© 2016 Paumanok Group Consulting

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Ceramic  Chip  Inductors:    Mul6layered  and  Thin  Film  Ceramic  Inductors    World  Markets,  Technologies  &  Opportuni6es:  

 FY  2016-­‐2021    

Ceramic  Chip  Inductors:    Mul6layered  and  Thin  Film  Ceramic  Inductors    World  Markets,  Technologies  &  Opportuni6es:  

 FY  2016-­‐2021  

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Copyright  ©July  2016  Paumanok  Publica6ons,  Inc.  Published  by:  Paumanok  Publica6ons,  Inc.  

Publica6on  Date:  JULY  2016              

Paumanok  Publica-ons,  Inc.  502  Ballad  Creek  Court  Cary  NC,  27519  USA  

www.paumanokgroup.com  Customer  Service:  (919)  468-­‐0384  Email:  Info@paumanokgroup.com  

   MARKET  RESEARCH  BY  

Dennis  M.  Zogbi  dennis@paumanokgroup.com  

 

© 2016 Paumanok Group Consulting

 

A  NEW  MARKET  RESEARCH  REPORT  COVERING  THE  WORLD  MARKET  FOR:  

•  Mul6layered  Ceramic  Chip  Inductors  

•  Thin  Film  Ceramic  Chip  Inductors  

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TABLE  OF  CONTENTS  •  SECTION  ONE:  INDUCTORS:  GLOBAL  MARKET  UPDATE:  FY  2016  (OUTPERFORMING  IN  PASSIVES)  13  •  SECTION  TWO:  CERAMIC  CHIP  INDUCTORS:  GLOBAL  MARKETS:  FY  2016  (HIGH  GROWTH  FOR  HIGH  FREQUENCY)

 25  •  High  Frequency  Ceramic  Inductors:  (Thick  Versus  Thin  Film):  FY  2016  27  •  Global  ConsumpFon  Value  For  Ceramic  Chip  Inductors  World  Region:  FY  2016  EsFmates  30  •  Ceramic  Inductor  Chip  Markets  By  Case  Size:  FY  2016  35  •  Ceramic  Chip  Inductor  Markets  by  Thickness  (The  Fast  Growth  Low  Profile  Market);  FY  2016  45  •  Ceramic  Chip  Inductor  Markets  By  Inductance  Range  (Nanohenry  nH  Profit  Centers):  FY  2016  50  •  Ceramic  Chip  Inductors:  Demand  By  Q  Range  (In  Ghz):  57  •  Ceramic  Chip  Inductor  Markets  By  Maximum  Rated  Current  (In  Milliamps)  65  •  VENDOR  MARKET  SHARES:  CERAMIC  INDUCTORS:  FY  2016  73  •  Thick  Film  MulFlayered  Ceramic  Chip  Inductor  Vendors:  FY  2016  Sales  and  Market  Shares:  77  •  Thin  Film  Ceramic  Chip  Inductor  Vendors:  FY  2016  Sales  and  Market  Shares:  79  •  CORPORATE  STRATEGIES  IN  DISCRETE  INDUCTORS-­‐  THE  RIGHT  PRODUCT  FOR  THE  RIGHT  MARKET  81  •  THICK  FILM  MULTILAYERED  CERAMIC  CHIP  INDUCTORS:  GLOBAL  PRODUCT  OFFERINGS  AND  COMPETITIVE  ANALYSIS  BY  VENDOR:  FY  

2017  83  •  THIN  FILM  CERAMIC  CHIP  INDUCTORS:  GLOBAL  PRODUCT  OFFERINGS  AND  COMPETITIVE  ANALYSIS  BY  VENDOR:  FY  2017  93  •  SECTION  THREE:  CERAMIC  INDUCTORS:  MARKET  FORECASTS  TO  2021  (HIGH  GROWTH  IN  HIGH  GHZ)  100  •  FORECASTS:  HIGH  FREQUENCY  CERAMIC  INDUCTOR  FORECASTS  TO  2021  100  •  FORECASTS:  GLOBAL  CONSUMPTION  VALUE  FOR  CERAMIC  CHIP  INDUCTORS:  2016-­‐2021  105  •  Market  Forecasts  By  End-­‐Use  Market  Segment:  FY  2016-­‐2021  108  •  Ceramic  Inductor  Markets:  Forecasts  By  Frequency  Band:  FY  2016-­‐2021  115  •  SECTION  FOUR:  PRODUCER  PROFILES  (COMPARING  TECHNOLOGY  PLATFORMS)  123  

