COMPLEMENTARY MOSFET · 2019. 5. 5. · 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s)...

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HMC 4622 1 / 10 ©GUANGDONG HOTTECH INDUSTRIAL CO.,LTD E-mail:hkt@heketai.com FEATURES VDS=20V,ID=7.3A,RDS(ON)≤23mΩ@VGS=10V VDS=-20V,ID=-5A,RDS(ON)≤53mΩ@VGS=-4.5V Low gate charge and Ultra low on-resistance For low Input Voltage inverter applications Surface Mount device SOP-8 MECHANICAL DATA Case: SOP-8 Case Material: Molded Plastic. UL flammability Classification Rating: 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Weight: 0.3 grams (approximate) MAXIMUM RATINGS (TA = 25°C unless otherwise noted) N-CHANNEL ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Parameter Symbol Min Typ Max Unit Conditions Drain-Source breakdown voltage V(BR)DSS* 20 V VGS=0V, ID=250μA Zero gate voltage drain current IDSS* 1 μA VDS=16V, VGS=0V Gate-body leakage current I GSS * ±100 nA VDS=0V, VGS=±16V Gate-threshold voltage V GS(th) * 0.6 1.25 2 V VDS=VGS, ID=250μA On-State Drain Current I D(ON) 35 A V DS =5V, VGS=4.5V Drain-source on-resistance R DS(ON) * 19 23 mΩ VGS=10V, ID=7.3A 28 33.6 mΩ VGS=10V, ID=7.3A,TJ = 125°C 24 30 mΩ VGS=4.5V, ID=6.4A 67 84 mΩ VGS=2.5V, ID=2A Forward transconductance g FS 17 S VDS=5V, ID=7.3A Diode forward voltage V SD 0.7 1 V IS=1A, VGS=0V Diode forward current IS 3 A Input capacitance Ciss 900 1100 pF VDS=10V, VGS=0V, f=1MHz Output capacitance Coss 162 pF Reverse transfer capacitance Crss 105 pF Gate resistance Rg 0.9 1.35 Ω VDS=0V, VGS=0V, f=1MHz Total gate charge Qg 7.2 9 nC VGS=4.5V,VDS=10V,ID=6.5A Total gate charge 15 18 nC VGS=10V,VDS=10V,ID=6.5A Gate-source charge Qgs 1.8 nC Gate-drain charge Qgd 2.8 nC Turn-on delay time td(on) 4.5 nS VGS=10V, VDS=10V, RGEN=3Ω,RL=1.4Ω Turn-on rise time tr 9.2 nS Turn-off delay time td(off) 18.7 nS Turn-off fall time tf 3.3 nS Body Diode Reverse Recovery Time trr 18 nS IF=7.3A, dI/dt=100A/μs Body Diode Reverse Recovery Charge Qrr 9.5 nC IF=7.3A, dI/dt=100A/μs *Pulse test ; Pulse width ≤300µs, Duty cycle ≤ 0.5% . Parameter Symbol Max N-channel Max P-channel Unit Drain-source voltage VDS 20 -30 V Gate-source voltage V GS ±16 ±12 V Continuous drain current TA = 25°C I D 7.3 -5 A TA = 70°C 6.2 -4.2 A Pulsed drain current IDM 35 -25 A Avalanche current I AS, I AR 13 13 A Avalanche energy L=0.1mH E AS, E AR 25 25 mJ Power dissipation TA = 25°C PD 2 2 W TA = 70°C 1.44 1.44 W Thermal resistance from Junction to ambient RθJA 110 °C/W Thermal resistance from Junction to Lead RθJL 40 °C/W Junction temperature T J 150 °C Storage temperature T STG -55 ~+150 °C COMPLEMENTARY MOSFET

Transcript of COMPLEMENTARY MOSFET · 2019. 5. 5. · 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s)...

