COMPREHENSIVE CHIPSET SYSTEMSOLUTION PORTFOLIO

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APPLICATION

SHAPING CONVERGED COMMUNICATIONSLeveraging over two decades of leadership in semiconductor development and innovation in signal processing, wireless communications and unique voice expertise, DSP Group offers a comprehensive portfolio of System-On-Chip (SoC) solutions for consumer electronics (CE) end products at home, in the office and on-the-go. Our complete solutions enable OEMs/ODMs introduce innovative products that embed smart processing and converged communications, addressing the growing demand for more cost-effective design, innovative applications/technologies and low-power processing. Our complete SoC solutions include hardware development kits (HDKs), embedded software packages, and software development kits (SDKs) – everything you need to develop innovative, cost-effective and power-efficient products. Our advanced technologies are positioning DSP Group as an enabler in the burgeoning Internet of things, smart voice processing, voice user interface for consumers, mobile and wearable devices, and enterprise telephony markets.

SOLUTIONSDSP Group continues to play a key role in the rapidly-changing communications arena. OEMs/ODMs, telecommunication operators, and service providers use our market-leading solutions to rapidly bring to market innovative products for home, enterprise and mobile environments. Complementing our traditional offering, our new solutions for voice and audio enhancement (HDClear™), always-on voice activation and sensor hub, IoT applications, home automation and security (ULE), and enterprise telephony (VoIP) are enabling our customers to develop a new wave of products by raising the bar in both voice processing and converged communications.

HDClear™ – Voice and Audio Enhancement for Mobile

HDClear by DSP group is a revolutionary technology for enabling voice user interface and enhancing voice quality. In smart audio, mobile phones, wearable devices, PCs and tablets, HDClear enables the device to be always-on and always-listening, suppresses background noise with voice barge-in and promotes high speech intelligibility for unparalleled voice communications and user experience, all in extremely low power consumption. HDClear is an ideal solution for smart speakers, mobile and wearable devices, bringing a better user experience to voice communications, command and activation – all with ultra-low power consumption.

DSP Group’s solution is based on DSP Group’s SoC and embedded software and advanced voice activation and sensor fusion algorithms, providing simultaneous analysis of data from multiple sensor sources in addition to voice activation.

Our solutions include reference designs for the following applications:• Smart speakers • IoT applications • Mobile phones• Wearable devices

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APPLICATIONAPPLICATION

Always-On Voice Activation and Sensor Hub Functions for Smartphones, Wearables and IoT

DSP Group’s solution for smartphones, wearable and IoT devices provides excellent performance of always on voice-trigger, voice command and sensor hub functions while maintaining extremely low power consumption.

Sensor hub functions include capturing data from multiple sensors such as microphones, biometrics, accelerometers, gyroscopes, and magnetometers, and also from environmental sensors such as light level, color, temperature, pressure, and humidity gauges.

Our solution includes reference designs for smartphones and wearables devices and can be used for voice activation in other appliances.

Enterprise V2oIP

The leading VoIP silicon provider for enterprise voice and video, DSP Group offers comprehensive, best-in-class, yet highly-affordable V2oIP solutions. Powering the full range of IP desktop phones, Video phones, conferencing systems and analog telephone adapters (ATAs), DSP Group’s scalable, green solutions are ideal for all enterprise segments. Our solutions deliver enterprise-grade acoustics and exceptional HD voice quality, while featuring the industry’s lowest power consumption.

We offer reference designs for the following applications:• Low to high-end IP Phones• Video Phones• Conferencing phone• IP doorphones and Intercoms• ATAs

Internet of Things applications (IoT)

Based on best-in-class ULE technology, our IoT solutions offer low cost of ownership together with market-leading performance. Utilized in a wide variety of sensors, ULE is an ideal wireless technology for variety of IoT applications including security, safety, smart home, industrial and healthcare connected via consumer premise equipment (CPE) such as home gateways and over the top boxes (OTT’s). Combination of ULE with Voice and Video capabilities places DECT/ULE in the unique position in IoT world, supporting also variety of VUI use cases.

