Click here for production status of specific part numbers ... · Phablets Tablets Benefits and...

General DescriptionThe MAX20334 is a 2 x SPDT switch with overvoltage protection intended for use with portable devices. In high-voltage charging solutions, a data line short event to the high-voltage VBUS can result in either charger misdetec-tion or permanent damage to the portable device. The MAX20334 is designed to protect the downstream data line from a high-voltage short or surge event.The device combines low on-capacitance (CON) and low on-resistance (RON) necessary for high-performance switching applications in portable electronics. The MAX20334 features internal positive overvoltage, negative overvoltage, and surge protection. The device handles USB low/full/high-speed signaling and operates from a 2.7V to 5.5V supply.The MAX20334 is available in a 12-bump (1.23mm x 1.63mm) wafer-level package (WLP) and operates over the -40°C to +85°C extended temperature range.

Applications Smart Phones Phablets Tablets

Benefits and Features Distortion-Free, High-Speed Signaling

• Dual SPDT• Signal Range: 0V to 5V• RON: 4Ω (typ)• Bandwidth 600MHz

Flexible System Design• Separate Control for Each Switch Path• EN to Save Supply Current• FLAG Signals Fault Event• 12-Bump WLP (1.23mm x 1.63mm) Package• -40°C to +85°C Operating Temperature Range

Robust and Safety• Positive Overvoltage Protection up to +20.5V• Hot Plug-In Robustness

Ordering Information appears at end of data sheet.

19-100527; Rev 1; 9/19

MAX20334 Overvoltage and Surge-Protected Dual SPDT Data Line Switch

Click here for production status of specific part numbers.

EVALUATION KIT AVAILABLE

https://www.maximintegrated.com/en/storefront/storefront.html

(All voltages referenced to GND.)VCC, CSA, CSB, EN, FLAG ....................................-0.5V to +6VCOMA, COMB (Note 1) ......................................-0.5V to +20.5VPA1, PA2, PB1, PB2 ................................................-0.5V to +6VCurrent into all pins ........................................................±100mA

Continuous Power Dissipation (TA = +70°C) WLP (derate 13.73mW/°C above +70°) ....................1098mW

Operating Temperature Range ........................... -40°C to +85°CJunction Temperature ......................................................+150°CStorage Temperature Range ............................ -65°C to +150°CSoldering Temperature (reflow) .......................................+260°C

PACKAGE TYPE: 12 WLPPackage Code W121C1+1Outline Number 21-100286Land Pattern Number Refer to Application Note 1891THERMAL RESISTANCE (FOUR-LAYER BOARD)Junction to Ambient (θJA) 72.8°C/W

(VCC = 2.7V to 5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 4.3V, TA = +25°C) (Note 2)


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Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.

Note 1: Surge capable from -30V to +45V by the surge tester with 2Ω source impedance IEC61000-4-5 modified waveform.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Electrical Characteristics

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITSSUPPLY OPERATIONOperating Voltage VCC 2.7 5.5 V

Supply Current ICC VIN below OVLO 26 51 µA

Supply OVLO Shutdown Current ICC_O VCOM_ = 6V, VPA_/PB_ = 0V 29 58 µA

Power On Reset VPOR 2.3 VCOMA, COMB, PA1, PA2, PB1, PB2

Positive Overvoltage Trip Level VPOVLO (Note 3)VIN rising 4.6 4.8 5

VVIN falling 4.5

COM_ On Leakage Equivalent Resistance RCOM_ON VCOM_ = 2.5V 3 6.3 15 MΩ

PA_, PB_ Off Leakage Current IP_OFFSwitch open, VCC = 3V, VPA_ = 0V, 2.5V, VCOM_ = 0V, 2.5V -0.1 0.1 µA