  • HMC4622

    1 / 10©GUANGDONGHOTTECH INDUSTRIALCO.,LTD E-mail:[email protected]

    FEATURES VDS=20V,ID=7.3A,RDS(ON)≤23mΩ@VGS=10V VDS=-20V,ID=-5A,RDS(ON)≤53mΩ@VGS=-4.5V Low gate charge and Ultra low on-resistance For low Input Voltage inverter applications Surface Mount device SOP-8MECHANICAL DATA Case: SOP-8 Case Material: Molded Plastic. UL flammability Classification Rating: 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Weight: 0.3 grams (approximate)MAXIMUM RATINGS (TA = 25°C unless otherwise noted)

    N-CHANNEL ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)Parameter Symbol Min Typ Max Unit Conditions

    Drain-Source breakdown voltage V(BR)DSS* 20 V VGS=0V, ID=250μAZero gate voltage drain current IDSS* 1 μA VDS=16V, VGS=0VGate-body leakage current IGSS* ±100 nA VDS=0V, VGS=±16VGate-threshold voltage VGS(th)* 0.6 1.25 2 V VDS=VGS, ID=250μAOn-State Drain Current ID(ON) 35 A VDS=5V, VGS=4.5V

    Drain-source on-resistance RDS(ON)*19 23 mΩ VGS=10V, ID=7.3A28 33.6 mΩ VGS=10V, ID=7.3A,TJ = 125°C24 30 mΩ VGS=4.5V, ID=6.4A67 84 mΩ VGS=2.5V, ID=2A

    Forward transconductance gFS 17 S VDS=5V, ID=7.3ADiode forward voltage VSD 0.7 1 V IS=1A, VGS=0VDiode forward current IS 3 AInput capacitance Ciss 900 1100 pF

    VDS=10V, VGS=0V, f=1MHzOutput capacitance Coss 162 pFReverse transfer capacitance Crss 105 pFGate resistance Rg 0.9 1.35 Ω VDS=0V, VGS=0V, f=1MHzTotal gate charge Qg 7.2 9 nC VGS=4.5V,VDS=10V,ID=6.5ATotal gate charge 15 18 nC

    VGS=10V,VDS=10V,ID=6.5AGate-source charge Qgs 1.8 nCGate-drain charge Qgd 2.8 nCTurn-on delay time td(on) 4.5 nS

    VGS=10V, VDS=10V,RGEN=3Ω,RL=1.4Ω

    Turn-on rise time tr 9.2 nSTurn-off delay time td(off) 18.7 nSTurn-off fall time tf 3.3 nSBody Diode Reverse Recovery Time trr 18 nS IF=7.3A, dI/dt=100A/μsBody Diode Reverse Recovery Charge Qrr 9.5 nC IF=7.3A, dI/dt=100A/μs

    *Pulse test ; Pulse width ≤300µs, Duty cycle ≤ 0.5% .

    Parameter Symbol Max N-channel Max P-channel UnitDrain-source voltage VDS 20 -30 VGate-source voltage VGS ±16 ±12 VContinuous drain current TA = 25°C ID 7.3 -5 ATA = 70°C 6.2 -4.2 APulsed drain current IDM 35 -25 AAvalanche current IAS,IAR 13 13 AAvalanche energy L=0.1mH EAS,EAR 25 25 mJPower dissipation TA = 25°C PD 2 2 WTA = 70°C 1.44 1.44 WThermal resistance from Junction to ambient RθJA 110 °C/WThermal resistance from Junction to Lead RθJL 40 °C/WJunction temperature TJ 150 °CStorage temperature TSTG -55 ~+150 °C

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    N-CHANNEL TYPICAL ELECTRICAL AND THERMAL CHARACTERI STICS

    1.4

    494 593692 830

    19318

    59142

    0

    5

    10

    15

    20

    25

    30

    1 2 3 4 5VGS(Volts)

    Figure 2: Transfer Characteristics

    I D(A

    )

    0

    10

    20

    30

    40

    50

    60

    70

    80

    90

    100

    0 5 10 15 20 25 30

    ID (A)Figure 3: On-Resistance vs. Drain Current and

    Gate Voltage

    RD

    S(O

    N) (

    mΩΩ ΩΩ

    )

    1.E-05

    1.E-04

    1.E-03

    1.E-02

    1.E-01

    1.E+00

    1.E+01

    1.E+02

    0.0 0.2 0.4 0.6 0.8 1.0 1.2

    VSD (Volts)Figure 6: Body-Diode Characteristics

    I S (

    A)

