BSS R10 PPD

Product Package Description

221 03-FAP 130 550 R1A Uen Rev A 2004-05-10 © Ericsson. Commercial in Confidence

Description 2 (41)

221 03-FAP 130 550 R1A Uen

Rev A 2004-05-10 © Ericsson. Commercial in Confidence

The information provided in this document concerning capacity, suitability and performance shall not be considered commercially binding. Ericsson shall not be liable for any damages or monetary losses resulting from the use of the contents of this document. Please note that all capacity figures and dimensioning methods are based on Ericssons own models of how subscribers behave in a network. The document is intended to be used by professionally trained personnel. It is strongly recommended to involve Ericsson in discussions covering the contents of this document.

Due to the continued progress in methodology, design and manufacturing, the information contained in this document is subject to revision without notice. Any customer feedback that may help Ericsson improve the documentation and information methods is welcome.

Description 3 (41)

221 03-FAP 130 550 R1A Uen


Contents 1 General 5 1.1 Purpose 5 1.2 The Product Package Concept 5 1.3 Changes from BSC R9.1 -> BSC R10 Product Package 6 1.4 Changes since last release of this document 6 1.5 Description of Product numbers 6 2 Application Description 7 2.1 System Overview 7 2.2 BSC, BSC/TRC and TRC nodes 7 3 Choosing the Right Product Package Configuration 8 3.1.1 Compact or High capacity 8 3.1.2 BSC, BSC/TRC or TRC 8 3.1.3 High Speed Signalling Link (HSL) 8 3.1.4 Number of supported Transceivers 9 3.1.5 Signalling links, RBS 200 and Real Time Event Data (RTED) 9 3.1.6 Traffic/Transcoder Capacity 10 3.1.7 Number of E1/T1s 11 3.1.8 Packet Control Unit (PCU) capacity 12 4 New Product Packages Compact nodes 13 4.1 Base Configurations with Characteristics 13 4.2 Options 14 4.3 Expansion 15 5 New Product Packages High capacity nodes 17 5.1 Base Configurations with Characteristics 17 5.2 Options within base cabinets 19 5.3 Options with additional cabinets 20 5.4 Expansion of Base Configurations within R10 Release 21 6 Upgrades from Previous Releases. 22 7 Cabinet Allocation and Floor plan 23 7.1 Cabinet Allocations 23 7.1.1 APZ cabinet (Mandatory) 23 7.1.2 GEM GS/TRA/ET155 cabinet (Mandatory) 24 7.1.3 APG/PCU/RPG3 cabinet 24 7.1.4 PCU cabinet 25 7.1.5 RPG3 cabinet 25 7.1.6 Compact BSC and BSC/TRC cabinet 26 7.1.7 Compact node extension cabinet (Optional) 26 7.2 Standard Floor plan for BSC R10 27 7.2.1 High Capacity Floor Plans 27 7.2.2 Compact Floor Plans 29 8 Site Products 30 8.1 Node Related Site Products (NRSP) 30 8.2 Site Related Site Products (SRSP) 30 8.3 Optional Spares 30 9 Appendix A - Environmental Characteristics 31 9.1 General Operating Conditions 31 9.2 Conformity with EU Directives 31 9.3 Electromagnetic Compatibility (EMC) 31 9.4 Product Safety 32 9.5 Power Requirements 32 9.6 Dissipated heat 32 10 Appendix B Node Related Site Products (NRSP) 33 10.1 AXE Operation and Maintenance, O&M 33 10.2 External Cables 34

Description 4 (41)

221 03-FAP 130 550 R1A Uen


10.3 Conversion of STM-1/OC-3 36 10.3.1 External Cables Associated with the Conversion Option 37 11 Appendix C Site Related Site Products (SRSP) supporting BSC,

BSC/TRC and TRC R10 38 11.1.1 Power Supply 38 11.1.2 Power Distribution 38 11.1.3 AXE Operation and Maintenance (AXE O&M) 38 11.2 Mobile PBN 38 11.2.1 Distribution Frames (DF) 39 11.2.2 Raised Floor 39 11.2.3 External Mechanics 39 11.2.4 Earthquake Reinforcements 40 11.2.5 GPS Synchronisation Clock 40 11.2.6 DataCom cabinet 40 12 Appendix D Terminology 41

Description 5 (41)

221 03-FAP 130 550 R1A Uen


1 General 1.1 Purpose

The purpose of this document is to describe the Product Package for the GSM BSC R10. The commercial products are presented according to:- • New Product Packages • Expansion Product Packages within this Release This document also provides the following details:- Estimated Capacity, Functionality, Allocation drawings, Floor plan and the estimated Maximum power consumption/fuses of the included cabinets. This PPD represents the Hardware Product Packaging Only. For RTU license information, refer to the feature descriptions.