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List  of  Tables  •  Figure 1: Global Value of Consumption for Discrete Inductors FY 2003 to FY 2016 Actual 14 •  Figure 2: Global Volume of Consumption for Discrete Inductors: FY 2007-2016 In Billions of Pieces: 16 •  Figure 3: Average Unit Selling Price for Discrete Inductors: FY 2007-2016 (In USD Per Thousand Pieces) 18 •  Figure 4: Inductor Manufacturer's Index: Trends & Directions (Part 1) 20 •  Figure 5: Inductor Manufacturer's Index: Trends & Directions (Part 2) 21 •  Figure 6: Global Consumption Value for Discrete Inductor, Coils and Cores By Configuration: FY 2016 (Surface Mount,

Throughole and Core) 22 •  Figure 7: Global Consumption Value For Surface Mount Inductors By Type: FY 2016 24 •  Figure 8: Global Consumption Value for Multilayered Ceramic Chip Capacitors By End-Use Market Segment: FY 2016 29 •  Figure 9: Global Consumption Value for Ceramic Chip Capacitors By World Region: FY 2016 32 •  Figure 10: High Frequency Ceramic Chip Inductor Markets By Type: (Thick Versus Thin Film): FY 2016 34 •  Figure 11: High Frequency Ceramic Chip Inductor Markets By Case Size: (O1OO5, O2O1, O4O2, O6O3, O8O5, Other): FY

2016 37 •  Figure 12: High Frequency Ceramic Chip Inductors: Competition by Case Size: (Thick Versus Thin Film): FY 2016 42 •  Figure 13: Number of Manufacturers Globally for Ceramic Chip Inductors by Case Size: FY 2016 44 •  Figure 14: Minimum Thickness of MLCI and Thin Film Chip Inductors: 2016 By Case Size (In mm) 47 •  Figure 15: Ceramic Vendors by Case Size and Inductor Thickness (Thick and Thin Film): FY 2016 49 •  Figure 16: Maximum Inductance Capabilities By Chip Inductor Case Size: 52 •  Figure 17: Competitive Environment in Ceramic Chip Inductors By Case Size and Inductance Range: O1OO5 Case Size (0.2

to 47 nH) 53 •  Figure 18: Competitive Environment in Ceramic Chip Inductors By Case Size and Inductance Range: O2O1 Case Size (47 to

100 nH) 54 •  Figure 19: Competitive Environment in Ceramic Chip Inductors By Case Size and Inductance Range: O4O2 Case Size (101 to

330 nH) 55 •  Figure 20: Competitive Environment in Ceramic Chip Inductors By Case Size and Inductance Range: 0603 Case Size (331 to

680 nH) 56 •  Figure 21: Competitive Environment in Ceramic Chip Inductors By Case Size and Inductance Range: O8O5 Case Size

(Legacy Part) 57 •  Figure 22: Technology Trends & Directions: Q Factor By Ceramic Chip Case Size: FY 2016 58 •  Figure 23: High Frequency Ceramic Chip Inductor Market by Minimum Q Factor: FY 2016 60 •  Figure 24: 2 to 3 Minimum Q Factor and Competitive Environment: Leading Edge In Inductive Technology 61 •  Figure 25: 4 to 8 Minimum Q Factor and Competitive Environment: FY 2016 62 •  Figure 26: 9 to 12 Minimum Q Factor and Competitive Environment: FY 2016 63 •  Figure 27: 13+ Minimum Q Factor and Competitive Environment: FY 2016 64 •  Figure 28: Maximum Rated Current In MilliAmps (mA) for Multilayered and Ceramic Thin Film Inductors By Case Size: FY

