CISCO CIUS Tablet - System Plus Consulting€“ Main Board – Bottom Side HD Photo & Markings –...

© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. CISCO CIUS Tablet

February 2012 - Version 1

written by : Wilfried THERON

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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Content

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1. Overview / Introduction………………….…………….…...…3 – Introduction – Main Features – Simplified Block Diagram – About the “Mooretown” Plateform – About the Intel “Lincroft” Atom Z615 SoC – About the “Langwell” PCH MP30 – The course of the analysis

2. Physical Analysis ………………………………………...…...10 – Packaging – Package Opening – Accessories – View & Dimensions – External Interfaces – Tablet Label – Details about the Battery – Step by Step Tablet Disassembly – Display Module Disassembly – Main Board – Global View – Main Board – Top Side HD Photo – Main Board – Top Side Markings – Main Board – Top Side Main Components Markings – Main Board – Top Side Main Components – Main Board – Top Side Discrete Components – Main Board – Top Side Unidentified Components – Main Board – Top Connectors – Main Board – Bottom Side HD Photo & Markings – Main Board – Bottom Side Main Components – Details about the Murata WLAN Bluetooth Module – Camera Board – Main Components – Display Board – Main Components – Touchscreen Board – Main Components – Microphones Flex – Main Components

3. BOM Cost ……………………………………………………….…..59 – Assessing the BOM – Estimation of the cost of the Intel “Lincroft” Atom Z615 SoC – Estimation of the cost of the Intel “Langwell” AF82MP30 – Estimation of the cost of the Sensors XXXXX – Estimation of the cost of the Camera Modules – Estimation of the cost of the PCBs – Estimation of the cost of the Main Board – Estimation of the cost of the Auxiliary Board – Estimation of the cost of the WLAN Module, Display,

Touchscreen, Camera Boards & Microphones Flex – Estimation of the Tablet Housing cost – Estimation of the cost of the Packaging – Material cost breakdown

4. Added Value Cost …………………………………..…….……...101

– Assessing the Added Value (AV) cost – Main Board Manufacturing Flow – Main Board Process Cadencies – Main Board Equipment Investment & Hourly Rates – Labor Hourly rates – Details of the Main Board AV Cost – Details of the Display Board AV Cost – Details of the Touchscreen Board AV Cost – Details of the WLAN Module AV Cost – Details of the Microphones Flex AV Cost – Details of the Tablet Housing AV Cost – Details of the Packaging AV Cost – Added Value Cost Breakdown

5. Estimation of the selling price …………………......................123 – Manufacturing Cost Breakdown – Estimation of the Selling Price

Glossary………..………………….…..……………..……..……......127 Contact…………………………….…..……………..……..………...128



Disassembly

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Display module Front Frame

(PC/ABS + TPU)

Speakers cover

Touchscreen Electronic Board

Display Electronic Board

Microphones Flex

45-Wire Capacitive Touch Screen

Window Glass (PC)

Front buttons Front buttons frame

Speakers felt Speakers frame

Main Electronic Board

Antenna part (Wifi/BT + GPS antennas)

Tape

LCEDI cable

Cable Flex 6 Pos

Top cover (PC/ABS) Back Cover (Magnesium)

SIM Card Cover



Main Board – Top Side – Global view

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Top side of the main board.



Main Board – Top Side – Main Components



Estimation of the cost of the Intel “Lincroft” Atom Z615 SoC

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The cost of the Intel “Lincroft” Atom Z615 SoC has been estimated with our IC Price+ software. The cost of an Integrated Circuit varies according to the used technology as well as the size of the die and a lot of parameters such as number of metallization, manufacturing yields, test durations, functional blocks, ... The Intel “Lincroft” Atom Z615 includes one silicon die assembled in flip-chip in a FCBGA-518 13.8mm x 13.8mm package. We have opened the package to see the die structure and done a cross-section to identified the number of metal layers.

Silicon die

Package

Package Opening Package Back view Package Top view


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Estimation of the cost of the Intel “Lincroft” Atom Z615 SoC


© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. CISCO CIUS Tablet 8

Estimation of the cost of the STMicroelectronics LSM303DLH

ASIC of Magnetic Sensor. (2.44mm x 1.45mm = 3.54mm²)

2-axis Magnetic Sensor. (0.89mm x 0.89mm = 0.79mm²)

3-Axis Accelerometer Sensor + ASIC. (1.95mm x 2.12mm = 4.13mm²)

Z-axis Magnetic Sensor. (1.61mm x 0.28mm = 0.45mm²)



Estimation of the cost of the Camera Modules

Opening of the rear-facing camera.

Die of the rear-facing camera. (6.97mm x 6.73mm = 46.9mm²)

Pixel area

Light protection mask

Light protection mask

Passivation layer Bonding on the PCB

Die marking.



Estimation of the cost of the PCBs

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Cross-Sections of the Main Board PCB and the WLAN Module.

Main Board PCB 8 copper layers.

WLAN Module PCB 6 copper layers

IC xxx cross-section

The cross-section of each printed circuit boards indicates the thickness of the PCB the number of metal layers and their thickness.



Main Board (1/3)

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Material cost breakdown

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Details of the Main board AV Cost (1/3)

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Details of the Tablet Housing AV Cost

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Added Value cost breakdown

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Manufacturing cost breakdown

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• Reverse costing analysis represents the best cost/price evaluation given by the publically available data,

completed with industry expert estimates.

• These results are open for discussion and we can re-evaluate them with your information.

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CISCO CIUS Tablet - System Plus Consulting€“ Main Board – Bottom Side HD Photo & Markings –...

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