Ceramic Substrates for theElectronics Industry

T H E C E R A M I C E X P E R T S

Electronic Applications Division

2

Substrates for thick-film

and thin-film technology

- stamped

- laser-machined

- dry-pressed

- green scored

❍

Power electronic materials

Ceramic Competence in Electronic Applications

CeramTec’s experience in manufacturing

ceramic products goes back to the earliest

days of electronics. Since then, our company

has evolved into a leading manufacturer of

aluminum oxide and aluminum nitride sub-

strates. Ceramics made by CeramTec have

found their way into a wide range of elec-

tronic applications, with client industries rang-

ing from automotive engineering, sensors,

optoelectronics, aerospace, navigation, power

electronics, instrumentation, and control

systems, medical equipment, telecommuni-

cations, industrial, and entertainment elec-

tronics. CeramTec’s products are noted for

their dependable performance under demand-

ing day-to-day operating conditions and are

essential to the safe and reliable functioning of

a wide range of systems.

In the manufacture of electronic compo-

nents, uncompromising quality is a first and

foremost requirement. Each material must

meet narrowly defined specifications. Opti-

mum physical properties and a long service life

are as essential as dimensional accuracy for

the use of automated processing lines.

Marktredwitz facility

While we are well aware of the global

nature of the electronics marketplace, our

customers appreciate a supplier with a local

presence. This need has prompted us to build

a worldwide manufacturing base which, in

addition to our Marktredwitz facility, relies on

production sites and lasering facilities in

Europe, North America, and Asia. Advanced

manufacturing processes allow us to supply

volume production parts with very high levels

of consistancy, dimensional accuracy, and pre-

cision. CeramTec also produces a range of

metallized substrates. Please contact us for a

separate brochure.

CeramTec is setting new standards in all

areas of quality management. CeramTec’s

declared goal is corporate-wide quality and

its continuous improvement. Customer satis-

faction is the main objective driving all our

activities. A comprehensive company-wide

quality system allows us to supply products

and services fully in line with your expec-

tations.

In 1996, CeramTec was granted the

“Quality Award for Excellent Corporate

Quality” by the Bavarian State Ministry of

Economics, Transport, and Technology. The

quality management system in force at our

Marktredwitz facility, where our ceramics for

the electronics industry are manufactured, has

been audited and certified to DIN EN ISO 9001

and QS 9001 by an independent institution.

Corporate quality does not only comprise

the consistent verification of product and

manufacturing qualities, but also requires a

continuous effort to improve and redesign

entire processes. Prevention-oriented methods

and systems help to preclude misunderstand-

ings and errors before they occur. Moreover,

each member of our workforce is responsible

for the quality of his or her output. Individual

units and operators are expected to design

and demonstrate viable error prevention

schemes and rugged, statistically stable

processes in their respective areas. The

systems in place are then evaluated against

defined process specifications through in-

house process and system audits.

Naturally, corporate quality also means

that our suppliers, as important partners, are

integrated into the process of delivering

customer satisfaction. For this reason, we do

everything to assure that our suppliers will

consistently support and fulfill CeramTec's

high quality standards.

A New Dimension of Quality

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Bavarian State Ministry's Quality Award

Each member of our workforce carries his or her own

responsibility for job performance

Substrates – the foundation for

innovative solutions

Hybrid microelectronic circuits form the

basis of a wide range of electronic applica-

tions. The growing integration density of elec-

tronic circuits, which is a result of the market's

demand for increasingly miniaturized products,

calls for ever new solutions in the field of sub-

strates. Ceramic components in electronic

devices must resist high mechanical, thermal,

and electrical loads while simultaneously per-

forming with the utmost reliability. Our ad-

vanced high-performance materials are de-

signed to meet these needs.