1.2 The Product Package Concept The New Product Packages are a result of continuous improvement through customer feedback and technological advancement. The idea behind the Product Package concept is to deliver equipment on node level, and by doing so simplify and speed up the ordering, supply lead-time, installation, and testing of the node. By using a standard floor plan it is possible to utilise pre-manufactured external cabling which further decreases the lead-time.

The Product Package objectives are:

• Simplify the order process.

• Reduce Order-to-Implementation time for new installations.

• Ship pre-assembled and pre-tested nodes.

The key operator benefits are:

• Capacity in the network can be deployed faster, so revenues are generated quicker.

• The operator can respond better to rapid network growth due to smoother and easier expansions.

Description 6 (41)

221 03-FAP 130 550 R1A Uen


1.3 Changes from BSC R9.1 -> BSC R10 Product Package

• APZ 212 33C replaces the APZ 212 25 and APZ 212 30.

• High Speed Signalling Link (HSL) for ANSI introduced

• ET4-1 + ET155 used instead of ETC.

• Increased capacity to 8000 Erlang

• Compact nodes with lower capacity

• Compact BSC expandable to Compact BSC/TRC

1.4 Changes since last release of this document • Document number 221 03-FAN 101 145 R1A Uen replaced by 221 03-FAP

130 550 R1A Uen

• Compact nodes updated.

1.5 Description of Product numbers The Product numbers correspond to the defined Base Configurations and the Optional Functionalities. The types of Product numbers are listed below:

• FAM : used for Base Configurations

• FAH : used for Optional Functionalities and Site Options Note:- These are not the Product Numbers which contain the deliverable items

Description 7 (41)

221 03-FAP 130 550 R1A Uen


2 Application Description

2.1 System Overview The following figure shows a simplified overview of the GSM Network and also describes the interface names and types associated with GSM R10.

Figure 1. Overview of the position of the BSC, BSC/TRC and TRC in GSM R10. Note: SMPC nodes, LMUs and Lb-interfaces, needed for Mobile Positioning, are not shown in the picture above.

2.2 BSC, BSC/TRC and TRC nodes

The Base Station Controllers (BSCs) control the Radio Base Stations (RBSs) and can be placed separately from the Transcoder Controller (TRC), to minimize transmission. The Transcoders are normally placed closer to the core network/Switching system. The capacity of the BSC node is 1,020 TRXs and the capacity of the TRC node is 8000 Erlang. The BSC/TRC is a combined BSC and TRC node optimised for medium and high subscriber density network topologies. The BSC/TRC has common transcoders pools supporting its own TRXs and remote BSCs. The transcoders are set up on a per call basis, which means that transcoder resources are efficiently used.

There are compact and high capacity nodes. Compact BSC and BSC/TRC are preferably used in areas where less capacity is needed. The Compact BSC and BSC/TRCs are based upon a single GEM 16 K GS. The Compact BSC and BSC/TRC can be expanded to handle maximum 1920 TRA channels, 126/168 E1/T1 and 600 TRX:es. A high capacity BSC/TRC has many advantages for the operator: • Reduces load on the MSC due to fewer BSC handovers • Insensitive for traffic peaks

Description 8 (41)

221 03-FAP 130 550 R1A Uen


• High capacity offered and suitable for multi band operations (GSM 800/900/1800/1900)

• Reduced operation and maintenance costs due to fewer nodes in the network • Optimum usage of radio network resources • High trunking efficiency in transcoder pool.

A Packet Control Unit (PCU) can be added to the BSC and BSC/TRC nodes to support GPRS and EGPRS.

3 Choosing the Right Product Package Configuration

Follow the steps in this chapter to find a suitable BSC R10 product package.

1. Compact or High Capacity node 2. What type of node, BSC, BSC/TRC or TRC? 3. Will High Speed Signalling Link (HSL) be used? 4. What number of transceivers needs to be supported? 5. How many signalling links are needed? How many RBS200 needs to

be supported? Is Real Time Event Data (RTED) used? 6. How large transcoder pool (Traffic capacity in Erlang) is needed?

Clarification: A BSC does not have a transcoder pool. 7. How many E1/T1s are needed? 8. Is a Packet Control Unit (PCU) needed? How large shall it be?

