V, 5Vsb ±5% (ATX)

5-20V (AT)

Wide voltage input support5-20V, 5Vsb ±5% (ATX)

5-20V (AT)

Operating Temperature

0°C to +60°C -40°C to +85°C (optional)

0°C to +60°C-40°C to +85°C (optional)

0°C to +60°C -40°C to +85°C (optional for E3800 Series

SoC)

BSP Support Windows 7/8.1U, WES7, WE8 Std.; Linux Windows 7/8, WES7, WE8 Std.; Linux , VxWorks

Windows 7/8, WES7, WE8 Std., WEC7; Linux , VxWorks

*Cache specification dependent on processor SKU.

P 35

COM Express Type 2

Model Name Express-HL2 Express-IBE2 cExpress-BT2 Express-CVC

Form Factor & Compatibillity

PICMG COM.0 R2.1, Type 2Basic size: 95 x 125 mm

PICMG COM.0 R2.1, Type 2Basic size: 95 x 125 mm

PICMG COM.0 R2.0, Type 2Compact size: 95 x 95 mm

PICMG COM.0 R2.1, Type 2Compact size: 95 x 95 mm

CPU

Intel® Core™ Processors: i7-4860EQ/4700EQ

i5-4400E/4402Ei3-4100E/4102E

Intel® Celeron® Processor 2000E/2002E

Intel® Core™ Processors:i7-3615QE/3612QE

i7-3555LE/i7-3517UE i5-3610ME, i3-3120ME/3217UE

Intel® Atom™ Processors E3800 Series SoC

Intel® Celeron™ Processors N2930/J1900

Intel® Atom™ Processor N2600/N2800/D2550

Chipset Intel® QM87/HM86 Express Intel® QM77 Express - Intel® NM10

DRAM Up to 16GB Dual Channel DDR3L at 1600/1333MHz

Up to 16GB Dual Channel DDR3L at 1600/1333MHz

Up to 8 GB DDR3L SDRAM at 1333/1066 MHz

Standard DDR3 up 4 GB(D2550) or 2GB (Nx00)

on single SODIMM socket

Cache* L3: 6MB or 3MB L3: 3MB, 4MB or 6MB L1: 2MB, 1MB or 512K L2 1MB

BIOS TypeAMI EFI with Intel®AMT 9.0 support,

(no AMT support by HM86)

AMI Aptio EFI withIntel® iAMT support AMI Aptio EFI AMI Aptio EFI

TPM support (opt.) Atmel AT97SC3204 Atmel AT97SC3204 Atmel AT97SC3204 Atmel AT97SC3204

Integrated Graphics Support

VGA18/24-bit single/dual LVDS

VGA18/24-bit single/dual LVDS,

SDVO (on PEG)

VGA18/24-bit single/dual LVDS

VGA18/24-bit single/dual LVDS

Graphics Features DirectX* 11, 10.1, 10, 9;OpenGL* 3.0

DirectX 11, OpenGL 3.1,OpenCL 1.1

DirectX 11,OpenCL 1.1, OpenGL ES Halt/2.0/1.1, OpenGL 3.2

DirectX 9

LAN Intel® MAC/PHY i217LM, supporting 10/100/1000 GbE

Integrated MAC with Intel®WG82579LM PHY, supporting

10/100/1000 Mbps

Intel® MAC/PHY i210LM, supporting 10/100/1000 GbE

Integrated MAC with Intel i210LM PHY, supporting 10/100/1000 GbE

USB 8x USB 2.0 8x USB 2.0 4 x USB 1.1/2.04 x USB 2.0 only 8x USB 2.0

Parallel ATA (IDE) one channel, one device one channel, one device one channel, one device one channel, one device

Serial ATA 4x SATA 6Gb/s (QM86)3x SATA 6Gb/s (HM86)

2x SATA 3 Gb/s,2x SATA 6 Gb/s 1x SATA 3 Gb/s 2x SATA 3 Gb/s

Audio HDA integrated in PCH,supporting ALC886

HDA integrated in PCH,supporting ALC888

HDA integrated in PCH,supporting ALC888

HDA integrated in PCH,supporting ALC886

PCI/PCI Express1x PCI Express x16

6x PCI Express x1 (AB) 1x PCI

1x PCI Express x16 5x PCI Express x1 (AB)

