CHIP Catalog.pdf0

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Notes CHIP Name: X-SAP-WDY-CHIP:BSSP_NOTES CL_BSSP_NOTES Feeder Class: Description In the Notes CHIP, you can store, display, change, or delete notes. Inports Port Parameter Data Element Parameter Tags BORTYPE SWO_OBJTYP /BSSP/:BORTYPE

description

sap chips

Transcript of CHIP Catalog.pdf0

Page 1: CHIP Catalog.pdf0

NotesCHIP Name: X-SAP-WDY-CHIP:BSSP_NOTES

CL_BSSP_NOTES Feeder Class:

Description

In the Notes CHIP, you can store, display, change, or delete notes. 

 

Inports

Port Parameter Data Element Parameter Tags

BORTYPE SWO_OBJTYP /BSSP/:BORTYPE

 

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AttachmentsCHIP Name: X-SAP-WDY-CHIP:BSSP_ATTACHMENTS

CL_BSSP_ATTACHMENTS Feeder Class:

Description

In the Attachments CHIP, you can store, display, change, or delete attachments.

Inports

Port Parameter Data Element Parameter Tags

BORTYPE SWO_OBJTYP /BSSP/:BORTYPE

 

 

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General Ledger AccountCHIP Name: X-SAP-WDY-CHIP:BSSP_GL_ACCOUNT

CL_BSSP_GL_ACCOUNTFeeder Class: BUS3006 BOR Object:

Description

This CHIP displays the data of the General Ledger Account.

Inports

Port Parameter Data Element Parameter Tags

BUKRS BUKRS /BSSP/:BUKRS

SAKNR SAKNR /BSSP/:SAKNR

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CustomerCHIP Name: X-SAP-WDY-CHIP:BSSP_DEBITOR

CL_BSSP_DEBITORFeeder Class: KNB1 BOR Object:

Description

This CHIP displays the data of the customer.

Inports

Port Parameter Data Element Parameter Tags

BUKRS BUKRS /BSSP/:BUKRS

KUNNR KUNNR /BSSP/:KUNNR

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VendorCHIP Name: X-SAP-WDY-CHIP:BSSP_CREDITOR

CL_BSSP_CREDITORFeeder Class: LFB1 BOR Object:

Description

This CHIP displays the data of the vendor data.

Inports

Port Parameter Data Element Parameter Tags

BUKRS BUKRS /BSSP/:BUKRS

LIFNR LIFNR /BSSP/:LIFNR

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Cost CenterCHIP Name: X-SAP-WDY-CHIP:BSSP_COSTCENTER

CL_BSSP_COSTCENTERFeeder Class: BUS0012 BOR Object:

Description

This CHIP displays the data of cost center.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 6

Inports

Port Parameter Data Element Parameter Tags

KOKRS KOKRS /BSSP/:KOKRS

KOSTL KOSTL /BSSP/:KOSTL

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Profit CenterCHIP Name: X-SAP-WDY-CHIP:BSSP_PROFITCENTER

CL_BSSP_PROFITCENTERFeeder Class: BUS0015 BOR Object:

Description

This CHIP displays the data of the profit center.

Inports

Port Parameter Data Element Parameter Tags

PRCTR PRCTR /BSSP/:PRCTR

KOKRS KOKRS /BSSP/:KOKRS

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Internal OrderCHIP Name: X-SAP-WDY-CHIP:BSSP_INTERNALORDER

CL_BSSP_INTERNALORDERFeeder Class: BUS2075 BOR Object:

Description

This CHIP displays the data of the internal order.

Inports

Port Parameter Data Element Parameter Tags

AUFNR AUFNR /BSSP/:AUFNR

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UserCHIP Name: X-SAP-WDY-CHIP:BSSP_USER

CL_BSSP_USERFeeder Class: USER BOR Object:

Description

This CHIP displays the data of the user.