COM_ Current Sink VCOM_ = 20V 0.3 mA

COM_ Positive Overvoltage Fault Protection Response Time tFP

VCOM_ = 1V to 10V step, VCC = 2.7V to 5.5V, RPA_ = RPB_ = 1kΩ, (Figure 2) 100 ns

COM_ Positive Overvoltage Fault Protection Recovery Time tFPR

VCOM_ = 10V to 1V step, VCC = 2.7V to 5.5V, RPA_ = RPB_ = 1kΩ, (Figure 2) 80 µs

Package Information

http://pdfserv.maxim-ic.com/package_dwgs/21-100286.PDF

http://www.maximintegrated.com/an1891

http://www.maximintegrated.com/thermal-tutorial

www.maximintegrated.com/packages




Electrical Characteristics (continued)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITSCOMA to PA1/PA2, COMB to PB1/PB2Analog Signal Range VCOM_ 0 5 VInternal SWPOS Regulator VSWPOS VCC = 2.7V 5 V

On-Resistance RON VCC = 3V, ICOM_ = 10mA, TA = +25°C 4 8 Ω

On-Resistance Match Between Channels ∆RON

VCC = 3V, VP_ = 0V, ICOM_ = 10mA (Note 4, 5) 0.2 Ω

On-Resistance Flatness RFLATVCC = 3V, ICOM_ = 10mA , VCOM_ = 0V to 1V (Note 6) 0.3 Ω

Turn-On Time (Figure 3) tON

VPA_/VPB_ = 1.5V, RL = 50Ω, From an CSA/CSB control 45 90

µsVPA_/VPB_ = 1.5V, RL = 50Ω, From an EN control 90 120

Turn-Off Time (Figure 3) tOFFVPA_/VPB_ = 1.5V, RL = 50Ω, EN control or CSA/CSB control 0.5 10 µs

Output Skew Same Switch tSK(P) Figure 4 40 psOutput Skew Between Switch tSK(O) Figure 4 40 ps

Break-Before-Make Time Delay tDRL = 50Ω, time delay between one side of the switch opening and the other side closing

20 µs

Power On Reset Time tPOR 0.4 0.7 ms

COM_ On Capacitance CCOM_ONVCOM_ = 0.5VPP, DC bias = 0V, f = 1MHz 10 pF

DIGITAL SIGNAL (FLAG, EN, CSA, CSB)FLAG Output Voltage Low VOL IFLAG = 1mA 0.4 VFLAG Output Leakage ILEAK VFLAG = 5.5V -1 1 µAInput Voltage High VIH EN, CSA, CSB 1.4 VInput Voltage Low VIL EN, CSA, CSB 0.4 VInput Leakage ILEAK EN, CSA, CSB = 5.5V or GND -1 1 µAAC CHARACTERISTICS (NOTE 4)

-3dB Bandwidth BW VCOM_ = 0dBm, RS = RL = 50Ω, Figure 5 600 MHz

Off Isolation f = 100kHz, VCOM_ = 1VRMS, RL = 50Ω, Figure 5 -95 dB

Crosstalk (Note 7) f = 100kHz, VCOM_ = 1VRMS, RL = 50Ω, Figure 5 -80 dB

Note 2: All devices are 100% production tested at TA = +25°C. Specifications over the operating temperature range are guaranteed by design.

Note 3: The switch turns off for voltages above VPOVLO protecting downstream circuits in case of a fault condition.Note 4: Guaranteed by design.Note 5: ∆RON(MAX) = | RON(CH1) – RON(CH2) |Note 6: Flatness is defined as the difference between the maximum and minimum value of on-resistance, as measured over specified

analog signal ranges.Note 7: Between two switches.Note 8: Strike applied through 1m cable, 12nH peaking inductors installed in series with COMx pins.


Figure 1. Timing Diagram



Electrical Characteristics (continued)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITSTHERMAL PROTECTIONThermal Shutdown TSHDN 150 °CThermal Hysteresis THYST 20 °CESD PROTECTION

Human Body Model COMA, COMB ±15 kV

IEC61000-4-2 Contact Discharge

COMA, COMB (Note 8) ±8 kV

IEC61000-4-2 Air Gap COMA, COMB ±15 kV

Human Body Model All Other Pins ±2 kV

COM_

VPOVLO

PA_/PB_

tOFF tON

EN

FLAG

VPOVLO

VIHVCC

Figure 2. Fault Protection Timing Diagram

Figure 3. Switching Timing Diagram



VCC = 4.3V

VCOM_

VPOVLO

VPB_

VPA_

tFP tFPR

10V

1V

1V0V

tr < 5nstf < 5ns

50%VIL

LOGICINPUT

RL

COM_

GND

CONTROL

CL INCLUDES FIXTURE AND STRAY CAPACITANCE.

