'c'(...REFLECTII'ITY The origin of >(RR is ueated itr a number of publications, bolh in ao optical...

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Transcript of 'c'(...REFLECTII'ITY The origin of >(RR is ueated itr a number of publications, bolh in ao optical...

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    sturmTypewritten TextProceedings of a Workshop at NIST, Jan. 30 - Feb 2, 1995, published by AIP 1996

  • Energy Dispersive X-Ray Reflectivity Characterization ofSemiconductor Heterostructures and Interfaces

    E. Chasona), T.M. Mayera), Z. Matutinovic Krsteljb) and J. C. Sturmb)

    a) Sandia National Laboraiories, Albuquerque, NM 871854350b) Dept. ofElectdcal Engineering, Princrton U., Princetor\ N.J 08544

    En6$/ dispsrsiv€ X-ray refle.tivity is a versatil€ tool for anallzinS thil film strucNr.s. kyer lhicknds,i erfare roughn€ss and crnpositior can be d€terrnined wilh a singl€ aond€structiv€ messurment. Use of€ner8y dispersive d€t€ction enables sp€cta to be a.quned in l€ss than 500 s vith a rolating anode X-Iavgenentd, ssking the study ofkinetics possible.

    Multiple advanced devrce structures incorporatethin semiconductor heterolayeB to oblain enhancedperfonnance, e.g,, heterojunction bipolar transislors(HBT'S), enhanced mobility FETS and resolrantrumeling diodes. These skuclues require precisecontrol of lhe layer thickness and interfac! morpholo$/for optimal perrormance. we have d€veloped atechnique using enerry disp€rsive X-ray reflectivityO(RR) to characterize these structures with high deplhsensitivity. The pammeters that can be determined fromthis measurement are layer ihickness, composition andsurface/interface roughness. Layer thickness can bedetermined in the range of 3 - 200 Dm wilh 1 5%r€solution and surface and interface rouglmess can be

    determined in the range of 0.t - 3 nm with I 20%resolulion.

    W€ have applied the XRR technique tochaiacterize C\rD-grown SiGe/Si hetercslructures [U,enabling us to correlate the layer thickness and interface

    roughness with the groMi conditions. We have alsoperform€d real-time measurcments during low'€nel$/ion spurtering of semiconductors [2,3] and SiO2 [4] todetermine the kinetics of surface evolution. Thesemeasurements confirmed the preseDce of a rapidroughening instability and enabled us to quantitativelydelermine the value of ion€nhanced transportpanmeters (dimBivity, viscosity) importafi for sputler-morphology evolution.

    PRINCPLES OF X.RAY REFLECTII'ITY

    The origin of >(RR is ueated itr a number ofpublications, bolh in ao optical multilayer I5l and a

    O 1996 American lnslilule of Physics

    5t2

    diftaction fonnalism 16l, so only a brief featnent willbe presented here. x-ray reflectivily is defined as theratio of the reflected intetrsity lo the incident intensityand is measued as a imction ofthe scattering vector,

    k = 41rlhc E sine (t)

    where E is lhe energy of the X-ray and 2€ is thescattering angl€. ln canlrasi \vilh X-tay dillraction, X-ray rcflectivity is performed at small values of k wherelhe refl€ctivity can be inteDreted using the F.esn€lequatrons. The layer is tre3ted as a @ntinuous mediumwith an index of relractioq n, that depnds on theelectron density, pel [7]. The index of rcfraclion for X-mys in matter is less than I so that for s!fiiciendy smallilcident angles total extemal rcflection occurs.

    Above the critical lalue for total exlemal rellection(lt), lhe rcflectivity from an ideal inte ace is given bythe Fresnel reflecdvity (RF{k) wilh the atmplolic formtk4.;t4. For an imperfect inlerface. $e reflectivity rsgiven approximately by [6]

    R(k) = RFG)I F(dpel/dz)I2 (z)

    where F(dpel/dz) is the Fourier transform of the ele.trondensity gradient in the direchon nonnal to the surface ofthe lilm. It is important to note that this equatron refeNto the s?€cutar reflectivity, i.e., wh€re th€ angle ofincidence equals the angle of rcflection. Under ihes€conditions, the scattering vector is orienled normal lothe surface so that the reflectivity is otrly sensitive rcvariations in lhe electron density nonnal to the fiIo

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    o 1oo 200growth Prsssure (torr)

    F'oure 4. D€Dondsnce ol roughn€ss on growth pressurei"i'i.-" isi J"olsie"t and b;(om (sice/Si substrats)iilrr*"i.rn" ip"ari *"re fit to a two-lav€r modelr thei"rcui"G ,nr"niitv rro. the multilay€r model is shownii ir," l""n"a lin; rn the risures' The intensitv of the

    "l",ii"ti"r" t the spectra d;creases for the samples

    grown at higher Pressures.

