CEMAL BASARAN - UB Electronic Packaging Laboratory

Cemal Basaran

Department of Civil, Structural

and Environmental Engineering

243 Ketter Hall

University at Buffalo, SUNY

Buffalo, NY 14260

Tel: (716) 645-4375

E-mail: [email protected]

Web page: www.packaging.buffalo.edu

Citizenship

United States of America.

Education

Ph.D. Dept. of Civil Engineering and Engineering Mechanics, University of Arizona,

Tucson, AZ, December 22, 1994. Cum. G.P.A. 4.00/4.00

M.S. Dept. of Civil Engineering, M.I.T., Cambridge, MA, May 27, 1988. Cum. G.P.A.

4.80/5.00

Honors and Awards

Department of Defense ONR Young Investigator Award, 1997, ($500,000.0). In 1997 one of the

29 junior faculty members and the only Civil Engineering faculty in the U.S. to receive the

award.)

Riefler Award, State University of New York at Buffalo, 1997.

ASME Journal of Electronic Packaging, Associate Editor of the Year, 2005.

Fellow of ASME, May 1, 2008

Journal Editorships

Associate Editor, IEEE, Trans. On Components, Packaging and Manufacturing Technology,

January 2011- present

Assoc. Editor, ASCE Journal of Nanomechanics and Micromechanics, March 2011 - present

Associate Editor, Trans. of ASME, Journal of Electronic Packaging, October 2003- present

Associate Editor, IEEE Transactions on Advanced Packaging, July 2003 –December 2010

Regional Editor for Americas, Int. Journal of Materials and Structural Integrity, 2006-present

Editorial Board, The Open Civil Engineering Journal, 2007 – present.

Editorial Board, Journal of Recent Patents On Electrical Engineering, January 2008 – present

Editorial Advisory Board, The Open Numerical Methods Journal, September 2, 2008 –present

Editorial Board, ISRN Mechanical Engineering, October 2010 - present

Guest Editor, International Journal of Damage Mechanics. (Special issues on Electronic

Packaging April 2001, July 2001

mailto:[email protected]

http://www.packaging.buffalo.edu/

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Guest Co-Editor, International Journal of Materials and Production Technology, special issue on

Micro/Nano Electronics, NEMS and MEMS Packaging, vol. 34 No1/2, 2009

Guest-Editor, ASME Journal of Electronic Packaging, Special Issue on Carbon Nano Tube and

Graphene in Electronics, and NEMS, June 2011

Guest Editor, ASCE Journal of Nanomechanics and Micromechanics Inaugural issue on recent

Advances in Nanomechanics and Micromechanics, March 2011

Professional Experience (academia)

University at Buffalo, SUNY

Professor and Director 8/2005 – present

Electronic Packaging Lab

Assoc. Professor and Director 1/1999 – 7/2005

Electronic Packaging Lab

Assistant Professor 9/1995 - 12/1998

Visiting Assistant Professor 10/1994 - 9/1995.

University of Arizona

Research Assistant 1/1992 - 8/1994.

M.I.T.

Teaching Assistant 8/1986 - 6/1988

Ph.D. Dissertations Supervised as the Primary Advisor

1- Cheng-yong Yan, "A Damage Mechanics Based General Purpose

Interface/Contact Element," February, 1998, Senior Engineer, PICO Design

Corp., Detroit, MI.

2- Rumpa Chandaroy, "Damage Mechanics of Microelectronics Packaging Under

Combined Dynamic & Thermal Loading" August 1998, Project Engineer, Altair

Engineering, Detroit, MI.

3- Ying Zhao," Mechanics of Ball Grid Array Packages: Testing and Modeling,”

December 2000. Senior reliability Engineer, Analog Devices Inc., Norwood, MA.

4- Hong Tang, “A Thermodynamic Damage Mechanics Theory and Experimental

Verification: For Thermomechanical Fatigue Life Prediction of Microelectronics”

November 2002, Senior Mechanical Engineer, Honda Electronics, Detroit MI.

5- Heng Liu,”Phase Reconstruction of Phase Shifted Moire Interferograms Using

Continuous Wavelet Transforms,” July 2003, Senior Engineer, KLA-Tencor, San

Jose, CA.

6- Yujun Wen, “Thermomechanical Analysis of Multilayered Microelectronic

Packaging: Modeling and testing” December 2003, Vice-Chief Engineer,

Shanghai Shentong Holdings Co., Ltd.

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7- Hua Ye,”Mechanical Behavior of Microelectronics and Power Electronics Solder

Joints Under High Current Density: Analytical Modeling and Experimental

Investigation”, March 2004. Received International Microelectronics and

Packaging Society (IMAPS) 2002 Award, $15,000, for his PhD work. One of four

chosen internationally. Reliability and Component Engineer, Microsoft,

Redmond, WA.

8- Shihua Nie,” A Micromechanical Study on Damage Mechanics of Acrylic

Particulate Composites Under Thermomechanical Loadings” May 2005,

Structural Engineer, Skidmore Owings & Merrill, San Francisco, CA

9- Juan Gomez “A Thermodynamic Framework for Damage Mechanics of

Electronic Packaging Solder Joints Including Size Effects”, February, 2006.

Assist. Professor, Escuela De Ingenieria, University of EAFIT, Medellin,

Colombia.

10- Minghui Lin,” A Thermodynamic Framework for Damage Mechanics of

Electromigration and Thermomigration”, September, 2006, Structural Engineer,

L&W Engineering Group, Linden, NJ.

11- Mohammed Abdulhamid, “Thermomigration; An Experimental Damage

Mechanics Study on Nanoelectronics Lead-free Solder Alloys ”, May 2008.

Lecturer, Faculty of Mechanical Engineering, Universiti Teknologi, Johor,

Malaysia

12- Shidong Li, ” A Multi-Scale Damage Mechanics Framework for Nanoelectronics

Interconnects and Solder Joints”, May 2009, Staff Engineer/Scientist, IBM

Fishkill, NY.

13- Tarek Ragab, “A Multi-Scale Electro-Thermo-Mechanical Analysis of Single

Walled Carbon Nanotubes, May 2010, Assistant Professor, University of Tabuk,

Tabuk, Kingdom of Saudi Arabia.

14- Michael Sellers, “Atomistic Modeling Of The Microstructure And Transport

Properties Of Lead-Free Solder Alloys”, September 2010, Research Associate,

US Army National Labs, Aberdeen, MD.

15- Mustafa Eray Gunel, “ Large Deformation Micromechanics of Particle Filled

Acrylics at Elevated Temperatures” , September, 2010. Consultant, Terra

Technology, Norwalk, CT.

16- Bicheng Chen, “Nano Resolution Moire Interferometry” , May 2011,

Development Engineer III, Tyco Electronics, Harrisburg, PA.

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17- Yongchang Lee, “Multi-Scale Damage Mechanics of Power and Nanoelectronics

Under Time Varying Loads” expected graduation May 2012.

18- Wei Yao, ”Quantum Mechanics of Carbon Nanotube and Graphene Resistance

and Degradation under High Current Density”. expected graduation May 2012

19- Yanbiao Chu, “Quantum Mechanics of High Current Density Induced Damage in

Graphene “, May 2012

20- Pierre Gautreau, “Using Graphene and SWCNT for Next Generation Power

Electronics: A Multi-Scale Analysis Framework” expected graduation May 2013

21- Tingyue Lan, ”Graphene for Power Electronics” expected graduation May 2015

Ph.D. Dissertations Supervised as a Committee Member

1- Zongrong Liu, “Electrically Conductive and Thermally Conductive Materials for

Electronic Packaging” September 2004, Primary Advisor Prof. Deborah D.L.

Chung of MAE Dept.

2- Sang Kyu Kwak, “Studies of Point Defects in Strained Solids By Molecular

Simulation,” May 2005, Primary Advisor David Kofke of CBE

3- Chia-Ken Leong, “Improving Materials for Thermal Interface and electrical

Conduction by Carbon” May 2007, Primary Advisor Prof. Deborah D.L. Chung

of MAE Dept.

4- Dong Keon Kim,” A Cyclic Viscoplastic Damage Model with Application to

Seismic Response of Metallic Dampers,” May 2010, Primary Advisor, Prof. Gary

Dargush of MAE Dept.

Post-Doctoral Fellows Advised

1- Hale Ergun,PhD, Damage Mechanics of Infilled Composites, September 2004 -

August 2005.

MS Theses Supervised as the Primary Advisor

1- Rumpa Chandaroy, “Nonlinear Dynamic Analysis of Microelectronic Packaging

Interconnects “, 12/1996. (Senior Engineer, Altair Engineering, Detroit, MI.)

2- Joseph Ball, "3-D Building Design,” 12/97, (Staff Engineer, ATSI Inc. Buffalo, NY.)

3- Jianbin Jiang,”Size Effect for Pb/Sn Solder Alloys and Its Measurement by Nano

Indentation” May 2002, (PhD candidate Univ. of Tennessee at Knoxville)

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4- Minghui Lin, “Electromigration Caused Damage in Microelectronics Pb/Sn Solder

Joints”, May 2002, (PhD Candidate University at Buffalo, SUNY.)

5- Shihua Nie,”Fatigue Behavior of Particle Filled Composites, December 2002, (PhD

Candidate, University at Buffalo, SUNY)

MS Theses Supervised as a Committee Member

1- Mathew Blaczak,”Using Twyman-Green Interferometry for Measuring Material

Properties” Co-Advisor with Dr. Alex Cartwright of EE Dept, April 2001.

2- Kyu-Dong Kim, “Reliability of Soldered and Conductive Adhesive Joints in

Electronics,” April 2002, Primary Advisor Prof. D. L. Chung of MAE Dept.

3- Chia Ken Leong,”Development of Thermal Pastes for High Thermal Contact

Conductance,” May 2003, Primary Advisor, Prof. D.L. Chung of MAE

4- Bhanu Jaiswal,”Innovative Circuit Board-Level Routing Designs for BGA Packages,”

May 2003, Primary Advisor Prof. A. Titus of EE (Funding Advisor Prof. Basaran)

5 – Yuanbo Guo, “Development of a High Current High Temperature SiC MOSFET

Based Solid-State Power Controller” December 2010, Primary advisor, Prof. DC

Hopkins

Undergraduate Research Assistants

1- Stacey Serafin, (Physics major) “Optical Diffraction Grating Manufacturing

Methodologies,” Spring 2001.

2- Tom Downes, (EE major)” Digital Image Processing for Moiré Interferometry Fringes,”

Spring 2001.

3- Jigar Patel,(EE major)” Moiré Interferometry Grating Replication, Fall 2001.

4- Shun Wu, (EE major)“Optical Diffraction Grating Replication for Moiré Interferometry”

Fall 2001, Spring 2002, Summer 2002

5- Julia Johnson, (Park High School Senior) “Fatigue Testing Particle Infilled Composites”

Summer 2002. Sponsored by Minorities in Engineering Program (BEAM)

6- Frankie Jones, (EE major),” Moire Interferometry Grating Replication,” Summer 2002,

Fall 2002

7- Fanor Balderrama, (Computer Science major) Moire Interferometry Grating Replication,

Fall 2002, Spring 2003, Summer 2003

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8- Tushar Bansal, (CSE Major, Honors program),” Pathfinding in printed circuit boards,

Fall 2002

9- Jonathan Davis, (Park High School Senior), Testing Particle Infilled Composites,”

Summer 2003, Sponsored by Minorities in Engineering Program (BEAM).

10- Faaiza Ansari, (Biology and MAE major) Moire Interferometry Grating Replication,

Summer 2003, Fall 2003, Spring 2004, Fall 2004, Spring 2005.

11- Eli Dickinson (Computer Science and English major), Software Development, Fall 2003,

Spring 2004.

12- Maureen West (Buffalo City Honors Senior) Software Development, Summer 2006

13- Yiwei Jin, CSEE Senior Scholar) Deformation behavior of CarbonNanoTubes, Spring

2009

Funding (Not including Consulting)

1- "Unholtz-Dickie Vibration System", University at Buffalo Equipment Challenge

Grant Program, March 20, 1997, Principal Investigator/PD Cemal Basaran, $25,000.

2- "Damage Mechanics of Semiconductor Devices with Emphasis on Interfaces".