Our solutions include reference designs for the following applications:

ULE reference design and startup kits, including SDK and EVM for:• Nodes / Devices• Gateways and OTTs

Home Gateways, CAT-iq and FMC

DSP Group’s DCX DECT/CAT-iq/ULE SoC solution for home gateways and fixed-mobile convergence (FMC) provides advanced DECT cordless capabilities including HD voice quality, multi call, multi-line, and ULE functionality. Our DCX solutions support multiple lines and handsets while complying with the CAT-iq 2.0, 2.1, 3.0 (SUOTA) and ULE standards.

Our solutions include reference designs for the following applications:• DECT cordless phones• DECT/CAT-iq/ULE Gateways, OTT and FMC

Cordless

Leading the cordless phone market with over 70% market share, DSP Group continues to offer cost-effective, fully-featured and comprehensive solutions - delivering unrivaled range, unmatched listening experience and robust processing power, while enabling rich GUI functionality. For entry-level to high-end applications, our products feature the industry’s smallest footprint, the highest level of integration, and the lowest power consumption.

Our solutions include reference designs for the following applications:• HD Voice CAT-iq reference design with advanced GUI• HD Voice CAT-iq / ULE reference for Home Gateways and OTTs• Wireless audio and cordless headset• PSTN cordless phone• Video Monitoring over DECT

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PRODUCTSPRODUCTS

PRODUCTSTargeting home, enterprise, and mobile markets, DSP Group’s comprehensive chipset portfolio reduces development risk costs, and shortens time to market. ODMs and service providers use our system-on-chips (SoCs), hardware reference packages (HDKs) and software development packages (SDKs) to rapidly and cost-effectively develop cutting- edge consumer electronics and business products.

CHIPSET PRODUCT FAMILIES

Home Enterprise Mobile

Cordless Gateways IoTVoice & Video Over IPV2oIP)

HDClear

DCX (ARM9)DECT BB, DECT RFVoice AFE, PMU

DCX (ARM9)DECT BB, DECT RFPMU

DHX91 (ARM9)DECT ULE BB, DECT ULE RFVoice AFE, PMU

DVF99 (2xARM9)VoIP DSP, Voice AFE,Security HW, 2D GPUPMU,Opt: DECT BB

DBMD2 (DSP)Noise CancellationAECVoice TriggerVoice AuthenticationVoice CommandSensor Hub

DCE (DSP)DECT BBVoice AFE, PMU

RF19 DECT RFRF24 2.4DECT RF

DVF99 (2xARM9)DECT ULE BB,DECT ULE RFVoIP DSP, Voice AFE, PMU

DVF101 (A9+ARM9)VoIP DSP, Voice AFE,Security HW, 3\2D GPU PMU,Opt: DECT BB

DBMD4 (DSP) Beam FormingNoise CancellationAEC Voice TriggerVoice AuthenticationVoice CommandSensor Hub

DCX (ARM9)DECT ULE BB,DECT ULE RFVoice AFE, PMU

DVF1100 (2xA9)Video ENC/DEC, 4xGPU, Security HW, FHD Display pipe, HDMI IN&OUT, USB3.0, PCIe

DBMD5 (Dual-core DSP)Beam FormingNoise CancellationAEC Voice TriggerVoice AuthenticationVoice CommandSensor Hub

VOICE ENHANCEMENT AND ALWAYS-ON – HDClear FAMILY DSP Group’s HDClear family of SoCs offers enhanced voice enhancement, voice activation and sensor hub functionality, enabling ultra-low power, always-on capabilities in smartphones, wearable devices and other mobile devices.

HDClear chipsets dramatically suppress background noise for far-end users, enhance privacy for near-end speakers, and maximize performance of Automatic Speech Recognition (ASR) engines.

