CASIS NATIONAL DESIGN CHALLENGE PHASE II KICKOFF MEETING
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Transcript of CASIS NATIONAL DESIGN CHALLENGE PHASE II KICKOFF MEETING
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
CASISNATIONAL DESIGN
CHALLENGEPHASE II
KICKOFF MEETINGESET/MISL/PIC
OVERVIEW
Dr. Joseph A. Morgan, P.E.
Professor, Texas A&M University
May 8-9, 2014
GOVER
NM
ENT IN
DUSTRY
ACADEMIA
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Focus on electronic products and systems
Experiential learning basedCurriculum consists of three
technical tracks with integrated systems level courses
Culminating in real-world experienceCapstone Design ProjectTwo semester sequence
ESET Program
Analog/Digital Electronics
Embedded Systems
Communications
Products and Systems
Instrumentation and Controls
Testing
Quality
Product Development
Experiential Capstone
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Support and Encourage InnovationMultidisciplinary
ActivitiesEntrepreneurshipCommercialization
Facility 3400 ft2 facilityOpened – Feb 20135 functional areas3 support areas
Unique Features24/7 operationStudent operated
Mobile Integrated Solutions Laboratory/Product Innovation Cellar
PRODUCT INNOVATION
CELLAR
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Development AreaDesign SuiteMechanical FabElectronics FabCollaboration RoomSTEM PROJECTS
Krisys RoboticsNESI
Extreme ScienceNDC
Zero Robotics100kFt Rocket Payload
MISL/PIC
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Embedded systems development expertiseElectronics SoftwareTest & Validation Documentation
STEM interestOutreach RecruitingMotivation Education
NDC experienceResources
Physical PersonnelIndustry Partnerships
What MISL/PIC brings to the table
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Educate using the real stuffVideo tutorials
Record screenRecord voiceWatch how to do it – not read how to do it
Share knowledgeMentors with teamsTeams with teams
Recommend student leadersHardware EngineerSoftware Engineer
Educational Approach
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Dates – July 2x – 2y Format
3 days Hands on Interaction
Introduction Enclosure NESI Board and peripherals Example project
Process Hardware development Sensors and Actuators Interfacing -- Sparkfun Software development Integration Testing
Teacher Workshop -- NESI
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
NESI Board in NanoRacks Endcap
3.75”
Features:• Space Qualified by
NanoRacks• Designed specifically
for 1U and 1.5U enclosures
• Common elements on board
Upgrades for Phase II:• New interfaces (I2C)• Common connectors• More control
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
NESI Board Functionality
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Example - Camera
61 4
Camera Enable
5/6
2
3
JP15
1
2
3
JP7
1
4
2
3
JP13
1
4
6
5
• On Board Camera Mount • Secondary Header
TX
RX
IC1
3
LowSide
PowerDriver
3.3V
• Camera Power Control Header
PIC24
RP19
RP26
PIC24
DO E1
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Schematic
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
On the Board
Internal camera interface -- Grd selectable
External camera interface - ON
Grd Select
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Recipe For SuccessA step-by-step guide for the
successful Integration of
NESI Board
into
NDC Experiment
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Electronic Hardware Students take ownership of NESI Board
Configure Solder components
Design Conceptual Functional
Software Storyboard C Programming Language Modify/integrate code modules
Test and ValidateProven process that works
Pantry (wiki) – all resources available Recipe – step-by-step approach to effective
communications and success
Embedded Systems
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Functional Diagram
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Main• The main method of the
microcontroller will water the plants, store the values, and take the pictures.
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Systems Check• The system
checks all sensors to make sure that sufficient power is reaching all of the sensors that we need.
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Check-off ListHardware Engineer Software Engineer All Team Members
Hardware Overview - -
Soldering Videos - -
Soldering NESI Board - -
- Download MPLAB X -
- Software Environment Test -
- Download/Unzip Code -
- NESI Software -
- - Hardware Integration
- - Create Storyboard
- - Determine Peripherals
- - Create FBD
- - Start Experiment
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
HARDWARE
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Watch Hardware OverviewThe first step for the hardware engineer is to
watch the NESI Hardware Overview videoThe NESI Hardware Overview video can be
accessed using the following link: https://www.youtube.com/watch?v=ydAVm43RE8g
The NESI Board Schematic can be found at: http://nesiwiki.tamu.edu/images/5/54/NESI_Schematic1.3.pdf
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
SOFTWARE
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Download MPLAB XThe first step of the software engineer is to
download MPLAB X and the XC16 compiler from microchip.com
Video that details process can be found at : https://www.youtube.com/watch?v=vo1ejavY84o
Microchip website for download: https://www.microchip.com/pagehandler/en-us/family/mplabx/
Notes: Make sure to download latest versions
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
ALL
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Watch Hardware IntegrationWatch the Example Project: Hardware
Integration videoThe video walks step-by-step from a problem
statement to a completed hardware setThe Hardware Integration video can be
accessed using the following link: https://www.youtube.com/watch?v=rJpJuohw0ss
Note: This step is to be completed by all members of the team
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
NDC Project Development Timeline
Project Timeline
Hardware Activities
Software Activities
Management Activities
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Mentor Team J. Morgan, D. Karrer, C. ShumankOne undergrad student per team
NDCwiki.tamu.eduOn-line supportRestricted development community
Zoom Video ConferencesBrainstormingProblem solving Scheduled (mentor and team)
Industry PartnershipsSparkfunMicrochipNanoRacksOthers
Support
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
Soldering ironDevelopment computerHigh speed internet accessZoom audio/video capability
SensorsActuatorsData Card(s)Experiment materials
Required Resources
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ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y
Innovating tomorrow’s products and systems today
GOVER
NM
ENT IN
DUSTRY
ACADEMIA