1x PCI Bus

1x PCI Express x16 6x PCI Express x1 (AB)

1x PCI Bus 3x PCIe x1 (AB)

Management Bus I2C, SMBus I2C, SMBus I2C, SMBus I2C, SMBus

SEMA Support Yes Yes Yes Yes

Power SupplyWide voltage input support8.5~20V, 5Vsb ±5% (ATX)

8.5~20V (AT)

Wide voltage input support8.5~19V, 5Vsb ±5% (ATX)

8.5~19V (AT)

Wide voltage input support5~20V, 5Vsb ±5% (ATX)

5~20V (AT)

Wide voltage input support5~20V, 5Vsb ±5% (ATX)

5~20V (AT)

Operating Temperature

0°C to +60°C-40°C to +85°C (optional) 0°C to +60°C

0°C to +60°C -40°C to +85°C (optional for E3800

Series SoC) 0°C to +60°C

BSP Support Windows 7/8, WES7, WE8 Std.; Linux , VxWorks

Windows XPe, WES 7, Linux, VxWorks

Windows 7/8, WES7, WE8 Std., WEC7; Linux, VxWorks

Windows XPe, WES 7, WEC 7, Linux, VxWorks

Note: All specifications are subject to change without further notice.

P 36

Selection Guide COM Express Type 10

Model Name nanoX-BT nanoX-TC nanoX-TCR

Form Factor & Compatibillity

PICMG COM.0 R2.1, Type 10Mini size: 84 x 55 mm

PICMG COM.0 R2.1, Type 10Mini size: 84 x 55 mm

PICMG COM.0 R2.1, Type 10Mini size: 84 x 55 mm

CPU

Intel® Atom™ ProcessorE3800 Series SoC

Intel® Celeron® ProcessorN2930/J1900

Intel® Atom™ Processor:E680T, E660T, E640T, and E620T

Intel® Atom™ Processor:E680T, E660T, E640T, and E620T

Chipset - Intel® EG20T PCH Intel® EG20T PCH

Memory Soldered, up to 4GB DDR3L at 1333/1066MHz

Soldered, 1GB DDR2 at 800 MHz(optional 512MB)

Soldered, 1GB DDR2 at 800 MHz (optional 512MB or 2GB)

Cache* L1: 2MB, 1MB or 512K L2: 512 KB L2: 512 KB

BIOS Type AMI Aptio EFI AMI Aptio EFI AMI Aptio EFI

TPM support (opt.) Atmel AT97SC3204 Atmel AT97SC3204 Atmel AT97SC3204

Integrated Graphics Support

Single channel 18/24-bit LVDS (optional eDP) DDI channel for DP/HDMI

18/24-bit single/dual channel LVDSSDVO

18/24-bit single/dual channel LVDSSDVO

Graphics Features DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2

Encode : MPEG4, H.263, H.264Decode : MPEG2/4, VC1, WMV9, H.264

Encode : MPEG4, H.263, H.264Decode : MPEG2/4, VC1, WMV9, H.264

LAN Intel® MAC/PHY i210LM,supporting 10/100/1000 GbE

Integrated MAC with Realtek PHY, supporting 10/100/1000 Gb

Intel® MAC/PHY 82574IT, supporting 10/100/1000 GbE

USB1x USB 3.03x USB 2.0

1x USB 2.0 client

6x USB 2.01x USB 2.0 client

6x USB 2.01x USB 2.0 client

Serial ATA 2x SATA 3 Gb/s 2x SATA 1.5 Gb/s 2x SATA 1.5 Gb/s

Audio HDA integrated in SOC,supporting ALC886

HDA integrated in PCH,supporting ALC886

HDA integrated in PCH,supporting ALC886

PCI Express 3x PCI Express x1 (AB) PCI Express x4 (AB, optional) 3x PCI Express x1 (AB) 2x PCI Express x1 (AB)

