Complex System Design Cycle, Analysis and Test...

ComplexSystemDesignCycle,AnalysisandTest,FabricationPackageDr.KathrynWingateME4182

Overview•  ComplexSystemDesignCycle

•  AnalysisandTest

•  FabricaConPackage

LearningObjectives•  UnderstandwhyanalysisandtestiscriCcal

•  Whattoanalyze/test

•  Developconcreteanalysisandtestplans

•  Presentanalysisandtestresults

•  WhattoincludeinfabricaConpackages

TheLRS-BwillprovideoperaConalflexibilityacrossawiderangeofmilitaryoperaCons.

Boeing/LockheedMarCnConceptImage

NorthropGrummanConceptImage

LongRangeStrikeBomber

PreliminaryDesignReview

DefenseSystemAcquisitionFramework

UserNeeds:

•  CarryXXtonspayload

•  XXmilerangewithoutrefueling

•  CompaCblewithairtoairrefueling

•  Stealth

EngineeringRequirements:•  CarryXXtonsofpayload

•  CarryXXtonsoffuel

•  WinggenerateXXlbfliX

•  TotalweightofaircraX(tons)

•  Totalpower

LongRangeBomber

Structure Engines Power PayloadDeployment Comm Electronic

Warfare

-  Weight-  Power-  LiX-  Stealth-  Thermal-  Environmental-  Volume

FlightControls Avionics HydraulicThermal/

Cooling


MarketResearchProblemUnderstanding

IdeaCon

TradeStudiesSystemOpCmizaCon

EngineeringRequirementsSpecificaConSheets

Proposal:PreliminaryDesign

CongressionalLobbying

ConceptReFinement

Analysis:DemonstrateDesignFuncConality


ProposalAwarded

RequirementCreep.


TechnologyDevelopment:PreliminaryDesignReview

EngineeringRequirements/SpecificaConSheet

DetailedPreliminaryDesign

TesCng:qualificaConofnewmaterialsanddesigns

PreliminaryAnalysis


SystemDevelopment&DemonstrationCriticalDesignReview

EngineeringRequirements/SpecificaConSheet

DetailedFinalDesign TesCng:AcceleratedLife,

Qual

Analysis

ProducConTestBuild

Whydowegothroughthispriortoproduction?

Design<->Cost

•  FailuresinproducCon->majorcost.

F-22:67billion

37.6BillionSunkcost

30BillionFlyawaycost

SystemDevelopmentandDemonstration:ManufacturingReadinessReview


ManufacturingProcessFlowand

Plans

PreProducConRunData

Schedule

ProductionandDeployment:


SystemIntegraCon

Sub-systemProducCon Test Deliver

DesignCycle:Capstone

DevelopCustomer/Stakeholder

Needs

DevelopEngineeringRequirements

ValidateEngineeringRequirements

DesigntoEngineeringRequirements

•  Stakeholderanalysis

•  Marketresearch•  HouseofQuality

•  HouseofQuality

•  Specsheet•  RegulaCons•  Analysis

•  IdeaCon•  FuncContree&

Morphcharts•  Tradestudies•  IndustrialDesign•  HumanFactors•  CAD/Modeling•  Mockups•  Analysis

•  Analysis•  Test•  Inspect•  Prototype

ProducCon

AnalysisandteststartsearlyandconCnuesthroughproducCon.

AnalysisandTesCng

Lifeasananalyst•  hhps://www.youtube.com/watch?v=BKorP55Aqvg

Whydowedoanalysis?

Whydowedoanalysis?•  SelecCon:Analysiscanimprovedesign!•  Wallthickness•  FastenerselecCon•  Numberoffasteners•  WeightreducCon•  MaterialselecCon•  Structuralgeometry•  ComponentselecCon•  Geartraindesign

Dr.JulianRimolihhp://www.magicalrobot.org/BeingHuman/2016/01/related-projects-by-collaborators

Whydowedoanalysis?•  ValidaCon:Analysisdemonstratesdesignmeetsengineeringrequirements!•  Life•  Load•  Weight•  Geometry•  Gain/Phase•  Power•  Thermal

TypesofAnalysis

Analysis

Structural

Dynamics

Thermal/Fluids

MaterialsControls

SystemOpCmizaCon

Power/Energy

GD&T

DFMA

Youlearnedanalysisin….