Department of Defense, Office of Naval Research Young Investigator Award, June 1,

1997 – May 31, 2001. Principal Investigator/PD Cemal Basaran. The award amount

(not including the equipment grant and UB matching funds) is $350,000; including

the UB matching funds (cash plus in kind) but not including equipment grant the total

project budget is $724,400. 00

3- University at Buffalo, SEAS EngiNET Long Distance Learning Program Equipment

Grant, March 20, 1997, $950.0

4- Riefler Award, UB School of Engineering and Applied Sciences, June 1997, $1000.0

5- University of California SanDiego, Institute for Mechanics and Materials Fellowship

for Fifth Annual Meeting of IMM Young Investigators '97, $250.0+ conference

expenses.

6- University at Buffalo, PDQWL Individual Development Awards Program, $1,000.0

April 16, 1998.

7- University at Buffalo, PDQWL Individual Development Awards Program, $1,000.0

November 4, 1998.

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8- "Reliability of Interfaces in Microelectronics Packaging", National Science

Foundation-GOALI Program/ Intel Corporation, Principal Investigator/PD Cemal

Basaran, Co-PI, Alexander Cartwright and Dr. Terry Dishongh of Intel Corp.,

October 1, 1999, -September 30, 2003, $247,323.0 [including the matching money

from Intel Corporation and UB the total budget of the project is $602,000.0].

9- “An Explicit FEM Code for Damage Mechanics of Solder Joints”, Principal

Investigator/PD Cemal Basaran, Intel Corp. Hillsboro, OR, September 1999-

September 2000, $28,000.0 plus a four Xeon processor Intel server. (Approx. worth

$100,000.0)

10- “Thermomechanical Behavior of BGA Solder Joints “, Principal Investigator/PD

Cemal Basaran, Intel Corp. Hillsboro, OR, January 2000-September 2000, $30,000.0

11- “Laser Mechanics and Damage Imaging Laboratory” Defense University Research

Instrumentation grant DURIP, Department of Defense Co-PI, Alexander Cartwright

February 2000. $325,000.0 (including the UB equipment challenge matching funds)

12- “Grain Size Effect in Solder Joints,” Principal Investigator/PD Cemal Basaran, Intel

Corp. Hillsboro, OR, May 2000- April 2001, $25,000.0

13- “Reliability of Power Electronic Devices” Office of Naval Research, Principal

Investigator/PD Cemal Basaran, May 2000-April 2004. $300,000.0

14- Research Education for Undergraduates National Science Foundation Supplemental

Grant, May 2000-April 2001, $10,000.0

15- UUP Individual Development Awards Program, May 2000, $462.0

16- Unrestricted Grant, DuPont Corporation, September 2000, $15,000.0

17- “Thermomechanical Behavior of Flip Chip DRAM Packaging” Micron Technology,

November 2000-May 2002, $12,500.

18- IT Collaboratory, NY Science Technology and Research Office, $6,000,000.0, PI:

Paras Prasad, of Chemistry, Co-PIs: Cemal Basaran of Civil Engineering, Alex

Cartwright and Pao-Lo Liu of Electrical Engineering, Bruce McCombe and Hong

Luo of Physics, May 2002- May 2005 [This is an equipment grant]

19- “Damage Mechanics of BGA Solder Balls Under High Electrical Current Density”,

International Microelectronics And Packaging Society, Co-PI Doug Hopkins,

October 2001- September 2002. [Graduate student fellowship award], $15,000.0.

20- Reliability of Solder Joint-Metalization Interfaces, AG Communications, October

2001- December 2001, $9,000.0

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21- Equipment Donation, MTS 858 material characterization hydraulic grip components,

Dupont Corp, December 2001, $23,000.0.

22- Research Education for Undergraduates National Science Foundation Supplemental

Grant, December 2001-November 2002, $10,043.0

23- Evaluation of Alternate I/O Routing for Bumpless BGA-Printed Circuit Boards”,

Intel Corporation, Co-PI Alex Cartwright, and Albert Titus of EE, February 2002 –

August 2004, $86,092.0

24- Damage In BGA Solder Joints Under Vibrations, Intel Corporation, April 2002-

March 2003, $25,000.0

25- Damage Mechanics of Composite Structural Systems, Dupont Corporation, August

2002- July 2003, $25,000.0.

26- University at Buffalo, UUP Professional Development Award, June 2002, $510.0

27- Micromechanics of Particle Infilled Composites, Dupont Corporation, , July 2003-

January 2004. $22,000 (including $7,000 in Equipment)

28- Advanced SiC Converter for Embedded Applications, US Navy, PI Dr. D. Hopkins

of DC Hopkins & Assoc., February 2004 - September 2004, $76,000.0, Co-PI Dr. C.

Basaran.

29- Determination of Micromechanical Material Parameters for Particle Infilled

Composites, Dupont Corp., March 20004 - October 2004, $15,000.0

30- Experimental Validation of Damage Mechanics Models for Different Compositions

of Corian, Dupont Corp., October 2004- June 2004, $20,000.

31- Reliability of Next Generation Power Electronics Packaging Under Concurrent

Vibration, Thermal and High Power Loads,” ONR, $ 445,409.00 September 1, 2004

–October, 2007.)

32- Damage Mechanics of Next Generation Nanoelectronics and Power Electronics

Packaging, NY State CAT for Microelectronics Packaging, $40,000, July 1 2005 –

June 30, 2006.

33- Damage Mechanics of NanoElectronics Packaging Solder Joints , $284,500, NSF,

CO-PI David Kofke of Chemical and Biological Engineering, August 1, 2005 – July

31, 2009.

34- Material Properties of Acrylic Particle Filled Composites. DuPont Corporation,

$40,000.0 January 1, 2006- December 2006.

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35- Thermomechanical behavior of Inkjet MEMS, Kodak Corp., October 2006 –

December 2006., $5000.

36- Damage Mechanics of Particle Filled Composites During Thermoforming, DuPont,

Corp., $90,000, January 1, 2008, -December 31, 2010.

37- Solder Joint Quality Inspection, Northrop-Grumman, Amherst Systems, January,

2007, $2,500.

38- Multi-Scale Damage Mechanics of High Temperature and High Power Density

Power Electronics, May 2008- May 2011, ONR, $498, 678.00

39- Electromigration in lead-free solder joints for wireless systems, $17,500, April 2008-

June 2008, STMicroelectronics, Grenoble, France.

40- Extrusion in Al Interconnects in Analog Devices, Texas Instruments, Dallas, TX,

June 2008-December 2008, $34,000.

41- Multi-Scale Modeling of Electromigration and Thermomigration in Nanoelectronics and

Power Electronics, $200,826, May 2009-May 2012, Semiconductor Research Corporation.

42- Determination of Fatigue Life of Gull-Wing Solder Joints, WatchFireSigns, $3,900

December 2009

43- Nanotechnology Research Laboratory Setup, University of Tabuk, $40,000, January

2011

44- The Framework for Next Generation Power Electronics Using Nanomaterials, ONR,

$650,191.00 June 2011-June 2014.

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Books and Book Chapters:

1- Basaran, C, Nie, S and Gunel, E.M.” Damage Coupled Viscoplastic Modeling of

Particulate Composites With Imperfect Interphase”, Chapter in Encyclopedia of

Composites, John. Wiley & Sons, Inc., 2012.

Publications in Refereed Journals

Citations: 1200+ h-index: 19 (reference: Harzing’ s Publish or Perish)

1- Desai, C.S., Basaran, C., and Wu, Z. "Numerical Algorithms and Mesh

Dependence in the Disturbed State Concept," Int. Journal for Numerical Methods

in Engineering, Vol. 40, 3059-3083, 1997.

2- Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element

Analysis of Problems in Electronic Packaging Using the Disturbed State Concept

Part I: Theory and Formulation " Trans. of ASME, Journal of Electronic

Packaging, Vol. 120, No. 1, pp. 41-47, 1998.

3- Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element

Analysis of Problems in Electronic Packaging Using the Disturbed State Concept

Constitutive Models: Part II: Verification and Application ", Trans. of ASME,

Journal of Electronic Packaging, Vol. 120, No. 1, pp. 48-53, 1998.

4- Desai, C. S., Basaran, C., Dishongh, T. and Prince, J.,"Thermomechanical

Analysis in Electronic Packaging with Unified Constitutive Models for Materials

and Joints,” IEEE Trans. on Comp. Pack. And Manu. Tech, Part B, Trans. on

Advanced Packaging, Vol. 21, No. 1, 87-97, 1998.

5- Basaran, C., and Chandaroy, R.,"Finite Element Simulation of the Temperature

Cycling Tests," IEEE, Transactions on Components Packaging and Manufacturing

Technology -Part A, Vol. 20, No. 4, pp. 530-536, 1997.#3

6- Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount

Interconnects, Part I: Theory", Trans. of ASME, Journal of Electronic Packaging,

Vol. 121, Number 1, pp. 8-12, March 1999. #7a

7- Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount

Interconnects, Part II: Applications", Trans. of ASME, Journal of Electronic

Packaging, Vol. 121, No 1, pp. 12-17, March 1999. #7b

8- Basaran, C., and Chandaroy, R., "Mechanics of Pb40/Sn60 Near –Eutectic Solder

Alloys Subjected to Vibrations," Journal of Applied Mathematical Modeling, Vol.

22, pp. 601-627, 1998, #8.

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9- Basaran, C., and Yan. C.Y."A Thermodynamic Framework for Damage Mechanics

of Solder Joints,” Trans. of ASME, Journal of Electronic Packaging, Vol. 120,

379-384, 1998. #12

10- Chandaroy, R. and Basaran, C.,"Damage Mechanics of Surface Mount

Technology Solder Joints Under Concurrent Thermal and Dynamic Loadings,"

Trans. of ASME, Journal of Electronic Packaging, Vol. 121, pp. 61-68, 1999.

11- Basaran, C.,”Using Finite Element Analysis for Simulation of Reliability Tests on

Solder Joints in Microelectronics Packaging,” Computers & Structures, Vol. 74,

Issue 2, pp. 215-231, November, 1999. #9

12- Basaran, C. and Zhao, Y.,”Closed Form vs. Finite Element Analysis of Laminated

Stacks,” Int. J. of Finite Elements in Analysis and Design, 32, pp.163-179, 1999.

#5

13- Zhao, Y., Basaran, C., Cartwright, A., and Dishongh, T.,”Thermomechanical

Behavior of Micron Scale Solder Joints: An Experimental Observation,” Journal of

the Mechanical Behavior of Materials, Vol. 10, No. 3, pp. 135-146, 1999. #13

14- Zhao, Y., Basaran, C. Cartwright, A. and Dishongh, T.,”Thermomechanical

Behavior of Micron Scale Solder Joints Under Dynamic Loads,” Mechanics of

Materials, Vol. 32, Issue 3, pp. 161-173, 2000. #14

15- Basaran, C., Zhao, Y., Cartwright, A. and Dishongh, T.,”Effects of

Thermodynamic Loading,” Advanced Packaging, Vol. 1, pp. 51-58, October 2000.

Review article.#17

16- Basaran, C.,” Disturbed State Concept for Metals and Alloys,” J. of Mechanical

Behavior of Materials Vol. 10, No. 5-6, pp. 279-311, 2000.

17- Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEA for Multilayered Electronic

Packaging,” Trans. of ASME, Journal of Electronic Packaging, Vol. 123, 3, pp.

218-224, September 2001. #22

18- Basaran, C., Cartwright, A. and Zhao, Y.,”Experimental Damage Mechanics of

Microelectronics Solder Joints Under Concurrent Vibration and Thermal

Loading,” Int. J. of Damage Mechanics, Vol. 10, No. 2 pp. 153-170, April 2001.

