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![Page 1: Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Mechanical Test Assessment for Electronic Modules Able to Function in Harsh.](https://reader038.fdocuments.in/reader038/viewer/2022110116/551a4e8e550346545e8b54fa/html5/thumbnails/1.jpg)
Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
Mechanical Test Assessment for Electronic Modules Able to
Function in Harsh Conditions
The 3rd International Symposium on Electrical and Electronics Engineering, 16-18 September, Galati, Romania
I.Plotog, G.Varzaru, P. Svasta
Vapor Phase Soldering Technology, a response for Innovative IMM Requests to
Lead–Free Era ChallengesI.Plotog, G.Varzaru, P. Svasta
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
2
ContentsIntroductionCritical Mass outbreak of Innovation ProcessLead-Free Soldering Challenge
VPS technologyBasicsEquipments facilities
Applications
Conclusions
Acknowledgment
References
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Introduction:Introduction:Critical Mass outbreak of
Innovation Process
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Critical Mass outbreak of
Innovation Process
Human Factors Knowledge
Catalyst: Socio-Economic & Financial
environment
Economic development with broad social implications
Competitiveness through competence
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Innovation
EducationKnowledge
Practice
Theory
Industry
Inventors & Innovative SME
Cri
tic
al M
as
s o
f p
eo
ple
an
d S
ME
s
by
incr
eas
ing
th
e c
om
pe
ten
ce
UPBCETTI-ITA
Actions
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
66
Assembling Workshop
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Introduction:Introduction: Lead-Free Soldering Challenge
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
10
Solder Paste
Pad NiAu, OSP, Ag-Im, HAL, Sn-Im
Solder joints
4P Soldering Model = 4 terms involve PASTE-PAD-PIN-PROCESS
Soldering Process
Thermal profile
Electronic
components
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
Lead-Free Soldering Process
Lead/Lead-Free Thermal profile
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Large dispersion for temperatures at PCB surface with consequences over solder joints microstructure
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
Thermal problemsTemperatures exceeding 230°C drastically increase the risk of thermal damages of the board and the electronic components
Popcorning
Cold Solder Joint (L-leaded package)
Cold or unsoldered solder joints
Limited temperature induction increases the risk of insufficient heat transfer especially on hidden solder joints (Shadowing effect)
Temperature
Cold Solder Joint (BGA ball)
Thermally overheated BGA ball
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
Non Wetting of BGA ball
Non Wetting of L-leaded package
Wetting problemsReduced wetting properties of lead-free solders usually require a protective gas atmosphere during the soldering process
N2 coverage
Bad Wetting of rectangular component
Bad Wetting of L-leaded package
Higher process cost due to protective gas
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
Increased overall machine length
To avoid solder cracks by enabling a smooth temperature ramp up the overall soldering track is further increased
Increased energy costHigher temperatures, larger machines, along with increased requirement for protective gas increases the already high energy requirements even higher
Increased ReworkHigh temperatures increase the risk of severe damage to the board. Solder and wetting problems, popcorning and others increase the production cost.
Hot Air Rework Process of BGA
T >> 250°C
Convection Vapour Phase
Power consumption
Depending on system
11 - 20kWh0,8 - 5,5kWh
Max Power consumption
Depending on system
>>20kWh1,8 - 10,4kWh
Solder Crack in L-leaded package
Solder Crack in J-leaded package
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Consequences: Increased temperature Poor wetting More voiding More oxidation Worse cosmetics Smaller process window Large temperature dispersion at PCB level with important modifications of the solder joints microstructure and in consequence over quality and reliability
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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VPS technology:Basics
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
The heat transfer rates are much higher in condensation (Vapour Phase) than in convection.
Overview: Condensation (Vapour Phase) and Convection
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
Vapour phase:A boiling fluid is creating a vapour blanket. The temperature is physically limited by the boiling point of the fluid. The electronic units are moved into the vapour, which is condensing at the (colder) electronic units. Convection:Heating elements in combination with blower motors are creating various hot air zones (forced convection). The electronic units are moved through the zones on a conveyor.