Management Bus I2C, SMBus I2C, SMBus I2C, SMBus

SEMA Support Yes - -

Power SupplyWide voltage input support

5-14V, 5Vsb ±5% (ATX) 5-14V (AT)

Wide voltage input support5-20V, 5Vsb ±5% (ATX)

5-20V (AT)

Wide voltage input support5-20V, 5Vsb ±5% (ATX)

5-20V (AT)

Operating Temperature

0°C to +60°C -40°C to +85°C (optional for E3800 Series

SoC) 0°C to +60°C -20°C to +70°C

-40°C to +85°C (optional)

BSP Support Windows 7/8, WES7, WE8 Std., WEC7; Linux, VxWorks

Windows XPe, WES7, WinCE 6.0,WEC7, Linux, VxWorks

Windows XPe, WES7, WinCE 6.0,WEC7, Linux, VxWorks

*Cache specification dependent on processor SKU.

P 37

COM Express Carrier Boards

Model Name Express-BASE6 Express-BASE miniBASE-10R

COM Express Module

PICMG® COM Express® Revision 2.0,Type 6

PICMG® COM Express® Revision 2.0,Type 2

PICMG® COM Express® Revision 2.1,Type 10

Dimensions 305 mm x 244 mm 305 mm x 244 mm 150 mm x 142 mm

Connectors 2x 220-pin (Type 6) 2x 220-pin (Type 2) 1x 220-pin (Type 10)

Power Supply ATX/AT ATX/AT 19V AdapterSmart Battery

Expansion Busses

1x PCI Express x4 slot 3x PCI Express x1 slots

1x ExpressCard slot1x PCI Express x16 / SDVO slot

2x 32-bit PCI 2.3 slots5x PCI Express x1 slots

1x ExpressCard slot1x PCI Express x16 / SDVO slot

1x Mini PCIe card slot 1x Mini PCIe / mSATA card slot

1x SD card slot

POST LEDs Onboard diagnostics for BIOS POST Onboard diagnostics for BIOS POST Onboard diagnostics for BIOS POST

Secondary BIOS SPI flash LPC & SPI flash SPI flash

Audio Codec Realtek ALC886 Realtek ALC880 Realtek ALC262

Audio Interfaces Mic/Line-in/Line-out on I/O panelS/PDIF on header/jack

Mic/Line-in/Line-out on I/O panelS/PDIF on header

Mic/Line-in/Line-out on I/O panelS/PDIF on jack

Display Outputs

1x VGA (DB-15 connector)1x LVDS (onboard 34-pin header)

3x DDI to DP/HDMI (through video adapter card)

1x VGA (DB-15 connector)1x LVDS (onboard 34-pin header)

1x LVDS/eDP (onboard 30-pin header)1x DP port

Super I/O Winbond WF83627DHG on LPC bus Winbond WF83627DHG on LPC bus -

Digital I/O Extensive GPIO (SMBus to GPIO bridge PCA9535) - Extensive GPIO (SMBus to GPIO bridge

PCA9535)

KB/Mouse 2x 6-pin Mini-DIN 2x 6-pin Mini-DIN -

Serial Port1x DB-9 connector (from Super I/O)

3x onboard 10-pin header(one from Super I/O, two from module)

1x DB-9 connector1x onboard 10-pin header 2x DB-9 connectors

Parallel Port - 1x DB-25 connector -

SATA 2x SATA connectors2x eSATA connectors 4x SATA connectors 1x SATA connector

1x SATA through mini PCIe / mSATA card slot

PATA - 1x 40-pin header for IDE1x CF socket -

USB 4x USB 2.0 connectors4x USB 2.0/3.0 connectors

6x USB 2.0 connectors1x USB 2.0 header

1x USB 2.0 through ExpressCard

4x USB 2.0 connectors2x USB 2.0/3.0 connectors

1x USB 2.0 through Mini PCIe card slot1x USB 2.0 through Mini PCIe / mSATA card slot

