CMOxTM Memory Technology - Applications & Products October 2009

Memory Cell AdvantagesMemory Cell Advantages

© 2009 Unity Semiconductor Corporation 2

The 0 5F2 Memory CellThe 0.5F2 Memory Cell

F = feature size

© 2009 Unity Semiconductor Corporation 3

Unity achieves a 0.5F2 cell size by fabricating 4 physical layers of transistor-less CMOxTM memory in a cross-point array, and storing 2 bit/cell MLC.

4x Density Advantage4x Density Advantage

© 2009 Unity Semiconductor Corporation 4

Since CMOxTM memory technology uses 4 memory layers, Unity memory products have a 4x density advantage over today’s NAND Flash.

Ionic Charge MovementOxygen Vacancy MigrationOxygen Vacancy Migration

Unity CMOxTM memory technology works by the uniform movement of ionic charge under electric field control.

© 2009 Unity Semiconductor Corporation 5

Competing Next GenerationCompeting Next GenerationNVM Technologies: Scaling

Phase Change Kozicki RRAM CMOx

Write current >100ua Write current >5ua Write current >50ua Write current <500na

Ovonyx Intel Adesto, Qimonda, Sandisk/Toshiba UnityOvonyx, Intel Micron Samsung Unity

Melting Metal /Ion Movement Melting

Oxygen VacancyRe-distribution

© 2009 Unity Semiconductor Corporation 6

Ion Movement Re distribution

Write & Read Data PatternsWrite & Read Data Patterns

All 0’s Diagonal 0’s Checkerboard Column Stripes

All 1’s Diagonal 1’s Checkerboard Bar Row Stripe

7

Only Unity has achieved successful data pattern writes and reads on a passive cross-point memory array. Each data pattern represents 1024 bits.

© 2009 Unity Semiconductor Corporation

Manufacturing ModelManufacturing Model

Chip Design Base WaferBEOL

Memory™Product

CMO M

Standard CMOSLogic Foundry

BEOL Memory™ Fab

CMOx Memory Layer

Standard CMOS Logic

© 2009 Unity Semiconductor Corporation 8

Unity leverages existing standard CMOS logic foundries to reduce the capital required to build CMOxTM memory.

Enterprise Storage EvolutionIBM’s Visioncost. IBM s Vision

ache

DRAMHDDuP

1990’s

HDD(Fast)

C

SSDe

1990 s

P HDDSSD Tier 0

StorageCac

he

DRAMuP2010’s

HDD

DR

AM HDD

Cac

he LowLatency High Density/Low Cost

uP2015’s DC

NAND Flash

PCM, STT-MRAM, Qs(low density, high cost)

© 2009 Unity Semiconductor Corporation 9

FlashOnly Unity CMOxTM memory competes with HDD via high density and low cost. Other next-generation SCM technologies are targeted at low latency (DRAM).

Cost Learning CurvesgCost/Bit DRAMDRAM

NAND Flash

CMOxTM maintains 4x cost/bit

HDDHDD

CMOx maintains 4x cost/bit advantage over NAND

CMOxTM achieves cost/bit of only 1.5x HDD

Time

10© 2009 Unity Semiconductor Corporation

On the cost learning curves, Unity’s On the cost learning curves, Unity’s CMOxCMOxTMTM achieves a cost per bit of only 1.5 achieves a cost per bit of only 1.5 times HDD bit costs, while maintaining a cost per bit advantage of 4x over NAND.times HDD bit costs, while maintaining a cost per bit advantage of 4x over NAND.

Applications for CMOxTMApplications for CMOxui

rem

ents Enterprise

SSD (Tier 0)

Consumer Mobile

NetbookSSD

(Eee PC, etc )ili

ty R

equ

Consumer Electronics

(Flash Cards/USB Drives/MP3 Players,

t )

Storage etc.)

e &

Rel

iab

etc.)

rform

ance

Unity market

introduction

Pe

2000 2005 2010

Performance & reliability requirements are increasing

© 2009 Unity Semiconductor Corporation 11

y q gwith each new application. CMOxTM is designed to address even the most demanding requirements.

2009-2014 Product Plan2009-2014 Product Plan

64Gb 256Gb128Gb 512Gb 1024Gb

2008 2009 2010 2011 2012 2013 2014

64Gb 256Gb128Gb 512Gb 1024Gb

64Gb < 64GbA /64GbB >64GbA proto

128GbB < 128GbB > 128GbB proto256Gbproto < 256GbA/ 256GbB >256Gb proto < 256GbA/ 256GbB >

< 512Gb > 512 GbB proto

< 1024Gb > 1024 Gbproto

256Gb

< 512Gb >

512GbBNote: “Version A” is un-shrunk product and “Version B” is a linear shrink.

Design Proto Production

© 2009 Unity Semiconductor Corporation 12

Internal Qual Complete

g

3rd P t

Unity BusinessModel

3rd PartyTechnologyEndorser

InvestorsInvestors

Unity JVPartner

BBEOL Fab JVPatentPartner

13

Product OutputCustomerSupply Agreement

FoundryFEOL Wafers

© 2009 Unity Semiconductor Corporation

Additional information located at:

http//:www unitysemi comhttp//:www.unitysemi.com

© 2009 Unity Semiconductor Corporation 14