The DBMD4 chip is DSP Group’s most advanced solution for voice communications. It supports a rich set of voice processing features to significantly enhance voice call quality, intelligibility and speech recognition accuracy, including:

• Noise suppression for the far-end listener• Noise reduction and speech conditioning for the near-end listener• Acoustic Echo Cancellation (AEC)• Flexispeech – variable speech playback for the hearing impaired• Flexible Listening Experience (FLE) – automatic adjustment of incoming voice when the near-end listener is in a noisy environment• Ultra-low power voice activation and voice command• Sensor hub functions

DBMD2 DBMD4 DBMD5

Function

Far-end noise cancellation Enhanced 2nd generation ✓

Near-end noise reduction Enhanced 2nd generation ✓

Maximized ASR ✓ ✓ ✓

AEC ✓ ✓ ✓

FLE ✓ ✓ ✓

Speaker improvements and protection ✓ ✓ Optinal

Supported voice bandwidth NB, WB NB, WB, Super WB, Fullband NB, WB

Voice activation and voice commands ✓ ✓ ✓

Sensor-Hub ✓ ✓

Segment

Mobile phone ✓ ✓

BT headset ✓ ✓

Cordless headset/ handset ✓ ✓

Wired headset ✓ ✓

Tablets ✓ ✓ ✓

Wearable devices ✓ ✓

Smart speakers ✓ ✓ ✓

DSP

Processor DSP 32 bits DSP 32 bits Dual DSP 32 bits

Program memory RAM RAM RAM

I/O

GPIO 13 13 ✓

UART ✓ ✓ ✓

PCM/ I2S 4 2 ✓

I2C ✓ ✓ ✓

SPI ✓ ✓ ✓

SLIMbus ✓ ✓

AFE

Audio In 4 Digital, ADC 3 Digital, ADC 7 Digital, 2-ADCs

Audio Out Digital Digital Digital

Package

Size 3 x 3 mm 2.1 x 1.8 mm 10 x 10 mm

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PRODUCTSPRODUCTS

ENTERPRISE VOICE – DVF FAMILY As the leading silicon vendor for enterprise voice, DSP Group offers the DVF chipset family. Our DVF SoCs family is a comprehensive solution for developing affordable, scalable and green V2oIP home and office products. DVF enables development of low-power enterprise IP Phones, Video Phones, analog terminal adapters (ATAs) and home IP terminals that offer superb acoustic echo cancellation, high-quality HD voice, multi-line capabilities, and an enhanced user interface (UI). Built on an open platform with ARM processors running on Linux OS, DVF includes IPfonePro™, an extensive SDK for IP phones and ATAs.

DVF9xxx provides outstanding cost/performance value for low to mid-end IP phones. Designed especially to meet Tier 1 requirements, DVF99 fully complements existing DSP Group solutions.

DVF101x is a two cores (Cortex-A9+ARM926 co-processor) processor, provides outstanding performance for High-end Voice centric IP phones. Designed especially to meet Tier 1 requirements, DVF101 fully complements existing DSP Group solutions, including DVF9xx VoIP processors for mid- and low-range applications

DVF1100 is a dual-core System on a Chip (SoC) for Video and Voice over IP (V2oIP) solutions. It provides an ideal solution for high-end voice and video conferencing terminals with rich GUI, HD Video streaming and other multimedia content targeting media IP phones. It implements a high-performance, dual-core architecture with advanced memory support, while reducing power consumption and supporting green features. DVF1100 integrates high-quality HD video engines, hardware-based security and advanced graphics.

DVF9x FamilyProduct Ultra-Low-End IP-Phone Low-End IP-Phone Mid-End IP-Phone High-End IP-Phone

