C251-E028A Xslicer SMX-6000Seamless Fusion of X-Ray Fluoroscopy and CT Imaging The Xslicer SMX-6000...
Transcript of C251-E028A Xslicer SMX-6000Seamless Fusion of X-Ray Fluoroscopy and CT Imaging The Xslicer SMX-6000...
C251-E028A
Microfocus X-Ray Inspection System
Xslicer SMX-6000
Seamless Fus ion o f X -RayF luoroscopy and CT Imag ing
The Xslicer SMX-6000 is an X-ray inspection system equipped with a Shimadzu microfocus
X-ray generator and high-sensitivity flat panel detector and featuring CT scanning capabil ity.
Smooth and quick switching is now enabled between viewing fluoroscopic and cross-section
images. In addition, the system includes a new Xslicer CT image processing engine used to
fully automate calibration and provide high-speed scanning and reconstruction.
The system can be used to observe distortion-free, high-magnification, and high-resolution
images of detailed internal structures and defects in flat samples, such as electronic devices.
Xslicer SMX-6000M i c r o f o c u s X - R a y I n s p e c t i o n S y s t e m
Easy Operation
The new user interface is simple and intuitive, enabling inspections to be started as soon as the door
is closed. This makes X-ray inspections easy to perform, even for operators using the system for the
first time.
Easy CT Imaging
Switching from fluoroscopy to CT imaging requires simply switching tabs. As a result, cross-section
images of complex 3D structures that are difficult to differentiate using fluoroscopy can be viewed
immediately with a simple operation.
High-Speed Scan & Reconstruction
The included Xslicer unit enables fully automated calibration and provides high-speed scanning and
reconstruction. Cross-section images can be displayed in as little as three minutes after starting CT
scans (in the [Simple] mode).
C o n t e n t s Intuitive Operabil ity
Simple Workflow
Easy CT Imaging
Smooth Switching
High-Speed Scan and Reconstruction
Principle of CT Imaging
Advantages of Oblique View Cone Beam Tomography (OVCBT)
System Configuration
Ample Safety Measures
Measurement Functions
Various Features for Facil itating Inspections
Applications
Optional Software
Specifications
P. 4
P. 6
P. 8
P. 9
P. 9
P. 10
P. 11
P. 12
P. 13
P. 14
P. 16
P. 18
P. 19
P. 20
Intuitive Operability
A large monitor screen and simple button layout provide excellent visibility for intuitive operability.
Therefore, X-ray inspections can be performed easily, even by operators using the system for the first time.
Stage Positioning Via the X-Ray ImageSimply click on any point in an X-ray image to control all stage movements,
such as changing the XY position, tilt, rotation, or field-of-view size.
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Large MonitorThe system is equipped with a large 27-inch monitor. The simple button layout and large
high-resolution detector provides excellent visibility for observing details.
Using Exterior Images for Stage PositioningAn included dedicated camera obtains sample exterior images that capture the entire stage area. The stage position can be specified by
simply clicking on any position in the exterior image. Zooming is also possible in the exterior image, so that the stage position can be
specified in detail, at the part level. It also allows the user to operate the stage without looking away from the monitor.
Xslicer SMX-6000Microfocus X-Ray Inspection System 5
Simple Workflow
After placing the work, fluoroscopic images can be obtained in just three steps.
STEP 1Replace the previous sample.
Click the [Change Sample] button.
Stops X-ray irradiation.
Unlocks the electromagnetic lock on the front door.
The stage automatically moves to a position
where it is easier to replace the sample.
STEP 2Start the inspection.
Close the front door and click [Start].
Irradiates X-rays.
Captures an exterior image of the entire stage area.
STEP 3Position the stage.
Click on the exterior image to roughly position the stage.
Then click on the X-ray image to move the stage to the target observation point.
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The new user interface enables all stage movement operations by simply clicking and dragging on the X-ray image.
Consequently, the user can move the stage quickly without looking away from the monitor.
Moving the Center Point
Click anywhere on the displayed X-ray image area to display that point at the center of the displayed image area.
Zoom In
Drag the pointer left to right across the displayed X-ray image area to magnify the specified area so it fills the screen.
Zoom Out
Drag the pointer right to left across the displayed X-ray image area to zoom out a given percentage.
Xslicer SMX-6000Microfocus X-Ray Inspection System 7
Easy CT Imaging
CT imaging can display cross-section images of complex 3D structures, which may be difficult to differentiate using
fluoroscopy, separated into separate layers.
Example 1
Example 2
CT images can be obtained at any portion within 350 mm × 350 mm area.
300 mm
300
mm
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Smooth Switching
Switch between X-ray fluoroscopy and CT imaging simply clicking on the menu tab. Settings for CT imaging involve only
selecting the scan mode, scan angle, and scan field-of-view. A seamless switching feature ensures that CT images can be
obtained seamlessly for any point of interest in fluoroscopic inspections.