Inports

Port Parameter Data Element Parameter Tags

BAPIBNAME XUBNAME /BSSP/:BAPIBNAME

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Statistical KeyfigureCHIP Name: X-SAP-WDY-CHIP:BSSP_KEYFIGURE

CL_BSSP_KEYFIGUREFeeder Class: BUS1138 BOR Object:

Description

This CHIP displays the data of the statistical keyfigure.

Inports

Port Parameter Data Element Parameter Tags

KOKRS KOKRS /BSSP/:KOKRS

STAGR STAGR /BSSP/:STAGR

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Company CodeCHIP Name: X-SAP-WDY-CHIP:BSSP_COMPANYCODE

CL_BSSP_COMPANYCODEFeeder Class: BUS0002BOR Object:

Description

This CHIP displays the data of the company code.

Inports

Port Parameter Data Element Parameter Tags

BUKRS BUKRS /BSSP/:BUKRS

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Activity TypeCHIP Name: X-SAP-WDY-CHIP:BSSP_ACTIVITYTYPE

CL_BSSP_COMPANYCODEFeeder Class: BUS1031 BOR Object:

Description

This CHIP displays the data of the activity type.

Inports

Port Parameter Data Element Parameter Tags

LSTAR LSTAR /BSSP/:LSTAR

KOKRS KOKRS /BSSP/:KOKRS

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MaterialCHIP Name: X-SAP-WDY-CHIP:BSSP_MATERIAL

CL_BSSP_MATERIALFeeder Class: BUS1001 BOR Object:

Description

This CHIP displays the data of the material.

Inports

Port Parameter Data Element Parameter Tags

MATNR MATNR /BSSP/:MATNR

WERKS WERKS /BSSP/:WERKS

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Bank AccountCHIP Name: X-SAP-WDY-CHIP:BSSP_BANK_ACCOUNT

CL_BSSP_BANK_ACCOUNTFeeder Class: BSSP_ACEXT BOR Object:

Description

This CHIP displays the data of the bank account.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 2

Inports

Port Parameter Data Element Parameter Tags

BKKRS BSSP_BKKRS /BSSP/:BKKRS

ACNUM_EXT BSSP_ACNUM_EXT /BSSP/:ACNUM_EXT

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Bank DataCHIP Name: X-SAP-WDY-CHIP:BSSP_BANK

CL_BSSP_BANK_DATAFeeder Class: BUS1011 BOR Object:

Description

This CHIP displays the data of the bank data.

Inports

Port Parameter Data Element Parameter Tags

BANKS BSSP_BANKS /BSSP/:BANKS

BANKL BSSP_BANKL /BSSP/:BANKL

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Business AreaCHIP Name: X-SAP-WDY-CHIP:BSSP_BUSINESSAREA

CL_BSSP_BUSINESSAREAFeeder Class: BUS0003 BOR Object:

Description

This CHIP displays the data of the business area.

Inports

Port Parameter Data Element Parameter Tags

GSBER GSBER /BSSP/:GSBER

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Business PartnerCHIP Name: X-SAP-WDY-CHIP:BSSP_BUSINESSPARTNER

CL_BSSP_BUSINESSPARTNERFeeder Class: BUS1006 BOR Object:

Description

This CHIP displays the data of the business partner.

Inports

Port Parameter Data Element Parameter Tags

PARTNER BU_PARTNER /BSSP/:PARTNER

Page 18: CHIP Catalog.pdf0

Business ProcessCHIP Name: X-SAP-WDY-CHIP:BSSP_BUSINESSPROCESS

CL_BSSP_BUSINESSPROCESSFeeder Class: BUS1036 BOR Object:

Description

This CHIP displays the data of the business process.

Inports

Port Parameter Data Element Parameter Tags

KOKRS KOKRS /BSSP/:KOKRS

PRZNR PRZNR /BSSP/:PRZNR

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CommodityCHIP Name: X-SAP-WDY-CHIP:BSSP_COMMODITY

CL_BSSP_COMMODITYFeeder Class: BUS5120 BOR Object:

Description

This CHIP displays the data of the commodity data.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 3.