VOUT = VIN ( RL ) RL + RON

VIN

VIH

tOFF

0V

PA_OR PB_

0.9 x V0UT 0.1 x VOUT

tON

VOUT

SWITCHOUTPUT

LOGICINPUT

CONTROL DEPENDS ON SWITCH CONFIGURATION;INPUT POLARITY DETERMINED BY SENSE OF SWITCH.

VCC

CL

VCC

VOUT

MAX20334

Figure 4. Output Skew Timing Diagram



IN+

IN-

CSA ORCSB

OUT+

OUT-

VIN+

VIN-

VOUT+

VOUT-

PA1 ORPA2

PB1 ORPB2

COMA

MAX20334

COMB

0V

V+

0V

V+

0V

V+

0V

V+

tPLHX tPHLX

tINRISE

tOUTRISE tOUTFALL

RISE-TIME PROPAGATION DELAY = tPLHX OR tPLHYFALL-TIME PROPAGATION DELAY = tPHLX OR tPHLYtSK(O) = |tPLHX - tPLHY| OR |tPHLX - tPHLY|tSK(P) = |tPLHX - tPHLX| OR |tPLHY - tPHLY|

50%

50%

50%

50%

90%

10% 10%

90%

10% 10%

RL

RL

50%

50%

50%

50%

tINFALL

90%

90%

tPHLY tPLHY

RS

RS

LOGICINPUT

Figure 5. On-Loss, Off-Isolation, and Crosstalk



MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM_ AND "OFF" PA_ OR PB_ TERMINAL ON EACH SWITCH. ON-LOSS IS MEASURED BETWEEN COM_ AND "ON" PA_ OR PB_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL.SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED.

VCC

VOUT

VCC

PA1

COMA

MAX20334

PB1*

VIN

OFF-ISOLATION = 20log VOUT

VIN

ON-LOSS = 20log VOUT

VIN

CROSSTALK = 20log VOUT

VIN

NETWORKANALYZER

50Ω

50Ω 50Ω

50Ω

MEAS REF

0.1µF

50Ω

GND

*FOR CROSSTALK THIS PIN IS PA2. PB2 AND COMB ARE OPEN.MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS.

OFF-ISOLATION IS MEASURED BETWEEN COM_ AND "OFF" PA_ OR PB_ TERMINAL ON EACH SWITCH. ON-LOSS IS MEASURED BETWEEN COM_ AND "ON" PA_ OR PB_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL.SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED.

VCC

VOUT

VCC

PA1

COMA

MAX20334

PB1*

VIN

OFF-ISOLATION = 20log VOUT

VIN

ON-LOSS = 20log VOUT

VIN

CROSSTALK = 20log VOUT

VIN

NETWORKANALYZER

50Ω

50Ω 50Ω

50Ω

MEAS REF

0.1µF

50Ω

GND

*FOR CROSSTALK THIS PIN IS PA2. PB2 AND COMB ARE OPEN.

(VCC = 4.3V, TA = +25°C, unless otherwise noted.)