1x USB 2.0 through miniUSB connector

LAN 10/100/1000BASE-T compatible RJ-45 10/100/1000BASE-T compatible RJ-452x RJ-45 (one from module, one from LAN chip

on carrier board)10/100/1000BASE-T compatible RJ-45

Feature Connectors SMBus, I2C, module control signals SMBus, I2C, module control signals SMBus, I2C, module control signals

Smart Battery Support

One 10-pin header for Smart Battery management communications (connects to

ADLINK BattMan board)

One 10-pin header for Smart Battery management communications (connects to

ADLINK BattMan board)Integrated Smart Battery management system

MiscellaneousReset button, Lid button, Sleep button, Power button, Power LED, HDD LED,

Buzzer

Reset button, Power button, Power LED, HDD LED, Buzzer

Reset button, Lid button, Sleep button, Power button, PowerLED, HDD LED

Note: All specifications are subject to change without further notice.

P 38

Selection Guide COM Express Starter Kits

Model Name Type 6 Starter Kit Plus Type 2 Starter Kit Plus Type 10 Starter Kit Plus

Standard Items

Reference Carrier Board Expres-BASE6 Express-BASE miniBASE-10R

IDE cable - √ -

SATA cable √ √ √

TV out cable - √ -

miniUSB to USB cable - - √

CF adapter - √ -

T6-DDI video adapter card √ - -

DP adapter cable to DVI - to VGA

PCIe x 16-to-two-x8 adapter card √ - -

PCI 2-slot riser card - √

DB40 DeBug module √ √ √

USB stick with documentations,

drivers, libraries, BSP√ √ √

Carrier design guide and product manuals √ √ √

Live USB with OS Linux Linux Linux

Optional Items

COM Express module with CPU √ √ √

Memory √ √ √

Thermal Solution √ √ √

10"1 LVDS panel - - √

* Cache performance depends on processors sku

P 39

Engineering Test Tools

BattMan

Smart Battery Management Reference Platform

The BattMan Smart Battery Management Reference Platform allows developers to first verify on a system level and then easily implement the same type of battery power design into their own carrier board. BattMan supports single battery mode or balanced loading and unloading using two batteries.

Ordering Information

Model Number Description

StarterKit-Battman

Smart Battery Management Reference Platform for COM Express® modules (includes two Smart Batteries, 19V adapter and USB key)

Flat Panel Transfer Board

The Flat Panel Transfer Board (FPTB) supports prototyping and verification of LVDS and TTL flat panel displays . The module includes an LVDS-to-TTL converter to allow users to implement TTL displays with COM modules that support LVDS only. Onboard PWM circuitry supports backlight control for LVDS and TTL displays.

Ordering Information

Model Number Description

FPTB Flat Panel Transfer Board for LVDS-to-TTL signal conversion

LVDS cable for FPTB Reference carrier LVDS output to FPTB LVDS input cable

DB40 Debug Module

The DB40 Debug Card is designed for debugging of COM Express and PC/104 boards. It includes the following features:

• Port 80/81 decoding for Power On Self Test (POST) via LPC• Interface to SPI Flash for BIOS update• Interface to Board Management Controller (BMC) for update• Power and Reset buttons and status LEDs

The DB40 Debug card can only be used on products that have the appropriate FFC debug connector designed for this purpose.

Ordering Information

Model Number Description

DB40 Multipurpose debug board

PCIe x16-to-two-x8 Adapter Card

The ADLINK PCIe x16-to-two-x8 adapter card can be used with modules that support bifurbication on the PEG x16 interface. The card reroutes the PCIe x16 to two x8 and allows testing of two independent PCIe add-on cards with x8/x4/x2/x1 width.

Ordering Information

Model Number Description

P16TO28 PCIe x16-to-two-x8 adapter card

Note: All specifications are subject to change without further notice.