Inports

Port Parameter Data Element Parameter Tags

COMMODITY_ID CHAR18 /BSSP/:COMMODITY_ID

Page 20: CHIP Catalog.pdf0

CompanyCHIP Name: X-SAP-WDY-CHIP:BSSP_COMPANY

CL_BSSP_COMPANYFeeder Class: BUS0014 BOR Object:

Description

This CHIP displays the data of the company data.

Inports

Port Parameter Data Element Parameter Tags

RCOMP RCOMP_D /BSSP/:RCOMP

Page 21: CHIP Catalog.pdf0

Controlling AreaCHIP Name: X-SAP-WDY-CHIP:BSSP_CONTROLLINGAREA

CL_BSSP_CONTROLLINGAREAFeeder Class: BUS0004BOR Object:

                  

Description

This CHIP displays the data of the controlling area.

Inports

Port Parameter Data Element Parameter Tags

KOKRS KOKRS /BSSP/:KOKRS

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Cost ElementCHIP Name: X-SAP-WDY-CHIP:BSSP_COSTELEMENT

CL_BSSP_COSTELEMENTFeeder Class: BUS1030 BOR Object:

Description

This CHIP displays the data of the cost element.

Inports

Port Parameter Data Element Parameter Tags

KSTAR KSTAR /BSSP/:KSTAR

KOKRS KOKRS /BSSP/:KOKRS

Page 23: CHIP Catalog.pdf0

Cost ObjectCHIP Name: X-SAP-WDY-CHIP:BSSP_COSTOBJECT

CL_BSSP_COSTOBJECTFeeder Class: BUS1079 BOR Object:

Description

This CHIP displays the data of the cost object.

Inports

Port Parameter Data Element Parameter Tags

KSTRG KSTRG /BSSP/:KSTRG

Page 24: CHIP Catalog.pdf0

Fixed AssetCHIP Name: X-SAP-WDY-CHIP:BSSP_FIXEDASSET

CL_BSSP_FIXEDASSETFeeder Class: BUS1022 BOR Object:

Description

This CHIP displays the data of the fixed asset.

Inports

Port Parameter Data Element Parameter Tags

BUKRS BUKRS /BSSP/:BUKRS

ANLN1 ANLN1 /BSSP/:ANLN1

ANLN2 ANLN2 /BSSP/:ANLN2

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Functional AreaCHIP Name: X-SAP-WDY-CHIP:BSSP_FUNCAREA

CL_BSSP_FUNCAREAFeeder Class: BUS0023 BOR Object:

Description

This CHIP displays the data of the functional area.

Inports

Port Parameter Data Element Parameter Tags

FKBER FKBER /BSSP/:FKBER

Page 26: CHIP Catalog.pdf0

Futures AccountCHIP Name: X-SAP-WDY-CHIP:BSSP_FUTURES_ACCOUNT

CL_BSSP_FUTURES_ACCOUNTFeeder Class: BSSP_FUTAC BOR Object:

Description

This CHIP displays the data of the futures account.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 6

Inports

Port Parameter Data Element Parameter Tags

FUKRT FUKRT /BSSP/:FUTAC

BUKRS BUKRS /BSSP/:BUKRS

Page 27: CHIP Catalog.pdf0

Securities AccountCHIP Name: X-SAP-WDY-CHIP:BSSP_SECURITIES_ACCOUNT

CL_BSSP_SECURITIES_ACCOUNTFeeder Class: BSSP_SECAC BOR Object:

Description

This CHIP displays the data of the securities account.

Inports

Port Parameter Data Element Parameter Tags

SECAC BSSP_SECACC /BSSP/:SECAC

BUKRS BUKRS /BSSP/:BUKRS

Page 28: CHIP Catalog.pdf0

Security ID NumberCHIP Name: X-SAP-WDY-CHIP:BSSP_FINANCIAL_PRODUCT

CL_BSSP_FINANCIAL_PRODUCTFeeder Class: BUS1076 BOR Object:

Description

This CHIP displays the data of the security ID number.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 2.