    25°C

    125°C

    -40°C

    0.60

    0.80

    1.00

    1.20

    1.40

    1.60

    -50 -25 0 25 50 75 100 125 150 175

    Temperature (°C)Figure 4: On-Resistance vs. Junction

    Temperature

    Nor

    mal

    ized

    On-

    Res

    ista

    nce

    VGS=10V, 7.3A

    VGS=4.5V, 6.4A

    VGS=2.5V, 5.5A

    10

    15

    20

    25

    30

    35

    40

    3 4 5 6 7 8 9 10

    VGS (Volts)Figure 5: On-Resistance vs. Gate-Source Voltage

    RD

    S(O

    N) (

    mΩΩ ΩΩ

    )

    25°C

    125°CVDS=5V

    VGS=10V

    ID=7.3A

    25°C

    125°C

    0

    10

    20

    30

    40

    50

    60

    0 1 2 3 4 5

    VDS (Volts)Figure 1: On-Region Characteristics

    I D (

    A)

    VGS=3V

    4.5V10V 6V

    3.5V

    VGS=4.5V

    -40°C

    VGS=2.5V

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    N-Channel TYPICAL ELECTRICAL AND THERMAL CHARACTERI STICS

    1.4

    494 593692 830

    19318

    0

    2

    4

    6

    8

    10

    0 3 6 9 12 15Qg (nC)Figure 7: Gate-Charge Characteristics

    VG

    S (

    Vol

    ts)

    0

    200

    400

    600

    800

    1000

    1200

    1400

    0 5 10 15 20VDS (Volts)Figure 8: Capacitance Characteristics

    Cap

    acita

    nce

    (pF

    )

    Ciss

    Coss

    Crss

    VDS=10VID=7.3A

    0

    10

    20

    30

    40

    50

    0.0001 0.001 0.01 0.1 1 10 100Pulse Width (s)

    Figure 10: Single Pulse Power Rating Junction-to-Ambient (Note E)

    Pow

    er (

    W)

    TJ(Max)=150°CTA=25°C

    0.0

    0.1

    1.0

    10.0

    100.0

    0.1 1 10 100VDS (Volts)

    I D (

    Am

    ps)

    Figure 9: Maximum Forward Biased SafeOperating Area (Note E)

    10µs

    1ms

    0.1s

    DC

    RDS(ON)limited

    TJ(Max)=150°CTA=25°C

    100µ

    0.01

    0.1

    1

    10

    0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000

    Pulse Width (s)Figure 11: Normalized Maximum Transient Thermal Imp edance

    Zθθ θθJ

    A N

    orm

    aliz

    ed T

    rans

    ient

    The

    rmal

    Res

    ista

    nce

    Single Pulse

    D=Ton/T

    TJ,PK=TA+PDM.ZθJA.RθJARθJA=62.5°C/W

    TonT

    PD

    In descending orderD=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse

    1

    10s

    10ms

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    -

    +VDC

    Ig

    Vds

    DUT

    -

    +VDC

    Vgs

    Vgs

    10V

    Qg

    Qgs Qgd

    Charge

    Gate Charge Test Circuit & Waveform

    Ig

    Vgs

    -

    +VD C

    DUT

    L

    Vgs

    Vds

    IsdIsd

    Diode Recovery Test C ircuit & W aveforms

    Vds -

    Vds +

    I FdI/dt

    I RM

    rr

    VddVdd

    Q = - Idt

    t rr

    -

    +VD C

    DUT VddVgs

    Vds

    Vgs

    RL

    Rg

    Vgs

    Vds

    10%

    90%

    Resistive Switching Test C ircuit & W aveform s

    t t rd(on)

    ton

    td(o ff) t f

    toff

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    P-CHANNEL ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)Parameter Symbol Min Typ Max Unit Conditions

    Drain-Source breakdown voltage V(BR)DSS* -20 V VGS=0V, ID=-250μAZero gate voltage drain current IDSS* -1 μA VDS=-16V, VGS=0VGate-body leakage current IGSS* ±100 nA VDS=0V, VGS=±12VGate-threshold voltage VGS(th)* -1.3 -0.9 -0.5 V VDS=VGS, ID=-250μAOn-State Drain Current ID(ON)* -25 A VDS=-5V, VGS=-4.5V