2016 66 •  Figure 29: Estimated Ceramic Inductor Consumption Value by MilliAmp Range: FY 2016 68 •  Figure 30: Competition In The 80 to 350 mA Range in Ceramic Inductors: FY 2016 69 •  Figure 31: Competition In the 351 to 470 mA Range in Ceramic Inductors: FY 2016 70 •  Figure 32: Competition in the 471 to 900 mA Ceramic Chip Inductor Markets: FY 2016 71 •  Figure 33: Competition in the 900 to 1200 mA Ceramic Chip Inductor Markets: FY 2016 72 •  Figure 34: Competition in the Legacy Ceramic Chip Inductor Markets: FY 2016 73 •  Figure 35: High Frequency Ceramic Chip Inductor Vendors: FY 2016 Sales and Market Shares 76 •  Figure 36: Multilayered Ceramic Chip Inductor Vendors: FY 2016 Sales and Market Shares 78 •  Figure 37: Corporate Strategies in Inductors- The Right Product For The Right Market: FY 2017 82 •  Figure 38: TDK (EPCOS) MLCI Product Offering BY Case Size and Performance Criteria for FY 2017 83

Figure 39: Taiyo Yuden MLCI Product Offering BY Case Size and Performance Criteria for FY 2017 84 Figure 40: Samsung EMCO- MLCI Product Offering BY Case Size and Performance Criteria for FY 2017

85 Figure 41: Murata MLCI Product Offering BY Case Size and Performance Criteria for FY 2017 86 Figure 42: Mag Layers: Product Offering BY Case Size and Performance Criteria for FY 2017 86 Figure 43: AVX Corporation: Product Offering BY Case Size and Performance Criteria for FY 2017 87 Figure 44: Johanson Technology: Product Offering BY Case Size and Performance Criteria for FY 2017

88 Figure 45: Vishay-Dale: Product Offering By Case Size and Performance Criteria for FY 2017 88 Figure 46: Darfon: Product Offering By Case Size and Performance Criteria for FY 2017 89 Figure 46: Token: Product Offering BY Case Size and Performance Criteria for FY 2017 90 Figure 47: Viking: Product Offering BY Case Size and Performance Criteria for FY 2017 90 Figure 48: Chilisin: Product Offering BY Case Size and Performance Criteria for FY 2017 91 Figure 49: AEM Components: Product Offering By Case Size and Performance Criteria for FY 2017 91 Figure 51: Feng Hua Advanced Technology (Yingda Inductor Factory) Product Offering By Case Size and Performance Criteria for FY 2017 92 Figure 52: Shenzhen Microgate: Product Offering By Case Size and Performance Criteria for FY 2017

93 Figure 50: Thin Film Ceramic Chip Inductor Vendors: FY 2016 Sales and Market Shares 80 Figure 51: Murata: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017

94 Figure 52: AVX: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017

95 Figure 53: Vishay-Dale: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017 95 Figure 54: Token: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017

96 Figure 55: AEM: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017

97 Figure 56: Darfon: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017

97 Figure 57: Viking: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017

98 Figure 58: Viking: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017

98 Figure 59: Cyntec: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017

99 Figure 60: High Frequency Bands and Related Nomenclature 101 Figure 61: Ultra Hi-Q Market Drivers (1 to 2.9 GHz): FY 2017-2021 102 Figure 62: Hi-Q Market Drivers (3.1 to 30 GHz): FY 2017-2021 103 Figure 63: Extremely Hi-Q Market Drivers (3.1 to 30 GHz): FY 2017-2021 104 Figure 64: Ceramic Chip Inductors: Global Market Forecasts for Consumption: FY 2016-2021 106 Figure 65: Forecasted Growth In Ceramic Inductors By End-Use Market Segment FY 2016-2021 108 Figure 66: Ceramic Inductor Forecasts By Frequency Range: FY 2016-2021 122

   

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Key  Findings  of  Study  

•  Inductors  outperforming  other  passive  component  products  in  FY  2016  

•  Key  focus  in  Japan,  Korea  and  China  on  producing  inductors  for  increasingly  higher  frequencies.  