Inports

Port Parameter Data Element Parameter Tags

SECURITY_NUMBER VVRANLWTR /BSSP/:SECURITY_NUMBER

Page 29: CHIP Catalog.pdf0

Accounts Payable ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_AP

: CL_BSSP_FINREP_FI_APFeeder Class: LFB1 BOR Object

Description

This CHIP displays links to the accounts payable reporting.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS

Page 30: CHIP Catalog.pdf0

Accounts Receivable ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_AR

: CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object

Description

This CHIP displays links to the accounts receivable reporting.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 31: CHIP Catalog.pdf0

Asset Accounting ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_AA

: CL_BSSP_FINREP_FI_AAFeeder Class: BUS1022 BOR Object

Description

This CHIP displays links to the asset accounting reporting.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports

Port Parameter Data Element Parameter Tags

BUKRS BUKRS /BSSP/:BUKRS

ANLN1 ANLN1 /BSSP/:ANLN1

ANLN2 ANLN2 /BSSP/:ANLN2

Page 32: CHIP Catalog.pdf0

Cost Center ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_CO_OM_CCA

: CL_BSSP_FINREP_CO_OMFeeder Class: BUS0012 BOR Object

Description

This CHIP displays links to the cost center reporting.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports

Port Parameter Data Element Parameter Tags

KOKRS KOKRS /BSSP/:KOKRS

KOSTL KOSTL /BSSP/:KOSTL

Page 33: CHIP Catalog.pdf0

Document FlowCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_DOCFLOW

: CL_BSSP_DOCUMENT_FLOW Feeder Class

Description

This CHIP displays a link to the Document Relationship Browser.

Inports

Port Parameter Data Element Parameter Tags

BORTYPE SWO_OBJTYP /BSSP/:BORTYPE

Page 34: CHIP Catalog.pdf0

Email ServicesCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_EMAIL

: CL_BSSP_EMAIL Feeder Class

Description

This CHIP displays links to Email Services

Inports

Port Parameter Data Element Parameter Tags

BORTYPE SWO_OBJTYP /BSSP/:BORTYPE

Page 35: CHIP Catalog.pdf0

Internal Order ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_CO_OM_OPA

: CL_BSSP_FINREP_CO_OMFeeder Class: BUS2075 BOR Object

Description

This CHIP displays links to the internal order reporting.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports

Port Parameter Data Element Parameter Tags

AUFNR AUFNR /BSSP/:AUFNR

KOKRS KOKRS /BSSP/:KOKRS

Page 36: CHIP Catalog.pdf0

General Ledger ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_GL

: CL_BSSP_FINREP_FI_GLFeeder Class: BUS3006BOR Object

Description

This CHIP displays links to the general ledger reporting.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports

Port Parameter Data Element Parameter Tags

BUKRS BUKRS /BSSP/:BUKRS

SAKNR SAKNR /BSSP/:SAKNR

Page 37: CHIP Catalog.pdf0

Product Cost ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_CO_PC

: CL_BSSP_FINREP_CO_PCFeeder Class: BUS1001 BOR Object

Description

This CHIP displays links to the product cost reporting.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.

Inports

Port Parameter Data Element Parameter Tags

MATNR MATNR /BSSP/:MATNR

Page 38: CHIP Catalog.pdf0

Asset Accounting Posted DepreciationCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AA_POSTED_DEPREC_C

CL_BSSP_FINREP_FI_AAFeeder Class: BUS1022 BOR Object:

Description

This CHIP displays the posted depreciation in asset accounting.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

BUKRS BUKRS /BSSP/:BUKRS

ANLN1 ANLN1 /BSSP/:ANLN1

ANLN2 ANLN2 /BSSP/:ANLN2

Page 39: CHIP Catalog.pdf0

Cost Center Breakdown Actual Planned Costs byPeriodCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_CC_PERIOD_BD_C