Observe that the product packages in R10 allow flexibility when choosing amounts of E1/T1s, TRA, RPPs in PCU etc. It also allows expanding from BSC to BSC/TRC. With the Group Switch GS890 and the new APZ 212 33C processor, the GS size (including SRS size) and the processor capacity dont need to be considered when choosing a product package.

3.1.1 Compact or High capacity

There are compact and high capacity nodes. Compact BSC and BSC/TRC are preferably used in areas where less capacity is needed. The Compact BSC and BSC/TRCs are based upon a single GEM 16 K GS. The Compact BSC and BSC/TRC can be expanded to handle maximum 1920 TRA channels, 126/168 E1/T1 and 600 TRX:es.

3.1.2 BSC, BSC/TRC or TRC

BSCs are preferably used in low traffic areas, to provide coverage and minimize transmission costs.

The BSC/TRCs are preferably used in medium-to-high traffic areas. It can have transcoder capacity to support its own TRXs as well as TRXs from remote BSCs. The transcoder pool(s) handles the total traffic in the BSC cluster.

3.1.3 High Speed Signalling Link (HSL)

Description 9 (41)

221 03-FAP 130 550 R1A Uen


High speed signalling links is available in the R10 product packages. Two RPP boards can handle one (plus one redundant) HSL link. Maximum number of supported High Speed Signalling Links is four (2+2), for redundancy.

High speed signalling links both increases the signalling capacity and decreases the signalling delay time.

3.1.4 Number of supported Transceivers

One RPG3 board handle 32 TRXs in most cases, see handbook for BSC HW dimensioning for further information. The maximum capacity in a node is 1020 TRXs. Redundancy is not included in the dimensioning values.

Note: Number of signalling terminals, RBS200 support and Real Time Event Data also need to be considered when deciding needed amount of RPG3-boards.

3.1.5 Signalling links, RBS 200 and Real Time Event Data (RTED)

Each RPG3 board can handle four SS7 or C7 (No. 7) signalling links.

Note: When HSL is used, the signalling terminals are handled by RPP-boards and it is not needed to reserve any RPG3-boards for the signalling.

Each RPG3 has a capacity of 12 STCs. STC functions are needed to support RBS 200. Each STC supports one RBS 200. When RBS2000 is used no extra RPG3-boards are needed above the number of RPG3-boards needed for the transceiver support, according to 3.1.4 Number of supported Transceivers.

Real Time Event Data requires one RPG3 board (as STOC device). Redundancy is not supported. An Ethernet cable, to connect with the RPG3-board, is included when the feature is ordered.

With the tables below it is possible to calculate the TRX capacity of the nodes with different amount of RPG3-boards used for signalling terminals, RBS200 support and Real Time Event Data..

Base Configurations (BSC, BSC/TRC and TRC)

TRX capacity

450 700 900 1000 1000 XT

0 512 768 1020 1020 1020

1 480 736 992 1020 1020

2 448 704 960 1020 1020

3 416 672 928 1020 1020

4 384 640 896 1020 1020

Number of RPG3 boards used for signalling terminals, RBS200 support, Real Time 5 352 608 864 1020 1020

Description 10 (41)

221 03-FAP 130 550 R1A Uen


6 320 576 832 1020 1020

7 288 544 800 1020 1020

Real Time Event Data.

8 256 512 768 1020 1020 Table 1: High Capacity nodes: The TRX capacity of the RPG3s in a node depends on how many RPG3s that are configured to handle signalling terminals, support of RBS200, Real Time Event Data.

Base Configurations (BSC, BSC/TRC )

TRX capacity

1001 200 450

1 128 224 480

2 96 192 448

3 64 160 416

Number of RPG3 boards used for signalling terminals, RBS200 support, Real Time Event Data. 4 32 128 384

Table 2: Compact nodes: The TRX capacity of the RPG3s in a node depends on how many RPG3s that are configured to handle signalling terminals, support of RBS200, Real Time Event Data. 1) The 100 TRX option is only available as a BSC (remote BSC).

3.1.6 Traffic/Transcoder Capacity

The traffic capacity in Erlang can be chosen independently of the number of supported TRX:es.

# TRA channels (FR,H-R, EFR, AMR F-R,

AMR H-R)

Erlang (0,1% GoS)

768 706

1536 1450

2304 2200

3072 2960

3840 3720

4608 4480

5376 5240

Description 11 (41)

221 03-FAP 130 550 R1A Uen


6144 6000

6912 6760

7680 7530

8448 8290

Note: The Erlang values are approximate since they depend on several parameters.