#15

19- Basaran, C., Tang, H., Dishongh, T. and Searls, D.,”Computer Simulations of

Solder Joint Reliability Tests,” Advanced Packaging, Vol. 1, pp. 17-22, May

2001.Review article. #27

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20- Basaran, C., Dishongh, T., and Zhao, Y.,” Selecting a Temperature Time History

for Predicting Fatigue Life of Microelectronics Solder Joints,” Journal of Thermal

Stresses, Vol. 24, No. 11, pp. 1063-1084, November, 2001. #20

21- Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints

Under Thermal and Vibrational Loading,” Tran. ASME Journal of Electronic

Packaging, Vol. 124, No 1, pp. 60-67, March 2002. #24

22- Basaran, C., Ye, H., Johnson, R. and Long, J., ”Moire Interferometry for

Inspecting BGA Solder Balls for Manufacturing Defects,” Journal of Global SMT

and Packaging, Vol. 2, No. 2, pp. 9-14, May 2002. #33

23- Tang, H. and Basaran, C.”Influence of Microstructure Coarsening on

Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints,” Int. Journal

of Damage Mechanics, Vol. 10, No 3, pp. 235-255, July 2001. #29

24- Basaran, C. and Tang, H.,”Implementation of a Thermodynamic Framework for

Damage Mechanics of Solder Interconnects in Microelectronic Packaging,”

International Journal of Damage Mechanics, Vol. 11, No. 1, pp. 87-108, January

2002. #17

25- Basaran, C., Ye, H., Bush, P., Johnson, R., and Long, J.,” Inspection of Under

Bump Metallization – Solder Ball Interfaces by SEM, EDX and Moire

Interferometry,” TAP Technology, Vol. 4, pp. 23-27, 2002, Review article.#31

26- Ye, H., Lin, M., and Basaran, C.,”Failure Modes and FEM Analysis of Power

Electronic Packaging,” Finite Elements in Analysis and Design, Vol. 38, Issue 7,

pp. 601-612, May 2002. #25

27- Basaran, C. and Jiang, J.,”Measuring Intrinsic Elastic Modulus of Pb/Sn Solder

Alloys,” Mechanics of Materials, 34, pp. 349-362, 2002, #26

28- Basaran, C., Cartwright, A., Zhao, Y. and Dishongh, T.”Reliability of Solder

Bumps”, Advanced Packaging, Vol. 1, pp. 47-56, July 2002, Review Article. #52

29- Dishong, T., Basaran, C., Cartwright, A., Zhao, Y., and Liu, H., “Impact of

Temperature Cycle Profile on Fatigue Life of Solder Joints,” IEEE Transactions on

Advanced Packaging, Vol. 25, No 3, pp. 433 –438, August 2002. #35

30- Tang, H. and Basaran, C.”A Damage Mechanics Based Fatigue Life Prediction

Model,” Trans. Of ASME, Journal of Electronic Packaging, Vol. 125, No 1, pp.

120-125, March 2003. #21

31- Wen, Y. and Basaran, C.,”Thermal Stress Analysis of Multilayered

Microelectronic Packaging,” Trans. Of ASME, Journal of Electronic Packaging,

Vol. 125, No 1, pp. 134-138, March 2003. #23

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32- Ye, H., Basaran, C. and Hopkins, D., Thermomigration in Pb-Sn Solder Joints

Under Joule Heating During Electric Current Stressing, Applied Physics Letters,

Vol. 82, No 8, February 2003, #38.

33- Wen , Y.and Basaran, C. “Analysis of Multi-layered Microelectronic Packaging

Under Uniformly Distributed Loading”, vol 40/13-14, pp 3331 - 3345,

International. J. of Solids and Structures, May 2003, #45

34- Ye, H., Hopkins, D. and Basaran, C.”Measuring Joint Reliability: Applying the

Moire Interferometry Technique,” Advanced Packaging, Vol. 1, pp.17-20, May

2003, Review article. #46

35- Ye, H., Basaran, C. and Hopkins, D., Damage Mechanics of Microelectronics

Solder Joints Under High Current Densities,” International Journal of Solids and

Structures, Vol. 40, No. 15, pp. 4021-4032, July 2003. #34

36- Basaran, C. and Wen, Y.,”Coarsening in BGA Solder Balls: Modeling and

Experimental Evaluation,” Trans. Of ASME J. of Electronic Packaging , Vol 125,

No. 3, pp. 426-430, September 2003, #30

37- Liu, H., Cartwright, A. N. and Basaran, C.,” Sensitivity Improvement in Phase

Shifted Moiré Interferograms Using 1-D Continuous Wavelet Transform Image

Processing”, Optical Engineering 42(09), pp. 2646-2652, September 2003, #50

38- Ye, H., Hopkins, D. and Basaran, C.,”Measurement of High Electrical Current

Density Effects in Solder Joints,” Advanced Microelectronics, Vol. 30, No. 5, pp.

13-16, September 2003, Review Article.#69

39- Ye, H., Basaran, C. Hopkins, D.,”Numerical Simulation of Stress Evolution

During Electromigration in IC Interconnect Lines,” IEEE Trans. On Comp.

Packaging Tech. Vol. 26, No. 3 pp.673-681, September 2003.#43

40- Basaran, C., Lin, M. and Ye. H. “A Thermodynamic Model for Electrical Current

Induced Damage”, Int. Journal of Solids and Structures Vol. 40, No 26 pp. 7315-

7327, November 2003 #37

41- Ye, H., Basaran, C. and Hopkins, D.,”Mechanical Degradation of Microelectronics

Solder Joints Under Current Stressing,” Int. Journal of Solids and Structures, Vol

40 No 26, pp 7269-7284, November 2003 #40

42- Ye, H., Basaran, C. and Hopkins, D.,”Measurement of High Electrical Current

Density Effects in Solder Joints,” Microelectronics Reliability, Vol. 43, issue 12,

pp. 2021-2029, December 2003. #42

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43- Wen, Y. and Basaran, C.,”An Analytical Model for Thermal Stress Analysis of

Multi-layered Microelectronic Packaging,” Mechanics of Materials, 36, pp. 369-

385, 2004. #47

44- Liu, H., Basaran, C., Cartwright, A. and Casey, W.,” Application of Moiré

Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA

Packages, IEEE Transactions on Components and Packaging Technologies, Vol.

27, No 1, pp. 217- 223, March 2004. #28

45- Ye, H., Basaran, C. and Hopkins, D.,”Pb Phase coarsening in eutectic Pb/Sn flip

chip solder joint under electrical current stressing,,” Int. J. of Solids and Structures,

41, pp. 2743-2755, 2004. #48

46- Liu, H., Cartwright, A., and Basaran, C. Moiré interferogram Phase Extraction: A

Ridge Detection Algorithm Based on Continuous Wavelet Transform” Applied

Optics, Vol. 43, No. 4/1, pp.850-857, February 2004, #51.

47- Liu, H., Cartwright, A. and Basaran, C.,”Experimental Verification of

Improvement of Phase Shifting Moire Interferometry and Wavelet-Based Image

Processing,” Optical Engineering, 43 (05) pp. 1206-1214, May 2004, #56

48- Basaran, C. Tang, H. and Nie, S.,”Experimental Damage Mechanics of

Microelectronics Solder Joints Under Fatigue Loading,” Mechanics of Materials,

36, pp. 1111-1121, August 2004, #36

49- Ye, H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints

Under Current Stressing and Numerical Simulation I,” International Journal of

Solids and Structures, vol. 41, pp. 4939-4958, September 2004. #59

50- Ye, H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints

Under Current Stressing and Numerical Simulation II,” International Journal of

Solids and Structures, vol. 41, pp. 4959-4973, September 2004, #60

51- Basaran, C. and Nie, S.”An Irreversible Thermodynamic Theory for Damage

Mechanics of Solids,” International Journal of Damage Mechanics, vol. 13, No 3,

pp 205-224, July 2004, #41

52- Ye, H., Basaran, C., and Hopkins, D.,” Mechanical Implications of High Current

Densities in Flip Chip Solder Joints,” International Journal of Damage Mechanics,

Vol. 13, No. 4, pp 335-346, October 2004, #58

53- Gomez, J. and Basaran, C.”A Thermodynamics Based Damage Mechanics

Constitutive Model for Low Cycle Fatigue Analysis of Microelectronics Solder

Joints Incorporating Size Effect,” International Journal of Solids and Structures,

Vol. 42, issue 13, pp. 3744-3772, (2005) #67.

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54- Nie, S., and Basaran, C. “A Micromechanical Model for Effective Elastic

Properties of Particulate Composites with Imperfect Interfacial Bonds,”

International Journal of Solids and Structures Vol. 42, pp 4179-4191, 2005, #62

55- Lin, M., and Basaran, C.”Electromigration Induced Stress Analysis Using Fully

Coupled Mechanical-Diffusion Equations With Nonlinear Material Properties,”

Computational Materials Science, Vol. 34/1 pp. 82-98, May 2005, #64

56- Basaran, C., Ye, H. Hopkins, D., Frear, D. and Lin, J.K.”Failure Modes of Flip

Chip Solder Joints Under High Electrical Current Density,” Trans. Of ASME J. of

Electronic Packaging, vol. 127, pp. 157-163, June 2005 #53

57- Basaran, C., Zhao, Y., Tang, H. and Gomez, J..”A Damage Mechanics Based

Unified Constitutive Model for Solder Alloys,” Trans of ASME, Journal of

Electronic Packaging, Vol. 127, issue 3, pp. 208-214, September 2005 . #18

58- Ye, H., Basaran, C. and Hopkins, D., ”Experimental Damage Mechanics of

Micro/Power Electronics Solder Joints Under Electrical Current Stresses,” Int. J. of

Damage Mechanics, vol. 15, pp. 41-68, January 2006, #65

59- Gomez, J. and Basaran, C. “ Nanoindentation of Pb/Sn Solder Alloys;

Experimental and Finite Element Simulation Results”, Int. J. of Solids and

Structures, vol. 43, (2006), pp. 1505-1527, 2006, #77

60- Gomez, J. and Basaran, C., ”Damage Mechanics Constitutive Model for Pb/Sn

Solder Joints Incorporating Nonlinear Kinematic Hardening and Rate Dependent

Effects Using a Return Mapping Integration Algorithm,” Mechanics of Materials,

38 (2006), 585-598. #72

61- Gomez, J, Lin, M. and Basaran, C. “Damage Mechanics Modeling of Concurrent

Thermal And Vibration Loading On Electronics Packaging” Multidiscipline

Modeling in Materials and Structures, Vol.2, No.3, pp. 309-326, July 2006. #71.

62- Nie, S., Basaran, C., Hutchins, S. and Ergun, H,” Failure Mechanisms in

PMMA/ATH Acrylic Casting Dispersion,” Journal of Mechanical Behavior of

Materials, Vol. 17, No 2, 2006, pp. 79-95, #39

63- Basaran, C. and Nie, S.“A Thermodynamics Based Damage Mechanics Model for

Particulate Composites,” International Journal of Solids and Structures, 44, (2007)

1099-1114. #63

64- Basaran, C. and Wen, Y., ”Analysis of Multilayered Microelectronic Packaging

Under Thermal Gradient Loading,” IEEE Trans. On Components and Packaging

Technologies, vol. 29, no 4, pp. 850-855, December 2006, #75.

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65- Basaran, C. and Wen, Y. “Influence of Interfacial Compliances on

Thermomechanical Stresses in Multilayered Microelectronic Packaging,” IEEE

Trans. On Advanced Packaging, vol. 29, No. 4, pp. 666-673, November 2006,#61

66- Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration in

Microelectronics Copper Interconnects,” International Journal of Materials and

Structural Integrity, vol. 1, Nos1/2/3, 16-39, 2007, #76

67- Basaran, C. and Lin, M. “Electromigration Induced Strain Field Simulations for

Nanoelectronics Lead-Free Solder Joints”, Int. J. of Solids and Structures, 44,

(2007), 4909-4924. #68.

68- Gomez, J., and Basaran, C., ”Determination of Strain Gradient Plasticity Length

Scale for Microelectronics Solder Alloys,” Trans. Of ASME Journal of Electronic

Packaging, ASME Journal of Electronic Packaging, Vo. 129, No. 2, pp-120-128,

June 2007. #66

69- Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration Induced

Failure,” Mechanics of Materials, 40 (2008) 66-79, #74

70- Basaran, C., Nie, S., Hutchins, S. and Ergun, H. ,”Influence of Interfacial Bond

Strength on Fatigue Life and Mechanical Behavior of a Particulate Composite: An

Experimental Study, Int. J. of Damage Mechanics, Vol. 17, No. 2, 123-148, March

2008 #54.

