CeNTI Centre for Nanotechnology and Smart Materials...
Transcript of CeNTI Centre for Nanotechnology and Smart Materials...
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• CeNTI – Centre for Nanotechnology
and Smart Materials
João Gomes
• Development of Printed Capacitive
Sensors: R&D to Product Engineering
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Summary
• CeNTI an overview;
• Main Areas of Application;
• Facilities;
• Printed Capacitive Sensors;
• R&D;
• Up-scaling approach;
• Projects;
• Product Development;
• Final Notes
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About CeNTI
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High Level Shareholders
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CITEVE / CeNTI technology campus
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Three Pilars
Functional Materials
& Solutions
Smart Materials
& Systems
Modeling Design & Engineering
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Lab to Market
I&D Prototyping Pre-series
co-production
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Substrates
Textile
Leather
Paper Ceramics
Wood
Cork
Glass Polymers
Concrete
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Main Applications
Automotive & Aeronautics
Architecture & Construction
Health, Protection & Well-being
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Facilities
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Screen Printing (Sheet and Rotary)
Inkjet Printing LTE thermal evaporation
Gravure
Spray and Dip coating
Slot die and Rotary Screen Lamination& Encapsulation
Sheet/Sample
R2R
Facilities
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3DMM Microflex Print Line
- Printed Electronics Line R2R;
- Multi Technology Print line R2R PVD system 500mm
- PML, Metal Evap and PVD with 500mm width
Facilities
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Facilities
Materials R&D Lab Polymer Coatings and Compounding
R2R Plasma
R2R Spray and US Coating w/ IV+UV
Curing
Nanoparticle synthesis
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Advances Surface Treatment Plant
- Spray, US and Plasma;
- 500mm R2R or S2S (rigid&flexible)
- IV and UV curing stages;
Tri Component Spinning Plant
- 36 filament tricomponent fibres;
- Multi functional yarn spinning;
Facilities
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Product Engineering
SMT Technologies
Prototyping
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Printed Capacitive Sensors
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R&D Approach
Numerical simulation
Design optimization
Processing
Printing
Lamination
Laser Cutting
Vacuum Systems
etc.
Caracterization
Electrical measurement
AFM,profilometry
Optical microscopy
Engineering
Development of systems for acquisition, treatment and transmission of data
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R&D Project
•Proof-of-concept;
•Final Prototype;
Process Development
•Process development;
•Product Design;
•Production Cost Assessment
Pre-Series;
•Small Scale Manufacturing;
•Market Test;
•Logistics
Scalability: demonstrator do end-product
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0
2
4
6
8
10
12
0 20 40 60 80 100 120
C/C
0
Liquid Level (%)
Liquid level sensor
0%
100%
Substrate: PET Encapsulant: PET
Liquid: Water (ε=80)
Electric Field Analysis
Capacity vs Liquid Level
Numerical Simulation
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Lab & Pilot Processing
10000 100000 1000000
30
35
40
45
C/p
F
f/Hz
water drop
metal object
object (=3)
air
Performance Characterization Materials Characterization
1
1.2
1.4
1.6
1.8
2
2.2
2.4
0 25 50 75 100
C/C
0
Liquid Level (%)
SENSOR A
SENSOR B
SENSOR C
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Various substrates (Rigid and Flexible):
Flexible polymeric substrates;
Directly on carbon composite, paper, cork, textiles;
Lab & Pilot Processing
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R2R Processing & Hardware Engineering
Rotaryscreen Lamination/encapsulation
Laser Etching and interconnection
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Synergy with R2R Vacuum Coating
• Lab-scale research needs to consider
the process requirements given by the
2nd step up-scaling;
• Pilot scale is required to assess the
feasibility of the printing/processing of a
given device and the final product
(assembling and integration step);
• Assessing the viability of intermediate
assembling steps is key for determining
the feasibility of the process as whole.
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Engineering
Printed Heating Elements
Printed Actuators for Printed Lighting
Streachable Printed Flexible Sensor
Actuator Flexible matrix
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Printed Capacitive Sensors
Projects & Products
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Intelligent Multi-reactive textiles Piezoelectric Fibres
Development of new Tri-component piezoelectric fibres for sensor / energy harvesting applications – Processing of Fibre devices
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Project Invisible Network
• Development of interactive surfaces through the integration of printed
technologies onto non conventional substrates:
• Directly printed sensor-actuators ( ex: temperature, pressure, gas sensors and biometric);
• Development of embedded and integrated hardware;
• Development of fully interconnected rigid-flexible electronics and mobile device comunication platforms;
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SENSE | Development of solution embedded sensing and/or printed electronics integrated on fuel tank.
GOALS | The objective of the work is to develop R&D activities that enhance innovation in
sensorized structures.
OUTPUTS | Technologic demonstrator with integrated sensing multi-monitoring system on composite: structure analysis system fuel level and temperature sensors.
Project SENSE
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Performance evaluation
Number of drops
SENSOR B Output Signal
10 0.0% 20 0.1%
30 0.3%
50 0.7%
Insensitivity to liquid drops
0.99
1
1.01
1.02
1.03
1.04
1.05
0 20 40 60 80 100
C/C
0
Liquid Level (%)
SENSOR B
SENSOR C
Sensitivity to liquid with low ε (~3)
Project SENSE
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Engineering
Rise Time Rise Time
Measuring rise time and fix the R value, the C is proportional to rise time.
Project SENSE
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Sensor Tile
• Ceramic tile with an integrated printed piezoelectric switch: electronic module embedded on the tile structure
• Results: International patent held by Dominó.
• CE certified product
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MOON Ceramic
• Application of printed sensoring systems and integrated electronics
• Development of a new series of highly efficient (eco-friendly) discharge system:.
• Product to be commercialized
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Final Notes
• An integrated strategy is necessary in order to successfully upscale R&D systems to pilot and production processes:
• Proof-of-concept;
• In house” “market test” production (pre-series)
• Bridge the gap between pre-series and full scale production - Valley of death;
• Focus on integrated sensoring systems:
• Integrated/added functionality;
• Added-value;
• Interconectivity and hardware integration;
• Interactivity and availability of information;
• Moving towards all printed and all-integrated flat film electronics – still a way to go… ;
• Certification and quality control processes need to be developed concurrently with engineering and Up-scaling
processes;
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Thank You
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