X-ray fluoroscopic X-ray CTSimply select the mode ([Simple], [Normal], or [Fine]) and the tilt angle.
High-Speed Scan and Reconstruction
The new Xslicer CT image processing engine completely automates the calibration process, resulting in high-speed imaging.
Cross-section images are displayed in as little as two minutes after starting CT scans (in the [Simple] mode).
Xslicer dramatically increases reconstruction speeds as well, with cross-section images displayed only five seconds after data
acquisition is finished.
Xslicer SMX-6000 CT Imaging Process Flow
Positionsample
Scan
Reconstruct
Display
2 min 5 to 13 times higher throughput
Conventional CT Imaging Process Flow
Positionsample
Switch to CT mode
Calibrate Scan Reconstruct Display
15 to 40 min
Xslicer SMX-6000Microfocus X-Ray Inspection System 9
Principle of CT Imaging
Oblique View Cone Beam Tomography (OVCBT)
X-ray fluoroscopic images are captured by tilting the flat panel detector and rotating it 360 degrees.
The resulting fluoroscopic images are then combined by a reconstruction process to create cross-section images.
X-ray detector
XY stage
X-ray generator
Reference Normal Cone Beam Tomography (NCBT)
X-rays are irradiated in a direction orthogonal to the rotation direction.
Fluoroscopic images are taken from various directions, and are then reconstructed to obtain cross-section
images of the sample.
X-ray generator
Exterior camera
CT stage
X-ray detector
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Advantages of Oblique View Cone Beam Tomography (OVCBT)
Enables High Magnification Scans of Flat Sample
Oblique View Cone Beam Tomography (OVCBT)
X-ray detector
XY stage
X-ray generator
Explanation
When large substrates are scanned
with an OVCBT, the work is on the XY
stage, so high magnification scans
can be obtained by bringing it close
to the X-ray generator.
Normal Cone Beam Tomography (NCBT)
Obstructed
X-ray generator
Maximum trajectory for the work
Rotating table
Sample (Large substrate)
X-ray detector
View of NCBT from above the rotation table
Explanation
When large substrates are scanned
with an orthogonal CT, if the work is
brought closer to the X-ray generator
in order to increase the magnification,
they will be obstructed by the X-ray
generator during the CT scan, making
high magnification scans impossible.
Example
Normal Cone Beam Tomography (NCBT) Xslicer SMX-6000
Xslicer SMX-6000Microfocus X-Ray Inspection System 11
System Configuration
Drive System Facilitating InspectionsHigh-speed XYZ-stage
Quickly moves to inspection points with ±180-degree rotation and 0 to 60-degree tilting.
X-ray tubeTurbo molecularpump
High-voltagetransformer
Equipped with Microfocus X-ray Generator Unit Made by ShimadzuEquipped with an open X-ray generator with 160 kV tube voltage and 1 μm resolution.
Due to the integrated high-voltage transformer, no greasing is necessary.
Automated adjustment simplifies the filament replacement process.
* 1 μm resolution: JIMA chart resolution
Ample Safety Measures
Prevents X-Ray Leakage Outside the SystemProtective barrier blocks X-rays from escaping outside the system
(1 μSv/h external X-ray leakage).
Collision Sensor
A collision sensor around the X-ray detector stops the drive
system in the event of an emergency (a collision with the
sample).
Front Door Lock MechanismThe front door lock mechanism locks the front door during
X-ray irradiation.
The interlock system also ensures safety by disabling X-ray
irradiation and the drive system when the door is open.
Software Limits
The software limit function prevents collisions with the flat panel
detector by specifying settings based on the sample height.
Xslicer SMX-6000Microfocus X-Ray Inspection System12 13
System Configuration
Drive System Facilitating InspectionsHigh-speed XYZ-stage
Quickly moves to inspection points with ±180-degree rotation and 0 to 60-degree tilting.
X-ray tubeTurbo molecularpump
High-voltagetransformer
Equipped with Microfocus X-ray Generator Unit Made by ShimadzuEquipped with an open X-ray generator with 160 kV tube voltage and 1 μm resolution.
Due to the integrated high-voltage transformer, no greasing is necessary.
Automated adjustment simplifies the filament replacement process.
* 1 μm resolution: JIMA chart resolution
Ample Safety Measures
Prevents X-Ray Leakage Outside the SystemProtective barrier blocks X-rays from escaping outside the system
(1 μSv/h external X-ray leakage).
Collision Sensor
A collision sensor around the X-ray detector stops the drive
system in the event of an emergency (a collision with the
sample).
Front Door Lock MechanismThe front door lock mechanism locks the front door during
X-ray irradiation.