•  Mul6layered  ceramic  chip  inductors  and  thin  film  ceramic  inductors  are  driving  component  growth  within  the  magne6cs  segment.  

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Cri6cal  Points  of  Technology  Differen6a6on:    Volumetric  Efficiency  

 •  GOOD-­‐Mul6layered  Ferrite  Metal  Bead  

Technology  –  Limited  by  Frequency  –  Limited  by  Case  Size  

•  BETTER-­‐  Mul6layered  Ceramic  Coil  3-­‐D  Technology  –  Ultra-­‐High  Frequency  Capabili6es  –  Ultra-­‐Small  Case  Sizes  Available  

•  THINNER  Profile-­‐  Thin  Film  Chip  –  Ultra-­‐thin  technology  required  to    –  keep  up  with  MLCC  technology.  

8  ©  2016  Paumanok  Group  Consul6ng      

Discrete Inductors: Type, Construction, Markets, Case Sizes and Vendors: 2007Product Case

Inductor Photo Inductor Type Construction Markets Sizes VendorsTDK

Wireless Handset Taiyo YudenMultilayered Computer Motherboard MurataStacked HDTV Tuner Vishay-Dale

Multilayered Ceramic Inductor Ceramic HDD O2O1 to O8O5 Kyocera/AVXCordless Phone Bourns/JW MillerDigital Camera Johanson TechnologiesGame Console AEM

Gang Song ElectronicsTaiyo YudenTT Electronics

Single Layered Wireless Handset Vishay-DaleFerrite Bead Extruded Ferrite Computer Motherboard O4O2 to 1206 Ceratech (Korea)

or Aluminum HDTV Tuner AEMOxide Materials. AOBA Technology Co. Ltd

Gang Song ElectronicsSkymos Microelectronics Ltd,

Castellated Wireless Handset TDKSingle Layered Computer Motherboard Taiyo YudenExtruded Ferrite HDTV Tuner Qauds and Octels TT Electronicsor Aluminum HDTV Backlight Vishay-Dale

Ferrite Bead Array Oxide Chips MP3 Ceratech (Korea)Connected By Alumina Digital Camera PanasonicBridge. AEMPhotolithography of Wireless Handset Kyocera/AVXInductive Film GPS Products O2O1 to O6O3 Vishay

Thin Film Inductive Chip Deposited On Pagers MurataCeramic Substrate Wireless LAN

TDKNikel-Chromium Wireless Handset Taiyo YudenWire Wrapped around Computer Motherboard Murata

Wirewound Vertical Chip a Vertical Alumina HDTV Tuner 1206 to 2525 PanasonicCore Tokin

CoilcraftVishayEPCOSMurataPanasonicTT Electronics

Nikel-Chromium Wireless LAN Vishay-DaleWire Wrapped around Computer Motherboards 03015 to 0805 Bourns/JW Miller

Wirewound Horizonal Chip a Horizontal Alumina Broadband Infrastructure Ceratech (Korea)Core and Epxoy Johanson TechnologiesMolded API Delevan

AOBA Technology Co. LtdGang Song ElectronicsTechnitrol/Pulse EngineeringABC Taiwan GroupSkymos Microelectronics Ltd,TDKTaiyo Yuden

Molded Ferrite CRT TV Monitor CoilcraftAxial Inductor Materials Thru CRT Computer Monitor Vishay-Dale

Axial Lead Wire VCR 2030 to 5080 API DelevanCD Player GowandaHousehold Appliances Gang Song Electronics

Bourns/JW MillerTDK

Molded Ferrite Household Appliances 5440 To 7080 Taiyo YudenMaterials Through Television Sets Coilcraft

Radial Inductor Radial Lead Frame TT ElectronicsVishay-DaleAPI DelevanBourns/JW MillerTDK

