Capabilities - Engineered Electronics | Sensors, Power ...€¦ · TT Electronics’ power products...
Transcript of Capabilities - Engineered Electronics | Sensors, Power ...€¦ · TT Electronics’ power products...
CapabilitiesCustom high reliability solutions for harsh environments
TT Electronics is a global provider of leading expertise in highly engineered electronics components that operate in harsh environments for critical applications.
Who we are.
TT Electronics’ power products portfolio brings together experience and expertise across power modules, hybrid microcircuits, RF transistors and discrete semiconductors to support customer applications for harsh environments.
Our customers are supported by a global network of application sales engineers.
From concept to manufacture, our engineering teams aim to build strong partnerships with customers to provide enhanced solutions for performance critical technologies in the fields of:
• Electrical Aircraft Management• Wideband Communication• Green Energy• Oil and Gas Exploitation and Extraction• Medical Equipment and Imaging• Space, Nano and Geo Satellites and Launch Vehicles• High-Specification Instrumentation
TT Electronics’ power products are manufactured at several of our global facilities and, as part of TT Electronics, our customers have the security of knowing we have the expertise and resources to meet their exacting environmental performance and quality requirements.
To find out how we can work together on your specific application requirements contact us at [email protected]
We provide engineering support and expertise through our global network
We develop products for regulated markets in specialist areas
We deliver reliable products for harsh environment applications
We help our customers solve difficult problems and to meet their needs
Hermetic Packaging
More Electrical Aircraft
Transient Suppression
Gallium Nitride
Double Sided Cooling
High Frequency
Fuel Management
Silicon Carbide
Wing Ice Protection
Inertial Navigation
Wide Bandgap
Thrust Vector Actuation
Radiation Tolerance
Materials Expertise
Aerospace Pedigree
Space Pedigree
Obsolescence Management
Close Engineering Collaboration
VAVE Strategic Agreements
Fast Switching
Ultra Reliability
Matching to Mission Profile
High Reliability
Harsh Environments
Low ProfileFlight Surface ActuationLight Weight
Advanced Materials for High Reliability
Power Electronics
Engine Controls
Power Distribution
By applying our engineering expertise and innovative design approach we have developed a number of standard platforms to achieve improved product characteristics, including: • Increased thermal management
• Higher temperature performance
• Lower mass and size
• Low profile
• Reduced cost
• Improved longevity of life-cycle
Features and benefits
These improved characteristics, whose modular nature can be applied in combination, provide the following real life benefits:
CTE matched construction
• Increased reliability
• Extended product life
State-of-the-art wideband devices
• Higher temperature
• Low loss performance
Standard baseplate design
• Reduced cost of ownership
• Lower NRE’s
Continued development
Given the importance of components reliability in critical and challenging conditions, we are continuing to develop new processes to provide measurable improvements in system reliability, including:
• Double sided cooling
• Advanced die-attach
• Wire-bonding
Innovative Development of Power Modules.
“We are developing new processes to provide measurable improvements in system reliability.”
H
K
J (2x)
2
1
F
Features and benefits
The new RF GaN product range has been developed to meet the challenges of current and future application requirements with the following improvements:
• Higher frequency up to 6GHz
• High efficiency: small heat sync, lower operating cost, less PA cooling
• High power density, reduced size and weight
• Wider frequency range achieved using wideband gap devices
• Increased linearity
• Lower capacitance
• Reduced system cost
• European source avoiding US export regulations
• All parts fully RoHS compliant, environmentally friendly
Applications
Our RF GaN range is suitable for the following applications:
• Avionics: beacons, radar, transceivers, navigation equipment
• Satellite communications: transponders
• Industrial: induction heating, DME
• Military communications: jammers
RF GaN Technology.Based on over twenty years’ experience with no product obsolescence, we are proud to introduce our new range of specially designed RF GaN transistors for pulsed and CW applications.
