Chemical Mechanical Planarization (CMP):

Asahi Glass CMP Slurries are the latest in state-of-the-art CMP Slurry technology. Asahi works closely with leading fabs to optimize slurry properties for custom processes. CMP processing using AGC's polishing slurries results in excellent surface planarity, uniformity and low defectivity on customer wafers

Chemical mechanical planarization (CMP) has been a mainstream process in semiconductor manufacturing since the 250nm node. It was initially developed to improve yield and enhance depth of focus in lithography operations as illustrated below:

An abrasive process used for polishing the surface of the wafer flat. It involves the use of chemical slurries and a circular (sanding) action to polish the surface of the wafer smooth. A smooth surface is necessary to maintain

correct focus during the photolithography process. CMP is required multiple times during wafer fabrication