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Typical Operating Characteristics

0.7

0.8

0.9

1

1.1

1.2

1.3

1.4

1.5

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

NORM

ALIZ

ED P

A_ O

N-RE

SIST

ANCE

COMA VOLTAGE (V)

NORMALIZED PA_ ON-RESISTANCE vs. COMA VOLTAGE

toc04

IPA_ = 10mA, NORMALIZED TO VCC = 4.3V, TA = 25ºC, VCOMA = 1V

VCC = 2.7V, TA = +85°CVCC = 5.5V, TA = +85°C

VCC = 4.3V, TA = +85°C

VCC = 2.7V, TA = +25°C

VCC = 5.5V, TA = +25°C

VCC = 4.3V, TA = +25°C

VCC = 4.3V, TA = -40°CVCC = 5.5V, TA = -40°C

VCC = 2.7V, TA = -40°C

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

NORM

ALIZ

ED P

B_ O

N-RE

SIST

ANCE

COMB VOLTAGE (V)

NORMALIZED PB_ ON-RESISTANCE vs. COMB VOLTAGE

toc05

IPA_= 10mA, NORMALIZED TO VCC = 4.3V, TA = 25ºC, VCOMA = 1V

VCC = 2.7V, TA = +85°CVCC = 4.3V, TA = +85°C

VCC = 5.5V, TA = +85°C

VCC = 2.7V, TA = +25°C

VCC = 5.5V, TA = +25°C

VCC = 4.3V, TA = +25°C

VCC = 5.5V, TA = -40°C

VCC = 2.7V, TA = -40°CVCC = 4.3V, TA = -40°C

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

-40 -15 10 35 60 85

PA_

OFF

LEA

KAG

E CU

RREN

T (n

A)

TEMPERATURE (°C)

PA_ OFF LEAKAGE CURRENT vs. TEMPERATURE

toc06

VEN = VCC = 3V

VPA_ = 2.5V

VPA_ = 3.6V

0

5

10

15

20

25

30

35

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

SUPP

LY C

URRE

NT (

µA)

SUPPLY VOLTAGE (V)

VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE

toc01

TA = +85°C

TA = -40°C

VEN = 0V, VCOM_ = 0V

TA = +25°C

0

5

10

15

20

25

30

35

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

SUPP

LY C

URRE

NT O

VLO

SHU

TDO

WN

(µA)

SUPPLY VOLTAGE (V)

VCC SUPPLY CURRENT OVLO SHUTDOWN vs. SUPPLY VOLTAGE

toc02

TA = +85°C

TA = -40°C

TA = +25°C

VEN = 0V, VCOM_ = 6V 0

5

10

15

20

25

30

35

40

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

SUPP

LY S

HUTD

OW

N CU

RREN

T (µ

A)

SUPPLY VOLTAGE (V)

VCC SUPPLY SHUTDOWN CURRENT vs. SUPPLY VOLTAGE

toc03

TA = -40°C

TA = +85°C

TA = +25°C

VEN = VCC, VCOM_ = 0V

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

-40 -15 10 35 60 85

PB_

OFF

LEA

KAG

E CU

RREN

T (n

A)

TEMPERATURE (°C)

PB_ OFF LEAKAGE CURRENT vs. TEMPERATURE

toc07

VEN = VCC = 3V

VPB_ = 2.5V

VPB_ = 3.6V

4.0

4.5

5.0

5.5

6.0

6.5

7.0

-40 -15 10 35 60 85

COM

_ O

N LE

AKAG

E EQ

UIVA

LENT

RE

SIST

ANCE

(M

Ω)

TEMPERATURE (°C)

COM_ ON LEAKAGE EQUIVALENT RESISTANCE vs. TEMPERATURE

toc08

VCC = 4.3V

VCOM_ = 3.6V

VCOM_ = 2.5V

(VCC = 4.3V, TA = +25°C, unless otherwise noted.)

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5V/div

5V/div

5V/div

toc15

40ns

10V

VCOM_

COM_ OVP WAVEFORM

1V

RPA_/PB_ = 1kΩ

VPA_/PB_

VFLAG

-0.6

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

DIF

FER

EN

TIA

L S

IGN

AL

(V)

TIME (ns)

EYE DIAGRAMtoc16

Typical Operating Characteristics (continued)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

TURN

-OFF

TIM

E (µ

s)

SUPPLY VOLTAGE (V)