P 40

Selection Guide SMARC

Model Name LEC-Q1000 LEC-BT LEC-BTS LEC-iMX6 LEC-3517

Form Factor & Compatibillity

SMARC short size,82 x 50 mm

SMARC full size, 82 x 80 mm

SMARC short size,82 x 50 mm

SMARC short size, 82 x 50 mm

SMARC short size82 x 50 mm

CPU Inte® Quark Processor X1000 Series SoC

Intel® Atom™ ProcessorE3800 series SoC

Intel® Atom™ ProcessorE3800 series SoC

Freescale i.MX6 Quad, Dual, DualLite and Solo

Processors

TI Sitara AM3517 Cortex-A8

Memory Up to 2 GB DDR3 at 800MHz

Up to 8GB DDR3L at 1333/1066 MHz with ECC

Up to 4GB DDR3L at 1333/1066 MHz without

ECC

Up to 2GB DDR3L at 1066 MHz

256MB DDR2,512MB NAND flash

onboard storage

Cache* 16k, 400 MHz L2: 512 kB to 2 MB L2: 512 kB to 2 MB L2: 512kB to 1 MB L2: 512 kB to 2 MB

Boot Loader AMI UEFI BIOS AMI UEFI BIOS AMI UEFI BIOS U-Boot U-Boot

LAN 2x 10/100 FEIntel® MAC/PHY i210IT, supporting 10/100/1000

GbE

Intel® MAC/PHY i210IT, supporting 10/100/1000

GbE10/100/1000 GbE

SMSC LAN 8710A-EZK PHY, supporting 10/100 Base-T

USB 2x USB2.0 host1x USB2.0 device

1x USB 3.02x USB 2.0

1x USB 3.03x USB 2.0

2x USB 2.01x USB 2.0 OTG

1x USB 2.0 host1x USB 2.0 host/OTG

Serial ATA - 1x SATA 3 Gb/s 1x SATA 3 Gb/s 1x SATA 3Gb/s(Quad and Dual only) -

Audio - HDA HDA Located on carrierS/PDIF 3x I2S, on carrier

PCI Express 2x PCIe x1 3x PCIe x1 3x PCIe x1 1x PCIe x1 -

SEMA Support Yes Yes Yes Yes -

Power Supply 3.0 V-5.25 V DC ±5% 3.0 V-5.25 V DC ±5% 3.0 V-5.25 V DC ±5% 3.0 V-5.25 V DC ±5% 5V DC

Operating Temperature

0°C to 60°C-40°C to +85°C

0°C to +60°C-40°C to +85°C

0°C to +60°C-40°C to +85°C

0°C to +60°C-40°C to +85°C -40°C to +85°C

BSP Support Linux Linux, VxWorks, Android, Windows 7/8, WEC7

Linux, VxWorks, Android, Windows 7/8, WEC7

Linux, Android, WEC7, QNX Linux, WEC7

Note: All specifications are subject to change without further notice.*Cache specification dependent on processor SKU.

P 41

SMARC Carrier Board and Starter Kits

Model Name LEC-BASE R1

Display Outputs

Combined HDMI, DPLVDS 18/24-bit or eDPPanel support signals (I2C, Power Enables, PWM)Combined HDMI, 18/24-bit RGB

Camera Camera input 0: CSI-2Camera input 1: RGB or CSI-4

SDIO 4-bit SD/SDIO card interfaces8-bit eMMC/SD/SDIO interfaces

SPIOff module boot use (optional)G-sensor ADXL345 BCCZ2x SPI interface

I2C

4x I2C- Power Management- HDMI- Camera 0- Camera 1 or GP

I2S

3x I2S interface- Audio codec TLV320AIC23BPW- Line-in, Line-out, Mic- Optional with HDA

Asynchronous Serial Port

4x asynchronous serial ports (UART)- Two with 2 wire handshake (RXD, TXD, RTS#, CTS#)- Two with data only (RXD, TXD)- Logic level interface

CAN Bus

1x CAN bus interface- Logic level signals from Module based CAN bus protocol controllers- RXD, TXD only

USB5x USB- One with USB 2.0 OTG- 4x USB 2.0 Host operation (full speed and high speed)

PCI Express

One PCIe x1 linkPCIe Gen1 or Gen 2 (module dependent)Reference clock pairFull set of PCIe support signalsMay be configured as PCIe target if module chipset allowsPCIe wake signal

SATA 1x SATA with power interface

Ethernet RJ-45 10/100/1000 Ethernet (by LAN transformer)