Rubalit® – superior substrate materials

from a global leader

A key prerequisite for CeramTec’s success-

ful partnership with the electronics industry is

the ability to deliver the right materials. The

family of Rubalit® materials developed by

our company has become a byword of quality

among the world's most renowned manu-

facturers of hybrid circuits and has established

itself as the standard choice in many elec-

tronic circuit applications.

High strength and thermal conductivity

are the characterizing features of these sub-

strate materials. Providing an outstanding sur-

face quality on both faces, Rubalit® 708 S

(96% Al2O3) gives outstanding results with

commercially available thick-film pastes and

metallization systems. In addition, this mate-

rial is suitable for both fine line and some-

times thin-film applications. For optimum

results in thin-film technology, Rubalit® 710

(99.6% Al2O3) is the material of choice.

High-Performance Materials for Electronic Applications: Rubalit® Aluminum Oxide Ceramics

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Structure of Rubalit® 708 S10 µm

Structure of Rubalit® 71010 µm

Formats and standard sizes for Rubalit® 708 S and Rubalit® 708 HP

Width Length Thickness min. Thickness max.

115 115 0.20 1.50

138 188 0.25 1.50

203 272 0.50 1.00

all information in mm

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Cool solutions for power electronics

Progressive advances in power electronics

have called for the use of sophisticated cool-

ing systems to dissipate the intense heat

build-up. For example, special heat ex-

changers based on our Alunit® material

allow the use of water as a cooling fluid as a

substitute for environmentally hazardous oil-

cooling systems. Used as mountings for elec-

tronic power components, these heat ex-

changers dissipate heat at its point of origin.

Alunit® for maximum performance

With its extremely high thermal conduc-

tivity of 180 W/mK and outstanding electrical

insulation properties, Alunit® is the high-end

supplement to our Rubalit® range. The ther-

mal expansion coefficient of this material

is comparable to silicon. Its electrical and

mechanical characteristics are similar to alu-

minum oxide. Like Rubalit®, Alunit® is non-

toxic and environmentally compatible, pre-

senting no disposal problems.

These new properties open entirely new

fields of application in advanced circuit en-

gineering. With its enhanced heat dissipation,

Alunit® enables the production of compact

high-performance solutions. It is the preferred

substrate for power hybrid and VLSI-type

MCM circuits. Our product range includes

substrates and dry-pressed components made

to customer’s specifications ready for further

processing, and also products already subjec-

ted to finishing operations such as lasering,

grinding, and polishing.

As-fired Alunit® surface

Ground Alunit® surface

Polished Alunit® surface

Comparison of thermal conductivity levels:

plastics, Al2O3 and AIN

High-Performance Materials for Electronic Applications: Alunit® Aluminum Nitride Ceramics

300

250

200

150

100

50

BeOAlNAl2O3

Glass, polymers

Thermal conductivity

20 oC0

100 oC 200 oC

Formats and standard sizes for Alunit® „as fired“

Width Length Thickness min. Thickness max.

110 127 0.50 1.27

138 188 0.50 1.27

all information in mm

Material Characteristics of Rubalit®

and Alunit®

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Property Units Rubalit® 708 S Rubalit® 710 Alunit® Test per

96% Al2O3 99.6% Al2O3 AlN

Color – white white translucent –

medium gray

Medium grain size d50 µm 3 –5 2 4 –5 –

Surface roughness Ra µm 0.6 max 0.1 0.6 max Profilometer

(0.8 mm cutoff)

Bulk density kg/m3 3780 3900 3330 ASTM C 20

Water absorption capacity % 0 0 0 ASTM C 373

Bending strength

- 4-point method (40 x 4 x 3 mm3) MPa 400 360 ASTM F 417

- dual-ring method MPa 500 400 DIN 52292

(0.63 mm substrate thickness)