Heating elements with different temperatures
Conveyor Air at 175°C - 300°C
Air at 175°C - 300°C
Overview:Basic Vapour Phase
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
Air
Process fluid
Vapour
Water Cooled Housing
Circular Water Cooling
Condensing Fluid
50-80°C
230-240°C
230-240°C
Standby
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
Air
Process fluid
Vapour
Water Cooled Housing
Circular Water Cooling
Condensing Fluid
50-80°C
230-240°C
230-240°C
Cold Board Enters Vapour Phase System
21
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
Air
Process fluid
Vapour
Water Cooled Housing
Circular Water Cooling
Condensing Fluid
50-80°C
230-240°C
230-240°C
Board at Soldering Temperature
22
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
1.
2.
3.4.
5.
Soft Vapour Phase movement
Vapour Phase thermal profiling
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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VPS technology:VPS-Convection process comparison
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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VPS technology:Equipments facilities
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
The VPS equipment and facilities
The VPS equipment IBL company: SLC309
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Vacuum applications in VPS- IBL equipment Vacuum zone
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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VPS Technology and Applications
Applications
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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PCB with Different Core Materials
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Pin-In-Paste (a.k.a. Alternative Assembly and Reflow Technology, AART, and reflow soldering of
through-Hole, ROT)
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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High thermal resistance
Lower thermal resistance
• Thermovizion analyzes
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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CONCLUSIONSCONCLUSIONS Electrical & thermal parameters depend by all P
“actors” of the 4P Soldering Model; The Process influence significant the solder
joints reliability; VPS soldering process contribute to the
component thermal stress reduction (30°C maximum difference);
VPS offer lower peak temperature & lowest ΔT; Vapour Phase soldering is an ideal solution for:• Increased Quality• Economical Production• Energy Saving
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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AcknowledgmentAcknowledgment
This paper represents the result of work done for promoting innovative technologies in the frame of INOINDEX project (CNMP: 91-002/2007). The authors are very grateful to the leading staff of IBL-Löttechnik GmbH for continuous support and collaboration to fulfill experiments used in the presented paper.
Many thanks from the authors to: -Cookson Electronics which offered the solder pastes for experiments, -FELA Leiterplattentechnik GmbH, the company that supplied the glass and metal core PCBs for experiments.
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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ReferencesReferences
[1] R. Strauss, SMT Soldering Handbook, Butterworth-Heinemann Linacre House, Oxford, 1998, ISBN 0 7506 35894, pp. 179-189
[2] P. Svasta, I. Plotog, T. Cucu, A. Vasile, A. Marin, 4 P Soldering Model for Solder Joints Quality Assessment, ISSE 2009,The 32nd International Spring Seminar on Electronics Technology, 13-17 May, Brno, Czech Republic proceedings ISBN 978-80-214-3874-3.
[3] I. Plotog, P. M. Svasta, N. D. Codreanu, T. C. Cucu, C. Turcu, G. Varzaru, VPS Solution for Lead-Free Soldering in EMS Industries, ESTC 2008: Vol. 1, 2, Proceedings Pages: 121-124, London 2008
[4] I. Plotog, P. M. Svasta, N. D. Codreanu, T. C. Cucu, G. Varzaru “Investigations on Assembling of Electronic Packages onto Glass Substrates using Lead-free Technology”, 31st International Spring Seminar on Electronics Technology, ISSE 2008, Budapest, Hungary, May, 2008, Conference proceedings, pp. 415-419.
[5] H. Leicht, A Thumm, Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering, IBL-Löttechnik GmbH, www.ibl-loettechnik.de, Germany
[6] FELAM Thermoline, „Technical Documentation“, FELA Leiterplattentechnik, 2007.
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Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010
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Mechanical Test Assessment for Electronic Modules Able to Function in Harsh Conditions
Ioan Plotog
Senior researcher, Executive Director, Technological and Business Incubator, CETTI-ITA Center for Technological Electronics and Interconnection Techniques, UPB-CETTI“Politehnica” University of Bucharest, UPBSpl. Independentei 313, sector 6, 060042Bucharest, Romania Tel: +40 21 4103108; +40 21 4024650Fax: + 40 21 4103118Email: [email protected]://www.cetti.ro/ita
Do You Have Any Questions ?
Bucharest International Technical Fair
TIB 2010, 36 edition, October 6-9, 2010