Card Quality Management in Card Production & Personalization
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Transcript of Card Quality Management in Card Production & Personalization
Card Quality Management
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Card Production & Personalization
ICMA Euroforum 2011
Munich, 13th October
Presented by: Thies Janczek
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Content
Introduction Quality Management
Card Production Assessment
Card Tests
Quality Strategy
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Quality ManagementIntroduction
Yesterday Quality Assurance
Inspect Quality into Product
ISO 9001 first published in 1987 Today
Quality Management Commitment, Communication, Culture
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Quality ManagementIntroduction
What is Quality? „Delighting the customer by fully meeting
their needs and expectations“ What is Quality Management?
„A set of coordinated activities to direct and control an organization in order to continually improve the effectiveness and efficiency of its performance.“
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Quality ManagementIntroduction
Classical Quality Assurance Total Quality Management
Humans make failures Processes provoke failures
Single employees are responsible for failures
All employees are responsible for failures
Zero failure is not realizable Zero failure is the target
Procurement from many supplier Partnering with selected supplier
Customer need to accept the quality that is delivered
Everything is focused on complete customer satisfaction
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Quality ManagementIntroduction
Poor practices (examples) Leaders not giving clear direction Not understanding, or ignoring competitive positioning Each department working only for itself Trying to control people through systems Confusing quality with grade Accepting that a level of defects or errors is inevitable Firefighting, reactive behavior The “It’s not my problem” attitude
Quality ManagementProduction Objectives
Culture Change to „Right First Time“ New Products and Components
Commitment to Continuous
Improvement Never Stop Improving
Total Costs View to be established Testing versus Field Return/Claims
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Card Quality ManagementCard Production Assesment
Process and Product Assessment Is every critical Parameter controlled? What are the Variables and Changes?
In-Production Testing Quality Plan / Control Plan
Identification of New Products/Materials Define Qualification necessities
Yield limits / Scrap rates Monitoring
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Card Quality ManagementCard Tests - Definitions
ISO 7810 – ID Cards Physical Characteristics ISO 7811-x – Magnetic Stripe Recording ISO 7816-x – Integrated Circuit Cards ISO 14443-x – Contactless Cards-Proximity ISO 10373-x – Test Methods Further Specifications/Standards
E.g. ANSI, AFNOR, Tender (Health, ID-cards), MasterCard CQM, Customer Specifications
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Card Quality ManagementProduct Quality Requirements
Physical Characteristics Size, Shape, Surface, Chemical, Magnetic, Electrical,
Construction Temporal
Mechanical, Electrical, Magnetic, Ageing Functional
Electric, Electromagnetic, Magnetic, Terminal interface Appearance
Layout, Design, Brand, Color Ergonomics
Toxicity, Breaking Behavior Security
UV, Hologram, Signature Panel Miscellaneous
Manufacturing Process Stability
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Card Quality ManagementCard Tests - Considerations
Functional 100% for Chip Cards
Durability Adjust for extended Lifetimes (Banking, ID)
Internal vs. External Prefer In-House Testing
Qualification/Production Quick and Easy Tests in Production
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Card Quality ManagementCard Tests – Selection
Card size Resistance to ChemicalsTensile stress test to simulate mailing
Dimensions of contacts
Card Thickness Card dimensional stability and warpage with temperature and humidity
Relief height of embossing after mechanical stress
Number and location of contacts
Corners LightRelief height of embossing after temperature stress
Stability to Plasticizer
Edges DurabilityHigh and low temperature storage
Module Adhesion
Dynamic Bending test Peel strength Temperature stabilityAbrasion resistance of Personalisation
Dynamic Torsion test Adhesion or blocking Magnetic stripe tracks position UV-light
Bending stiffness OpacitySurface Profile and Height of contacts
X-Rays
3-Wheel test Overall Card WarpageMechanical Strength of contacts
Static magnetic fields
Wrapping testHigh temperature storage in cantilever position
Electrical Resistance of contacts
Color fastness
Corner Impact test Surface distortionsLocal Pressure on Module w/ counter plate
Encoding on Magnetic Stripe
Impact test Adhesion of Add on's Static Electricity Discharge Relative Height of Contacts
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Card Quality ManagementStrategy / Recommendation
In-Production Testing Monitor Performance Indicators
Yield Rate Peel Strength
Set Internal Threshold to 6 N/cm Statistical Analysis as Early Indicator
Module Adhesion Set Internal Minimum to 60-70 N
Test Matrix (changes vs. tests) Identification of Changes (Material/Process)
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THANK YOU
FOR YOUR ATTENTION
Card Quality Management inCard Production & Personalization
More Information:COCASO – Thies Janczek – Moewenstrasse 5a – 24113 Molfsee – Germany
Phone: +49-(0)4347-703526 – Email : [email protected]
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