Business Presentation for El t i M t i l (EM) B iElectronic Materials (EM) Business

March 15, 2017

FORWARD-LOOKING STATEMENTSForward looking statements such as those relating to earnings forecasts and other projections contained in

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Forward-looking statements, such as those relating to earnings forecasts and other projections contained in this material, are managementʼs current assumptions and beliefs based on currently available information. Such forward-looking statements are subject to a number of risks, uncertainties, and other factors. Accordingly, actual results may differ materially from those projected due to various factors.

Todayʼs Agenda

Business Structure

Strength of EM businessStrength of EM business

Growth Strategies

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Business Structure

Photo imaging

Optical Device & Electronic Imaging 

d t

Global services

Others

71%

17%

10%

¥353 3 billion

productsProduction services Imaging 

Solutions29%

14%

FY2016/3Revenue

¥353.3 billion（14%）

HealthcareOffice printers

Document Solutions 44%16%

Revenue

¥2,491.6 billion

FPD

Information Solutions

¥1,174.1 billion（47%） FPD 

materialsOffice products

Industrial Products and 

Electronic materials

10%

43%

¥964.2 billion（39%）

Graphic systems

Electronic materials

30%

5%11%Recording 

media Highly functional materials

30%

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Business StructureThere are 9 plants in the world. Most products were manufactured by several plants.

Shizuoka Japan

Rhode Island USA

ArizonaUSA

CaliforniaUSA

Texas USA

Zwijndrecht Belgium

HsinchuTaiwan

SuzhouChina

CheonanKorea

Photoresists Negative Resist

Developers

Photoresists Negative Resist

Solvents and Resist Edge-bead Removers

Developers

Polyimides Polyimides

Acids / Blends

g

Acids / Blends

Cleaners

Thin Films Thin FilmsThin Films

Cleaners

Thin Films Thin Films

Color Mosaics Color Mosaics

CMP Sl i CMP Sl i CMP Sl i

Thin Films

CMP Slurries CMP Slurries CMP Slurries

・・・Plants which were reinforced or built over the last 3 years 4

Business StructureRecent changes of the market – Semiconductor market has grown steadilyg g y

Though steady growth were seen on the U.S dollar basis, the market shrunk on a Yen basis.

WSTS Semiconductor Market Forecast

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Business StructureRecent changes in the market –gSlowdown in growth of smartphones and IoT devicesSlowdown in growth of smartphones

Smartphone market maturing, market growth has slowed

CY2015 Growth rateYoY: +11.1%

CY2016 Growth rateYoY: +3.2%

Delay in the rise of the IoT Device market

Delay in the rise of the Downward revision ofelectronic materials market for IoT devices

Downward revision of growth forecasts

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Many legacy materials will be used in semiconductors for IoT, instead of cutting-edge devices because they will be manufactured using existing devices at least 28nm (Poly-Si) nodes.

Business StructureRecent changes of the market – More Moore and More than Moore

Movement for miniaturization

Recent changes of the market More Moore and More than MooreMore Moore

ArF Double patterning/Multi patterningo e e t o atu at o

ArF Double patterning/Multi patterning

Demands for cost reduction increase due to increasing

number of masks EUV

Multi patterning

More Than Mooreminiaturization

3D NAND highly-integrated, large capacity FlashMemory

Implementing increase of demands for SSD

High functionality

capacity, FlashMemory of demands for SSD

3D DRAM High-Band Implementing HBM (High Bandwidth Memory)

2.5D, 3D chipsUsing RDL, FOWLP highly-integrated,

large capacityAdvancing FOWLP by LogicFoundry: TSMC InFO

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Image Sensor with DRAM

Implementing High pixel, High speed flaming

IoT, Automatic driving

Business Structure

2 9 times sales growth from FY2009

3 0

3.5 2.9 times2.9 times sales growth from FY2009

Sales expansion of wide product line, ranging from Realizing sales growth over

th k t i

2.5

3.0 cutting-edge products to materials for legacy

devices

the market expansionrate

2.0 YenBas

1.5

n sis

1.0

0.0

0.5

0.0 2009 2010 2011 2012 2013 2014 2015 2016

Growth of the EM business 8

(FY)

Strengths of EM businessGaining customer trust through differentiation from competitors1) Development of advanced highly functional products

・Fundamental technologies: Capability to design and synthesize organic chemical compounds/polymers and id if d l h

Gaining customer trust through differentiation from competitors

to identify and analyze phenomena.・Product development: Capability to design/develop with speed and accuracy based on customer needs identified through on-site sales.