71- Chen, B. and Basaran, C. “Automatic Full Strain Field Moiré

Interferometry Measurement with Nano-scale Resolution” Experimental

Mechanics, vol. 48, no 5, October 2008, pp. 665-673. #83

72- Abdulhamid, M., Li, S., Basaran, C. “Thermomigration in lead-free solder joints,

Int. J. of Materials and Structural Integrity, Vol. 2, Nos 1 / 2, pp. 11-34, 2008, #87

73- Basaran, C., Li, S., Abdulhamid, M.,” Thermomigration Induced Degradation in

Solder Alloys,”, Journal of Applied Physics, 103, 123520 (2008), # 86

74- Basaran, C., Nie, S. and Hutchins, C., Time Dependent Behavior of a Particle

Filled Composite PMMA/ATH at Elevated Temperatures” Journal of Composite

Materials, Vol. 42, No. 19, pp. 2003-2025, 2008, #55

75- Li, S., Abdulhamid, M. and Basaran, C. “Simulating Damage Mechanics of

Electromigration and Thermomigration,” Simulation: Transactions of the Society

for Modeling and Simulation International Vol. 84, Number 8/9, pp. 391-401,

August/September 2008 #91

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76- Gomez, J. and Basaran, C. “Computational Implementation of Cosserat

Continuum,”, International Journal of Materials and Production Technology, Vol.

34, No 1 / 2, pp 3-36, January 2009, #78

77- Abdulhamid, M , Basaran, C,” Influence Of Thermomigration On Lead-Free

Solder Joint Mechanical Properties”. Trans of the ASME Journal of Electronic

Packaging,, March 2009, Vol. 131 / 011002-1-011002-12, #80

78- Li, S. and Basaran, C. “A Computational Damage Mechanics Model for

Thermomigration,” Mechanics of Materials, vol. 41, issue 3, pp. 271-278, March

2009, #82

79- Li, S., Abdulhamid, M., Basaran, C. and Lai, Y.S. “Damage Mechanics of Low

Temperature Electromigration and Thermomigration” IEEE Trans. On Advanced

Packaging, Vol. 32, No 2, pp., 478-485, May 2009, #85

80- Li, S., Sellers, Basaran, C., M. Schultz, A.,. and Kofke, D., ”Lattice Strain Due to

an Atomic Vacancy,” Int. J. of Molecular Sciences, 2009, 10, 2798-2808, #81

81- Basaran, C. , Li, S. ,Hopkins D.C. and Veychard, D.”Electromigration Time To

Failure of SnAgCuNi Solder Joints” Journal of Applied Physics, 106, 013707,

(2009) # 92

82- Abdulhamid, M., Basaran, C., and Lai, Y.S., ”Thermomigration vs.

Electromigration in Microelectronics Solder Joints” IEEE Transactions on

Advanced Packaging, Vol. 32, No 3, pp. 627-635, August 2009, #79

83- Ragab, T. and Basaran, C. “A Framework for Stress Computation in Single-Walled

Carbon Nanotubes Under Uniaxial Tension” Computational Material Science, 46,

1135-1143, (2009) #89

84- Ragab, T. and Basaran, C.,” Joule heating in single-walled carbon nanotubes,”

Journal of Applied Physics, 106, 063705, (2009), #95

85- Basaran, C., Abdulhamid, M.” Low Temperature Electromigration and

Thermomigration in Lead-Free Solder Joints,” Mechanics of Materials, 41, (2009)

1223-1241, #88

86- Ragab, T., Basaran, C. “A Quantum Mechanical Formulation of Electron

Transport Induced Wind Forces in Metallic Single Walled Carbon Nanotubes:”

Carbon 48 ( 2010) 47-53, #96

87- Li, S. and Basaran, C.”Effective Diffusivity of Lead-Free Solder Alloys”

Computational Materials Science 47, (2009) 71-78, #90

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88- Gunel, E.M., Basaran, C. Micro-deformation mechanisms in thermoformed

alumina trihydrate reinforced poly (methyl methacrylate)

Materials Science and Engineering: A, 523 (2009) 160-172, #99

89- Seller, M. Schultz, A. Basaran, C. and Kofke, D, "Atomistic Modeling of beta-Sn

Surface Energies and Adatom Diffusivity" , Applied Surface Science, 256, (2010)

4402-4407. #93

90- Ragab, T. and Basaran, C. “Semi-classical transport for predicting joule heating in

carbon nanotubes" Physics Letters A, Vol.374 Issue 24 (2010) pp. 2475-2479,

#102

91- Seller, M., Schultz, A., Basaran, C. and Kofke, D., “Sn Grain Boundary Structure

and Self-Diffusivity via Molecular Dynamics Simulation” Physical Review B, 81,

134111 (2010) #103

92- Gunel, E.M., and Basaran, C. “Stress Whitening Quantification in Thermoformed

of Mineral Filled Acrylics”, ASME Journal of Engineering Materials and

Technology, July 2010, Vol. 132, 031002-11, #100

93- Ragab, T and Basaran, C. “The prediction of the effective charge number in single

walled carbon nanotubes using Monte Carlo simulation " Carbon, 49, (2011) 425-

434, #104

94- Chen, B. and Basaran, C. “Statistical Phase Shifting Step Estimation Algorithm

Based on the Continuous Wavelet Transform for High Resolution Interferometry

Metrology” Applied Optics, Vol. 50, No 4, 586-593, February 2011 # 98

95- Sellers, M., Schultz, A. J., Kofke, D., and Basaran , C ” Solute Effects on Sn

Grain Boundary Energy and Shear Stress,” ASCE J. of Nanomechanics and

Micromechanics ,Vol. 1, Number 1, pp. 41-50, March 2011, #109

96- Chen, B. and Basaran, C. Measuring Joule Heating and Strain Induced by

Electrical Current with Moiré Interferometery” Applied Physics Journal , 109,

074908 (2011) # 97

97- Ragab, T. and Basaran, C. “The Unraveling of Open-Ended Single Walled Carbon

Nanotubes Using Molecular Dynamics Simulation,” ASME Journal of Electronic

Packaging, June 2011, Vol. 133, 020903-1- 7, #107

98- Lee, Y. and Basaran, C. “A viscoplasticity model for solder alloys” Trans. Of

ASME, J. of Electronic Packaging, vol. 133, issue 4, December 2011,#101

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Papers Accepted for Publication

99- Gunel, E. and Basaran, C.,”Influence of Filler Content and Interphase properties

onLarge Deformation Micromechanics of particle Filled Acrylics,” July 20, 2010)

Int. J. of Materials and Structural Integrity #108

100- Sellers, M., Schultz, A. J., Basaran , C. and Kofke, D.,” Effect of Cu and Ag Solute

Segregation on Sn Grain Boundary Diffusivity,” (accepted, May 15, 2011)

Journal of Applied Physics, #110

101- Chen, B. and Basaran, C.,”Near Field Modeling of the Moire Interferometer for

Nanoscale Strain Measurment,” (accepted April 4, 2011) ASCE Journal of

Nanomechanics and Micromechanics, #111.

102- Chen, B. and Basaran, C., ”Far-Field Modeling of Moire Interferometry using

Scalar Diffraction Theory,” (accepted August, 2011) Journal of Optics and Lasers

in Engineering, #112

103- Gunel, E.M. and Basaran, C. “Damage Characterization in Non-Isothermal

Stretching of Acrylics: Part I Theory” Mechanics of Materials (accepted

September 26, 2011) #105

104- Gunel, E.M. and Basaran, C. “Damage Characterization in Non-Isothermal

Stretching of Acrylics: Part II Experimental Validation, Mechanics of Materials

(accepted September 26, 2011) #106

Papers Submitted for Review

105- Yao, W. and Basaran, C. “Electromigration of Lead-free Solder Bump under

Pulsed DC”, IEEE CPMT, April 2010. #113

106- Lee, Y. and Basaran, C.,”A Multi-scale Modeling Approach for Bridging

Molecular Dynamics with Finite Element Analysis,”(submitted September 21,

2011) J. of Computational Physics, #114

107- Yao, W. and Basaran, C., ”Electromigration Analysis of Solder Joints under

Alternating Current” #115

Publications: Refereed Archival Pamphlet and Monograph Papers

1- Chandaroy, R., and Basaran, C., "Damage Mechanics of a SMT Package Under

Thermal & Dynamic Loading," 97-WA/EEP-7, ASME publication individual paper.

2- Basaran, C, Yan, Y., and Zhao, Y. ,”Entropy as a Damage Metric for Fatigue Life

Predictions,", 98-WA/EEP-13, ASME publication individual paper.

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3- Basaran, C., Chandaroy, R., and Zhao, Y.,”Influence of Grain Size and

Microstructure on Dynamic Response of Solder Joints,” 98-WA/EEP-12 ASME

publication individual paper.

4- Desai, C.S., Chia, J., Kundu, T., Basaran, C. and Prince, J., "Unified Constitutive

Modeling of Interfaces and Materials in Semiconductor Devices", in Structural

Analysis in Microelectronics and Fiber Optics, editor E. Suhir, Vol.7, 113-126, 1993,

Trans. of ASME-EEP.

5- Basaran, C., Desai, C., Kundu, T. and Prince, J., "Computer Simulation of the

Temperature Cycling Tests,” in Structural Analysis in Microelectronics and Fiber

Optics, editor E. Suhir, Vol.12, 77-82, 1995, Trans. of ASME-EEP.

6- Basaran, C.,"A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn

Solder Alloys," in Structural Analysis in Microelectronics and Fiber Optics, editor E.

Suhir, Vol.16, pp.149-153, 1996, Trans. of ASME-EEP.

7- Basaran, C., and Chandaroy, R.,"Material Nonlinear Dynamic Analysis of a

Pb40/Sn60 Solder Joint," in Structural Analysis in Microelectronics and Fiber

Optics, editor E. Suhir, Vol. 21, pp.227-242, 1997, Trans. of ASME-EEP.

8- Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under

Concurrent Dynamic and Thermal Loading,” Advances in Electronic Packaging

Editors Agonafer, G, Saka, M. and Lee, Y.C. ASME-EEP-Vol. 26-1, pp. 419-439,

1999.

9- Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEM Modeling for Multilayered

Stacks,” Advances in Electronic Packaging Editors Agonafer, G, Saka, M. and Lee,

Y.C. ASME-EEP-Vol. 26-1, pp1147-1154, 1999.

10- Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C. “Creep Behavior of BGA

During Thermal Cycling by Moiré Interferometry”, Advances in Electronic

Packaging Editors Agonafer, G, Saka, M. and Lee, Y.C. ASME-EEP-Vol. 26-1, pp

685-691, 1999.

Publications: Book Review

1- Basaran, C., Solving Large-Scale Problems In Mechanics: The Development and

Application of Computational Solution Methods, editor Papadrakakis, P., John Wiley

& Sons, Int. J. for Numerical and Analy. Meth. In Geomechanics, Vol.18, 139-140,

1994.

Publications: Conference Papers Published in Proceedings

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1- Erdik, M., Basaran, C. and Guler, F., "Soil-Structure Interaction Effects on Recorded Strong

Ground Motion Data," Proc. of the Seventh European Conference on Earthquake

Engineering September 7 - 12, 1986, Lisbon, Portugal.

2- Desai, C.S., Chia, J., Kundu, T., Basaran, C., and Prince, J., "Constitutive Modeling for

Thermomechanical Response of Semiconductor Chip-Substrate Systems," Proc. of the Joint

ASCE-ASME-SES Meeting on Applied Mechanics in Electronic Packaging, Charlottesville,

Virginia, June 1993.

3- Desai, C.S., Chia, J., Basaran, C., Kundu, T. and Prince, J., "Constitutive Modeling of

Mechanical Response of Semiconductor Devices with Emphasis on Interface Behavior,"

Proc. of the NSF Design and Manufacturing Systems Conference, Charlotte, NC, December

1993.

4- Basaran, C., "A Constitutive Model for Sand," Proc. of the IACMAG 94 - VIII International

Conference on Computer Methods and Advances in Geomechanics, May 22-28, 1994,

Morgantown, West Virginia.

5- Desai, C.S., Basaran, C., Chia, J. and Kundu, T., "Disturbed State Constitutive Models for

Thermo-Viscoplastic Behavior of Solids and Interfaces - Computational Aspects," Invited

Key Note Paper, Proc. of the III World Congress on Computational Mechanics, Chiba, Japan,

1 - 5 August, 1994.

6- Desai, C.S., Chia, J., Basaran, C., and Kundu, T., "Disturbed State Concept for Cycling

Behavior: Computer Implementation," Invited Key Note Paper, Proc. of the Int. Conf. on

Computational Methods in Structural and Geotechnical Engineering, Hong Kong, December

12-14, 1994.

7- Desai, C., Kundu, T., Chia, J., Basaran, C. and Prince, J. ,"Unified Constitutive Modeling,

Testing and Computer Design of Semiconductor Devices with Emphasis on Interface

Behavior," Proc. of the National Science Foundation Manufacturing and Industrial

Innovation Conf., University of California San Diego, CA, January 4-6, 1995.