Molded and shaped EPCOSE Ferrite Core Ferrite Materials Telecom Infrastructure Ferroxcube (Yageo)

Into an E Mold SMPS Varies

TDKTelecom Infrastructure Taiyo YudenSMPS EPCOS

Pot Ferrite Core Pot and Fill Design Ultrasonics Ferroxcube (Yageo)Electrolysis Varies API DelevanWelding Gowanda

Spang/Magnetics

Varia%ons  in  Coil  Technology  Key  Technology  Pla4orms:  2016  

Movement  to  Mul6layered  Ceramic  3-­‐Dimensional  Ultra  Small  Case  Size  Chips  {Lawsuit  Murata/Samsung}  Big  Growth  Here.  Module  Integra6on.  

Extruded  Single  Layer  Ferrite  and  Mul6layered  Ferrite  Metals.    Limited  Frequency  Handling.  

Extruded  Single  Layer  Ferrite  and  Mul6layered  Ferrite  Metals.    Pick  and  Place  Solu6on.  Limited  Frequency  Handling.  

Barium  Stron6um  Titanate  Thin  Film  Chips  Samsung  Has  Entered.    TDK  Major  Investment  FY  2017.  Big  Growth  Here.    Hi-­‐Q  Markets.  

Volumetric  Efficiency  Push  is  Constant.  

Volumetric  Efficiency  Push  is  Constant.  

Automo6ve  Legacy  product-­‐  Shape  is  Key.  

Legacy  Products:  White  Goods  

Some  Innova6on  in  Germany  

Some  Innova6on  in  Germany  9  

The  Movement  To  Mul6layered  Ceramic  and  Thin  Film  Inductor  Chips  

 

–  Clear  movement  away  from  mul6layered  ferrite  beads  in  favor  of  mul6layered  3D  formulated  (P90  and  NPO/COG)  ceramic  inductors  for  Smartphones  for  Hi-­‐Q  and  small  case  size-­‐  EIA  0201.  

 –  Clear   movement   to   thin   film   barium   stron6um  6tanate   induc6ve   chips   for   high   Q   applica6ons   for  telema6cs,  transport  and  power.  

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End-­‐Markets  Discussed  

•  Wireless  Handsets  (Communica6on  Modules)  •  Computers  and  Peripherals  •  Consumer  Audio  and  Video  Imaging  •  Automo6ve  and  Transport  •  Specialty  Value-­‐added  and  App  Spec.  

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Regional  Markets  Discussed  

•  Greater  China  •  Japan  •  Europe  •  Americas  •  Rest  of  Asia  

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Technology  Markets  Discussed  

•  MLCI  Markets,  Technologies  &  Opportuni6es:  2016-­‐2021  (NPO  Formula6ons,  P90  Porcelain)  

 •  Thin  Film  Markets,  Technologies  &  Opportuni6es:  2016-­‐2021  (Barium  Stron6um  Titanate)  

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Ceramic  Chip  Inductor  Demand  By  Case  Size  (EIA)  

•  NextGen  008004  •  01005  •  0201  •  0402  •  0603  •  0805  •  1206+  

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Ceramic  Chip  Inductor  Market  Dichotomy:  FY  2017  

•  Chip  Thickness  (Low  Profile)  •  Inductance  By  Case  Size  •  Q  Factor  Trends  •  Rated  Current  

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Market  Shares  FY  2016  

•  Mul6layered  Ceramic  Chip  Inductor  Vendors:  FY  2016  Sales  and  Market  Shares  

•  Thin  Film  Ceramic  Chip  Inductor  Vendors:  FY  2016  Sales  and  Market  Shares  

•  Corporate  Strategies  in  Ceramic  Chip  Inductors:  2016-­‐2021  

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Detailed  Compe66ve  Analysis  

•  Vendors  of  Ceramic  Chip  Inductors  Comparison  by-­‐  – Compe66on  by  Technology  Base:  Thick  or  Thin  Film  