) bl l f l d d d2) Stable supply of leading-edge products・Stable and consistent manufacturing (control performance of raw materials/management of manufacturing process)・Quality Assurance (QA)/Quality Control (QC)

1: Our plants: Taking action against change in daily performance, responding to prevent abnormal data and human error

2: Production lines at customer plants: Reacting promptly and accurately when problems occur

３) Wide range of leading-edge, high-value-added global products that meet customersʼ needs・Selling wide range of product lines, such as photoresists including ArF resists, photolithography-related materials, COLOR MOSAIC for Image Sensors (ISCM), CMP slurries, cleaners/etchants, thin films, polyimide and high-purity solvents to semiconductor manufacturers around the world.p y g p y

4) Global production and supply system and integrated development system・Regarding FFEM Shizuoka factory as a mother factory, placing production bases in the U.S., Europe, and Asia. Aiming for stable supply to customers and sharing information including product development

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Asia. Aiming for stable supply to customers and sharing information including product development between each base by setting up several product supply bases for each product.

・Managing each base of FFEM (Japan, Europe, U.S., Taiwan, Korea, Singapore, and China) in the same direction -> Supporting Chinese market where volume is expanding.

Strengths of EM businessBuilding win-win relationships with priority customers

・Thorough awareness of Incident Free (No HVM (High Volume Manufacturing issue)) operations regarding QA/QC for members including top management R&D

Building win win relationships with priority customers (to gain and hold customer trust and reliance)

operations regarding QA/QC for members including top management, R&D, production, and sales. Support from the whole company to provide customer assistance. Creating win-win relationships with priority customers, following the management cycle shown below.a age e t cyc e s o be o

Respond to daily changes in h ithe environment

Customer Trust/ reliance based on R&D Build customer trust M f t ineeds based on identifying

customer needs

R&Dand reliance by offering samples

Manufacturing

Customer trustChanges in dailyCustomer trust andRequests for Customer trust and reliance

based on stable supply

Changes in daily performance

Customer trust and reliance through swift/accurate

responses

Requests fordevelopment of future products

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Continue improvement of QA/QC

Growth StrategiesGrowth Strategies1. Develop highly functional materials in a wide field using advanced

technology developments

Growth Strategies

2. Contribute to the development of the semiconductor industry through building win-win relationships with customers

Main Products for GrowthMain Products for Growth

① Photoresists② ISCM② ISCM③ CMP slurries④ Photolithography④ Photolithography

related materials① Etchants/Cleaners① Etchants/Cleaners② Polyimide

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Growth Strategies-(1) Photoresists, (4) Photolithography-Related Materials

From ArF immersion resists to photolithography-related materials•Specialize in the development of advanced photoresists and expand business in ArFimmersion/top coat less (TCL) photoresists and photoresists for NTI•Expand business areas from photoresists to NTI developers and other photolithographic-related

From ArF immersion resists to photolithography related materials

materials•For extreme ultraviolet (EUV) resists, develop materials together with customers that meet customer needs

Ad antages of the B siness•Selling Fujifilmʼs original NTI developing liquids and resists that are highly competitive especially in cutting-edge productsUtili i t h l i th t li hi h lit t bl l d hi h l

Advantages of the Business

•Utilizing technologies that realize high quality, stable supply, and high volume manufacturing (analysis technologies, synthesis technologies)

F t MPromote development of EUV resistsAt present, ArF immersion and multi-patterning are expanding start-up of EUV processes

Future Measures

p , p g p g p phas been delayed ⇒Expand EB sales through increase in usage volume of photomasks

・Only ArF to →•Strengthening of EB (increase in number of masks): Expansion in opportunities

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Strengthening of EB (increase in number of masks): Expansion in opportunities for EB resists business where Fujifilm has a high market share

•Expand ArF business (ArF resists for NTI)•KrF (thick membranes) and pre-wet agents

Growth Strategies- (2) Color MOSAIC for Image Sensors

Expand Business by Maintaining Leading Market PositionExpand Business by Maintaining Leading Market Position•Achieve leading market share (over 80%) by launching products ahead of competitors •Increase RGB by transitioning to dual cameras in advanced smartphonesy g p•Expand business for in-vehicle business (automatic driving) and security use (facial recognition, iris recognition) with infrared region (IR) products

Ad antages of the B siness

Draw on technologies developed in the photoresist field, including micro-h t l t h l i l th t l t h l i d t h l i

Advantages of the Business

photopolymer technologies, wavelength control technologies, and technologies for distributing ultra-fine pigment dyes evenly.

i i i hi h k h f G d d l /i d i l

Future Measures

Aim to maintain high market share of RGB and develop/introduce new materials for new applications. Aim to take leading market share in new materials.