S/PDIF S/PDIF out for audio

Boot Source Select Module: SPI/eMMC/NOR/NANDCarrier: SPI/eMMC/SD Card/SATADIP Switch (4)

GPIO 12-pin header (including fan control and HDA reset)

Alternate Function Blocks (AFB)v

Standard Module: AFB pins are reservedMOST Bus AFBDual GBE AFBFieldBus AFB

Dimension 330 mm x 175 mm (W x L)

Board Connector MXM 314 pins

Model Name LEC-Starter Kit R1

Features

• SMARC compliant LEC-BASE R1 carrier board

• 7” flat panel 800 x 400 display with assembly and USB touch cable

• SD card and USB stick

• Interface cables (one way open) for camera, GPIO, power management, I2S and SPI

• AC/DC adapter, power cord and universal socket

Optional Items Compatible Modules: LEC-3517, LEC-iMX6

Ordering Information

LEC-Starter Kit R1 with LEC-BASE carrier board, including SD card and power supply (LEC-3517 or LEC-iMX6 modules optional)

Model Name LEC-Starter Kit R2

Features

• SMARC compliant LEC-BASE R1 carrier board• SD card and USB stick• Interface cables (one way open) for camera,

GPIO, power management, SPI, I²C and LVDS• AC/DC adapter, power cord and universal

socket

Optional Items

• Modules: LEC-BT, LEC-BTS or LEC-Q1000• Heatsink: for LEC-BT, LEC-BTS or LEC-Q1000• Software: BSP depending on operating system

Ordering Information

LEC-Starter Kit R2 with LEC-BASE carrier board, including SD card and power supply (LEC-BT, LEC-BTS or LEC-Q1000 module and cooling solution optional)

Note: All specifications are subject to change without further notice.

P 42

Selection Guide

Model Name Q7-BT

Form Factor & Compatibillity Qseven v2.0Standard size: 70 x 70 mm

CPU Intel® Atom™ ProcessorE3800 Series SoC

DRAM Up to 8GB DDR3L at 1333/1066MHz

Cache* L2 512kB to 2MB

Integrated Graphics SupportDirectX 11.1, OGLES 2.0, OGL 3.2Decode: H.264, MPEG2, VC1, VP8

Encode: H.264 and MPEG2

LAN Intel® MAC/PHY i210IT, supporting 10/100/1000 GbE

USB 1x USB 3.06x USB 2.0

Serial ATA 2x SATA 3 Gb/s

Audio I2S and HDA

PCI Express 3x PCIe x1

eMMC 4GB to 64GB (optional)

SEMA Support Yes

Camera CSI 4L/1L on separate connector

Power Supply 3.0 V ~ 5.25 V DC ±5%

Operating Temperature 0°C to +60°C-40°C to +85°C

Standard OS (BSP Support) Win 7/8, WEC 7, Linux, VxWorks, QNX, Android

Model Name Q7-BASE

Display Outputs HDMI Dual channel LVDS 18/24-bit with backlight connector

SDIO 4/8-bit SDIO for MMC/SD

SPI1x SPI interface

1x SMBus1x misc

HD Audio 1 x HD audio codec ALC886

I2C

1x I2C1x line in

1x line out1x microphone

1x S/PDIF in/out

Asynchronous Serial Port 1x asynchronous serial port (UART)

CAN Bus 1x CAN bus interface

USB1x USB 3.0

5x USB 2.0 host1x USB 2.0 client

PCI Express 3x PCIe x11x PCIe Mini Card

SATA 2x SATA

Gigabit Ethernet 1x GbE

S/PDIF S/PDIF in/out

Boot Source Select SPI, eMMC, SD Card, SATA

Miscellaneous

LPC/TPM connector2x COM1x LPT

2x PS/2 for keyboard and mouse7-segment display for BIOS post code

Status LEDs and control buttons

Power Modes ATX/AT mode

Standard Voltage Input

5.0V ±5%, ±50mV ripple, 12V, 3.3V from ATX connector

Board Connector MXM 230-pin edge connector

Qseven module and Carrier Board

*Cache specification dependent on processor SKU.