Our standard range
We also offer an extensive range of VDMOS RF products, with devices from 750mW to over 400W, and for frequencies up to 1GHz, available in a range of industrial standard packages.
Johnson’s FM100
80
60
40
20
Breakdown voltage
Electron mobility
GaAs-HEMT
Electron saturationvelocity
Keyes’s FM
1/Ron
fmax
GaN-HEMT Si
6Discrete Semiconductors
XX
7
1112
14.516.5 � 0.5
9.6
77.6
910
0.2
0.4
6
R0.2REF.
R0.58-6-C0.5REF.
0.30.3
R0.54-
1.5REF.
"P"
This same technology can be applied to other susceptible high voltage industrial fields in various other applications.
Features and benefits
The fundamental advantages of current limiting technology over existing TVS solutions include:
Wide-band gap semiconductors
• Higher temperature performance
• Low switching loss
• Reduced real-estate
• Full control capability
State-of-the-art packaging
• Surface mount
• Through hole
Product technologies
TT Electronics have a widely acknowledged industry pedigree in the Aerospace and Space communities, built on our long-standing reputation for providing core product solutions in the following technologies:
• MOSFETs
• BiPolar transistors
• Linear regulators
• Multi-chip arrays
• Diodes
• Hybrid microcircuits
We serve specialist needs with internationally recognised quality systems, including MIL Standards, European Space Agency and CECC requirements. S18 (6 x NPN + 5 x PNP)
Discrete Semiconductor Solutions.To counter the threat of lightning strikes on modern airframes due to the increasing use of composite materials, we have partnered with leading industrial companies to develop current limiting devices, which are designed to protect, at source, the specialist and safety-critical circuits within an aircraft.
+ 0.316)(0.508x2
2.032 ±0.20
(SIG3)
(SIG2)
(SIG1)
(VCC)
(GND)
6 PA
5 PA
4 PA
3 PA
2 PA
(0.10 x7)
-B-
-D-
SDS0.406
34132
66100
6799
33
100
132
66
34
9967
33
(NOT TO SCALE)
DETAIL A
A S0.254 DB-C SS
4- Ø 1.092 REF.(DEEP 0.445 REF.)
FROM BACK SURFACE
8- 2.
540 R
EF.
(DEE
P 0.44
5 REF
.)
8- 2.
159 R
EF.
8- 2.032 REF.
8- 2.413 REF.
4- 0.508
4- 1.016
4- R 1.016
8- R 0.508
8- 1.270
8- 2.540
8- 2.032
4- 2.540
VENDOR'S OPTION4 PLCS
83.82
0
4- 63
.246
8- 4.
064
4 PLCS
12- Ø1.524 ±0.050
DETAIL B(NOT TO SCALE)
(NOT TO SCALE)DETAIL C
AS
B-C
SS
D
S/R
-A-0.203
(DIE ATTACH)0.178
DETAIL A
1 PA
0.152
0.889 ±0.130-0.030+0.050
KYOCERA A440NCS
Fe-Ni-Co ALLOYLEAD
124-1.270 REF.
132-0.813+0.060-0.040
124-1.270 REF.128-1.524 ±0.153
1.524
REF.
0.127
REF.
(MATERIALDIMENSION)
0.203 REF.
0.610
REF.
0.559
REF.
(MATERIAL DIMENSION)
(DEEP 0.445 REF.)
8-0.889 REF.
8-0.889 REF.
1.332
(GND)7 PA
1.016 REF. x 45°
B-CA
0.10
2 / 2
5.40
0 X
25.4
00
52.32
4 SQ.
±0.2
50
47.65
0 SQ.
REF.
49.27
6 SQ.
±0.2
50
53.08
6 SQ.
REF.
4- R 1.016
4- R 2.540
0.508 REF. x 45°3 PLCS
58.420 ±0.584
83.820
8- 2.667
8- 5.080
8- 14.732
2- 88.900 ±0.890
DETAIL C
DETAIL B
0.254 SQ. REF.INDEX.
128- 1.524
4- 68.580 ±0.760
4- 90.272 REF.