8- Desai, C.S. and Basaran, C.,"Disturbed State Modeling of Materials and Interfaces and

Computer Implementation," Invited Key Note Paper, Proc. of the Int. Conf. on Comp. Eng.

Science, Mauna Lani, Hawaii, July 30-August 3, 1995.

9- Basaran, C., and Yan, C.Y.,"An Interface Constitutive Model for Surface Mount

Interconnects," Proc. 1997 Joint ASME/ASCE/SES Summer Meeting, Northwestern

University June 29- July 2.

10- Basaran, C. and Chandaroy, R.,"Concurrent Dynamic and Thermal Analysis of Surface

Mount Solder Joints,” Proc. 1997 Joint ASME/ASCE/SES Summer Meeting, Northwestern

University June 29- July 2, 1997.

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11- Henry, D., Basaran, C., and Banerjee, P.K.," A Boundary Element Analysis of Multilayered

Structures in Electronics Packaging," Proc. 1997 Joint ASME/ASCE/SES Summer Meeting,

Northwestern University June 29- July 2, 1997.

12- Basaran, C. and Yan, C.Y.,"A Damage Criterion Based on Entropy," Proc. of 12th ASCE

Engineering Mechanics Conference, SanDiego, CA, May 17-20, 1998.

13- Basaran, C., and Zhao, Y.,”Numerical Analysis of Stacks with Very Thin and Very Thick

Layers,”13th

US National Congress of Applied MechanicsUniversity of Florida, Gainsville,

FL, June 21-June26, 1998.

14- Basaran, C. and Yan, C.Y., "A Damage Criterion Based on Entropy for Pb40/Sn60 Solder

Alloys," ASME, Int. Mechanical Engineering Congress and Exposition, Anaheim, CA

November 15-20, 1998.

15- Basaran, C., and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under

Concurrent and Dynamic Loading,” ASME, Int. Mechanical Engineering Congress and

Exposition, Anaheim, CA November, 15-20, 1998.

16- Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under

Concurrent Dynamic and Thermal Loading,” ASME/IEEE InterPACK 99 June 13-19, 1999

Maui, Hawaii.

17- Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEM Modeling for Multilayered Stacks,”

ASME/IEEE InterPACK 99 June 13-19, 1999 Maui, Hawaii.

18- Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C. “Creep Behavior of BGA During

Thermal Cycling by Moiré Interferometry”, ASME/IEEE InterPACK 99 June 13-19, 1999

Maui, Hawaii.

19- Basaran, C., and Yan, C.Y.,”A Damage Mechanics Based Interface Element for Multilayered

Packages,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville, TN

November 14-19, 1999.

20- Basaran, C. and Chandaroy, R.,” A Damage Mechanics Based Constitutive Model for Pb/Sn

Solder Alloys,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville,

TN November 14-19, 1999.

21- Basaran, C., and Zhao, Y., Mechanical Behavior of BGA During Vibrations by Moiré

Interferometry,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville,


22- Basaran, C. and Zhao, Y.,”Closed Form vs. Finite Element Analysis of Laminated Stacks in

Electronic Packaging,” ASME, Int. Mechanical Engineering Congress and Exposition,

Nashville, TN November, 14-19, 1999.

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23- Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C.,”Inelastic Behavior of

Microelectronics Solder Joints Under Concurrent Vibration and Thermal Cycling,” proc.

Itherm 2000, VIIth Thermal and Thermomechanical Phenomena in Electronic Systems, Vol.

II, pp. 349-355, Las Vegas, NV May 23-26, 2000.

24- Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C.,”Thermomechanical Behavior of

BGA Solder Joints Under Vibrations; An Experimental Observation,” Proc. Itherm 2000,

VIIth Thermal and Thermomechanical Phenomena in Electronic Systems, Vol. I, pp.174-

180, Las Vegas, NV May 23-26, 2000.

25- Basaran, C. and Zhao, Y.,”A Constitutive Model for Pb/Sn Solder alloys,”Proc. SMTA

International Assembly Technology Expo., Sept. 24-28, 2000, Rosemont, IL.

26- Wen, Y. and Basaran, C.,”Analysis of Multilayered Electronic Packaging,” InterPACK 2001,

July 8-13 Kauai, Hawaii.

27- Tang, H. Basaran, C. Dishongh, T. and Searls, D.,”Thermomechanical Analysis of Solder

Joints using Thermodynamics,” InterPACK 2001, July 8-13 Kauai, Hawaii.

28- Basaran, C. and Jiang, J.”Selecting Elastic Modulus for Pb/Sn Solder Joints; Is it Art or

Science? ” InterPACK 2001, July 8-13 Kauai, Hawaii.

29- Ye, H., Lin M. and Basaran, C.,”Failure Modes in Power Electronic Packaging,” InterPACK

2001, July 8-13 Kauai, Hawaii.

30- Zhao, Y. and Basaran, C. A Constitutive Model for Eutectic Pb/Sn Solder, InterPACK 2001,

July 8-13 Kauai, Hawaii.

31- Basaran, C., Zhao, Y., Cartwright, A., Dishongh, T.”Evaluating Solder Joint Fatigue

Reliability by Moiré Interferometry,” Proc. Of Advanced Packaging Technologies in the

Electronics Industry, SMTA, June 12-13, 2001 Boston, MA

32- Basaran, C. “Reliability of BGA Under Vibrations”, Proc. Of the Surface Mount Technology

International Conference September 30 – October 4 2001. Chicago, IL

33- Heng, Liu, Basaran, C. Cartwright, A. and Casey, A,”Moiré Interferometry for

Microelectronics Packaging Interface Fatigue Reliability” ManTech 2002, San Diego, April

8-11 2002

34- Ye, H. Basaran, C., Hopkins, D.,”Experimental Study on Reliability of Solder Joints Under

Electrical Stressing,” ICAPS, Int. Conf. On Adv. Packag. Systems March 10-13, 2002, Reno,

NV

35- Basaran, C. Tang, H. and Dishong, T.,” Experimental Characterization of Material

Degradation of Solder Joint under Fatigue Loading,” Proc. Of the VIIIth Intersociety

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Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 29

June1 2002, San Diego, CA.

36- Wen. Y. and Basaran, C. “Grain Growth in Eutectic Pb/Sn Ball Grid Array Solder Joints”,

Proc. Of the VIIIth Intersociety Conference on Thermal and Thermomechanical Phenomena

in Electronic Systems, May 29 June1 2002, San Diego, CA.

37- Ye, H., Basaran, C and Hopkins, D. Reliability of Solder Joints Under Electrical Stressing,

Proc. Of the VIIIth Intersociety Conference on Thermal and Thermomechanical Phenomena

in Electronic Systems, May 29 June1 2002, San Diego, CA.

38- Nie, S., Basaran, C. and Hutchins, C. Experimental Study of Failure Mechanics in Particle

Filled Acrylic Composites,” VIIIth Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San Diego, CA.

39- Ye, H., Hopkins, D., Basaran, C. “Measurement and Effects of High Electrical Current

Stress in Solder Joints,” International Microelectronics and Packaging Society, Symposium,

Denver, Colorado September 4-6, 2002. IMAPS 2002 Best Student Paper Honorable

Mention.

40- Basaran, C,”A Damage Mechanics Theory Without a Potential Surface,” Society of

Engineering Science 39th

Annual Meeting, Penn State, October 13-16, 2002 (Abstract only)

41- Ye, H., Basaran, C., and Hopkins, D.,”Damage Mechanics of Microelectronics Solder Joints

Under High Current Density,” ASME IMECE, New Orleans, LA, November, 17-22, 2002.

42- Basaran, C., Nie, S.,” Irreversible Thermodynamics for Damage Mechanics of Elastic-Brittle

Materials,” ,” ASME IMECE, New Orleans, LA, November, 17-22, 2002.

43- Basaran, C., Tang, H.,”Experimental Damage Mechanics of Microelectronics Solder Joints,”

,” ASME IMECE, New Orleans, LA, November, 17-22, 2002.

44- Basaran, C., and Tang, H.”Implementation of a Thermodynamic Framework for Damage

Mechanics of Solder Interconnects,”” ASME IMECE, New Orleans, LA, November, 17-22,

2002.

45- Basaran, C. and Jiang, J.,”Elastic Modulus of Pb/Sn Solder Joints in Microelectronics,” ,”

ASME IMECE, New Orleans, LA, November, 17-22, 2002.

46- Ye, H., Basaran. C and Hopkins, D.,”Damage Mechanics of Microelectronics Solder Joints

Under High Current Density,” The 54th

Electronic Components and Technology Conf. June

1-4, 2004, Las Vegas, NV.

47- Wen, Y. and Basaran, C.,”Influence of Interfacial Compliance on Thermomechanical

Stresses in Multilayered Microelectronic Packaging,” The 54th

Electronic Components and

Technology Conf. June 1-4, 2004, Las Vegas, NV.

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48- Basaran, C., Lin, M. and Ye, H.,”Thermodynamic Model for Electrical Current Induced

Damage in Microelectronics Solder Joints,” The 54th

Electronic Components and Technology

Conf. June 1-4, 2004, Las Vegas, NV.

49- Basaran, C. Ye, H.and Hopkins D.,”Deformation of Solder Joints Under Current Stressing:

Experimental Measurement and Numerical Simulation” 21st International Congress of

Theoretical and Applied Mechanics, August 15-21, 2004, Warsaw, Poland.

50- Gomez, J. and Basaran, C.”A Damage Mechanics Based Constitutive Model for Low Cycle

Fatigue Analysis,” Proc. Of the IMAPS Congress 2004, Anaheim, CA

51- Ye, H., Basaran, C. and Hopkins, D.C. “Measuring and Modeling the Deformation of BGA

Lead-free Solder Joints under High Current Density,” Proc. Of the IMAPS Congress 2004,

Anaheim, CA

52- Lin, M. and Basaran, C.,” Electromigration Induced Strain Field Simulation for

Microelectronic Lead Free Solder Joints,” Proc. Of the IMAPS Congress 2004, Anaheim, CA

53- Nie, S. and Basaran, C. and Tang, H.,” Experimental Damage Mechanics of Microelectronics

Solder Joints Under Fatigue Loading,” The 55th

Electronic Components and Technology

Conference May 31- June 3, 2005 Lake Buena Vista, Florida

54- Gomez, J. and Basaran, C. “Low Cycle Fatigue Analysis of Microelectronics Solder Joints

Incorporating Damage and Size Effects Using a Thermodynamic Based Rate Dependent

Constitutive Model,” The 55th

Electronic Components and Technology Conference May 31-

June 3, 2005 Lake Buena Vista, Florida

55- Basaran, C. Ye, H, and Hopkins, D. “Modeling Deformation in Microelectronics BGA

Solder Joints Under High Current Density: Simulation and Testing,” The 55th

Electronic

Components and Technology Conference May 31- June 3, 2005 Lake Buena Vista, Florida

56- C.Basaran, S.Nie, C.S. Hutchins ve H.Ergun, " An Experimental Study on the influence of

Filler-Matrix Interfacial Bond Strength and Temperature in a Composite Material", XIV.

National Mechanics Congress, 12-16 September 2005, Antakya, Turkey.

57- Hopkins, D., Kellerman, D., Wunderlich, R.,Basaran, C and Gomez, J.”High Temperature

High Density Packaging of a 60kW Converter for 200C Embedded Operation,” IEEE Power

Electronics Conference (APEX), Dallas, TX March 19-23, 2006.

58- Basaran, C. and Lin, M. abstract “Electrical Current Induced Stress Analysis in Nanowires,”

15th

US National Congress of Theoretical and Applied Mechanics, Boulder, CO 25-30 June

2006,

59- Abdulhamid, M., Basaran, C., Hopkins, H. Experimental Study of Thermomigration in Lead-

Free nanoelectronics Solder Joints, ASME IMECE November 5-10, 2006 Chicago, IL.

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60- Li, S., Lin., M., Abdulhamid, M. and Basaran, C. Thermomigration Induced Strain Field

Simulation for Microelectronics Lead Free Solder Joints, ASME IMECE November 5-10,

2006 Chicago, IL.

61- Gomez, J. and Basaran. C., Length Scale in Solder Joints, ASME IMECE November 5-10,

2006 Chicago, IL.

62- C. Basaran, Key Note Paper, Damage Mechanics of Solder Joints Under High Current

Density, Proc. Of the 10th

Int. Conf. The Mechanical Behavior of Materials, May 27-

30,2007, Busan , Korea., Key Engineering Materials, vols. 345-346, pp. 1403-1410, 2007.