3.1.7 Number of E1/T1s All nodes in R10 have 155Mbit/s interfaces and expansions are always done in step of 155Mbit/s channels. 2 Mbit/s and 1,5 Mbit/s interfaces are obtained by the ET4-1 multiplexor. The 2 Mbit/s (1.5 Mbit/s ANSI) interfaces stated can be divided flexibly between the A-, A-bis, Lb, Gb and A-ter interfaces.

3.1.7.1 ET4-1

ET4-1 is a multiplexor that generates an interface from AXE810 (optical STM-1) to PDH transmission. The ET4-1 is an optional extension product to ET155.

If ET4-1 is used towards a node, from where synchronization is taken, the two ETC boards shall be used to to get synchronization. The 2 ETC boards are available as an option.

3.1.7.2 E1 - ETSI On the A and Lb interface, each E1 has a capacity of 31 channels, 64 kbit/s each. Typically 30 channels are used as traffic channels and one is used for No. 7 signalling or O&M signalling. On the A-ter interface, each E1 has a capacity of 124 channels, 16 kbit/s each. Typically 120 channels are used as traffic channels and one 64 kbit/s channel is used for No. 7 signalling or O&M signalling. On the A-bis interface, each E1 has a capacity of 31 channels, 64 kbit/s each. Each TRX requires two 64 kbit/s channels if LAPD multiplexing is used, between two and three 64 kbit/s channels if LAPD Concentration is used and three 64 kbit/s channels if none of these features are used.

On the Gb interface, each E1 has a capacity of 31 channels, 64 kbit/s each. Dimensioning depends on the GPRS/EGPRS dimensioning.

The stated number of E1 interfaces always includes 1+1 redundancy of the ET155-1 boards.

Description 12 (41)

221 03-FAP 130 550 R1A Uen


The VC-12s (the logical 2 Mbit/s channels in the SDH format) can be divided flexibly between the A-, A-bis, Lb, Gb and A-ter interfaces. One 155 Mbit/s channel corresponds to 63 channels, 2 Mbit/s each. ET155-1 has optical interface.

3.1.7.3 T1 - ANSI

On the A and Lb interfaces, each T1 has a capacity of 24 channels, 64 kbit/s each.

On the A-ter interface, each T1 has a capacity of 96 channels, 16 kbit/s each. Typically 92 channels are used as traffic channels and one 64 kbit/s channel is used for No. 7 signalling or O&M signalling.

On the A-bis interface, each T1 has a capacity of 24 channels, 64 kbit/s each. Each TRX requires two 64 kbit/s channels if LAPD multiplexing is used, between two and three 64 kbit/s channels if LAPD Concentration is used and three 64 kbit/s channels if none of these features are used.

On the Gb interface, each T1 has a capacity of 24 channels, 64 kbit/s each. Dimensioning depends on the GPRS/EGPRS dimensioning.

The stated number of T1 interfaces always includes 1+1 redundancy of the ET155-1 boards.

The number of 155 Mbit/s interfaces stated is the total number of ET155s. The VC-12s can be divided flexibly between the A-, A-bis, Gb and A-ter interfaces. One 155 Mbit/s channel corresponds to 84 channels, 1.544 Mbit/s each. ET155-1 is always protected and has optical interface.

3.1.8 Packet Control Unit (PCU) capacity A PCU is needed for GPRS and EGPRS. The PCU is using RPP-boards. One RPP-board normally handles typically 150 channels (16kbit/s). For EGPRS and CS 3 & 4 64 kbit/s links is required for GSL and maximum 64 channels is supported per RPP. For an exact figure, based on the actual traffic model, please see the PCU dimensioning guidelines. The largest supported PCU capacity is 9450 (16 kbit/s) channels.

Description 13 (41)

221 03-FAP 130 550 R1A Uen


4 New Product Packages Compact nodes

Overview of mandatory and optional cabinets.

4.1 Base Configurations with Characteristics Product Description Base Configurations

Compact BSC Compact BSC/TRC Node type 100 C 200 C 450 C 200 C 450 C FAM 105 448 (ETSI) FAM 105 449 (ANSI)

/1 /2 /3 /4 /5

APG 40C 1 1 1 1 1 GEM K GS 16 16 16 16 16 APZ 212 33C 1 1 1 1 1 RPG3 boards 5 8 16 8 16 # E1/T1 with mandatory ET4-1 system

32/- (84 T1

available as

option for

ANSI)

- - - -

# E1/T1 (2/1,5 Mbit/s) on ET155-1-O3

-/84 Not

available for ETSI

63 /84

63 /84

63 /84

63 /84

Transcoder channels1 - - - 768 768 TRXs2 96 192 448 192 448 Signalling terminals2 8 8 8 8 8 Power for Base Conf. (Watt)

650 650 660 690 720

1) The maximum number of TRA channels is 1536 in the new node (to reach 1920 channels a separate expansion is needed). 2) The values of supported TRXs, signalling terminals are only examples of how the RPG3 boards can be used. See chapter 3.1.4 and 3.1.5 for further information. The maximum number of RPG3 boards is 16 (to reach support for 600 TRXs, 22 RPG3 boards, a separate expansion is needed).