CL_BSSP_FINREP_CO_OM Feeder Class: BUS0012 BOR Object:

Description

This CHIP displays the breakdown of actual versus planned costs by period for a certain cost center.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

KOKRS KOKRS /BSSP/:KOKRS

KOSTL KOSTL /BSSP/:KOSTL

Page 40: CHIP Catalog.pdf0

Cost Center Cumulative Actual versus Planned CostsCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_CC_ACT_PLAN_AGGR_C

CL_BSSP_FINREP_CO_OMFeeder Class: BUS0012 BOR Object:

Description

This CHIP displays the cumulative actual versus planned costs for a certain cost center.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

KOKRS KOKRS /BSSP/:KOKRS

KOSTL KOSTL /BSSP/:KOSTL

Page 41: CHIP Catalog.pdf0

Customer Balances Period Drill DownCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_PERIOD_C

CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object:

Description

This CHIP displays a period drill down for customer balances.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 42: CHIP Catalog.pdf0

Customer Balances TotalsCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_TOTALS_C

CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object:

Description

This CHIP displays the totals for customer balances.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 43: CHIP Catalog.pdf0

Customer Due Date AnalysisCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_ANALYSIS_C

CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object:

Description

This CHIP displays a due date analysis for a certain customer.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 44: CHIP Catalog.pdf0

Customer Due Date ForecastCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_FORECAST_C

CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object:

Description

This CHIP displays a due date forecast for a certain customer.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 45: CHIP Catalog.pdf0

Customer Overdue AnalysisCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_OVERDUE_C

CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object:

Description

This CHIP displays an overdue analysis for a certain customer.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 46: CHIP Catalog.pdf0

General Ledger Account BalanceCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_GL_ACC_BALANCE_C

CL_BSSP_FINREP_FI_GLFeeder Class: BUS3006 BOR Object:

Description

This CHIP displays the data of the G/L account balance.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

BUKRS BUKRS /BSSP/:BUKRS

SAKNR SAKNR /BSSP/:SAKNR

Page 47: CHIP Catalog.pdf0

Internal Order Actual vs. Planned Costs by PeriodCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_IO_PERIOD_BD_C

CL_BSSP_FINREP_CO_OMFeeder Class: BUS2075 BOR Object:

Description

This CHIP displays the cumulative actual versus planned costs for an internal order.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

AUFNR AUFNR /BSSP/:AUFNR

KOKRS KOKRS /BSSP/:KOKRS

Page 48: CHIP Catalog.pdf0

Internal Order Cumulative Actual-Planned CostsCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_IO_ACT_PLAN_AGGR_C

CL_BSSP_FINREP_CO_OMFeeder Class: BUS2075 BOR Object:

Description

This CHIP displays the cumulative actual versus planned costs for an internal order.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

AUFNR AUFNR /BSSP/:AUFNR

KOKRS KOKRS /BSSP/:KOKRS

Page 49: CHIP Catalog.pdf0

Material - Aggregated Actual versus Planned CostsCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_PC_MAT_ACT_PLAN_AGGR_C

CL_BSSP_FINREP_CO_PCFeeder Class: BUS1001 BOR Object:

Description

This CHIP displays the aggregated actual versus planned costs for a material.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package

Inports

Port Parameter Data Element Parameter Tags

MATNR MATNR /BSSP/:MATNR

Page 50: CHIP Catalog.pdf0

Material - Breakdown Actual versus Planned CostsCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_PC_MAT_PERIOD_BD_C

CL_BSSP_FINREP_CO_PCFeeder Class: BUS1001 BOR Object:

Description

This CHIP displays the breakdown of the actual versus planned costs by period for a material.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

MATNR MATNR /BSSP/:MATNR

Page 51: CHIP Catalog.pdf0

Vendor Balances - Period DrilldownCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_PERIOD_C

CL_BSSP_FINREP_FI_APFeeder Class: LFB1 BOR Object:

Description

This CHIP displays the period drilldown for vendor balances.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS

Page 52: CHIP Catalog.pdf0

Vendor Balances _ TotalsCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_TOTALS_C

CL_BSSP_FINREP_FI_APFeeder Class: LFB1 BOR Object:

Description

This CHIP displays the vendor balances.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS

Page 53: CHIP Catalog.pdf0

Vendor Due Date AnalysisCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_DUE_ANALYSIS_C

CL_BSSP_FINREP_FI_APFeeder Class: LFB1 BOR Object:

Description

This CHIP displays the analysis of the vendor due dates.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS

Page 54: CHIP Catalog.pdf0

Vendor Due Date ForecastCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_DUE_FORECAST_C

: CL_BSSP_FINREP_FI_APFeeder Class LFB1 BOR Object:

Description

This CHIP displays the vendor due date forecast.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS

Page 55: CHIP Catalog.pdf0

Vendor Overdue AnalysisCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_OVERDUE_C

CL_BSSP_FINREP_FI_APFeeder Class: LFB1 BOR Object:

Description

This CHIP displays the vendor overdue analysis.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS

Page 56: CHIP Catalog.pdf0

Asset Accounting - Posted DepreciationCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AA_POSTED_DEPREC

CL_BSSP_FINREP_FI_FORMFeeder Class: BUS1022 BOR Object:

Description

This CHIP displays the posted depreciation in asset accounting.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

BUKRS BUKRS /BSSP/:BUKRS

ANLN1 ANLN1 /BSSP/:ANLN1

ANLN2 ANLN2 /BSSP/:ANLN2

Page 57: CHIP Catalog.pdf0

Customer Balances - TotalsCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_TOTALS

CL_BSSP_FINREP_FORMFeeder Class: KNB1 BOR Object:

Description

This CHIP displays the totals for the customer balances.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 58: CHIP Catalog.pdf0

Customer Due Date Analysis.CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_ANALYSIS

CL_BSSP_FINREP_FORMFeeder Class: KNB1 BOR Object:

Description

This CHIP displays the due date analysis for a customer.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 59: CHIP Catalog.pdf0

Customer Due Date Forecast.CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_FORECAST

CL_BSSP_FINREP_FORMFeeder Class: KNB1 BOR Object:

Description

This CHIP displays the due date forecast for a customer.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 60: CHIP Catalog.pdf0

Customer Overdue Analysis.CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_OVERDUE

CL_BSSP_FINREP_FORMFeeder Class: KNB1 BOR Object:

Description

This CHIP displays the overdue analysis for a customer.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 61: CHIP Catalog.pdf0

Internal Order - Cumulative Actual versus PlannedCostsChip Name: X-SAP-WDY-CHIP:BSSP_CO_OM_IO_ACT_PLAN_AGGR

CL_BSSP_FINREP_FORMFeeder class: BUS2075BOR object:

Description

This CHIP displays the cumulative actual versus planned costs for an internal order.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Port Parameter Data Element Parameter Tags

AUFNR AUFNR /BSSP/:AUFNR

KOKRS KOKRS /BSSP/:KOKRS

Page 62: CHIP Catalog.pdf0

Material Aggregated Actual versus Planned CostsCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_PC_MAT_ACT_PLAN_AGGR

CL_BSSP_FINREP_FORMFeeder Class: BUS1001 BOR Object:

Description

This CHIP displays the aggregated actual versus planned costs for a material.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

MATNR MATNR /BSSP/:MATNR

Page 63: CHIP Catalog.pdf0

Vendor Balances - TotalsCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_TOTALS

CL_BSSP_FINREP_FORMFeeder Class: LFB1 BOR Object:

Description

This CHIP displays the totals for the vendor balances.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS

Page 64: CHIP Catalog.pdf0

Vendor Due Date Analysis.CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_DUE_ANALYSIS

CL_BSSP_FINREP_FORMFeeder Class: LFB1 BOR Object:

Description

This CHIP displays the analysis of the vendor due dates.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4.