Modulus of elasticity GPa 340 350 320 ASTM F 417

Thermal conductivity 20–100 ºC W/m ºK 24 28 180 ASTM C 408

Specific heat J/kg ºK 800 800 738

Coefficient of linear expansion 10-6/ºK ASTM C 372

20 – 300 ºC 6.8 6.8 4.7

20 – 600 ºC 7.3 7.5 5.2

20 – 1000 ºC 8.0 8.5 5.6

Dielectric constant ASTM C 150

- 1 MHz 9.8 ± 10% 10.1 ± 10% 9.0 ± 10%

- 1 GHz 10.0 ± 10% 10.1 ± 10%

Dielectric loss factor (1 MHz) 10-3 0.3 0.2 0.4 ASTM D 150

Breakdown voltage KV/mm ASTM D 149

- 1 mm substrate thickness 15 16

- 0.63 mm substrate thickness 20 >10

- 0.25 mm substrate thickness 28

Volume resistivity Ohm x cm ASTM D 257

- 20 °C 1013 1013 1013

- 200 ºC 1012 1013

- 400 ºC 1011 1012

- 600 ºC 108 109

Indexes and parameters for ceramic substancesIn order to profile ceramic substances certain parameters are indicated. The crystalline nature of these substances, statistical fluctuations in the composition of the substances and in the factors that impact on the production processes indicate that the figures quoted are typically mean values and hence the substance para-meters quoted in this brochure are only standard, recommended or guide values that might differ given dissimilar dimensions and production processes.

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Manufacturing Perfection

Raw materialsincoming inspection

Feedstock preparation

In-process inspection

In-process inspection In-process inspection

In-process inspection In-process inspection

In-process inspection

In-process inspection

In-process inspection

In-process inspection Quality certification

Quality certification

Quality certification

Tape casting

Stamping Firing

Firing

In-process inspection

In-process inspection

In-process inspection

Tape casting

Stamping

Firing Machining

Laser cutting Packaging

Packaging

Packaging Shipping

Shipping

Shipping

Machining

Machining

Dry pressing

The production and machining steps per-

formed on substrates and electronic materials

are as diverse as their range of applications.

Over the decades, CeramTec has refined these

individual processes and methods to near

perfection. Quality-monitored operating se-

quences conforming to DIN ISO 9000 form the

basis of a manufacturing process which pro-

vides customer specific parts with the same

precision and reliability as volume-produced

standard parts. Our improvement manage-

ment assures continuous process refinement

and ongoing increased efficiency. The result is

a range of cost-effective, reliable manufac-

turing processes that benefit your products.

The substrates used for hybrid circuits are

primarily of the tape-cast type. This enables

quality efficient casting of various thicknesses

of “green” tapes which are then stamped

and sintered, and in some cases, subsequently

lasered.

Tape casting – the key to quality

substrates

The production of thin substrates relies on

a special technology referred to as tape

casting. Substrates are produced from a spe-

cially formulated slurry which is cast into

various thicknesses. CeramTec is a leader in

tape casting. Globally, tape casting is the

dominant technology for processing hybrid

substrates.

Geometries

The stamping process of the “green” tape

yields substrates of various geometries, cut-

outs, and hole patterns produced to cus-

tomer’s specifications. Stamping is the ideal

volume production method, allowing even

complex structures and geometries to be made

in a cost-effective manner by the use of single

or multi-up arrays.

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Special Production Technology for Ultimate Quality

Tape casting

Stamping

0.60 1.20 1.80 2.40 3.00 3.60 4.20

0Ka MgKa SiKa AuMa CaKa

Lasering of the sintered substrates allows

us to produce small diameter holes, cut-outs,

and diverse geometries to very close toler-

ances. Since lasering does not require fabri-

cation of tools, it shortens production cycles

and reduces costs.

Substrates with a thickness of 1 mm or

more are particularly suitable for production

by the dry-pressing method. The high-preci-

sion press tools used in this process are made

at low cost in our own toolmaking depart-

ment. This allows CeramTec to produce sub-

strates with holes, snap-lines of various

thicknesses, and irregular edge contours

quickly and in large numbers.