58.42
0 ±0.5
84
4- 5.
080 ±
0.640
8- 1.
270
4- 1.778 REF.
4- 1.524
VENDOR'S OPTION
0.406
2.286 ±0.250 THK.
Fe-Ni-Co ALLOY
0.635
REF.
(MATERIALDIMENSION)
0.70 ±0.07
(ALL OVER)
1.27µm - 7.62µm (ALL OVER)1.27µm - 6.00µm (SEAL RING)NICKEL THICKNESS :0.03µm - 0.10µmGOLD THICKNESS :PLATING :
NOTES
Key capabilities
Turnkey circuit layout and packaging design based on customers’ electrical schematics, and performance and environmental requirements.
Design and manufacture in compliance with MIL-PRF-38534 Class H.
Engineering and program management support.
A broad range of packaging and technologies, including:
• Hermetic and non-hermetic packaging
• Multi-layer thick film printing on ceramic (AIO and AIN)
• High and low temperature co-fired ceramic (HTCC and LTCC)
• Thin film
• Surface mount
• Bare die and wire bonding (or mixed SMT and With Chip & Wire)
State of the art ‘lean’ manufacturing facilities, including:
• Class 10,000 clean room facilities in the US and UK
• Fully automated SMT lines
• Fully automated die bonding and wire bonding
• Automated inspection (under development for wire bonding)
• Custom test systems including full temperature testing
• Environmental screening to MIL-STD-883, ESA ECSS-Q-ST-60-05 and BS9450
ISO9001:2008 and IS014001:2004 quality management systems
Applications
Our diverse range of custom solutions have recently been adopted in the following applications:
• Aircraft engine controls
• Airborne phased array radars
• Aerospace / space inertial measurement units
• Wing ice protection systems
• Electronic counter measures
• Missile fusing / seeker systems
• Helicopter mission computer systems
• Minesweeper sonar systems and beacons
• Suppressor circuits for aircraft lightning protection
• High voltage mass spectrometer circuits
• Optical test instrumentation
• Oil and gas exploration pressure and temperature logging modules
Hybrid Microcircuits Capabilities.The engineering design teams at TT Electronics have successfully developed high reliability microelectronics to be space-saving and weight-saving; unusual from a single source. We have achieved this through the development of a number of key capabilities.
Product Applications.
Product segment Applications Features
Flight Control SystemsLightning Strike ProtectionWing/Engine De-Icing Down-Hole DrillingSpace Power SystemsDefence Aids Systems
Radar ArraysAircraft Transceivers / TransmittersBeaconsJammersPoint-To-Point Communication
Motor Drives For Flight Actuation SystemsPower Distribution SwitchingElectrical Fuel Pumps Engine Starter ActuationThrust Vector Actuation
Engine ControlsFuel Management ControlDe-Icing ControlsProximity SensorsInertial NavigationDown-Hole Data Logging
Wide range of modern and traditional packagesScreening to highest international standardsSupport long service life and/manage obsolescence
High performance: high gain/excellent linearityRobust packaging for harsh environmentsSupport long service life/manage obsolescence
Bespoke hermetic or plastic packaged modulesReduced size/high power densityHigh reliability screening to highest standardsSilicon/Silicon Carbide Technology
Screening to MIL- PRF-38534, Class H, MIL-STD-883Turnkey solution, circuit layout and customer designsEnhanced thermal management for reliability
Discrete semiconductors
RF transistors
Power modules
Hybrid microcircuits
“From concept to manufacture, our engineering teams aim to build strong partnerships with customers to provide enhanced solutions for performance critical technologies.”
To find out how we can work together on your specific application requirements contact us at [email protected]
www.ttelectronics.com
DLA Land and Maritime Qualified Manufacturers
List 38535
VQC-03-003050VQC-03-003049
Cage Code U3158