•  ME1770•  MSE2001•  ME2016•  ME2202•  C0E3001•  ME3322

…Now,howdoyoudecidewhattoanalyze?

•  ME3340•  ME3017•  ME3345•  ME3210•  ME3180•  ME4315

WhattoAnalyze/Test•  Choosingrequirementstodesignto/validatewithanalysis:

•  SystemcriCcalrequirements•  DesignforfuncCon(operaConalloads)•  Designforfailure(limitloads)•  FailureModesandEffectsAnalysis(FMEA)

•  Life,load,andweight •  Chooseyourcomponents/dimensionsfromanalysis!

WhentoAnalyze•  Canbevalidatedbyanalysis

•  Doesyourteamhavethecapabilitytocompletethisanalysis?•  OutsourceanalysiswithtechnicalconsulCngfirms!

•  Willgoodresultsvalidatetheproblemwiththecorrectlevelofconfidence?

•  Timeefficient

•  Expensivetestsetup

•  NeedbothtesCngandanalysis•  FMEAindicateshighrisk(highprobabilityandseverity)•  hhp://www.youtube.com/watch?v=Ai2HmvAXcU0

DevelopinganAnalysisPlan•  Whatistherequirement?

•  Whatisyourfactorofsafety?•  Howwelldoyouknowthedesign/material(heritage?)•  HowconfidentareyouinthematerialproperCes?•  HowconfidentareyouintheanalysispredicCngthefailuremode?•  IsthisrequirementsystemcriCcal?

•  DesignforfuncCon:SimulatetheoperaCngenvironment!•  Whatareyourknowns?•  WhatassumpConsareyoumaking?

•  Pointload?•  Thermalenvironment?•  kf=isthereanythingspecialaboutthisenvironment?Corrosion?PlaCng?•  Constrained?BoundarycondiCons?

•  Designforfailure:worstcasescenario

•  Determineanalysisbasedoffof:•  Textbooks(Shigley’s,Roarks,CRChandbooks)•  Standards:ASME,MILSTD,ect.•  Literature(Googlescholar),Expertsinthefield

AnalysisExample:CubeSat

CommonAnalyses(Mechanical)•  GD&T:ToleranceStackUp(WorstCaseScenario)

•  StaCcLoading:VonMises:(bending,axial,torsion,shear)

•  FaCgue:(Goodman)

•  CoefficientofThermalExpansion:•  Geometry•  CTEmismatch

•  Fasteners:Preload,Shear

•  Components:life/load

•  GearTrains:torque,HP,gearraCos

•  Modelanalysis(VibraCon,naturalfrequency),Shock

WhentoTest•  Analysisisnotagoodpredictoroffailuremode•  FaCguefailures•  Shockfailures•  FracturepropagaCon•  Corrosion,environmentaltests•  hhps://www.youtube.com/watch?v=_jfXX7qppbc

•  Easiertotestthantorunanalysis•  TimeconsumingsimulaCon

•  Failuredependentonmanufacturingprocessormaterial•  Materiallotscreening•  Manufacturabilityscreening

•  NeedbothtesCngandanalysis•  FMEAindicateshighrisk(highprobabilityandseverity)

TestingClassS(SpaceFlight)MicroelectronicCircuit•  MILSTD883:•  Openelectricaltest•  -100x(highpower)visualinspecConofsemiconductorandpackage•  ThermalCycle(-65Cto165C)•  Centrifuge(30,000g)•  ParCcleImpactNoiseDetecCon(mini-vibraContest)•  GrossLeakTesCng•  FineLeakTesCng•  ExternalVisualInspecCon•  Electronic‘Burnin’test

•  DestrucCveTests:(Doneonsmallpercentofpackagesforqual)•  ResidualGasAnalysis *InternalvisualinspecCon•  DropTest *CrosssecCon•  Acceleratedlifetests *X-Ray

DevelopingaTestPlan•  Whatistherequirement?

•  WhatistheoperaCngcondiCon?•  Thermal?•  Mechanical?•  Geometry?•  Environmental?