CAD data transfer

A special service offered to our customers

is the transfer of CAD data via a remote data

transmission line. This assures maximum relia-

bility and precision, in addition to reduced

delivery times.

Sophisticated test and inspection

methods

The quality of your products is assured by

the use of advanced test and inspection

methods. Substrates are automatically checked

for missing or obstructed holes and specified

hole diameters with the aid of optoelectronic

equipment.

EDX microanalysis greatly enhances the

capabilities of the scanning microscope. This

method allows engineers to identify micro-

scopically small surface areas, phases, and

inhomogeneities by chemical analysis.

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Lasering

Optoelectronic inspection

Element analysis

Stamped substrates, whether made to

standard formats or volume-produced to cus-

tomer’s specifications, are characterized by

their smooth and highly regular edges. Even

complex geometries and sophisticated struc-

tures involving cut-outs and holes can be ef-

ficiently manufactured by single and multiple

unit techniques in large volumes. Stamped

multiple unit substrates in standard machine

formats from 2"x 2" through 4"x 4" provide

an extremely cost-effective basis for further

processing. Similarly, substrates for chip resis-

tors can be made as snapstrates (e.g. 3500

up) by the multiple unit technique, classified

according to the required tolerances, again

assuring low downstream processing costs.

Stamped Substrates with High Array Densities

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Snap-lines

Hole

Stamped edge

Resistor networks and chip resistors

Complex geometries

Substrates with holes and snap-lines

Standard formats

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Standard tolerances Special tolerances*

Length and width as-fired ± 0.8%1 ± 0.5%2

Thickness ± 10% ± 7%

Distance between snap-lines ± 0.8%1 ± 0.5%2

After breaking ± 0.8% ± 0.5%

plus additional tolerance for

break-off projections

nominal thickness ≤ 0.635 mm + 0.1 mm (0.0039“) } per edge+ 0.1 mm (0.0039“) } per edge

> 0.635 mm + 0.15 mm (0.0059“) + 0.15 mm (0.0059“)

Hole diameter

under 2 mm ± 0.05 mm (0.002“) ± 0.05 mm (0.002“)

2–10 mm ± 0.10 mm (0.0039“) ± 0.076 mm (0.003“)

over 10 mm ± 0.8% ± 0.5%

Distance between holes

center distance ± 0.8%1 ± 0.5%3

Overall camber

(measured between parallel plates, 45°)

nominal thickness ≥ 0.635 mm 0.3% of length (.003“/“) 0.2% of length (.002“/“)

< 0.635 mm quoted upon request quoted upon request

Perpendicularity ± 0.4% of outside dimension1 ± 0.3% of outside dimension1

Parallelism ± 0.4% of outside dimension ± 0.3% of outside dimension

Radii and corners 0.2 mm (0.0079“) 0.2 mm (0.0079“)

1 but not less than ± 0.1 mm (0.0039“) 2 but not less than ± 0.05 mm (0.002“) 3 but not less than ± 0.076 mm (0.003“)

Stamped Tolerances

*If tight tolerances are required in high

volume production of stamped substrates,

the length and width can be measured

automatically. In this way, the substrates

are ranked into different classes which

have been pre-determined with the cus-

tomer. Within each class, tolerances of up

to ± 0.05 mm are possible.

Diagram showing individual measurements

Computer-controlled CO2-lasers are used

for scribing, cutting, and drilling substrates to

very small tolerances (minimum hole dia-

meter: 0.10 mm). Eliminating the time-con-

suming and costly tool fabrication stage, this

method allows CeramTec to produce sub-

strates with various outside contour geome-

tries, hole patterns, cut-outs, and snape-lines.

For the cost-effective use of highly-com-

plex individual substrates in multiple printing

lines, laser-scribed multiple substrates can be

supplied in all common machine formats

from 2"x 2" to 5"x 6". Each large-size card

(4"x 6") may accommodate up to 13,872

individual substrates measuring 0.75 mm x

1.50 mm. Optimum laser programming for

each application assures the appropriate sin-

gulation results. Under our Quick Service pro-

gram, lasered substrates can be supplied

within 48 hours.