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Growth Strategies- (3) CMP slurries

Provide leading-edge CMP slurries for Cu and barriersProvide leading edge CMP slurries for Cu and barriers・Specialize in sales/development of leading-edge CMP slurries for Cu and barriers (Ba)・Expanding business for CMP slurries for Co/Ba from CMP slurries which only use for Cu/ Ba

•Leading-edge technologies for CMP slurries, including cost-competitiveness and sales capabilities

Advantages of the Business

sales capabilities•The ability to react for needs from each customer

•Reinforce measures to react to customers’ needs and improve transport efficiency by

Future Measuresp p y y

used manufacturing sites in South Korea and Taiwan •Expanding business for Front –end

Wiring and dielectrics with different

hardnesses are combined CMP slurry

Wafer surface is planarized, despite the

difference in hardness

Equally/Smoothly Equally/Smoothly planarizeplanarize wafer surface that has a mixture of wafer surface that has a mixture of various substances with different various substances with different hardnesseshardnesses 14

hardness

Growth Strategies- (5) Etchants/CleanersOffer advanced materials that meet the progress of technologiesOffer advanced materials that meet the progress of technologies

Advantages of the Business

・Build relationships with major semiconductor manufacturing companies and offer materials that meet the needs of the customersʼ operations

F t M・Promptly establish and introduce materials development/process capabilities that meet the daily development of circuit patterning through cooperation with

Future Measures

customers・Expanding sales of Cleaners for process of Co wiring

As miniaturization proceeds removing contaminants (the resin metal and otherAs miniaturization proceeds, removing contaminants (the resin, metal, and other materials remaining after the wiring process that leads to defects) and further

improving accuracy are becoming more and more necessary.

Wid i i li N i i liWide wiring line⇒wouldn̓t lead to

critical defect

Narrow wiring line⇒leads to critical

defect

15同じ⼤きさのコンタミでも、微細化が進むと致命的な⽋陥にxContaminants with the same size will become a critical problem as miniaturization proceeds.

Growth Strategies- (6) PolyamidesIntroduce Products Aimed at the Expanding Mid-End Markets

Back grounds

Introduce Products Aimed at the Expanding Mid-End Markets

•Because of the limitations on DRAM and logic miniaturization, 3D/2.5D semiconductors with circuit rearrangement are expected to realize higher speeds, expand transmission volumes, lower costs, and achieve other objectives.•Emergence of new mid-end markets (OSAT). Entry from a prior process stage⇒Expected to expand market for materials for this field.

•In comparison with competitors, Fujifilm has strengths in photosensitive

Advantages of the BusinessIn comparison with competitors, Fujifilm has strengths in photosensitive

technologies and technologies for photo base generating agents and thermal base generating agents using low temperature cure polyimides (LTC PI).

•First, introduce to existing customers, then expand to Big Followers in Asia.

Future Measures

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Growth Strategies- Synergy with the company which we acquired

Accelerate growth by leveraging acquisition

2004 FFEM became a 100%-owned subsidiary of FF while FF purchased the

Accelerate growth by leveraging acquisition

2004 y pmajor part of the Microelectronic Materials Div. of Arch Chemicals (a manufacturing base in Europe/U.S.A. and a sales base in Europe/the U.S.A./Asia)

FF established the Electronic Materials Div.Purchased 50 shares of Planar Solutions, a manufacturing/sales company of CMP slurries, from Arch Chemicals.

2005

Made Planar Solutions into a 100%-owned subsidiary.2010

Acquired Ultra Pure Solutions, Inc., 2015high-purity solvent manufacturer in the U.S.

Announced the acquisition of Wako Pure Chemical Industries, Ltd.

2015

2016

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Growth Strategies- Synergy with the company which we acquired

Ultra Pure Solutions Inc (FEUP)Expand sales of ultra-pure organic solvents to FFEM customers and increase sales of FFEM products to major customers of FEUPAs a result of the acquisition FEUP has adopted FFEMʼs quality assurance and quality control

Ultra Pure Solutions, Inc (FEUP)

As a result of the acquisition, FEUP has adopted FFEMʼs quality assurance and quality control (QA/QC) systems, and synergistic effects have already emerged, as evidenced by receipt of awards from customers.In April 2016, received Superior Supplier Award from leading semiconductor manufacturerp , p pp g

Wako Pure Chemical Industries, Ltd.