DSPG SoC DVF97 DVF9918 DVF9929 DVF9919

APPL1$

ARM926@250MHz32KB I$, 32KB D$

ARM926@400MHz32KB I$, 32KB D$

ARM926@500MHz32KB I$, 32KB D$

ARM926@600MHz32KB I$, 32KB D$

L2$ None None None None

CSSL1$TCM

ARM926@250MHz16KB I$, 16KB D$224KB I, 64KB D

ARM926@400MHz16KB I$, 16KB D$272KB I, 128KB D

ARM926@460MHz16KB I$, 16KB D$272KB I, 128KB D

ARM926@500MHz16KB I$, 16KB D$ 272KB I, 128KB D

DRAMSDRAM

16bit @ 125MHzSDRAM

16bit @ 133MHzDDR3 / DDR2 / mDDR

16bit @ 375MHzDDR3 / DDR2 / mDDR

16bit @ 375MHz

Flash QSPI NAND, QSPI NAND, QSPI NAND, QSPI

Internal BUS AHB AHB AHB AHB

GPU None None None GC200 2D

LCDCB&W

(SPI only)Monochrome

(CPU I/F or SPI)Up to WQVGA

(CPU I/F)WVGA @ 60Hz(24-bit RGB)

Video - - -Capable of QVGA 30fps/

VGA 20fps H.264 DEC by SW (<200MHz/<400MHz)

Ethernet I/FRMII

GMACMII/RMII/RGMII GMAC

MII/RMII/RGMIIGMAC

MII/RMII/RGMIIGMAC

USB - FS USB 2.0 HS USB 2.0 FS+HS USB 2.0

WiFi I/F - SDIO 2.0 SDIO 2.0 SDIO 2.0

PackageDR-QFN 164-pin 12x12mm2

0.5mm pitchTFBGA 225-ball

2.5x12.5mm2 0.8mm pitchTFBGA 361-ball 16x16mm2

0.8mm pitchTFBGA 361-ball 16x16mm2

0.8mm pitch

DVF1xxx Family

Product Voice Featured IP-Phone High-End Voice Featured IP-Phone Video Phone

DSPG SoC DVF1018 DVF1019 DVF1100

APPL1$

Cortex-A9@1.0GHz32KB I$, 32KB D$

Cortex-A9@1.2GHz32KB I$, 32KB D$

Dual Cortex-A9@1.5GHz32KB I$, 32KB D$

L2$ 256KB 256KB 1MB

CSSL1$TCM

ARM926@500MHz32KB I$, 32KB D$ 272KB I, 128KB D

ARM926@600MHz32KB I$, 32KB D$ 272KB I, 128KB D

Utilizing 2nd Cortex-A9for frame based processing

DRAM DDR3/3L 16bit @533MHzDDR3/3L 16bit @533MHz(DDR3 @667MHz – TBD)

DDR3 16/32bit @933MHz

Flash NAND / eMMC NAND / eMMC NAND + eMMC

Internal BUS AXI AXI AXI

GPUMALI-300 SP

2D/3D (w/ OpenGL ES) @366MHzMALI-300 SP

2D/3D (w/ OpenGL ES) @440MHzMALI-400 4MP

2D/3D (w/ OpenGL ES)

LCDC720p @ 60 Hz

DPI & MIPI/DSI 4L720p/1080p @ 60 Hz

DPI & MIPI/DSI 4L1080p @ 60 HzDPI & HDMI-OUT

Video Capable of 720p/VGA30 H.264 DEC by SW1080p60 H.264 ENC+DEC &

H.265 DEC, VP8, etc.

Camera I/F USB USB USB, HDMI-IN

Ethernet I/F MII/RMII/RGMII GMAC MII/RMII/RGMII GMAC RMII/RGMII GMAC

USB 2x HS USB 2.0 2x HS USB 2.0 2x HS USB 2.0, 1x USB 3.0

WiFi I/F SDIO 3.0 SDIO 3.0 SDIO 3.0, PCIe G2

Analog Front-EndDVFA101 with 2x ADC/DAC + 2W Class D

PA for 4x MIC IN & 4x SPK OUTDVFA101 with 2x ADC/DAC + 2W Class D

PA for 4x MIC IN & 4x SPK OUTExternal PCM/I2S Codecs

Package TFBGA 409-ball 19x19mm2 0.8mm pitch TFBGA 409-ball 19x19mm2 0.8mm pitchFCBGA 700-ball 25mm x 25mm 1.0/0.8

pitch

Process 40nm 40nm 28nm

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PRODUCTSPRODUCTS

IoT – ULE (ULTRA LOW ENERGY) FAMILYDSP Group is leading the ULE revolution to meet the growing demand in the Home Area Network (HAN) market for efficient low-power, wireless IoT solutions.