For improved edge properties, CeramTec

offers the following finishing options:

• Lasered substrates

• Edge treated

• Perfect Edge

Lasered Substrates with Tight Tolerances

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Complex geometries

Drilled and scribed

Scribed

Lasered substrates

Perfect Edge

Edge treated

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Lasered substrates Edge treated Perfect Edge PE

Length and widthnominal thickness ≤ 0.635 mm + 0.20 mm (0.0079“)

– 0.05 mm (0.002“) + 0.15 mm (0.0059“) + 0.10 mm (0.0039“)> 0.635 mm ≤ 0.76 mm + 0.25 mm (0.0098“) – 0.05 mm (0.002“) – 0.05 mm (0.002“)

– 0.05 mm (0.002“)> 0.76 mm ≤ 1.0 mm + 0.30 mm (0.0118“)

– 0.10 mm (0.0039“)

Distance from edge to snap-linenominal thickness ≤ 0.635 mm + 0.15 mm (0.0059“)

– 0.05 mm (0.002“)> 0.635 mm ≤ 0.76 mm + 0.20 mm (0.0079“) + 0.10 mm (0.0039“) + 0.075 mm (0.003“)

– 0.05 mm (0.002“) – 0.05 mm (0.002“) – 0.05 mm (0.002“)> 0.76 mm ≤ 1.0 mm + 0.25 mm (0.0098“)

– 0.10 mm (0.0039“)

Distance between snap-lines ± 0.05 mm (0.002“) ± 0.05 mm (0.002“) ± 0,05 mm (0.002“)

Hole spacingdistance from edge to hole center + 0.15 mm (0.0059“) ± 0.05 mm (0.002“)nominal thickness ≤ 0.635 mm – 0.05 mm (0.002“)

+ 0.20 mm (0.0079“) ± 0.05 mm (0.002“) ± 0.05 mm (0.002“)> 0.635 mm ≤ 0.76 mm – 0.05 mm (0.002“)

+ 0.25 mm (0.0098“) ± 0.075 mm (0.003“)> 0.76 mm ≤ 1.0 mm – 0.10 mm (0.0039“)center hole distance ± 0.05 mm (0.002“) ± 0.05 mm (0.002“)

Hole diameterhole diameter at nominal thickness≤ 3 mm ≤ 0.63 mm ± 0.05 mm (0.002“) ± 0.05 mm (0.002“) ± 0.05 mm (0.002“)

> 0.63 mm ± 0.075 mm (0.003“) ± 0.075 mm (0.003“) ± 0.075 mm (0.003“)> 3 mm ≤ 0.63 mm ± 0.075 mm (0.003“) ± 0.075 mm (0.003“) ± 0.075 mm (0.003“)

> 0.63 mm ± 0.10 mm (0.0039“) ± 0.10 mm (0.0039“) ± 0.10 mm (0.0039“)

Thickness ± 10%1 ± 10%1 ± 10%1

Overall camber (measured between parallel plates, 45°)nominal thickness ≥ 0.635 mm 0.3% of length (standard) 0.3% of length (standard) 0.3% of length (standard)

0.2% of length (special) 0.2% of length (special) 0.2% of length (special)< 0.635 mm quoted upon request quoted upon request quoted upon request

Perpendicularity within outside 0.015 mm/25.4 mm 0.0125 mm/25.4 mmdimension tolerance (0.006“/10“) (0.005“/10“)

Parallelism within outside within outside within outsidedimension tolerance dimension tolerance dimension tolerance

Test criteria per agreed specification 1 but not less than ± 0.05 mm (0.002“)

Laser Tolerances

Using production lines with a very high

degree of automation and custom-built tool-

ing, CeramTec produces dry-pressed sub-

strates to customer’s specification in large pro-

duction volumes. Standard dimensions range

up to 88.9 x 88.9 mm (3.5"x 3.5"). In special

cases, substrates up to 115 mm x 115 mm

(4.5"x 4.5") can be produced upon request.