APZ 212 33C

GEM

APG 40

(7 RPP)

APZ/IO/GS/PCU/RPG3 PCU/RPG3/ET4-1

Optional cabinetMandatory cabinet

5, 8 or 16 RPG3

(2 or 6 RPP)

ET4-1

(6 RPG3, 4 RPP)

Description 14 (41)

221 03-FAP 130 550 R1A Uen


3) ET155-1-O supports optical STM-1/OC-3. Compact BSC 100C ETSI with 32 E1 includes a mandatory ½ ET4-1 system.

4.2 Options

For a certain TRA channel capacity and E1/T1 capacity there are limitations in choosing number of 16 kbit/s GSL channels, see table below. See Chapter 3 Choosing the Right Product Package for guidelines in choosing a product package.

E1/T1

TRA

31/84

126/168

0 0 or 300 16 kbit/s GSL channels TBD

768 TBD TBD

1536 TBD TBD

2304 TBD TBD

Table 3: Compact BSC 100 C (5 RPG3)

E1/T1

TRA

63/84

126/168



1536 TBD TBD

2304 TBD TBD

Table 4: Compact BSC and BSC/TRC 200 C (8 RPG3)

E1/T1

TRA

63/84

126/168

0 0 or 900 16 kbit/s GSL channels 0 or 900 16 kbit/s GSL channels


1536 TBD

0 or 900 16 kbit/s GSL channels

2304 TBD

TBD

Table 5: Compact BSC and BSC/TRC 450 C (16 RPG3)

Description 15 (41)

221 03-FAP 130 550 R1A Uen


Product numbers for options:

Product Description Options (Quantity)

Product number (and quantity)

# E1/T1 (2/1,5 Mbit/s) on ET155-1-O1

63/84 FAH 107 338/1

# Transcoder Channels2 FR/EFR/HR/AMR

768 FAH 107 339/1

300 2*FAH 107 342/6 # 16 kbit/s GSL channels3

(for EGPRS/GPRS) 900 6*FAH 107 342/6

1) E1/T1 redundancy for ET155-1 is 1+1. E.g.: 63/84 E1/T1 means 63/84 ordinary +63/84 redundant. 2) Steps of 4 TRA R6 boards. 1 board handles 192 channels. 3) For EGPRS and CS 3 & 4 64 kbit/s links are required for GSL and 62 channels are supported per

RPP.

4.3 Expansion The compact BSC and BSC/TRC nodes can in a next step be expanded to handle 600 TRXs. The options in the previous chapter are also available in the expansion until the maximum size is reached.

Product Description

Options (Quantity)


3 RPG3 boards and 31 E1 with ½ ET4-1 system (for expanding BSC 100 C->BSC 200 C ETSI)

1 FAH 107 416/1

3 RPG3 (for expanding BSC 100 C->BSC 200 C ANSI)

1 FAH 107 417/1

6 RPG3 boards1 1 FAH 107 418/1 # 16 kbit/s GSL channels2

(for EGPRS/GPRS)

600 4*FAH 107 342/6

# 16 kbit/s GSL channels

(for EGPRS/GPRS)

1050 7*FAH 107 342/6

# Transcoder Channels3 FR/EFR/HR/AMR

384 FAH 107 419/1

½ RPG3 subrack (8 RPG3 boards)

1 FAH 107 221

Description 16 (41)

221 03-FAP 130 550 R1A Uen


1) Expansions of Compact BSC 450 C or Compact BSC/TRC 450 C to Compact 600. (16 RPG3 boards to 22 RPG3 boards.)

2) This expansion step is available when expanding 300->900 and 900->1500 16 kbit/s GSL channels. 3) 2 TRA R6 boards for expanding the Compact BSC/TRC from 1536 to 1920 TRA channels. (1 board

handles 192 channels)

When expanding Compact BSC to a BSC/TRC, the options in previous chapter shall be used.