•  Whattestsarealreadydonefortheserequirements/condiCons?•  MILHNDBKJ,ASTM,MILSTD883•  NIST

•  Whatarethepasscriteria?•  VisualinspecConat20x:novisualcrackingorfracture•  CTscan/X-ray:nointernalfracture•  Dyepenetrantcheckforfracture•  Yieldat>50ksi•  Electricalperformance

•  Whatisyourplanforeachpossibleoutcomeofthetest?

VascularGraft(Bypass)-  LiquidCght-  SutureretenCon:1.20±0.23N-  WithstandstaCcpressure:

200mmHg(systolic)

-  Withstanddiastolic/systoliccycleforpaCentlife:4.2X109repeCCons

-  Promotelaminarbloodflow

-  BiocompaCable

•  “Itdoesn’tmaherhowsmartyouareifyoucan’texplainyouranalysistotheprogrammanagerandthecustomer.”-ChiefEngineer,HamiltonSundstrand

Presenting/ReportingAnalysis•  Whatwastherequirementthatdrovethisanalysis?

•  Whatisthemodeoffailureyourconcernedabout?Whattypeofanalysisdidyoucomplete?•  Shearpullout?•  GoodmanfaCgue?

•  Whatarethekeyassump@onsintheanalysis?•  BoundarycondiCons?•  MaterialproperCes?•  Loading?•  Nodesandelements?

•  Howdoesyouranalysisshowthisrequirementhasbeenvalidated?•  Factorofsafety?•  Gainandphasemargin?

Just…No.FEA:ContactAnalysisofGasket

Analysis:CheckValveAssembly•  Withstandpressureloadingduetopreloadpersource:X114283-D002Rev.2

MaterialYieldStrength 35MaterialUl@mateStrentgth 42

Loaca@on Stress@860psiksi

LimitMarginofSafety

Loc#1 28.15 0.24Loc#2 22.85 0.53Loc#3 16.45 1.13

FEModelResults-VonMisesStressatLoc1DuetoPreload

LocaCon1-3marginofsafetyacceptableperprogramrequirements.

Presenting/ReportingTestResults•  Whatwastherequirementthatdrovethistest?•  SatellitemustwithstandthermalvariaConsinGEOorbitandlaunchof-65Cto

125C.

•  Whattypeoftestdidyoucomplete?Whatdocumenta@onorspecoutlinedtestrequirements?•  ThermalcyclingperMILSTD883method2050programclassK

•  Whatarethekeyvariablesinthetest?•  50cycleseachwith10minutesat-65Cand20minutesat120C

•  Howdoesyouranalysisshowthisrequirementhasbeenvalidated?•  VisualinspecConbeforeandaXertesttoensurenocracksordelaminaConin

electroniccircuitsperMILSTD883method2010programclassK•  ElectronicburnouttestbeforeandaXerthermalcyclingtoensureelectrical

performancemeetsprogramspecsperclassK

FabricationPackage•  FabricaConPackage–Drawings(asAppendixwithinreport).ThissecConshouldfocussolelyonthedetailsofthefabricaCon,assemblyof,andmanufactureofyourdesign,asifthissecCon,asastand-alonedocument,wouldbeprovidedtoamanufacturer.ItshouldNOTbeintroducingordescribingfuncCons,specificaCons,etc.•  Provideassemblyviewdrawing(s),explodedviews,etc.•  Providefullydimensionedworkingdrawingsforthecustompartsofyourdesign

•  ProvideadetailedBillorMaterialsand/orpartslist,includingvendors,partnumbersandprice

FabricationPackage:

FabricationPackage

TopMistakesNewGradsMake•  ChiefEngineersandDirectorsforHamiltonSundstrandUTC

•  TurninworkforgradinginsteadofcompleCon

•  PresentaConandreportclarity•  Itdoesn’tmaherhowsmartyouareifyoucannotexplainit

•  Workhard

•  StressAnalysts•  FBDiswrong•  UnderstandingthedifferencebetweenprincipalandeffecCvestresses•  BoundarycondiConsarewrong•  MaterialproperCesarenotfromthecorrectsource

Complex System Design Cycle, Analysis and Test...

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