The dry-press process allows the manufacture

of substrates with holes, snap-lines, or irregu-

lar outside contours in almost any thickness

from 0.63 mm to approx. 10 mm. Even differ-

ent thicknesses within the same substrate can

be produced. The dry-pressing method is suit-

able for making substrates of highly complex

geometries, including through-holes and blind

holes of 0.4 mm minimum diameter.

Dry-pressed parts are given their final

shape after the sintering (firing) stage. Various

machining methods such as grinding and

lapping can be employed to achieve superior

surface finishes and tolerances.

Volume Produced Dry-Pressed Substrates

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Multiple parts

Blind holes, downsets, cavities

Precision small pressed parts

Snapped edge and snap-line

Downsets and holes

Edges and recesses

Average peak-to-valley surfaceroughness Ra

of Rubalit® and Alunit®

Dry-pressed and tape-cast substrates

as-fired ≤ 0.6 µm

lapped/ground ≤ 0.8 µm

polished ≤ 0.1 µm

Other surface data (e.g., Rz, Rmax) may be specifiedupon request.

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Standard tolerances Special tolerances

Length and width as-fired ± 1%1 ± 0.7%2

Thickness ± 10% ± 7%

Distance between snap-lines ± 1%1 ± 0.7%2

After singulation ± 1% ± 0.7%

plus additional tolerance for + 0.1 mm (0.0039“) per snapped edge

breakoff projections

Hole diameter

under 2 mm ± 0.05 mm (0.002“) ± 0.05 mm (0.002“)

2–10 mm ± 0.10 mm (0.0039“) ± 0.076 mm (0.003“)

over 10 mm ± 1% ± 0.7%

Distance between holes

center distance ± 1%1 ± 0.7%3

Overall camber

(measured between parallel plates, 45°) 0.4% of length 0.3% of length

Perpendicularity ± 0.5%1

Parallelism within outside dimension tolerance

Radii and corners ≤ 0.2 mm

1 but not less than ± 0.1 mm (0.0039“) 2 but not less than ± 0.05 mm (0.002“) 3 but not less than ± 0.076 mm (0.003“)

1. Cracks (penetrating separation)

2. Chips

3. Scratches, score marks

4. Lumps

5. Burr

6. Ridges

7. Pin holes

8. Waviness

Cracks are defects

≤ 0.02" (0.5 mm)into the surface (t)

≤ 0.0007" (0.018 mm) depth

≤ 0.001" (0.025 mm) height

≤ 0.0008" (0.02 mm) height

≤ 0.001" (0.025 mm) height

≤ 0.007" (0.18 mm) diameter

≤ 0.0024"/ 0.400"(0.06 mm / 10 mm)

Dry-Pressing Tolerances

General substrate visual characteristics (stamped, lasered, and dry-pressed)

T H E C E R A M I C E X P E R T S

CeramTec AG

Innovative Ceramic Engineering

Electronic Applications Division

Lorenzreuther Strasse 2

D-95615 Marktredwitz

Phone: +49 92 31/69-3 84

Fax: +49 92 31/6 24 09

www.ceramtec.deA company of the mg chemical group Dynamit Nobel EL

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This brochure is a general overview of our present state of knowledge and is intended to provide general information and general recommendations regarding ourproducts and their uses. It is subject to change. It is expressly not a guarantee or warrantee of any specific properties of the products and/or materials described or theirsuitability for a particular application. Any existing industrial property rights must be observed. The quality of our products is assured under our Conditions of Sale.