63- C. Basaran, M. Lin and S. Li, “ Computational Simulation of Electromigration Induced

Damage in Copper Interconnects” Proc. Of the Summer Simulation Multiconference 2007,

Organized by Society for Modeling and Simulation July 14-18, 2007, San Diego, CA

64- C. Basaran, J. Gomez, M. Lin, and S. Li , Damage Mechanics Modeling of Concurrent

Thermal and Vibration Loading On Electronics Packaging, Proc. Of the Summer Simulation

Multiconference 2007, Organized by Society for Modeling and Simulation July 14-18, 2007,

San Diego, CA

65- M. S. Sellers, A. J. Schultz, D. A. Kofke, C. Basaran, “Molecular Dynamics Modeling of

Grain Boundary Diffusion in Sn-Ag-Cu Solder” AIChe Annual Meeting, Salt Lake City,

Utah, November 4-9, 2007.

66- Kevin E. Enser, Douglas C. Hopkins, Cemal Basaran Techniques for Investigation of Solder

interconnect Electromigration under Time Varying Current Stressing, IMAPS 2007

November 13-15, 2007 San Jose CA

67- Abdulhamid, M. F. and Basaran, C.”Low Temperature Electromigration and

Thermomigration in Lead Free Solder Alloy,” 33rd

Int. Electronics Manufacturing

Technology Conference, Penang, Malaysia, 4-6 November, 2008.

68- C. Basaran and M. Lin “Electromigration Damage Mechanics of Interconnects”, Proc. Of the

ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of

Electronics and Photonic Systems, MEMS and NEMS, InterPACK ’09, July 19-23, 2009 San

Francisco, CA

69- C. Basaran and T. Ragab, “Damage Mechanics of Carbon Nano Tubes under Unaixial

Tension,” ASME/Pacific Rim Technical Conference and Exhibition on Packaging and

Integration of Electronics and Photonic Systems, MEMS and NEMS, InterPACK ’09, July

19-23, 2009 San Francisco, CA

70- Chen, B., Basaran, C. Statistical Phase Shifting Step Estimation Based on Continous

Wavelet Transform For High resolution Interferometry Metrology,” Proc. Of the Itherm Int.

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Systems Conf. 2010, Las Vegas NV

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71- Lee, Y and Basaran, C. A Viscoplasticity Model for Solder Alloys, Proceedings of the

ASME 2010 International Mechanical Engineering Congress & Exposition IMECE2010

November 12-18, 2010 Vancouver, British Columbia, Canada

Publications: Technical Reports

1- Basaran, C., and Desai, C.S., Finite Element Thermomechanical Analysis of Electronic

Packaging Problems Using Disturbed State Constitutive Models, Report to the National

Science Foundation, Dept. of Civil Engineering and Engineering Mechanics, University

of Arizona, 9/1994

2- Basaran, C. Zhao, Y. and Yan, C. Experimental and Analytical Damage Mechanics of

BGA Packaging, Office of Naval Research, May 2001.

3- Basaran, C. and Ye, H. Reliability of Power Electronics Building Block Packaging,

Office of Naval Research, May 2004.

4- Basaran, C. Reliability of Next Generation Power Electronics Packaging Under

Concurrent Vibration, Thermal and High Power Loads, Office of Naval Research, April

2008

Invited Lectures and Key Note Presentations

1- "Disturbed State Concept", VIII International Conference on Computer Methods and

Advances in Geomechanics, Prof. C.S. Desai Honorary Session, May 22-28, 1994,

University of West Virginia, Morgantown, WV.

2- “Disturbed State Concept Constitutive Models for Surface Mount Technology

Interconnects", Dept. of Mechanical Engineering, University of Maryland, at College

Park, September 9, 1994.

3- “Damage Mechanics of Semiconductor Interconnects" Dept. of Mechanical Engineering,

Virginia Commonwealth University, Richmond, VA, June 2, 1997.

4- “Damage Mechanics of Surface Mount Technology Solder Joints”, Dept. of Mechanical

Engineering, Texas A&M University, College Station, TX, April 13, 1998.

5- “Damage Mechanics of Solder Joints in Surface Mount Technology Microelectronics

Packaging,” Dept. of Mechanical Engineering, Aeronautical Engineering and Mechanics,

Rensselaer Polytechnic Institute, Troy, NY, May 11, 1998.


Packaging,” Dept. of Aerospace Engineering and Engineering Mechanics, Iowa State

University at Ames, September 21, 1998.

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Packaging,” Dept. of Mechanical Engineering and Applied Mechanics, University of

Michigan at Ann Arbor, September 30, 1998.

8- “Experimental Mechanics of Electronic Packaging Using Moiré Interferometry”, Dept. of

Mechanical Engineering, Polytechnic University, Brooklyn, NY November 4, 1999.

9- “A Thermodynamic Framework for Damage Mechanics of Microelectronics”, Dept. of

Civil and Environmental Engineering, Cornell University, Ithaca, NY April 2, 2002.

10- “Damage Mechanics of Next Generation Electronics”, Dept. of Mechanical Engineering,

Florida State University, Tallahassee, FL, February 16, 2004.

11- “Damage Mechanics of Nanoelectronics”, Dept of Mechanical Engineering, Northeastern

University, Boston, MA March,2, 2007.

12- “Multi-Scale Damage Mechanics of Nanoelectronics Solder Joints”, POSTECH, Pohang

University of Science and Technology, Dept. of Mechanical Engineering, Pohang, South

Korea, May 29, 2007

13- Key Note Paper, Damage Mechanics of Solder Joints under High Current Density, 10th

Int. Conf. On Mechanical Behavior of Materials, May 27-30, 2007, Busan, South Korea.

14- Key Note Lecture, Modeling Damage Mechanics of Particle Filled Composites: with

Micromechanics and Thermodynamics,” 15th

Int. Symposium on Plasticity & Its Current

Applications, St Thomas, U.S. Virgin islands, January 3-8, 2009.

15- Key Note Lecture, Using Single Walled Carbon Nano Tubes for Electronics, ASME Int.

Mechanical Engineering Congress and Exposition IMECE 2009, Orlando, FL November

13-19, 2009.

16- “Electromigration and Thermomigration in Nanoelectronics” Dept. of Chemical

Engineering, University of Massachusetts, at Lowell April 15, 2011.

17- “Electromigration and Thermomigration in Nanoelectronics” Binghamton University,

The Center of Excellence, Small Scale Systems Integration and Packaging (S³IP), June

22, 2011

Conference and Workshop Presentations

18- "A Constitutive Model for Sand,” IACMAG 94 - VIII International Conference on

Computer Methods and Advances in Geomechanics, May 22-28, 1994, Morgantown,

West Virginia.

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19- Computer Simulation of the Temperature Cycling Tests,” ASME, International

Mechanical Engineering Congress and Exposition, San Francisco, CA, Nov 12-17, 1995.

20- "A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder

Alloys," ASME, Int. Mechanical Engineering Congress and Exposition, Atlanta, GA,

November 17-22, 1996.

21- "An Interface Constitutive Model for Surface Mount Interconnects,” 1997 Joint

ASME/ASCE/SES Summer Meeting, Northwestern University June 29- July 2, 1997.

22- "Concurrent Dynamic and Thermal Analysis of Surface Mount Solder Joints,” 1997 Joint

ASME/ASCE/SES Summer Meeting, Northwestern University June 29- July 2, 1997.

23- "Material Nonlinear Dynamic Analysis of a Pb40/Sn60 Solder Joint,” ASME, Int.

Mechanical Engineering Congress and Exposition, Dallas, TX, November 16-21, 1997.

24- "Damage Mechanics of a SMT Package Under Thermal & Dynamic Loading,” Symp. on

Mechanics of Surface Mount Assemblies, ASME, Int. Mechanical Engineering Congress

and Exposition, Dallas,TX, November, 16-21, 1997.

25- "Power Electronics Module Reliability," Office of Naval Research PEBB Conference,

Wilkes-Barre, PA, October 21-23, 1997.

26- "A Damage Criterion Based on Entropy,” 12th ASCE Engineering Mechanics

Conference, SanDiego, CA, May 17-20, 1998.

27- "A Thermodynamic Framework for Determination of Solder Fatigue Life," ASME, Int.

Mechanical Engineering Congress and Exposition, Anaheim, CA November 15-20, 1998.

28- ”Mechanics of Solder Joints Under Concurrent and Dynamic Loading,”“ Int. Mechanical

Engineering Congress and Exposition, Anaheim, CA November, 15-20, 1998.

29- ”Thermomechanical Analysis of Solder Joints Under Concurrent Dynamic and Thermal

Loading,” ASME- InterPACK ’99 International Electronic & Photonic Packaging

Conference Lahaina, Hawai’I, June 12-18, 1999.

30- ,”Mesh Sensitivity and FEM Modeling for Multilayered Stacks,” ASME- InterPACK ’99

International Electronic & Photonic Packaging Conference Lahaina, Hawaii, June 12-18,

1999.

31- “A Damage Mechanics Based Constitutive Model for Pb/Sn Solder Alloys”, ASME, Int.

Mechanical Engineering Congress and Exposition, Nashville, TN November 14-19,

1999.

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32- ”Mechanical Behavior of BGA During Vibrations by Moiré Interferometry and FEM

Simulation,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville,


33- “Closed Form vs. Finite Element Analysis of Laminated Stacks in Electronic Packaging,”

ASME, Int. Mechanical Engineering Congress and Exposition, Nashville, TN November,

14-19, 1999.

34- Damage Mechanics of BGA Solder Joints under Combined Loading and Mini Temp

Cycles” Intel Corporation, Hillsboro, OR March 16, 2000.

35- ”A Constitutive Model for Pb/Sn Solder Alloys,” Surface Mount Technology Assoc.

International Assembly Technology Expo. Sept. 24-28, 2000, Rosemont, IL.

36- “A Damage Mechanics Based Constitutive Model for Pb/Sn Solder Alloy,” ASME, Int.

Mechanical Engineering Congress and Exposition, November 2000 Orlando, FL.

37- ”Influence of Minicyles on Fatigue Life,”“ASME, Int. Mechanical Engineering Congress

and Exposition, Orlando, FL, November 2000.

38- A Damage Mechanics based Approach to Fatigue Life Prediction of Electronic Packaging,

Micron Technology, Q&R Engineering, Boise, ID, May 2001.

39- A Moiré Interferometry Technology for Thermomechanical Fatigue Reliability of Solder

Joints, SMTA Advanced Packaging Technologies Conference, Boston, MA June 12,

2001.

40- Using Moiré Interferometry for Fatigue Reliability of Solder Joints, ASME/ASCE/SES

Mechanics and Materials Conference, San Diego, CA June 26-29 2001.

41- A Moiré Interferometry Technique for Fatigue Reliability of Microelectronics Interfaces,

Inter. Mechanical Engineering Congress and Exposition, November 11, 2001, NY City,

NY.

42- ” Experimental Characterization of Material Degradation of Solder Joint under Fatigue

Loading,” Proc. Of the VIIIth Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San Diego,

CA.

43- “Grain Growth in Eutectic Pb/Sn Ball Grid Array Solder Joints”, Proc. Of the VIIIth


Systems, May 29 June1 2002, San Diego, CA.

44- “Reliability of Solder Joints Under Electrical Stressing, Proc. Of the VIIIth Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May

29 June1 2002, San Diego, CA.

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45- “Experimental Study of Failure Mechanics in Particle Filled Acrylic Composites,” VIIIth


Systems, May 29 June1 2002, San Diego, CA.

46- “A Damage Mechanics Theory without a Potential Surface” Society of Engineering

Science 39th

Annual Meeting, Penn State, October 13-16, 2002.

47- Thermo-Electro-Mechanical Reliability of Microelectronics”, Delphi-Delco Electronics

Inc., Kokomo, IN October 18, 2002.

48- Damage Mechanics of Microelectronics Solder Joints Under High Current Density,

ASME IMECE, New Orleans, LA, November, 17-22, 2002.

49- Irreversible Thermodynamics for Damage Mechanics of Elastic-Brittle Materials, ASME

IMECE, New Orleans, LA, November, 17-22, 2002.