    Drain-source on-resistance RDS(ON)*44 53 mΩ VGS=-4.5V, ID=-5A59 71 mΩ VGS=-4.5V,ID=-5A, TJ=125°C67 87 mΩ VGS=-2.5V, ID=-4.2A

    Forward transconductance gFS 13 S VDS=-5V, ID=-5ADiode forward voltage VSD -0.76 -1 V IS=-1A, VGS=0VDiode forward current IS -2.5 AInput capacitance Ciss 800 960 pF

    VDS=-10V, VGS=0V, f=1MHzOutput capacitance Coss 131 pFReverse transfer capacitance Crss 103 pFGate resistance Rg 6.7 10 Ω VDS=0V, VGS=0V, f=1MHzTotal gate charge Qg 7.4 nC VGS=-4.5V,VDS=-4.5V,ID=-4.5ATotal gate charge 15.5 nC

    VGS=-4.5V,VDS=-10V,ID=-4.5AGate-source charge Qgs 1.3 nCGate-drain charge Qgd 2.9 nCTurn-on delay time td(on) 4.4 nS

    VGS=-4.5V, VDS=-10V,RGEN=3Ω,RL=2Ω

    Turn-on rise time tr 7.6 nSTurn-off delay time td(off) 44 nSTurn-off fall time tf 13.5 nSBody Diode Reverse Recovery Time trr 20 nS IF=-5A, dI/dt=100A/μsBody Diode Reverse Recovery Charge Qrr 9 nC IF=-5A, dI/dt=100A/μs

    *Pulse test ; Pulse width ≤300µs, Duty cycle ≤ 0.5% .

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    TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: P-C HANNEL

    0

    5

    10

    15

    20

    25

    0 1 2 3 4 5

    -VDS (Volts)Fig 1: On-Region Characteristics

    -ID (

    A)

    VGS=-2.5V

    -6V

    -3.5V

    -4.5V

    -10V

    0

    5

    10

    15

    20

    0.5 1.0 1.5 2.0 2.5 3.0

    -VGS(Volts)Figure 2: Transfer Characteristics

    -ID(A

    )

    30

    40

    50

    60

    70

    80

    0 5 10 15 20 25

    -ID (A)Figure 3: On-Resistance vs. Drain Current and

    Gate Voltage

    RD

    S(O

    N) (

    mΩΩ ΩΩ

    )

    1.0E-06

    1.0E-05

    1.0E-04

    1.0E-03

    1.0E-02

    1.0E-01

    1.0E+00

    1.0E+01

    1.0E+02

    0.0 0.2 0.4 0.6 0.8 1.0

    -VSD (Volts)Figure 6: Body-Diode Characteristics

    -IS (

    A)

    25°C

    125°C

    0.6

    0.8

    1

    1.2

    1.4

    1.6

    -50 -25 0 25 50 75 100 125 150

    Temperature (°C)Figure 4: On-Resistance vs. Junction

    Temperature

    Nor

    mal

    ized

    On-

    Res

    ista

    nce

    VGS=-4.5V

    VGS=-2.5V

    20

    40

    60

    80

    0 2 4 6 8 10

    -VGS (Volts)Figure 5: On-Resistance vs. Gate-Source Voltage

    RD

    S(O

    N) (

    mΩΩ ΩΩ

    )

    25°C

    125°C

    VDS=-5V

    VGS=-2.5V

    VGS=-4.5V

    ID=-5A

    25°C

    125°C

    ID=-5A

    -40°C

    ID=-4.2A

    -40°C

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    TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: P-C HANNEL

    0

    2

    4

    6

    8

    10

    0 4 8 12 16

    -Qg (nC)Figure 7: Gate-Charge Characteristics

    -VG

    S (

    Vol

    ts)

    0

    250

    500

    750

    1000

    1250

    0 5 10 15 20

    -VDS (Volts)Figure 8: Capacitance Characteristics

    Cap

    acita

    nce

    (pF

    )