An extension of DECT, the new ULE standard enables development of multi-year, battery-run HAN applications that enjoy all of the advantages of DECT, such as interference-free connectivity, extended range, voice and video support and more. Leveraging its long-term technological and market leadership in DECT applications, DSP Group designed the architecture for ULE and is driving its adoption, together with the DECT Forum and the ULE Alliance.

DSP Group offers an advanced ULE family of chips, as well as a comprehensive ULE and HAN FUN (Transport and Application layer) protocol.

The DHX91 is a low-power chipset solution for home automation and security. Equipped with audio capabilities and a powerful ARM926™ processor, it implements hibernation features to deliver advanced ULE.The ULE base utilizes existing and proven cordless SoCs, functioning as a standalone ULE over the top box (DVF99) and embedded module for home gateways (DCX81).

Base Node

Function DVF99 DCX81 DHX91

Segment

ULE ✓ ✓ ✓

Radio Frequency

DECT (EUR) ✓ ✓ ✓

DECT 6.0 (US) ✓ ✓ ✓

K-DECT ✓ ✓ ✓

J-DECT ✓ ✓ ✓

Memory

Internal RAM ✓ ✓ ✓

External QSPI Flash ✓ ✓ ✓

Processing and Features

Processor 2 x ARM926 ARM926 ARM926

MIPS 2 x 400MHz 208MHz 208MHz

Cache I+D I+D I+D

Hardware Accelerators SecurityJPEG

ADPCMMLSE

JPEG ADPCM MLSE

Non-Blind Slot ✓ ✓

Hibernation ✓

Integration

RF PA ✓ ✓

RF Switches ✓ ✓

I /O

Keypad ✓ ✓

GPIO ✓ ✓

UART ✓ ✓

USB ✓ ✓

PCM/IOM/TDM ✓ ✓

I2S ✓ ✓

SPI ✓ ✓

PWM ✓ ✓

External Bus 8-bit

ULE I/O ✓

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DHAN-S MODULE FOR IOT ULE APPLICATIONSDSP Group’s DHAN-S module offers application developers a turn-key platform for Ultra Low Energy (ULE) applications, whether battery or AC-powered. Built around the company’s DHX91 chipset, DSP Group’s DHAN-S module is easily integrated into the smallest of Smart Home nodes.

The module can serve as a wireless connectivity channel for an application running on an external MCU or can act as a standalone solution using the DHX91’s internal ARM926® processor.

The complete platform includes everything an IoT designer needs – HW, SDK, API GUI and documentation – to bring competitive applications rapidly to market. Home automation, security, monitoring, metering and healthcare customers benefit not only from readily available applications but from DECT’s outstanding wireless range and ULE’s lowest power consumption.

Benefits:• In-Production ULE modules to Fast Time-To-Market and easy integration and implementation • Full SW stack, requiring no prior knowledge of the ULE or HAN-FUN standards.• Straightforward application reference design, HW and SW

DHAN-S Module Block Diagram:

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PRODUCTSPRODUCTS

DCE DCX

DE56/DCE58/9 + RF19Z/RF24

DCX79 DCX81 DCXD1 + DRF1912

Function Baseband + RF Single Chip Single Chip Baseband + RFAPU

Segment

Entry Level ✓ ✓ ✓

Mid-Range ✓ ✓

High-End ✓ ✓ ✓

Radio Frequency

DECT (EUR) RF19Z ✓ ✓ ✓

DECT 6.0 (US) RF19Z ✓ ✓ ✓

K-DECT RF19Z ✓ ✓ ✓

J-DECT RF19Z ✓ ✓ ✓

2.4 GHz RF24

Memory

External QSPI Flash ✓ ✓

External SRAM ✓

Internal RAM ✓ ✓ ✓ ✓

Internal Flash

ROM ✓ ✓

Processing and Features

Processor TeakLite ARM968 ARM926 ARM926

MIPS 74-110 MHz 124MHz 208MHz 208MHz

Cache I+D I+D

Hardware Accelerators ADPCMADPCMMLSE

JPEGDMA

ADPCMMLSE

JPEGDMA

ADPCM MLSE

Non-Blind Slot ✓ ✓ ✓

Integration

RF PA ✓ ✓ ✓ ✓

RF Switches ✓ ✓ ✓

Embedded LCD Controller14-SegmentDot Matrix

I /O

Keypad ✓ ✓ ✓ ✓

GPIO ✓ ✓ ✓ ✓

UART ✓ ✓ ✓ ✓

USB ✓ ✓ ✓

PCM/IOM/TDM ✓ ✓ ✓ ✓

I2S ✓ ✓

SPI ✓ ✓ ✓ ✓

PWM ✓ ✓ ✓ ✓

External Bus 8-bit 16-bit

HD-VOICE & ULE- ENABLED HOME GATWAY (HGW)DSP Group’s DCX81 SoC for HGW and FMC provide advanced DECT cordless capabilities including HD voice, multi-line, multi-handset and ULE support, while integrating the most advanced CAT-iq 2.0, 2.1, 3.0 (SUOTA) stack.

The DCX81 is a low-power flash-based SoCs based on an open powerful ARM9™ core processor with unsurpassed range, capable of advanced HD voice processing for multi-line, multi-call applications together with support of ULE standard for home automation applications.

DCX81

Function Single Chip

Standards

ULE ✓

DECT ✓

Radio Frequency

DECT (EUR) ✓

DECT 6.0 (US) ✓

K-DECT ✓

J-DECT ✓

Memory

External QSPI Flash ✓

Internal RAM ✓

Processing and Features

Processor ARM926

MIPS 208 MHz

Cache I+D

Non-Blind Slot ✓

Integration

RF PA ✓

RF Switches ✓

I/O

Keypad ✓

GPIO ✓

UART ✓

USB ✓

PCM/IOM/TDM ✓

SPI ✓

DECT CORDLESS – DCE AND DCX FAMILIESA market leader in DECT and next-generation CAT-iq cordless technology, DSP Group offers a wide range of cost-effective, highly-integrated SoC solutions. Delivering high-quality audio with notably low power consumption, our field-proven chipset solutions are ideal for totally integrated digital cordless telephony, home automation and security, and DECT-enabled gateways.

DSP Group’s cordless chipset solutions are available in two chipset families:

• The DCE family is a highly integrated, low-power ROM-based chipset solution, delivering enhanced audio and extended range for entry-level applications.

• The DCX SoC family is a low-power, Flash and ROM-based chipset solution targeting mid-to-high-range cordless applications. The cost-effective DCX is based on an open powerful ARM9™ core platform capable of advanced HD voice processing for multi-line and multi-call use cases as well as support for large LCDs and video applications.

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CUSTOMERSTECHNOLOGIES

TECHNOLOGIESDSP Group offers a broad portfolio of integrated technologies for diverse voice, audio, data and multimedia applications maintaining extensive expertise and a leading position in DECT/DECT6.0/JDECT, CAT-iq 1.0/2.0/2.1/3.0 (SOUTA), 2.4GHz, PSTN, and VoIP. We also leverage 25 years of audio processing experience to an array of new technologies that are shaping converged communications at home, in the office and in mobile devices. These advanced technologies include a revolutionary HDClear algorithm for the mobile applications, Ultra Low Energy (ULE) and VoIP.

Voice and AudioProviding the wireless industry’s most advanced chipset solutions, DSP Group offers innovative voice/audio technologies and advanced algorithms that extend the effective range of clear voice communications for CAT-iq and worldwide DECT - without increasing power and emission levels. In addition, we implement noise-reduction, acoustic echo cancellation and voice-enhancement algorithms that improve voice intelligibility and provide better user experience.

ULE (Ultra Low Energy)DSP Group is spearheading development of ULE for home area network (HAN) applications, including home automation, security and safety, energy management, climate control and healthcare. Leading design of the ULE architecture, we are driving ULE’s adoption by ETSI, DECT Forum, and the ULE Alliance.