PA_/PB_ TURN-OFF TIME vs. SUPPLY VOLTAGE

toc12

FROM CSB CONTROL

FROM EN CONTROL

RL = 50Ω

toc12

FROM CSB CONTROL

RL = 50Ω

toc12

FROM CS_ CONTROL

RL = 50Ω

4.70

4.74

4.78

4.82

4.86

4.90

-40 -15 10 35 60 85

COM

_ PO

SITI

VE O

VLO

THR

ESHO

LD (V

)

TEMPERATURE (°C)

COM_ OVLO THRESHOLD vs. TEMPERATURE

toc09

VIN RISING

VCC = 2.7V, 3.3V, 4.3V, 5.5V

VIN FALLING

30

40

50

60

70

80

90

100

110

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

TURN

-ON

TIM

E (µ

s)

SUPPLY VOLTAGE (V)

PA_ TURN-ON TIME vs. SUPPLY VOLTAGE

toc10

FROM CSA CONTROL

FROM EN CONTROL

RL = 50Ω

30

40

50

60

70

80

90

100

110

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

TURN

-ON

TIM

E (µ

s)

SUPPLY VOLTAGE (V)

PB_ TURN-ON TIME vs. SUPPLY VOLTAGE

toc11

FROM CSB CONTROL

FROM EN CONTROL

RL = 50Ω

0.001

0.010

0.100

1.000

10.000

20 200 2000 20000

THD+

N (%

)

FREQUENCY (Hz)

VCOM_ = 1VPP, DC BIAS 0.5V

toc13

RL = 100Ω

TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY

-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

0.1 1 10 100 1000

MAG

NITU

DE (d

B)

FREQUENCY (MHz)

ON LOSS

FREQUENCY RESPONSEtoc14

CROSSTALK

OFF ISOLATION



Bump Configuration

Bump Description

TOP VIEW(BUMPS ON BOTTOM) MAX20334

+1 2 3 4

A

B

C

CSA

COMB

COMA

FLAG

VCC

CSB

GND

EN

PB2

PA2

PB1

PA1

BUMP NAME FUNCTION

A1 CSA Channel Select Input for COMA. When CSA is low, COMA is connected to PA1. When CSA is high, COMA is connected to PA2.

A2 COMB Data Line B Input from External USB PortA3 COMA Data Line A Input from External USB PortA4 FLAG Open-Drain Flag Output. FLAG is driven low when OVP or thermal shutdown occurs.B1 VCC Supply Voltage Input. Bypass VCC with a 0.1µF ceramic capacitor as close to the device as possible.

B2 CSB Channel Select Input for COMB. When CSB is low, COMB is connected to PB1. When CSB is high, COMB is connected to PB2.

B3 GND GroundB4 EN Active-Low Enable InputC1 PB2 Data Line 2 to COMBC2 PA2 Data Line 2 to COMAC3 PB1 Data Line 1 to COMBC4 PA1 Data Line 1 to COMA



Functional Diagram

MAX20334 VCC

CHARGE PUMP CONTROLVBG REFERENCE

LOGIC CONTROL

FLAG

EN

CSA

CSB

PA1

PB1

PA2

PB2

VREF

VREF

DISABLE

DISABLE

HIGH ESD

GND

COMA

COMB

HIGH ESD

Detailed DescriptionThe MAX20334 is a high ESD and surge-protected, dual-SPDT switch that operates from a 2.7V to 5.5V supply and are designed to multiplex USB 2.0 high-speed signals and various analog signals. The switch combines low on-capacitance (CON) and low on-resistance (RON) neces-sary for high-performance switching applications, while withstanding the overvoltage event. The device meets the requirements for USB 2.0 signaling.

Analog SignalThe MAX20334 is bidirectional, allowing PA_, PB_, and COM_ to be configured as either inputs or outputs.The device can handle analog signals 0V to 5V.

Switch ControlThe MAX20334 switches are individually controlled by CSA and CSB. When EN is high, the switches are open and the device is in a low supply current mode. (Table 1)

FLAG OutputThe FLAG is an open-drain output. It asserts low when there is an overvoltage, or a thermal shutdown occurs.