    Ciss

    0

    10

    20

    30

    40

    50

    60

    0.0001 0.001 0.01 0.1 1 10 100 1000

    Pulse Width (s)Figure 10: Single Pulse Power Rating Junction-to-

    Ambient (Note E)

    Pow

    er (

    W)

    0.01

    0.1

    1

    10

    0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000Pulse Width (s)

    Figure 11: Normalized Maximum Transient Thermal Imp edance

    Zθθ θθJ

    A N

    orm

    aliz

    ed T

    rans

    ient

    The

    rmal

    Res

    ista

    nce

    Coss

    Crss

    VDS=-10VID=-5A

    Single Pulse

    D=Ton/T

    TJ,PK=TA+PDM.ZθJA.RθJARθJA=62.5°C/W

    TonT

    PD

    In descending orderD=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse

    TJ(Max)=150°CTA=25°C

    0

    0

    1

    10

    100

    0.1 1 10 100VDS (Volts)

    I D (

    Am

    ps)

    Figure 9: Maximum Forward Biased SafeOperating Area (Note E)

    10µs1ms

    0.1s

    DC

    RDS(ON)limited

    TJ(Max)=150°CTA=25°C

    100µ

    10s

    10ms

    1s

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    VDC

    Ig

    Vds

    DUT

    VDC

    Vgs

    Vgs

    Qg

    Qgs Qgd

    Charge

    Gate Charge Test Circuit & Waveform

    -

    +-

    +

    -10V

    Ig

    Vgs

    -

    +VDC

    DUT

    L

    Vgs

    Isd

    Diode Recovery Test Circuit & Waveforms

    Vds -

    Vds +

    dI/dt

    RM

    rr

    VddVdd

    Q = - Idt

    t rr-Isd

    -Vds

    F-I

    -I

    VDCDUT VddVgs

    Vds

    Vgs

    RL

    Rg

    Resistive Switching Test Circuit & Waveforms

    -

    +

    Vgs

    Vds

    t t

    t

    t t

    t

    90%

    10%

    r

    on

    d(off) f

    off

    d(on)

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    SOP-8 Package Outline Dimensions

    Symbol Dimensions In Millimeters Dimensions In InchesMin. Max. Min. Max.

    A 1.350 1.750 0.053 0.069A1 0.100 0.250 0.004 0.010A2 1.350 1.550 0.053 0.061b 0.330 0.510 0.013 0.020c 0.170 0.250 0.007 0.010D 4.800 5.000 0.189 0.197e 1.270(BSC) 0.050(BSC)E 5.800 6.200 0.228 0.244E1 3.800 4.000 0.150 0.157L 0.400 1.270 0.016 0.050θ 0° 8° 0° 8°

    SOP-8 Suggested Pad Layout

    Note:1.Controlling dimension: in millimeters

    2.General tolerance: ±0.05mm

    3.The pad layout is for reference purposes only

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    SOP-8 Tape and Reel

    SOP-8 Embossed Carrier Tape

    SOP-8 Tape Leader and Trailer

    SOP-8 Reel

    DIMENSIONS ARE IN MILLIMETER

    TYPE A B C d E F P0 P P1 W

    SOP-8 6.40 5.40 2.10 Ø1.50 1.75 5.50 4.00 8.00 2.00 12.00

    TOLERANCE ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1

    DIMENSIONS ARE IN MILLIMETER

    REEL OPTION D D1 D2 G H I W1 W2

    13’’ DIA Ø330.00 100.00 13.00 R151.00 R56.00 R6.50 12.40 17.60

    TOLERANCE ±2 ±1 ±1 ±1 ±1 ±1 ±1 ±1

    COMPLEMENTARY MOSFET

    HMC4622

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    N-CHANNEL ELECTRICAL CHARACTERISTICS (TA = 25°C P-CHANNEL ELECTRICAL CHARACTERISTICS (TA = 25°C *Pulse test ; Pulse width ≤300µs, Duty cycle ≤ 0.SOP-8 Package Outline Dimensions SOP-8 Tape and ReelSOP-8 Embossed Carrier Tape SOP-8 Tape Leader and Trailer SOP-8 Reel