High-purity washing solutions

High-performancePhotoresists CMP slurry washing solutions

Non-ionic surfactants

performance etchants

Photoresists

Materials for image sensors, etc.

C s u y

18Growth of the Electronics Materials Business

Summary

(1) M i t i t l hi h th t i th i d t(1) Maintain extremely high growth rate in the industry

(2) Seize opportunities firmly in a changing market(2) Seize opportunities firmly in a changing market environment

(3) Use Fujifilmʼs strengths in each of development, production, and sales/marketing to maximize advantage

(4) Plan to increase sales in each of a wide range of products(4) Plan to increase sales in each of a wide range of products

(5) Leverage M&A for further business expansion

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AppendixA field where Fujifilmʼs technological strengths can be utilized = semiconductor materials

ISCM

j g g

ISCM

Developer

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Appendix

100μm1.8m

埃

1μm

1m 1mm 1μm 1nm

埃

1 1μm200μm32‐14nm

1.1μm200μm

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AppendixPhotoresists are indispensable for the manufacturing of ultrasmall circuit patternsPhotoresists are indispensable for the manufacturing of ultrasmall circuit patterns. This photopolymer is used in the microphotolithography process, where the circuit pattern is printed onto a silicon wafer via exposure to light.

Creating photomasks Applying photoresists Exposing light

Pattern formation by lithography technology

LightPhotomask

Photoresist

Creating photomasksA base used when transcribing circuit

patterns to photoresist

Applying photoresistsApply photoresist to silicon wafers

Exposing lightPrint mask patterns on

photoresist

Silicon wafer

DevelopingMelt photoresist that has been

exposed by using developer

EtchingCut out parts that are not protected by photoresist

Strip off photoresist and clean

Strip off photoresistImmerse in developer

exposed by using developerprotected by photoresistStrip off photoresist

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Note: As in the case of positive resist

Appendix

New technologies are used to meet the needs for the further miniaturization of circuit

dimension.

A technology for increasing the resolution by filling the space

ArF immersion Top coat less

In the case of immersion, a topcoat is necessary to prevent elution into the water contained in the resist With “top Photoresist

Immersion water

Lens

between the stepper lens and the wafer with water that has a higher refractive index than air. This makes possible micro-processing without changing the light source or the photomask.

water contained in the resist. With top coat less” technology, the need for a topcoat is eliminated at the time of the exposure because polarity conversion technology changes the hydrophobic resist surface to a hydrophilic surface when development takes place

Wafer

g p when development takes place.

Negative tone imaging (NTI)U ti d l i t th t th d t i l ft It li f th i i t i ti dUses negative developing, a system that the exposed part is left. It realizes further miniaturization compared with the positive developing system, while shorting tact-time through its high sensitiveness.

Exposing light Exposing light

PositiveDeveloping

C t i it tt b

NegativeDeveloping

C t i it tt bCreate circuit patterns by

unexposed parts

Create circuit patterns by

exposed parts

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Appendix

A photo-sensitized coloring material to manufacture micro color filters, used in image sensors

Color resists

G B

R G

Colored by color resist

CCD

Micro lensPlanarization layer

Color filter

Smart phone Digital camera

Products that use image sensors

Structure of CCD image sensors Light receptor-transfer

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Appendix

CMP (chemical mechanical polishing) slurry CMP processCMP (chemical mechanical polishing) slurryAn abrasive material used to planarize the substrate that has various materials i th i it t t

Forming wiringForm electrode wiring

after removing photoresist

PlanarizationAbrade and planarize the

rough field of wafer

CMP process

Wafer (upside down)

Head pressure

CMP slurry

Polishing pad

in the circuit structure, like metal or dielectrics, to the ultimate level

Wire

Rotating head Rotating

platenCMP slurry

Photoresist products for photomask fabrication Cleaner

Products for thin film deposition

Insulator materials providing a lowpA specialized resist used for manufacturing photomasks A cleaner used for

clearing substrates and removing

Insulator materials providing a low dielectric (Low-k). It prevents reduction of the device operation speed or anincrease in the power consumption, caused by the reduction in the size of the wiring line and the insulator in between the Light source

impurities. It is used several times during the process of manufacturing semiconductors Before cleaning After cleaning

glines.

Polyimide ProductsPolyimides are widely used as an electronic material in various applications.

Photomask

Printed

Lens

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semiconductors. Before cleaning After cleaningThey have such characteristics as high thermal durability and good insulation properties.

WaferPrinted

pattern

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