Change in the Packaging of MELSEC iQ-R Series Products ......Change in the Packaging of MELSEC iQ-R...
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TECHNICAL BULLETIN [ 1/4 ] FA-A-0314-A HEAD OFFICE : TOKYO BUILDING, 2-7-3 MARUNOUCHI, CHIYODA-KU, TOKYO 100-8310, JAPAN NAGOYA WORKS : 1-14 , YADA-MINAMI 5-CHOME , HIGASHI-KU, NAGOYA , JAPAN Change in the Packaging of MELSEC iQ-R Series Products (Manufactured in August 2020 and after) Date of Issue August 2020 Relevant Models RX41C4, RX42C4, RX71C4, RX72C4, RY41NT2P, RY42NT2P, RY41PT1P, RY42PT1P, RX41C6HS, RX61C6HS, RY41NT2H, RY41PT2H, RD75P2, RD75P4, RD75D4, RD62P2, RD62D2, RD62P2E, RD40PD01, R60AD8-G, R60DA8-G, R60RD8-G, RG60, R00CPU, R01CPU, R02CPU Thank you for your continued support of Mitsubishi Electric programmable controllers. We are informing you that the packaging for some MELSEC iQ-R series products has been changed. There is no impact on the product functions and performance due to this change.
Transcript of Change in the Packaging of MELSEC iQ-R Series Products ......Change in the Packaging of MELSEC iQ-R...
TECHNICAL BULLETIN [ 1 / 4 ]FA-A-0314-A
Change in the Packaging of MELSEC iQ-R Series Products (Manufactured in August 2020 and after)Date of IssueAugust 2020Relevant ModelsRX41C4, RX42C4, RX71C4, RX72C4, RY41NT2P, RY42NT2P, RY41PT1P, RY42PT1P, RX41C6HS, RX61C6HS, RY41NT2H, RY41PT2H, RD75P2, RD75P4, RD75D4, RD62P2, RD62D2, RD62P2E, RD40PD01, R60AD8-G, R60DA8-G, R60RD8-G, RG60, R00CPU, R01CPU, R02CPU
Thank you for your continued support of Mitsubishi Electric programmable controllers.We are informing you that the packaging for some MELSEC iQ-R series products has been changed.There is no impact on the product functions and performance due to this change.
HEAD OFFICE : TOKYO BUILDING, 2-7-3 MARUNOUCHI, CHIYODA-KU, TOKYO 100-8310, JAPANNAGOYA WORKS : 1-14 , YADA-MINAMI 5-CHOME , HIGASHI-KU, NAGOYA , JAPAN
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1 TARGET MODELS AND BOX SIZERelevant model Box size
Product Model Before change After changeDC input module RX41C4 160 (W) 147 (D) 47 (H) [mm] 124 (W) 121 (D) 40 (H) [mm]
RX42C4
RX71C4
RX72C4
Transistor output module RY41NT2P
RY42NT2P
RY41PT1P
RY42PT1P
DC high-speed input module RX41C6HS
RX61C6HS
Transistor high-speed output module RY41NT2H
RY41PT2H
Positioning module RD75P2
RD75P4
RD75D4
High-speed counter module RD62P2
RD62D2
RD62P2E
Flexible high-speed I/O control module RD40PD01
Channel isolated analog-digital converter module
R60AD8-G
Channel isolated digital-analog converter module
R60DA8-G
Channel isolated RTD input module R60RD8-G
Blank cover module RG60
Programmable controller CPU R00CPU
R01CPU
R02CPU
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The following shows the external appearance and materials before and after change.
2 REASON FOR THE CHANGEBuffer materials are changed to cardboard in compliance with ISO 14001 (environmental management) to reduce environmental burden.
3 DATE OF CHANGEThe changes will take place on and after August 2020.Note that, depending on stock status, both the old and new boxes may be distributed in the market around that time.
Before change After change
Cardboard (outer packaging) + molded pulp (two piece of inner packaging)
Cardboard (outer packaging)
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REVISIONSVersion Date of Issue RevisionA August 2020 First edition