50- Experimental Damage Mechanics of Microelectronics Solder Joints, ASME IMECE,

New Orleans, LA, November, 17-22, 2002.

51- Implementation of a Thermodynamic Framework for Damage Mechanics of Solder

Interconnects, ASME IMECE, New Orleans, LA, November, 17-22, 2002.

52- Elastic Modulus of Pb/Sn Solder Joints in Microelectronics, ASME IMECE, New

Orleans, LA, November, 17-22, 2002.

53- Microstructural Evolution in Microelectronics Solder Joints Under High Electrical

Current Densities, ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ

June 17-20 2003

54- A Thermodynamic Model for Damage Mechanics of Solids Under High Current

Densities, ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June 17-20

2003

55- Damage Mechanics of Particle Infilled Composites: Model and Experimental

Verification, ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June 17-

20 2003

56- An Analytical Model for Thermomechanical Analysis of Layered Microelectronic

Packaging,” ,” ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June

17-20 2003

57- Damage Mechanics of Microelectronics Solder Joints: Modeling and Experimental

Verification,” ,” ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June

17-20 2003

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58- Improvement on moiré interferometry with phase shifting technique and wavelet

transform image processing,” ASME, 2003 Mechanics and Materials Conference,

Scottsdale, AZ June 17-20 2003.

60- Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered

Microelectronic Packaging,” The 54th

Electronic Components and Technology Conf.

June 1-4, 2004, Las Vegas, NV.

61- Thermodynamic Model for Electrical Current Induced Damage in Microelectronics

Solder Joints,” The 54th

Electronic Components and Technology Conf. June 1-4, 2004,

Las Vegas, NV. Poster session.

62- ,”Damage Mechanics of Microelectronics Solder Joints Under High Current Density,”

The 54th

Electronic Components and Technology Conf. June 1-4, 2004, Las Vegas, NV.

63- ”Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered

Microelectronic Packaging,” The 54th

Electronic Components and Technology Conf.

June 1-4, 2004, Las Vegas, NV.

64- ”Thermodynamic Model for Electrical Current Induced Damage in Microelectronics

Solder Joints,” The 54th

Electronic Components and Technology Conf. June 1-4, 2004,

Las Vegas, NV.

65- ,”Deformation of Solder Joints Under Current Stressing: Experimental Measurement and

Numerical Simulation” 21st International Congress of Theoretical and Applied

Mechanics, August 15-21, 2004, Warsaw, Poland.

66- “Failure Modes of Micro/Nano Electronics Solder Joints Under High Current Density”,

ASME International Mechanical Engineering Congress and Expo, Orlando , FL

November 6-11, 2005

67- Modeling Deformation in Micro/Nano Electronics Solder Joints Under High Current

Density: Simulation and Testing,”, ASME International Mechanical Engineering

Congress and Expo, Orlando , FL November 6-11, 2005.

68- Electrical Current Induced Stress Analysis in Nanowires,” 15th

US National Congress of

Theoretical and Applied Mechanics, Boulder, CO 25-30 June 2006.

69- Experimental Study of Thermomigration in Lead-Free nanoelectronics Solder Joints,

ASME IMECE November 5-10, 2006 Chicago, IL.

70- Thermomigration Induced Strain Field Simulation for Microelectronics Lead-Free Solder

Joints, ASME IMECE November 5-10, 2006 Chicago, IL.

71- Length Scale in Solder Joints, ASME IMECE November 5-10, 2006 Chicago, IL

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72- “ Computational Simulation of Electromigration Induced Damage in Copper

Interconnects” Proc. Of the Summer Simulation Multiconference 2007, Organized by

Society for Modeling and Simulation July 14-18, 2007, San Diego, CA

73- Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading On

Electronics Packaging, Proc. Of the Summer Simulation Multiconference 2007,

Organized by Society for Modeling and Simulation July 14-18, 2007, San Diego, CA

74- “Strain energy change due to an atomic defect in solder alloy lattice,” Summer

Simulation Multiconference 2007, Organized by Society for Modeling and Simulation

July 14-18, 2007, San Diego, CA, (Poster Session)

75- “Modeling High Current Density Induced Strain Field in Led Free Solder Joints” ASME

Int. Mechanical Engineering Congress and Expo Seattle, Washington, November 10-15,

2007.

76- ” Atomistic Modeling of Grain Boundary Diffisuon in Lead Free Solder Alloys,” ASME

Int. Mechanical Engineering Congress and Expo Seattle, Washington, November 10-15,

2007.

77- “Deterministic Calculations of Lattice Strain Due to Atomistic Defect in Solder Alloys,”

ASME Int. Mechanical Engineering Congress and Expo Seattle, Washington, November

10-15, 2007

78- “Thermomigration in Lead-Free Solder Joints,” ASME Int. Mechanical Engineering

Congress and Expo Seattle, Washington, November 10-15, 2007

79- ” A Micromechanics Based Damage Mechanics Model for Particle Filled Composites,”

ASME Int. Mechanical Engineering Congress and Expo Seattle, Washington, November

10-15, 2007

80- Simulating Degradation in High Density Power Electronics Packaging,,Int. Simulation

Conference, Edinburgh, Scotland, June 16-19, 2008

81- Molecular Dynamic Simulations of an Atom Vacancy in FCC Metal, ,,Int. Simulation

Conference, Edinburgh, Scotland, June 16-19, 2008

82- Simulating Low Temperature Electromigration and Thermomigration in Power

Electronics Packaging, ,,Int. Simulation Conference, Edinburgh, Scotland, June 16-19,

2008.

83- “Low Temperature Electromigration and Thermomigration in Lead Free Solder Joints,

ASME Int. Mech Engineering Congress and Expo, November 1-6, 2008, Boston, MA.

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84- C. Basaran and Mohd F. AbdulHamid, ”Low Tempertaure Electromigrationand

Thermomigration in Lead-Free Solder Joints,” ASME Int. Mech Engineering Congress

and Expo, November 1-6, 2008, Boston, MA.

85- “Automatic Full Strain Field Moire Interferometry measurement with Nanoscale

Resolution, ASME Int. Mech Engineering Congress and Expo, November 1-6, 2008,

Boston, MA.

86- “Quantitative Plane Strain Field measurement of Solder Joint under Electrical Field with

Quasi-Isothermal Condition using Automatic Moire Interferometery,” ASME Int. Mech

Engineering Congress and Expo, November 1-6, 2008, Boston, MA

87- “Thermomigration Induced Degradation Analysis with Fully Coupled

Thermomechanical-Diffusion Equations using Nonlinear Material Properties,” ASME

Int. Mech Engineering Congress and Expo, November 1-6, 2008, Boston, MA

88- “Thermomigration in Lead Free Solder Joints, ASME Int. Mech Engineering Congress

and Expo, November 1-6, 2008, Boston, MA

89- Atomistic Modeling of Grain Boundary Diffusion in Sn-Ag-Cu Solder Alloys,” ASME

Int. Mech Engineering Congress and Expo, November 1-6, 2008, Boston, MA

90- “Stress Calculations in CarbonNanoTunes,” Atomistic Modeling of Grain Boundary

Diffusion in Sn-Ag-Cu Solder Alloys,” ASME Int. Mech Engineering Congress and

Expo, November 1-6, 2008, Boston, MA

91- “Multi-Scale Electromigration and Thermomigration Analysis of Nanoelectronics and

Power electronics” Semiconductor Research Corporation Summer review, Georgia Tech,

Atlanta, GA June 16-18, 2009

92- “Electromigration Damage Mechanics of Interconnects”, ASME/Pacific Rim Technical

Conference and Exhibition on Packaging and Integration of Electronics and Photonic

Systems, MEMS and NEMS, Inter PACK ’09, July 19-23, 2009 San Francisco, CA

93- “An Empirical Electromigration Time to Failure Equation for Lead-Free Solder Joints”,

ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration

of Electronics and Photonic Systems, MEMS and NEMS, InterPACK ’09, July 19-23,

2009 San Francisco, CA

94- “Damage Mechanics of Carbon nano Tubes under Uniaxial Tension”, ASME/Pacific Rim

Technical Conference and Exhibition on Packaging and Integration of Electronics and

Photonic Systems, MEMS and NEMS, InterPACK ’09, July 19-23, 2009 San Francisco,

CA

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95- Quantum Mechanical Formulation For the Joule Heating in Single-walled Carbon

Nanotubes, ASME International Mechanical Engineering Congress and Exposition,

November 13-196, 2009, Orlando, FL

96- Prediction of Current-induced Forces in Single-walled Carbon Nanotubes , ASME

International Mechanical Engineering Congress and Exposition, November 13-196, 2009,

Orlando, FL

97- An Experimental Electromigration Study on SnAgCuNi Solder Joints, ASME


Orlando, FL

98- Simulating Single Walled Carbon NanoTube Failure Under Tension, ASME


Orlando, FL

99- A Computational Damage Mechanics Model for Thermomigration, ASME International

Mechanical Engineering Congress and Exposition, November 13-196, 2009, Orlando, FL

100- Full Field Joule Heating Measurement of Copper Plate using Phase Shifting

Moiré Interferometry in Microscopic Scale, ASME International Mechanical Engineering

Congress and Exposition, November 13-19, 2009, Orlando, FL

101- Statistical Phase shifting Step Estimation based on Continuous Wavelet

Transform for High Resolution Interferometry Metrology, ASME International


102- Modeling of the Moiré Interferometer for the Applications of Nano-scale

Measurement in the Reliability Testing of the Electronic Packaging, ASME International


103- Atomistic Modeling of Tin Surface and Grain Boundary Diffusion, ASME


Orlando, FL

104- A Study on Stress Whitening in Thermoformed Mineral Filled Acrylics , ASME


Orlando, FL

105- Damage Mechanics of Next generation Power Electronics, Summer Simulation

Multi-Conference, July 11-14, 2010 Ottawa, Canada

106- A Viscoplatic Model For Solder Alloys , ASME International Mechanical

Engineering Congress and Exposition, November 12-18, 2010, Vancouver, B.C., Canada

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107- Electromigration Behavior of Solder under Single Pulsed Load, ASME


Vancouver, B.C., Canada

108- The effect of Temperature on the Mechanical Behavior of Defected Single-

Walled Carbon Nanotubes Using Molecular Dynamics Simulations , ASME International

Mechanical Engineering Congress and Exposition, November 12-18, 2010, Vancouver,

B.C., Canada

109- Molecular Dynamics Simulations of the Unraveling of Carbon Nanotubes due

Field Emission Forces, ASME International Mechanical Engineering Congress and

Exposition, November 12-18, 2010, Vancouver, B.C., Canada

110- Damage Mechanics of electronic packaging solder joints under AC, ASME



111- Modeling of Moiré Interferometer for the Applications of Nano-scale

Measurement in Reliability Testing of Electronic Packaging, ASME International

Mechanical Engineering Congress and Exposition, November 12-18, 2010, Vancouver,

B.C., Canada

112- Near Field Multi-physics Modeling of the Moiré Interferometer for the

Applications of High Resolution for Thermomechanical Testing of Electronic Packaging

, ASME International Mechanical Engineering Congress and Exposition, November 12-

18, 2010, Vancouver, B.C., Canada

113- Damage Evolution in Non-Isothermal Stretching of Acrylics across Glass

Transition , ASME International Mechanical Engineering Congress and Exposition,

November 12-18, 2010, Vancouver, B.C., Canada

114- Non-Isothermal Stretching of Acrylics across Glass Transition , ASME



115- Atomistic Modeling of Copper Dopant Grain Boundary Stabilization in Tin,

ASME International Mechanical Engineering Congress and Exposition, November 12-18,

2010, Vancouver, B.C., Canada

116- Theory Of Entropy Based Damage Mechanics, ASME International Mechanical

Engineering Congress and Exposition, November 12-18, 2010, Vancouver, B.C., Canada

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117- A Multiscale Analyis Method to Connect MDS with FEA, Society for

Engineering Sciences Annual Conference, Northwestern University October 12-14, 2011

118- Unraveling in Field Emitter SWCNT, Society for Engineering Sciences Annual

Conference, Northwestern University October 12-14, 2011

119-

Professional Affiliations

Fellow, American Society of Mechanical Engineers

Member, IEEE

Member, IEEE Components, Packaging and Manufacturing Technology Society

Member, Society for Modeling and Simulation

Technical Reviewer

Nature

Acta Materialia

Journal of the Mechanics and Physics of Solids

Mechanics of Materials

Geophysical Journal International

Engineering Fracture Mechanics

Experimental Mechanics

Materials Science and Engineering A

International Journal of Solids & Structures

International Journal of Damage Mechanics

International Journal for Numerical Methods in Engineering

International Journal of Mechanical Sciences

Journal of Engineering Mechanics, Trans. Of ASCE

Journal of Electronic Packaging, Trans. Of ASME

Journal of Comp. Pack. Manuf. Tech. Part A, Trans. Of IEEE

Journal of Advanced Packaging, Trans. Of IEEE

Journal of Electronic Materials

Mechanics Research Communication

Journal of Alloys and Compounds

Microelectronics Reliability

Engineering Fracture Mechanics

Fatigue and Fracture of Engineering Materials and Structures

AWS, Welding Journal

Prentice Hall, Engineering Text Books.