The interlock system also ensures safety by disabling X-ray
irradiation and the drive system when the door is open.
Software Limits
The software limit function prevents collisions with the flat panel
detector by specifying settings based on the sample height.
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ROI
Static image
ROI area
Object area
Wire
Maximum bend point
L2
L1
Sweep ratio = L2 / L1×100 (%)
Measurement Functions
Wire Flow Ratio MeasurementsBGA Measurements
The system can measure ball grid array (BGA) bump diameters and void ratios.
Thanks to our proprietary image processing algorithm, complex parameter settings are not required.*
Measurements can also be performed by storing multiple settings in advance, and then calling up
different settings for each target examined.
Wire flow ratios can be measured by specifying both ends of a bonding
wire and the maximum bend point.
Pass/fail decisions can be performed based on the wire flow ratio.
(Measurable items)
Total void ratio
Maximum void ratio
Bump diameter
Bump roundness*: Manual adjustments may be required depending on the sample.
*: Manual adjustments may be required depending on the sample.
Area Ratio MeasurementsArea ratios for die bonds and solder paste wettability can be measured.
Thanks to our proprietary image processing algorithm, complex parameter settings are not required.*
Measurements can also be performed by storing multiple settings in advance, and then calling up different
settings for each target examined. Pass/fail decisions can be performed based on the area ratios.
Distance Measurements
The system can perform two-point and three point measurements.
With this system, calibration data is calculated internally in synch with the fluoroscopy magnification ratio,
enabling efficient distance measurements.
nt Fu
Each measurement function includes both fluoroscopic and cross-section calculation.
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ROI
Static image
ROI area
Object area
Wire
Maximum bend point
L2
L1
Sweep ratio = L2 / L1×100 (%)
Measurement Functions
Wire Flow Ratio MeasurementsBGA Measurements
The system can measure ball grid array (BGA) bump diameters and void ratios.
Thanks to our proprietary image processing algorithm, complex parameter settings are not required.*
Measurements can also be performed by storing multiple settings in advance, and then calling up
different settings for each target examined.
Wire flow ratios can be measured by specifying both ends of a bonding
wire and the maximum bend point.
Pass/fail decisions can be performed based on the wire flow ratio.
(Measurable items)
Total void ratio
Maximum void ratio
Bump diameter
Bump roundness*: Manual adjustments may be required depending on the sample.
*: Manual adjustments may be required depending on the sample.
Area Ratio MeasurementsArea ratios for die bonds and solder paste wettability can be measured.
Thanks to our proprietary image processing algorithm, complex parameter settings are not required.*
Measurements can also be performed by storing multiple settings in advance, and then calling up different
settings for each target examined. Pass/fail decisions can be performed based on the area ratios.
Distance Measurements
The system can perform two-point and three point measurements.
With this system, calibration data is calculated internally in synch with the fluoroscopy magnification ratio,
enabling efficient distance measurements.
nt Fu
Each measurement function includes both fluoroscopic and cross-section calculation.
Xslicer SMX-6000Microfocus X-Ray Inspection System14 15
Various Features for Facilitating Inspections
Teaching
By registering inspection points in
advance, sample inspections can
be repeated efficiently.
The status is displayed on screen.
"Pass" decisionDefer"Fail" decisionNot inspected or skippedCurrently being measured
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11
10 73 2
69 84 1
5
With the teaching function, fluoroscopy and CT scans can be configured at various positions.
point 1
Fluoroscopic Observation
point 2
Fluoroscopic Observation
point 3
Cross-section Observation(CT Images)
Step Feed Movement
The step feed function is especially convenient for inspecting samples on a pallet or arranged in a grid pattern.
Specify the interval between feeding each sample, how many times to feed a sample, and the amount of vertical
and horizontal movement.
The stage repeats stepwise movements in a staggered pattern.
Observation direction: Horizontal Observation direction: Vertical
Preset
Observation points and observation conditions can be registered easily.
Preregistered imaging conditions can be reproduced by clicking on a
registered number.
22
1111
333
44
Automatic Image Quality Adjustment
This function sets the optimal observation conditions for each situation.
D e p e n d i n g o n t h e
changing conditions, the
optimal window level
and window width are
specified in real time.
AW ON
AW OFF
When selecting an area
of interest, the window
l e v e l a n d w i n d o w
width are optimized for
the specified range.
Area of Interest
Panorama Image
Optimal panoramic images can be
obtained easily by simply specifying the
image range on the exterior image.
an be
ng the
One field-of-view
Xslicer SMX-6000Microfocus X-Ray Inspection System16 17
Various Features for Facilitating Inspections
Teaching
By registering inspection points in
advance, sample inspections can
be repeated efficiently.
The status is displayed on screen.