Czech RepublicCeramTec Czech Republic s.r.o.Zerotínova 62CZ-78701 SumperkPhone: +42 05 83/36 91 11Fax: +42 05 83/36 91 90e-mail: ceramtec@ceramtec.czwww.ceramtec.cz

FranceCeramTec France 51, rue PierreF-92110 ClichyPhone: +33 1/47.15.60.94Fax: +33 1/47.15.60.96e-mail: a.hainin@ceramtec.dewww.ceramtec.fr

Great BritainCeramTec UK Ltd.Sidmouth RoadGB-ColytonDevon EX24 6JPPhone: +44 12 97/55 27 07Fax: +44 12 97/55 33 25e-mail: sales@ceramtec.co.uk

CeramTec UK Ltd.Business Unit SPK Cutting Tools Unit 16, Mercia Business VillageTorwood CloseWestwood Business ParkGB-CoventryCV4 8HZPhone: +44 24 76/42 15 31Fax: +44 24 76/42 15 32

ItalyCeramTec Commerciale ItalianaVia Treviglio, 8I-24043 Caravaggio (BG)Phone: +39 03 63/35 91Fax: +39 03 63/35 92 20e-mail: ceramtec@axia.it

CeramTec Italia S.r.I.Innovative Ceramic EngineeringVia Treviglio, 8I-24043 Caravaggio (BG)Phone: +39 03 63/35 91Fax: +39 03 63/35 92 20e-mail: ceramtec@axia.it

ScandinaviaCeramTec Innovative Ceramic EngineeringScandinavian Sales OfficeKlippan 1 JS-41451 Göteborg (Sweden)Phone: +46 31/12 48 00 Fax: +46 31/12 48 03e-mail: hedlund@ceramtec.pp.se

Spain and PortugalCeramTec IbéricaInnovative CeramicEngineering, S.L.Santa Marta, 23-25E-08340 Vilassar de Mar (Barcelona) Phone: +34 93/7 50 65 60Fax: +34 93/7 50 18 12e-mail: ceramtec@terra.es

North AmericaCeramTec North America Corp.Laurens OperationsOne Technology PlaceUSA-Laurens, SC 29360Phone: +1-864-682-3215Fax: +1-864-682-1140e-mail: information@ceramtec.comwww.ceramtec.com

ChinaShanghai CeramTecInnovative Ceramic Engineering Co., Ltd.628, Kang an Road Kang Qiao Industrial Zone201315 Pu Dong ShanghaiPR ChinaPhone/Fax: +86/21 38 12 00 38e-mail: evanxu@online.sh.cn

KoreaCeramTec Korea Ltd.Innovative Ceramic Engineering398-17, Shin Dong, Paldal Ku,Suwon City, Korea, 442-390Phone: +82-31 204-06 63, -06 64Fax: +82-31 204-06 65e-mail: laser98@soback.kornet.net

MalaysiaCeramTec InnovativeCeramic Engineering (M) Sdn. Bhd.Lot 17, Lorong Bunga Tanjung 3/1Senawang Industrial Park70400 Seremban. Negeri SembilanMalaysiaPhone: +60 6/6 77 93 00, +60 6/6 77 98 61 Fax: +60 6/6 77 93 88e-mail: sales@ctmal.po.my

PolandPAWLAK-Sergiusz Pawlakul. Wiejska 3b05-552 LazyPolandPhone: +48 22 757 7008Fax: +48 22 757 7009e-mail: s.pawlak@xl.wp.pl

IndiaIVP LimitedS.N. Redij Marg. GhorupedoMumbai 400 033, IndiaPhone: +91 22 23 75 17 11Fax: +91 22 23 73 90 64e-mail: ivpceramics@vsnl.net

SingaporeCeratronics Trading12 Penjuru CloseSingapore 608615Phone: +65-266 4266Fax: +65-266 5021e-mail: ceratron@mbox3.singnet.com.sg

TaiwanHERR CORPORATION6F-11. No 22 Wu.chuan 2nd RoadHSIN · CHUANG CityTaipei TaiwanPhone: +886-2-2992244Fax: +886-2-2992020e-mail: herr1@ms17.hinet.net

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