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS

Page 65: CHIP Catalog.pdf0

Vendor Due Date Forecast.CHIP Name: X-SAP-WDY-CHIP: BSSP_FI_AP_DUE_FORECAST

CL_BSSP_FINREP_FORMFeeder Class: LFB1 BOR Object:

Description

This CHIP displays the due date forecast for a vendor.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS

Page 66: CHIP Catalog.pdf0

Vendor Overdue Analysis.CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_OVERDUE

CL_BSSP_FINREP_FORMFeeder Class: LFB1 BOR Object:

Description

This CHIP displays the overdue analysis for a vendor.

Information for Side-by-Side Scenario

Available as of ECC 6.0, Enhancement Package 4

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS

Page 67: CHIP Catalog.pdf0

Web Services (Bank)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_BANKL

CL_BSSP_LAUNCHPAD_LINKSFeeder Class: BUS1011 BOR Object:

Description

This CHIP displays links to external Web Services

Inports

Port Parameter Data Element Parameter Tags

BANKS BSSP_BANKS /BSSP/:BANKS

BANKL BSSP_BANKL /BSSP/:BANKL

Page 68: CHIP Catalog.pdf0

Web Services (Business Partner)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_BUPA

CL_BSSP_LAUNCHPAD_LINKSFeeder Class: BUS1006 BOR Object:

Description

This CHIP displays links to external web services.

Inports

Port Parameter Data Element Parameter Tags

PARTNER BU_PARTNER /BSSP/:PARTNER

Page 69: CHIP Catalog.pdf0

Web Services (Company)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_RCOMP

CL_BSSP_LAUNCHPAD_LINKSFeeder Class: BUS0014 BOR Object:

Description

This CHIP displays links to external Web Services

Inports

Port Parameter Data Element Parameter Tags

RCOMP RCOMP_D /BSSP/:RCOMP

Page 70: CHIP Catalog.pdf0

Web Servics (Cost Center)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_KOSTL

CL_BSSP_LAUNCHPAD_LINKSFeeder Class: BUS0012 BOR Object:

Description

This CHIP displays links to external Web Services

Inports

Port Parameter Data Element Parameter Tags

KOKRS KOKRS /BSSP/:KOKRS

KOSTL KOSTL /BSSP/:KOSTL

Page 71: CHIP Catalog.pdf0

Web Services (Customer)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_KUNNR

CL_BSSP_LAUNCHPAD_LINKSFeeder Class: KNB1 BOR Object:

Description

This CHIP displays links to external Web Services

Inports

Port Parameter Data Element Parameter Tags

KUNNR KUNNR /BSSP/:KUNNR

BUKRS BUKRS /BSSP/:BUKRS

Page 72: CHIP Catalog.pdf0

Web ServicesCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES

CL_BSSP_LAUNCHPAD_LINKS Feeder Class:

Description

This CHIP displays links to external Web Services.

Inports

Port Parameter Data Element Parameter Tags

BORTYPE SWO_OBJTYP /BSSP/:BORTYPE

Page 73: CHIP Catalog.pdf0

Web Services (Profit Center)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_PRCTR

CL_BSSP_LAUNCHPAD_LINKSFeeder Class: BUS0015 BOR Object:

Description

This CHIP displays links to external Web Services

Inports

Port Parameter Data Element Parameter Tags

PRCTR PRCTR /BSSP/:PRCTR

KOKRS KOKRS /BSSP/:KOKRS

Page 74: CHIP Catalog.pdf0

Web Services (Vendor)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_LIFNR

CL_BSSP_LAUNCHPAD_LINKSFeeder Class: LFB1 BOR Object:

Description

This CHIP displays links to external Web Services

Inports

Port Parameter Data Element Parameter Tags

LIFNR LIFNR /BSSP/:LIFNR

BUKRS BUKRS /BSSP/:BUKRS