    Analvsis of these spedra indicate that the decreas€

    ln ttre oscittatloo intensity correslonds to increasediornt n"". ut the inlerfacrs. The roughness at theiic-J*u.uur" int"rr"." -d the sice/Si cap interfacc issio"n ,n ngure 'f as a n nclion of growli

    pressr'lfe The

    i.".""." in-.rrfa"" roughness wili increasitrg gro*lhor"aa*" *^ aat"a*ir. lo be caus€d by lhe prcs'nce of'nrJ.d hvers at the interfaces created b] a lransient in

    ire switciing time of the gases in the 8ro$'dr reactor'

    fnis ascovetr was usea ro determine groMh condilroos

    to produce mole abrupt interfaces.

    KINETICS Otr SURFACE ROUGEENING ANI)

    SMOOTEING DURING SPUTTERING

    We have used lhe in situ measuemcnt capabilitios

    of XRR to sNdv the evolution of sudace 'oughnessiu;ns mutlerine of sio2 I4l sufaces These-.rrit"r.os *"i" p".formed in real t'lme whlle theJ""" w". U"ine .prtt.rcd Be windows allo\xtd lhei-rrvs [o enter ana oif rtte sputteriog chamber withmini'dul attenuation of the be3m.

    We initiallv bombard fte sudace with healy Xeions with an eoeiry of loo0 ev. The surface roughnessi"

    "nown in nsrre's to rise approximately linearly with

    ion nu"n"". ifto" un.tics arc much morc rspid th'nttre iiD tetravior tlat is exp€cled if the $putter beam israoaoorlv remouing atons ftom the surface The Xc-rouehened surface is the$ bombarded with light (H or

    ieiiom. The change in roughness with time is shol^'nin fis. 6 and indicates that the surface roughnessdecrJses exponentially with ioo fluence wi$ a Iale that

    increases wiih ion energy. )(RR sp€clra corr€s?onding

    io irr"r.a"ins He tluence are sho*n in Eg ?l theJo..as" i"

    -O. sMace roughness is evident by the

    decrqsing slope ofOe sp€ctra.thei kinetic studies confirmed the presenc€ of a

    ro'rshenine inslabiliry dMing healy ion spultering

    -t'_".a u-tft" .r*"n* aependence of the sputter yieldrt rt i"rd" to -o"h .ot" rapid roughening dun a simplesiochrstic rcmoval process. The smmthing by light ions

    o,r" aue to ion+nt anc"a \Tscous flow of the oxide'e,ttfrough in principle similrr measurments could beohain; bv se4uences of AFM meas:urements lhes'wo d be verv tli5icult lo obtain The real timecapabiliiy ofth; )GR Provided criticd kineiic dala for

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    oi sputter-inriuced roughening instability

    Fidure 6. Decrease in surface roughness during He

    "oitierino ofsior. Surfaces were in(ially roughened by

    i" "p-rtt"Ling.

    Li;es show lit to exPonential decay due to

    ion-enhanced viscous iow.

    514

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    Fioure 7. XRR sDectra from SiO, surfaces smoolhenedby-low ensrgy He sputbring lncreasing ion fluence lromai to d). Dashed Lnes represent ft to optrcal multrlayer

    development of modelssmoothing.

    In sumnury, XRR

    of surface roughening and

    is a useful in situ probe ofsemiconducto, thin films. It Provides information aboutlayer ihickness, composition and interface roughnesswirh sensilrvity in lhe nanoscale regme lhal is b€coming

    ircreasingly important technologically. Simple non_destructiv€ sample preparalron, rclalively mpid dalaacquisidon and compalabrlity wilh depositiongeometries make il suitable for in situ kinetic studi€s ofmorphologl evolution. For complete characteriTation ofthe stluclure, xRR needs to be combined with other in_plane probes.

    The authors gmtefully acknowledge usefuldrscussions with Bruce Kellerman. This work wassupported by the U.S. Depaflment of Ener$/ underconrad DE-ACO4-94AL85000.

    L Z. Matutinovic-l&stelj, J.C. Sturm dd E. Chdotr' J. Elect.Mater., submitted.2. E. chason, T.M. Mayer, B K. KeUtrman, D.N. Mcltrov dB.K. Keuerman, Phys. Rev. Letl. 72, 3040 (1994)

    3. E. clason, T.M. Mayer, A. Payne End D Wu, Appl. Phys'Let 60,2353 (1992).4. T.M. May€r, E. Chason aod A J. Ho*€rd' J. Appl. Phvs 76,

    1633 (1994).

    5. L.G. Puatt, Phys. Rev. 95, 359 (1954)

    6. J. Als-Nielsn i Sttuct\re and Dt ani.s of Swftces,ediled by W Scholmqs afld P. von Blmckentlasa (Sprinstr,Berlin, t986), p. 18l.7. J.H. Underwood and T.w. Barb€e, Appl opt- 20,3027(1981).

    516

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