P 43

ETX Modules, Carrier Board and Starter Kit

Model Name ETX-Proto

Interface ETX v3.0

Audio Onboard amplifier with Line-in,

Speaker-out and MicLine-In/Line-Out, Speaker-out

Video

VGA: DB-15 connector foranalog VGA displays

LVDS: Onboard header LVDSTV-out: Onboard header for PAL/

NTSC TV

Expansion Buses

Four 32-bit PCI slotsThree16-bit ISA slots

One Mini PCI slot

USB Four ports 1.1/2.0 compatible

LAN RJ-45

Serial Port2x 16550 compatible RS-232 ports2x additional ports COM3/4 from

secondary multi I/O

IDE Port Four IDE devices (two connectors)

Parallel Port One port SSP, ECP, and EEP mode

KB/Mouse Two 6-pin mini DIN connectors (on rear I/O panel)

KB/Mouse Two 6-pin mini DIN connectors (on rear I/O panel)

Power Modes ATX and AT onboardOnboard reset and ATX switches

Formfactor 304.8 x 190 mm

Model Name ETX-BT ETX-CV

Form Factor & Compatibillity

ETX 3.02Size: 95 x 114 mm

ETX 3.02Size: 95 x 114 mm

CPU

Intel® Atom™ ProcessorE3800 Series SoC

Intel® Celeron® ProcessorsN2930/J1900

Intel® Atom™ Processor N2600/N2800/D2550

Chipset - Intel® NM10

Memory Up to 4GB DDR3L at1333/1066MHz

Up 4GB (D2550) or 2GB (N200) DDR3 at 1066/800 MHZ

Cache L2: 512 kB to 2MB L2: 1MB

BIOS Type AMI Aptio EFI AMI Aptio EFI

TPM support (opt.) Atmel AT97SC3204 (optional) Atmel AT97SC3204

Integrated Graphics Support

Decode: H.264, MPEG2, MVC, VC-1, WMV9 and VP8

Encode: H.264, MPEG2 and MVC

VGA18/24-bit single/dual LVDS

Graphics Features DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2 DirectX 9

LANIntel® MAC/PHY i211,

supporting 10/100 Mbps (GbE via onboard connector)

Realtek RTL8111F,supporting 10/100 Mbps

USB 4x USB 2.0 4x USB 2.0

Parallel ATA (IDE) 2x PATA IDE with M/S support Two channels, four devices

Serial ATA 2x SATA 3Gb/s 2x SATA 3Gb/s

Audio Integrated on E3800 SoC, supporting, Realtek ALC 262

Integrated on Intel® NM10, supporting, Realtek ALC 262

SEMA Support Yes -

Power Supply 5V±5% / 5Vsb ±5% (ATX)5V±5% (AT)

5V only (AT),5V and 5Vsb (ATX)

Operating Temperature

0°C to +60°C-40°C to +85°C (optional)

0°C to +60°C-40°C to +85°C (optional)

BSP Support Windows 7/8, WES7, WE8 Std., WEC7; Linux, VxWorks

Windows XPe, WES 7, WEC 7, Linux, VxWorks

Note: All specifications are subject to change without further notice.

P 44

Note

Computer-on-M

odules 2015

50-40285-0000

137-881 서울시 서초구 서초대로 326, 802 (서초동, 모인터빌딩)

#50-56, First Floor, Spearhead Towers Margosa Main Road (between 16th/17th Cross), Malleswaram, Bangalore - 560 055, IndiaTel: +91-80-65605817, +91-80-42246107Fax: +91-80-23464606Email: india@adlinktech.com

ADLINK Technology, Inc. (French Liaison Office)6 allée de Londres, Immeuble Ceylan 91940 Les Ulis, FranceTel: +33 (0) 1 60 12 35 66Fax: +33 (0) 1 60 12 35 66Email: france@adlinktech.com

ADLINK Technology, Inc. (Israeli Liaison Office)27 Maskit St., Corex Building PO Box 12777 Herzliya 4673300, IsraeliTel: +972-54-632-5251Fax: +972-77-208-0230Email: israel@adlinktech.com

Vol. C153-1