Thermal Shutdown ProtectionThe MAX20334 features thermal shutdown protection to protect the device from overheating. The device turns off when the junction temperature exceeds +150°C (typ). The device exits thermal shutdown and resumes normal operation after the junction temperature cools by 20°C (typ). During thermal shutdown, the switches are open.

Application InformationExtended ESDESD protection structures are incorporated on all pins to protect against electrostatic discharges up to ±2kV (Human Body Model) encountered during handling and

assembly. COMA and COMB are further protected against ESD up to ±15kV (Human Body Model), ±15kV (Air Gap Discharge method described in IEC 61000-4-2), and ±8kV (Contact Discharge method described in IEC61000-4-2) without damage. Note that, if PA_ and PB_ are used as inputs and require higher than ±2kV, additional ESD pro-tection is needed.The ESD structures withstand high ESD, both in normal operation and when the device is powered down. After an ESD event, the MAX20334 continues to function without latchup.

ESD Test ConditionESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results.

Human Body ModelFigure 6 shows the Human Body Model, while Figure 7 shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest that is then discharged into the device through a 1.5kΩ resistor.

IEC 61000-4-2The IEC 61000-4-2 standard covers ESD testing and performance of finished equipment. However, it does not specifically refer to integrated circuits. The major difference between tests performed using the Human Body Model and those using IEC 61000-4-2 is the higher peak current in IEC 61000-4-2. This is due the series resistance being lower in the IEC 61000-4-2 model. Hence, the ESD withstand voltage measured to IEC 61000-4-2 is generally lower than that measured using the Human Body Model. Figure 8 shows the IEC 61000-4-2 model, while Figure 9 shows the current waveform for the IEC 61000-4-2 ESD Contact Discharge test.

Table 1. Functional Truth Table



EN0 1

[CSA:CSB] [CSA:CSB]00 01 10 11 D.C.

COMA = PA1 PA1 PA2 PA2 OPENCOMB = PB1 PB2 PB1 PB2 OPEN

Figure 6. Human Body ESD Test Model

Figure 7. Human Body Current Waveform

Figure 8. IEC 61000-4-2 ESD Test Model

Figure 9. IEC 61000-4-2 ESD Generator Current Waveform



CHARGE-CURRENT-LIMIT RESISTOR

DISCHARGERESISTANCE

STORAGECAPACITOR

Cs100pF

RC1MΩ

RD1.5kΩ

HIGH- VOLTAGE

DCSOURCE

DEVICEUNDERTEST

IP 100%90%

36.8%

tRL TIMEtDL

CURRENT WAVEFORM

PEAK-TO-PEAK RINGING(NOT DRAWN TO SCALE)

IR

10%0

0

AMPERES

CHARGE-CURRENT-LIMIT RESISTOR

DISCHARGERESISTANCE

STORAGECAPACITOR

CS150pF

RC50MΩ TO 100MΩ

RD330Ω

HIGH- VOLTAGE

DCSOURCE

DEVICEUNDERTEST

tR = 0.7ns TO 1ns30ns

60ns

t

100%90%

10%

IPEAK (AMPS)

+Denotes a lead(Pb)-free/RoHS-compliant package.T = Tape and reel.



Typical Application Circuit

MAX14699VBUS OVP

USB TYPE-CCONNECTOR

VBUS

D+

D-

GNDMAX20334

AP

PMIC

CHGIN BYP

CHGLX

SYS

BATT

20 µF

VCC

FLAGEN

CSACSBPA1PB1PA2PB2

COMA

COMB

VIO

PORT CONTROL

AP USB PORT 1

AP USB PORT 2

GND

1 µF0.1 µF

Ordering InformationChip InformationPROCESS: BiCMOS

PART TOP MARK

TEMP RANGE

PIN-PACKAGE

MAX20334EWC+T AEI -40°C TO +85°C 12 WLP

Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.

Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2019 Maxim Integrated Products, Inc. 15


Revision HistoryREVISIONNUMBER

REVISIONDATE DESCRIPTION PAGES

CHANGED0 4/19 Initial release —1 9/19 Updated Electrical Characteristics table, Extended ESD section 4, 12

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