– Compe66on  by  Case  Size  – Compe66on  by  Maximum  Inductance  Value  and  Case  Size  

– Compe66on  by  Frequency  Range  and  Case  Size  – Compe66on  by  Rated  Current  and  Case  Size    

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Forecasts  To  2021  

•  Ceramic  Inductors:  Market  Forecasts  to  2021  (High  Growth  In  High  GHz)  

•  Ultra-­‐Hi-­‐Q  Market  Drivers  (1  to  2.9  GHz):  FY  2017-­‐2021  

•  Super  Hi-­‐Q  Market  Drivers  (3.1  to  30  GHz):  FY  2017-­‐2021  

•  Extremely  Hi-­‐Q  Market  Drivers  (31  to  300  GHz):  FY  2017-­‐2021  

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Producer  Profiles  

•  Detailed  analysis  of  14  Manufacturers  of  Ceramic  Chip  Inductors  in  Both  Thick  and  Thin  Film:  FY  2017  

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Press Release Ceramic Chip Inductors World Markets, Technologies & Opportunities for Multilayered and Thin Film Ceramic Chip Inductors: 2016-2021   A Profitable Look At One of The Next Generation of Passive Electronic Component CARY NC USA- Paumanok Publications, Inc. has published“Ceramic Chip Inductors: World Markets, Technologies & Opportunities: 2016-2021 ISBN #:1-893211-99-1 (MLCI2016).” This new study is a detailed market and competitive analysis covering both the multilayered thick film ceramic chip inductor and thin film ceramic chip inductor markets worldwide. This study begins with a worldwide overview and update on the global inductor markets for FY 2016 and recent changes in the market regarding the global value, volume and pricing. The study then focuses specifically on the rapidly growing segment of the market for high frequency applications that employs frequency stable ceramic dielectrics, including NPO formulations, P90 porcelain and barium strontium titanate to achieve the desired inductance. The study offers a granular look at the ceramic chip inductor market and discusses the technology movement toward sputtering ceramic thin layers to augment or compete with ceramic green sheet stacking using air fired or gas fired techniques. The study compares the performance characteristics of thick versus thin film inductors in terms of thickness (low profile), inductance range, frequency range and rated current. A competitive analysis of all known product offerings in multilayered and thin film inductors is given by vendor and direct comparisons made in terms of volumetric efficiency and overall inductor performance. The study offers global demand for ceramic inductors by end-use market segment and by world region and forecasts growth for ceramic inductors in key end-use markets based upon operating frequency in modules, handsets, computers, TV sets, base stations, medical equipment, and much more. Detailed market share data for thick film and thin film ceramic chip inductors for FY 2016. Detailed forecasts for global consumption of ceramic chip inductors to 2021. Ceramic Chip Inductors: World Markets, Technologies & Opportunities: 2016-2021 ISBN #:1-893211-99-1 (MLCI2016),” 154 Pages, 66 Graphs, Published July 2016. $2750.00 USD. Ceramic Chip Inductors: World Markets, Technologies & Opportunities: 2016-2021 ISBN #:1-893211-99-1 (MLCI2016).” http://www.paumanokgroup.com/inductors-analysis/ceramic-chip-inductors-world-markets-technologies-opportunities-2016-2021-isbn-1-893211-99-1-mlci2016.html  

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For  Further  Informa6on…  •  Complete  Table  of  Contents  and  List  of  Figures  •  To  Purchase  and  Download  The  Study    

Ceramic  Chip  Inductors:  World  Markets,  Technologies  &  Opportuni6es:  2016-­‐2021  ISBN  #:1-­‐893211-­‐99-­‐1  (MLCI2016).”  

Paumanok  Publica-ons,  Inc.  502  Ballad  Creek  Court  Cary  NC,  27519  USA  

www.paumanokgroup.com  Customer  Service:  (919)  468-­‐0384  Email:  Info@paumanokgroup.com  

   MARKET  RESEARCH  BY  

Dennis  M.  Zogbi  dennis@paumanokgroup.com  

 

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