DSP Group is one of the founding companies of the ULE Alliance, continues to be a promoter member, holding a position on the board and chairing the Technical Working Group.

Voice Intelligibility and Noise ReductionHDClear™ technology eliminates the traditional tradeoff between voice intelligibility and noise reduction. It delivers measurably higher and more consistent voice quality and intelligibility to mobile users, even in noisy surroundings. HDClear low power and small footprint enable easy integration in mobile and wearable devices.

HDClear technology extends voice data acquisition from multi microphones. After the combined input is processed, our Vocal algorithm is applied to the acquired data to enable diverse voice processing tasks such as: echo and background noise cancellation, maximized effectiveness of automatic speech recognition (ASR) engines, loudness equalization, and general voice enhancement.

Cordless TelephonyThe world leader in cordless telephony for over two decades, DSP Group promotes both traditional and next-generation cordless technologies. The company is an active member of the DECT Forum, holding a position on the board and chairing a number of key working groups (WGs), including WG USA, WG Marketing and WG Japan. . This involvement is complemented by our active participation in other relevant Forum working groups, as well as in the ETSI Technical Committee for DECT (TC DECT).

CAT-iqDSP Group has been deeply involved in all stages of defining CAT-iq since its inception, including participating in the DECT Forum and defining ETSI DECT NG specifications. DSP Group is also supports CableLabs’ specification activities.

VoIPDSP Group is recognized for its worldwide leadership in VoIP, maintaining the fastest growing market share in this domain and offering the advantage of seamless scalability to DECT. DSP Group provides best-in-class audio quality and cost-effective solutions for low-to-mid-range VoIP applications, which can be seamlessly extended to high-end applications.

Radio Frequency (RF)DSP Group is a leading provider of RF chips, covering all RF bands used in cordless and wireless applications. These bands include 1.7 GHz-1.9 GHz (DECT for the EU, US, LATAM Japan-DECT and Korea), 2.4 GHz (EDCT/WDCT and FHSS DECT), 5.8 GHz (EDCT/WDCT), and Wi-Fi (2.4 GHz and 5 GHz). Designed with CMOS technology, DSP Group’s new generation of chips incorporates all required RF functionality on a single chip, including RF transceiver, LNA, PA and channel filters.

CUSTOMER ADVANTAGES AND BENEFITS

Advantages Benefits

Reflecting DSP Group’s two decades of leadership in wireless semiconductor development, our offering features a number of advantages for CE manufacturers and OEMs:

• Comprehensive product portfolio of complete reference designs of HW, SW and System

• Mature, field-proven chipset solutions • Highly integrated SoCs• Operational excellence anoutstanding customer

support• Broad international standards compliance

and support• Green, low-power offering

DSP Group’s chipset solutions offer CE manufacturers and OEMs a range of benefits to help them better compete in today’s rapidly-evolving residential communications market:

• Low development effort, risk and cost• Fast time to market• Small design footprint • Easy customization and integration of features• Supply reliability• Innovative revenue-generating applications• Expanded market opportunities

CustomersDSP Group is a customer-centric company that proactively partners with our consumer electronics (CE) manufacturer customer base. We also team with service providers who are focused on bringing innovative residential and enterprise converged communications solutions to market. Based on a deep understanding of market needs, we encourage customer involvement in our roadmap development, and offer customers access to our internal R&D resources. A reliable long-term industry supplier, DSP Group maintains a proven track record of operational excellence and successful delivery. With office across Asia, Europe and North America, we provide our customers with outstanding local service and support worldwide.

DSP Group®, Inc. (NASDAQ: DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics

(CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio

of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers

to shape the future of converged communications at home, office and on the go.

For more information, visit www.dspg.com.

Copyright © 2014, DSP Group, Inc. All rights reserved. DSP Group, Inc. and DSP Group Logo are trademarks of DSP Group, Inc. Other third party trademarks are property of their respective owners. All product information, dates and figures are not warranted as accurate or complete, and may be revised based on further information without notice.

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