Chip PCBChip PCB

08 Journal of the HKPCA / Issue No. 41 / 2011/ Q3

Technical Paper

Chip PCB

1.

2+HDI PCB GME

SMT

PP

PP

FR4

Plasma

Set unit Fiducial Mark

0201

34000 Dppm 990

Dppm PCB 36.7% 94%

III 2200 486

13 PCB 50%

30%

PCB

Integrated Passive

Embedded Passive Technology

FR4

PCB

Patent Ohmega-

ply Buried Resistor BR

Samina Buried Capacitor BC

10~20%

Chip

5%

PCB

GME

PoP Package on Package

1

PoP 3D

PoP

PoP

09

Technical Paper

www.hkpca.org

PCB

2 PoP

Package

PCB

2+4+2 HDI

L4/5 L4 L5

3

2. PCB

1

L3/4 L5/6

L3/4

L5/6 2+2

86 22 /Unit

PCB

Solder Mask

2

2

3

UV OSP

SMT

3

4

5

80%

1

L5

0.35mm L45

0.40~0.5mm

2

Cavity

Panel 16 X 18 6sets/PNL

12units/set 7776 /Pnl

PCB

6X 260

20s

10 Journal of the HKPCA / Issue No. 41 / 2011/ Q3

Technical Paper

1

4

3.

3.1

0.2~0.5kgf

2

1) + 2) 3)

Mylar

Mylar 4) 5) 6) U V 7)

4

0201

PCBA PCBA

PCB

DI

Cl <4.5ug/inch

1

0.23~0.35mm

0.3mm

PP IR

Reflow 6

- 2

3.2

3.3

5

6 +PP

11

Technical Paper

www.hkpca.org

2

PP 7

7 PP

3.4

0201

PP 4-6cm

8

9

8

1~2cm

9

12 Journal of the HKPCA / Issue No. 41 / 2011/ Q3

Technical Paper

3.5

4.1 :

4.

1

2 ( 10) L4

OSP

Reflow

DI Plasma PP

L3/4+L5/6

L4 SMT

1.2mm

2+HDI

( )

Unit 36.7% 1 Unit 108

unit

11

sets units /

units (per units) /

83 996 476 3690 3.43%47.8%

22ohm

4700ohm

10

13

Technical Paper

www.hkpca.org

Cpk

+/-3%

10000ohm

11

220nF

+/-20% +/-10%

PCB

288 10s Solder Float

13:

4.2

Tg

14

6600nF

12

13

14

Plasma PP Reflow

Tg

CTE

14 Journal of the HKPCA / Issue No. 41 / 2011/ Q3

Technical Paper

1.

2. Line mask

PP

+/-3% +/-

20%

15

PTH

Panel Form

4.3

15

R35 R34

short

R57 /

PTH

C22 C23 C22

SMT

1) 6set/Panel 16" X 18"

14 X 16

2)

3) unit Fiducial Mark

Unit Unit Mark

4

5

16

)

)

15

Technical Paper

www.hkpca.org

0201

0201

6

0.005

0.008 1.1

7 10Kohm 0402

IVH 0.15

2.5mil

2+HDI

+/-2.5mil

0201 10Kohm

0.2mm 5.5mil

)

)

8 SMT)

4.4 8 3 L4

16

17

Panel

547 DPPM

3 X-out 16.3%

94% 64 Sets

fail rate( by set) 68 13 19.12%

fail rate( by unit) 813 18 2.21%

fail rate( by component) dppm 87804 48 547

1 LOT 2 LOT 3 LOT

(108 ) (108 ) (108 )

PCB board yield 78.20% 97.20% 98%

rate (by unit)

Components yield 61.11% 81.70% 91.88%

rate (by unit)

Failed components 3.40% 1.36% 0.099%

rate (by qty)

Failed components 34000 13600 990

DPPM

st nd rd

Total yeild rate 49.10% 78.90% 94%

16 Journal of the HKPCA / Issue No. 41 / 2011/ Q3

Technical Paper

18

4.5

PCB

4 Reflow

+/-5% +/-20%

5X 4X 6X 10X Reflow

SMT

5. Chip PCB

1. PCB

Build-up

2. 0201 0402 Chip

IC

3. Through Via,

IVH, BVH and ALV/ViP inter-connections

HDI Rigid-flex

19

6.

PoP

---

2005.2

OKI

DNP Embedded Passive Device B2it PCB