"Pass" decisionDefer"Fail" decisionNot inspected or skippedCurrently being measured
12
11
10 73 2
69 84 1
5
With the teaching function, fluoroscopy and CT scans can be configured at various positions.
point 1
Fluoroscopic Observation
point 2
Fluoroscopic Observation
point 3
Cross-section Observation(CT Images)
Step Feed Movement
The step feed function is especially convenient for inspecting samples on a pallet or arranged in a grid pattern.
Specify the interval between feeding each sample, how many times to feed a sample, and the amount of vertical
and horizontal movement.
The stage repeats stepwise movements in a staggered pattern.
Observation direction: Horizontal Observation direction: Vertical
Preset
Observation points and observation conditions can be registered easily.
Preregistered imaging conditions can be reproduced by clicking on a
registered number.
22
1111
333
44
Automatic Image Quality Adjustment
This function sets the optimal observation conditions for each situation.
D e p e n d i n g o n t h e
changing conditions, the
optimal window level
and window width are
specified in real time.
AW ON
AW OFF
When selecting an area
of interest, the window
l e v e l a n d w i n d o w
width are optimized for
the specified range.
Area of Interest
Panorama Image
Optimal panoramic images can be
obtained easily by simply specifying the
image range on the exterior image.
an be
ng the
One field-of-view
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Applications
Damaged IC
Fluoroscopic Image Cross-Section Image VR Image
Heat-Damaged Connector
Fluoroscopic Image VR Image
Pin-Connector on a Substrate
Cross-Section Image VR Image
Double Sided Circuit Board
Fluoroscopic Image Cross-Section Image, 35 mm field of view
Cross-Section Image, 45 mm field of view
Applications
Power Module
Fluoroscopic Image Cross-Section Image
BGA
Fluoroscopic Image Cross-Section Image
Area Ratio
Fluoroscopic Image Cross-Section Image
Optional Software
VGStudioThree-Dimensional Image Processing SoftwareP/N: S362-99444-01
This software uses volume rendering (VR) to display three
dimensional images from cross-section images obtained using
X-ray CT imaging. It includes functionality for creating basic
animation and simple measurements.
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Applications
Damaged IC
Fluoroscopic Image Cross-Section Image VR Image
Heat-Damaged Connector
Fluoroscopic Image VR Image
Pin-Connector on a Substrate
Cross-Section Image VR Image
Double Sided Circuit Board
Fluoroscopic Image Cross-Section Image, 35 mm field of view
Cross-Section Image, 45 mm field of view
Applications
Power Module
Fluoroscopic Image Cross-Section Image
BGA
Fluoroscopic Image Cross-Section Image
Area Ratio
Fluoroscopic Image Cross-Section Image
Optional Software
VGStudioThree-Dimensional Image Processing SoftwareP/N: S362-99444-01
This software uses volume rendering (VR) to display three
dimensional images from cross-section images obtained using
X-ray CT imaging. It includes functionality for creating basic
animation and simple measurements.
Xslicer SMX-6000Microfocus X-Ray Inspection System18 19
Xslicer SM
X-6000
Specif icat ions
Model
P/N
Spatial Resolution
Maximum Sample Size
Fluoroscopic Inspection Stroke
CT Scan Range
Laminographic Angle (CT Scan Angle)
X-Ray Output
Detector
Fluoroscopy FOV (on Carbon Plate)
CT FOV (on Carbon Plate)
Power Requirements
Weight
Operating Environment Conditions
External Leakage Dose
Xslicer SMX-6000
S362-86000
1 μm (JIMA chart resolution)
470 × 420 × 100 mm, max. 5 kg
X: 460 mm, Y: 410 mm, Z: 100 mm, ±180° rotation, 60° tilt
X: 350 mm, Y: 350 mm
45° or 60°
Max. tube voltage: 160 kV, Max. tube current: 100 μA, Rated output: 16 W
Flat panel detector
0.75 mm (vertical) × 1.3 mm (horizontal) to 21 mm (vertical) × 38 mm (horizontal)
3 to 30 mm (given 45° laminographic angle) / 3 to 14 mm (given 60° laminographic angle)
200 V AC ± 10%, 1.5 kVA (ground resistance 100 Ω max.)
Approx. 2,450 kg
Ambient temperature: 15 to 30 °C, Ambient humidity: 35 to 80 % (no condensation)
1 μSv/h max.
Layout and Dimensions (units : mm)
1,60
038
4
Rec
om
men
ded
mai
nte
nan
ce s
pac
e: A
t le
ast
2,7
00
(Min. 25)
Recommended maintenance space: At least 3,300
1,8
80
to
(1
,91
0)
(1,1
50
) to
(1
,35
0)
1,520 280
(100) to (150)
22
1,76
0
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© Shimadzu Corporation, 2017First Edition: January 2016, Printed in Japan 3655-01702-20ANS