The Compact BSC and BSC/TRC can at the maximum be expanded to:

Product Description Expandable to (maximum):

BSC BSC/TRC

RPG3 boards 22 22 E1 /T1:s

126 /168

126 /168

Transcoder channels - 1920 # 16 kbit/s GSL channels

2 (for EGPRS/GPRS)

2550 (17 RPP boards)

2550 (17 RPP boards)

TRXs1 608 608 Signalling terminals1 12 12

1) The values of supported TRXs, signalling terminals are only examples of how the RPG3 boards can be used. See chapter 3.1.4 and 3.1.5 for further information.

Note 1: A second cabinet will be needed when HW to support more than 900 16 kbit/s GSL channels (for GPRS traffic) are installed or more than 16 RPG3 boards (448 TRX, 8 signalling terminals links).

Note 2: When the node is expanded to 600 TRXs it is suggested that a detailed capacity requirement analysis is made to assure efficient use of the node.

See Chapter 3 Choosing the Right Product Package for guidelines in choosing a product package.

Description 17 (41)

221 03-FAP 130 550 R1A Uen


5 New Product Packages High capacity nodes

Overview of mandatory and optional cabinets.

5.1 Base Configurations with Characteristics Product Description

Base Configurations

BSC BSC/TRC TRC Node type 450 700 900 1000 1000XT 450 700 900 1000 1000XT - FAM 105 410 (ETSI) FAM 105 412 (ANSI)

/1 /2 /3 /4 /5 /6 /7 /8 /9 /10 FAM 105 411 /1 (ETSI) FAM 105 413 /1 (ANSI)

RPG3 boards 16 24 32 40 48 16 24 32 40 48 16 # E1/T1 (2/1,5 Mbit/s) on ET155-1-O3

63 /84

126 /168

126 /168

189 /252

189 /252

63 /84

126 /168

189 /252

252 /336

252 /336

189 /252

Transcoder channels

- - - - - 768 1536 2304 3072 3840 3840

TRXs1 448 672 896 1020 1020 448 672 896 1020 1020 (256) Signalling terminals1

8 12 16 32 32 8 12 16 32 32 32

RBS 200 Support1

- - - - 108 - - - - 108 -

Power for Base Conf. (Watt)

820 895 930 1000 1035 880 1025 1120 1290 1360 1200

1) The values of supported TRXs, signalling terminals and RBS 200 support are only examples of how the RPG3 boards can be used. See chapter 3.1.4 and 3.1.5 for further information.

2) All base configurations require 20 fuses, consist of 3 cabinets and 0.84m2 in footprint. 3) ET155-1-O supports optical STM-1/OC-3.

APZ 212 33C

(2 HSL)

(2 HSL)

(Spare) (Spare)

(2 ETC5)

(Spare)

GEM GEM

GEM

GEM

APG 40

(2 or 7 RPP)

(7 RPP)

(7 RPP)

16 RPG3

(8 or 16 RPG3)

(Spare)

7 RPP

7 RPP

7 RPP

7 RPP 7 RPP

7 RPP

(Spare)

16 RPG3

16 RPG3

16 RPG3

16 RPG3

APZ/HSL GS/TRA/ET155 APG/RPG3/PCU PCU RPG3

Optional cabinetsMandatory cabinets

(8 or 16 RPG3)

Description 18 (41)

221 03-FAP 130 550 R1A Uen


High Capacity BSC and BSC/TRC base configurations can be ordered without the 21233C APZ. In this scenario, it is assumed that the customer will furnish a suitable APZ 212 30 or APZ 212 33C. APZs slated for reuse must be support in the SW and be properly equipped with memory, serial RP buses and the IPN bus for connection to APG40. APZ upgrades are not available from this Product Package. Consult your Ericsson representative if for details.

Product Description Product Number

BSC 450 w/o APZ (63/84 E1/T1 ET155)

FAM 105 452/1 (ETSI) FAM 105 454/1 (ANSI)

BSC 700 w/o APZ (126/168 E1/T1 ET155)

FAM 105 452/2 (ETSI) FAM 105 454/2 (ANSI)

BSC 900 w/o APZ (126/168 E1/T1 ET155)

FAM 105 452/3 (ETSI) FAM 105 454/3 (ANSI)

BSC 1000 w/o APZ (189/252 E1/T1 ET155)

FAM 105 452/4 (ETSI) FAM 105 454/4 (ANSI)

BSC 1000XT w/o APZ (189/252 E1/T1 ET155)

FAM 105 452/5 (ETSI) FAM 105 454/5 (ANSI)