Physics. Status Solidi B

Journal of Composites : A

Proceedings of the Royal Society: A

Cemal Basaran

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International Journal of Reliability and Safety

Materials Chemistry and Physics

ASCE J of Nanomechanics and Micromechanics

International Professional Service

Expert Advisor to Canada Foundation for Innovation for $65 million microelectronics

and photonics research infrastructure grants, September 13-14, 2001, Toronto, Canada.

Proposal Reviewer for Northern Ireland, UK Higher Education Authority, North South

Research Program, June 2003,

Proposal Reviewer Hong Kong Science and Technology Commission, Research Grants

Council, May 2000, March 2003, October 2005, February 2009.

Proposal Reviewer for, Science Foundation Ireland, Republic of Ireland, February 2004.

Reviewer, Chateaubriand Fellowship, French Embassy, Office for Science and

Technology, March 2007

Proposal Reviewer, U.S. State Department, International Science and Technology Center,

Nonproliferation Program for non-weapons opportunities for scientists and engineers in

the New Independent States (NIS) of the former Soviet Union, January 2008.

Proposal Reviewer for Department of Defense SERDP Weapons Systems and Platforms

program, April 2009.

University and Community Service

Dept. of Civil, Structural and Environmental Engineering

Director of Graduate Studies, July 2004 –July 2007.

Chair, Dept. of CSEE Computer Committee, March 2003-September 2004.

Member, Construction Engineering Faculty Search Committee, 2000-2001.

Member, Structures Faculty Search Committee, 1999-2000.

Coordinator, Geotechnical Division Master of Engineering Program, 1996-1997, 1997-

1998.

Member, Graduate Studies Committee, 1995-1999, 2002-present

Member, Master of Engineering Committee, 1997-1998.

Coordinator, Geotechnical and Computational Mechanics Divisions Graduate

Admissions, 1996-1997, 1997-1998, 1998-1999.

Member, Computer Committee, 1995 to 2004.

Member, Geotechnical Faculty Search Committee, Spring 1996.

Coordinator, Dept. of Civil Engineering Weekly Seminar Series, Spring 1996.

Faculty Advisor, Civil Engineering Dept. Graduate Student Association, 1996 to present.

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Freshmen Academic Advisor to SEAS Students 2000- present

Member, Structural Mechanics Faculty Search Committee, 1998-1999.

Faculty mentor, mentoring one junior faculty member, Prof. Aref. 1999-2002.

Coordinator, Dept. of Civil Engineering Computational Simulation Group Weekly

Seminar Coordinator, Spring 2004

School of Engineering and Applied Sciences

Director, Electronic Packaging Laboratory, 1997-present.

National Society of Black Engineers UB chapter Volunteer, Oratorical Contest Judge,

Fall 1996.

Advisor and host for NSF- SUNY Alliance for Minority Participation Research

Internship Program. Mr. Emanuel St. Pierre, Summer 1997.

Member, Provost Advisory Committee for Doubling Research Dollars at UB, 2000.

BEAM/SEAS Honors Research Summer Program Faculty Advisor since 1996-present

University at Buffalo

Member, Faculty Senate Executive Committee, 2004-2005, 2005-2006.

Member, Schomburg Minority Graduate Fellowship Review Committee, Spring 2005

Senator, University at Buffalo, Faculty Senate, July 1, 2004 – June 30, 2006.

Alternate Senator, University at Buffalo, Faculty Senate 1998-1999, 2003-2004.

SUNY Alliance for Graduate Education and Professoriate NSF Grant Advisory

Committee Member, 2000-2004

National Level Service

1. Member, ASME Electronic Packaging Division, 1995 to present.

2. Member, American Society of Mechanical Engineers, Electrical & Electronic

Packaging Division, Manufacturing Subcommittee 11/1995-11/1996.

3. Vice-Chair, Session EEP-11: Stress/Strain Modeling in Microelectronics, ASME

International Mechanical Engineering Winter Annual Congress & Exposition,

November 12-17, 1995.

4. Chair, session on Applications of FEM and BEM to Electronic Packaging 1997

Joint ASME/ASCE/SES Meeting June 29 - July 2, 1997 Northwestern University,

Evanston, IL

5. Chair, Track 3/ Session 3.2 Modeling of Solder Solidification and Fatigue, ASME

InterPACK Conference Maui, Hawaii, June 13-17, 1999.

6. Member, ASME Materials and Applied Mechanics Divisions Joint Constitutive

Modeling Executive Committee 1999 to present.

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7. Invited Panelist, National Science Foundation- SUNY Alliance for Minority

Participation Minority Graduate School Awareness Conference, Buffalo, NY,

October 11, 1997, and October 30, 1999 and October 14, 2000. November 2002.

8. National Science Foundation CAREER Award Panel, 1999, 2000.

9. National Science Foundation, Unsolicited Proposal Reviewer, 2000.

10. Chair, Symposium on Plasticity at Small Scale for Emerging Technologies, ASME

Int. Congress and Exposition, November 5-10, 2000 Orlando, FL.

11. Chair, Symposium on Advances in Applied Mechanics for New Technologies,

International Mechanical Engineering Congress and Exposition November 12-16,

2001, NY City, NY

12. Chair, session on Failure Mechanics,” VIIIth Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San

Diego, CA.

13. Chair, Symposium (8 sessions) on Recent Advances Damage Mechanics, ASME,

International Congress and Expo, November, 18-22, 2002, New Orleans, LA.

14. Lead Reviewer & Panelist, NSF, Division of Materials Research, Major Research

Instrumentation (MRI) infrastructure funding program, May 7- 8, 2003,

15. Panel Chair, NSF, Division of DMII Materials Processing and Manufacturing

Program, Unsolicited Proposals, December 15, 2003.

16. Chair, Symposium on Reliability, Electronics Packaging Division, ASME

International Mechanical Engineering Congress and Expo, Orlando , FL November 6-

11, 2005

17. NSF, Panelist, Division of DMII Materials Processing and Manufacturing Program

Unsolicited Proposals, January 10, 2006.

18. Chair, Session on Mechanics of Next generation Nanoelectronics and Power

Electronics, 15th

US National Congress of Theoretical and Applied Mechanics,

Boulder, CO 25-30 June 2006.

19. Chair, Session on Mechanical Behavior of Joints, 10th

Int. Conf. On the Mechanical

Behavior of Materials, Busan, Korea, May 27-30 2007.

20. External faculty mentor, Prof. Rashid Abu Al-Rub, Zachary Dept. of Civil

Engineering, Texas A&M University, College Station, TX

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21. Topic Co-Organizer, Symposium on Multi-Physics Issues in Electronic/Photonic

Packaging, Symposium Quality and Reliability of Electronic/Photonic Packaging,

Symposium Organizer on Multi-Scale Constitutive Modeling, ASME Int.

Mechanical Engineering Congress and Exposition, October 31- November 6, 2008,

Boston, MA

22. Chair, Session on Packaging Reliability I and Failure Mechanisms-II, ASME/Pacific

Rim Technical Conference and Exhibition on Packaging and Integration of

Electronics and Photonic Systems, MEMS and NEMS, InetrPACK ’09, July 19-23,

2009 San Francisco, CA

23. Chair, Symposium on Atomistic Level Modeling, ASME ASME International

Mechanical Engineering Congress and Exposition 2009

24. Co-Chair, ASME International Mechanical Engineering Congress and Exposition

2010 Electronic & Photonic Packaging Track Co-Chair, Vancouver, Canada

25. Chair, ASME International Mechanical Engineering Congress and Exposition 2011

Electronic & Photonic Packaging Track, Denver, Colorado.

Community Service

1- Volunteer Interpreter and Translator at the International Institute of Buffalo, which is

a nonprofit organization providing assistance to refugees, and new immigrants.

2- Volunteer Consultant Civil Engineer "Westfield Cooperative Farm" Construction,

1996.

3- Volunteer 4-H Leader Cornell Cooperative Extension in Chautauqua County, 1997,

1998.

4- Volunteer Speaker at Albion Central Schools, 2002.

5- Vice-President, Empower Orleans December 2006 – February 2008

6- Chairman, Orleans County Legislature’s Citizens Advisory Board, August 2008 –

present

Professional Experience (industry)

Cygna Energy Services, Boston, MA

Staff Engineer 6/1988-1/1992.

Group leader for structural analysis.

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Started the computer aided design tradition by initiating the use of MathCAD and

AutoCAD for designing nuclear pipe supports and steel structures. Initiated the tradition

of using Databases for power plant structural component inventory control. Trained

engineers on using finite element packages.

Worked as a consultant structural engineer in the nuclear industry. Some of the

consulting projects undertaken are;

1-Toledo Edison's Davis Besse Nuclear Station, seismic analysis of piping systems, ( 6

months in 1991)

2- New York Consolidated Edison's Indian Point 2, seismic analysis for snubber

reduction effort for the auxiliary coolant lines, (3 months in 1990)

3- Boston Edison Pilgrim Nuclear Power Plant Unit 1 Independent Design Review of the

main steam piping stress analysis, (2 months in 1988)

4- Toledo Edison's Davis-Besse Nuclear Power Plant, seismic analysis of the

demineralized water transfer and storage piping system (4 months in 1990)

5- Yankee Rowe Nuclear Station, seismic analysis of bleed drain piping system. (4

months, in 1989)

6- California Transportation Authority' (CALTRANS), seismic analysis and evaluation of

the Interstate 280 Highway China Basin section (San Francisco) viaduct soil-structure

system. (4 months in 1990)

7- CALTRANS, parametric study of finite element modeling of the two level elevated

highways for seismic analysis. (3 months in 1989)

8- Toledo Edison Davis-Besse Nuclear Power Plant, station blackout diesel generator

building, equipment, piping and pipe supports seismic analysis. (4 months in 1991)

9- Grand Gulf Nuclear Power Station, Drywell Valve Handling crane seismic analysis. (2

months in 1988)

10- Toledo Edison's Davis-Besse Nuclear Power Plant, seismic analysis of existing/new

pipe support associated with auxiliary and main steam cooling piping systems. (3 months

in 1989)

11- System Energy Resources Grand Gulf Nuclear Power Plant Unit 1, standby service

water piping nonstandard pipe supports and penetrations load reconciliation/evaluation

project.(2 months in 1988)

12- Boston Edison Pilgrim Nuclear Power Station, TIP room platform seismic analysis.(2

months in 1988)

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13- System Energy Resources, Grand Gulf Nuclear Station Unit-1, the seismic design of

instrument air system filter station.(3 months in 1989)

14- System Energy Resources Grand Gulf Nuclear Power Station Unit-1, seismic

analysis. (3 months in 1991)

15- Boston Edison's Pilgrim Nuclear Station, finite element analysis of the main steam

piping gangways.(2 months in 1988)

16- Tennessee Valley Authorities Browns Ferry Nuclear Power Plant for motor control

center enclosure design and seismic analysis. (2 months in 1989)

Workshops and Institutes Attended

American Society for Engineering Education, The National Effective Teaching Institute,

Milwaukee, WI, June 12-14, 1997.

American Society for Engineering Education/National Science Foundation Visiting Scholars

Effective Teaching Workshop, Buffalo, NY, February, 16 & 17, April 27 1998.

Power Electronics Packaging, University at Buffalo, SUNY, May 17, 2007

National and International Press Coverage of Research Contributions

http://www.packaging.buffalo.edu/news.html

http://www.packaging.buffalo.edu/news.html

CEMAL BASARAN - UB Electronic Packaging Laboratory

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