BSC/TRC 450 w/o APZ (768 TRA Channels, 63/84 E1/T1 ET155)

FAM 105 453/1 (ETSI) FAM 105 455/1 (ANSI)


FAM 105 453/2 (ETSI) FAM 105 455/2 (ANSI)


FAM 105 453/3 (ETSI) FAM 105 455/3 (ANSI)


FAM 105 453/4 (ETSI) FAM 105 455/4 (ANSI)

BSC/TRC 1000XT w/o APZ (3840 TRA Channels, 252/336 E1/T1 ET155)

FAM 105 453/5 (ETSI) FAM 105 455/5 (ANSI)

Table 6: Commercial Product Numbers for High Capacity nodes without APZ

Description 19 (41)

221 03-FAP 130 550 R1A Uen


5.2 Options within base cabinets

Optional Functionality can be added to a node to meet customer requirements more closely. The following table show the options, within the base cabinets, that can be added to the Base Configuration to provide the extra functionality that a particular customer may require. Selecting from these tables is optional.

For a certain TRA channel capacity there are limitations in choosing number of E1/T1s, see table below. See Chapter 3 Choosing the Right Product Package for guidelines in choosing a product package.

E1/T1

TRA

63/84

126/168

189/252

252/336

378/504

504/672

630/840

0 X X X X X X X

768 X X - - - - -

1536 X X X - - - -

2304 - X X X - - -

3072 - - X X - - -

3840 - - X X X - -

4608 - - - X X - -

5376 - - - X X X -

6144 - - - - X X -

6912 - - - - X X X

7680 - - - - X X X

8448 - - - - - X X

Table 7: Available combinations of TRA channels and E1/T1 marked with X. This means: When adding additional TRA and E1/T1 capacity to the base configurations you need to end up with an available combination, marked X.

Description 20 (41)

221 03-FAP 130 550 R1A Uen


Choose additional number of E1/T1:s, transcoder channels, GPRS channels and HSL:

Product Description

Options (Quantity)


# E1/T1 (2/1,5 Mbit/s) on ET155-1

1

63/84 FAH 107 338/1

# Transcoder Channels

2

FR/EFR/HR/AMR

768 FAH 107 339/1

300 2*FAH 107 342/6 7503 5*FAH 107 342/6

# 16 kbit/s channels

3

(EGPRS/GPRS/PCU/RPP)

1050 FAH 107 342/2

Number of HSL 1.5/ 2 Mbit/s links

4

1+1 FAH 107 340/1

# 8 RPG3 boards (with subrack if needed)

1 FAH 107 221

1) E1/T1 redundancy for ET155-1 is 1+1. E.g.: 63/84 E1/T1 means 63/84 ordinary +63/84 redundant. 2) Steps of 4 TRA R6 boards. 1 board handle 192 channels. 3) Steps of 1 subrack. For EGPRS and CS 3 & 4 64 kbit/s links is required for GSL and 64 channels is

supported per RPP. 750 channels upgrade only used when going from 300 to 1050 channels. 4) Steps of 1 subrack, up to 2 subracks. 1+1 for redundancy.

5.3 Options with additional cabinets

The following table show the options, with additional cabinets, that can be added to the Base Configuration to provide the extra functionality that a particular customer may require. Selecting from these tables is optional. Choose wanted number of GPRS channels:

Product Description Options (Quantity)


# 16 kbit/s channels1

(EGPRS/GPRS/PCU/RPP)

1050 1*FAH 107 342/2

# RPG3 subracks (512 TRX or C7 and RBS 200 support)

2

1 1*FAH 107 221/2

1) Steps of 1 subrack, up to 6 subracks. For EGPRS and CS 3 & 4 64 kbit/s links is required for GSL and 64 channels is supported per RPP.

2) Steps of 1 subrack, up to 4 subracks. 3) Some options are not possible because of DLEB restrictions. Maximum RPG3, ETC5(for sync), HSL

and PCU configurations (18 subracks in total) are not possible. The maximum total amount of subracks that can be chosen is 16.

See Chapter 3 Choosing the Right Product Package for guidelines in choosing a product package.

Description 21 (41)

221 03-FAP 130 550 R1A Uen


5.4 Expansion of Base Configurations within R10 Release

Expansion packages from all Base Configurations to larger Base Configurations are available in the product package release. Options can also be expanded to the maximum quantity specified in chapter 5.2 Options within base cabinets.

Description 22 (41)

221 03-FAP 130 550 R1A Uen


6 Upgrades from Previous Releases.

Upgrades from previous releases of the BSC, BSC/TRC and TRC is described in a separate BSC Expansion/upgrade PPD.

Description 23 (41)

221 03-FAP 130 550 R1A Uen


7 Cabinet Allocation and Floor plan

The following section describes the equipment practice, cabinet allocations and the standard floor plan used in the R10 BSC, BSC/TRC and TRC Product Package.

7.1 Cabinet Allocations

All HW is housed in BYB 501 single depth cabinets.

The cabinet dimensions (H x W x D) are 1800x600x400 mm.

All internal cables in BYB 501 cabinets are halogen free and self-extinguishing.

7.1.1 APZ cabinet (Mandatory)

APZ Cabinet

Space reserved for future Release.

APZ 212 33C (1 GB)

Optional ETC boards for synchronization.

APZ 212 33C

(2 HSL)

(2 HSL)

(Spare)

(Spare)

(2 ETC5)

(Spare)

Maximum Power Consumption: 270 W

Fuses: 6

Description 24 (41)

221 03-FAP 130 550 R1A Uen


7.1.2 GEM GS/TRA/ET155 cabinet (Mandatory)

Maximum Power Consumption: 1310W

Fuses: 8

7.1.3 APG/PCU/RPG3 cabinet


Fuses: 6

GEM Cabinet

GEM GEM

GEM

GEM

Subracks with ET155-1-O, TRA R6.

Subracks with ET155-1-O, TRA R6, DLEB and Clock boards.

APG/PCU/RPG3 Cabinet

APG 40 APG 40 (1 GB)

PCU, 7 RPP boards per subrack. Optional.

(2 or 7 RPP)

(7 RPP)

(7 RPP)

16 RPG3

(8 or 16 RPG3)

(8 or 16 RPG3)

16 RPG3 boards per subrack. Optional.

Description 25 (41)

221 03-FAP 130 550 R1A Uen


7.1.4 PCU cabinet

PCU Cabinet

(Spare)

7 RPP

7 RPP

7 RPP

7 RPP

7 RPP

7 RPP

(Spare)

Spare subracks

Each subrack is equipped with 7 RPP boards used for PCU.


Fuses: 4

7.1.5 RPG3 cabinet

RPG3 Cabinet

16 RPG3

16 RPG3

16 RPG3

16 RPG3

Each subrack is equipped with 16 RPG3 boards


Fuses: 4

Description 26 (41)

221 03-FAP 130 550 R1A Uen


7.1.6 Compact BSC and BSC/TRC cabinet

APZ/IO/GS/PCU/RPG3 Cabinet

APZ 212 33C (1 GB)APZ 212 33C

GEM

APG 40

5, 8 or 16 RPG3

(2 or 6 RPP)

Subrack with ET155-1-O, TRA R6, DLEB and clock boards.

PCU support (0, 2 or 6 RPP boards) Second subrack contains: 5, 8 or 16 RPG3 boards

APG 40 (1 GB)


Fuses: 4

7.1.7 Compact node extension cabinet (Optional)

PCU/RPG3/ET4-1 Cabinet

APZ 212 33C (1 GB)

PCU support (7 RPP boards) Second subrack contains: 6 RPG3 and/or 4 RPP boards (7 RPP)

ET4-1 (6 RPG3, 4 RPP)


Fuses: 4

Description 27 (41)

221 03-FAP 130 550 R1A Uen


7.2 Standard Floor plan for BSC R10

7.2.1 High Capacity Floor Plans

Note that there has to be at least 800mm of free space between a cabinet front or back with doors and the nearest wall.

APZ 212 33C

GEM

1800mm

800mm

Minimum aisle width required for maintenance activities

800mm

800mm

300mm Minimum clearance from walls in Earthquake Zones

1200mm 300 mm

opt RPG3Cab.

opt PCUCab.

APG40C Reserved for R11

Figure 2 Double Row floor plan

APG 40C APZ 212 33C

3600mm


800mm

400mm


1200mm 300 mm

opt RPG3Cab

opt PCUCab.

GEM Reserved for R11

Figure 3 Single Row floor plan. The Product Package generated for a single-row floor plan will contain a C-module that supports back-to-back. If single-row is requested the C-module has to be created locally.

Description 28 (41)

221 03-FAP 130 550 R1A Uen


APG 40C APZ 212 33C

3600mm


800mm

800mm


1200mm 300 mm

opt RPG3Cab

opt PCUCab.

GEM Reserved for R11

GEM APZ 212 33C

opt RPG3Cab

opt PCUCab.

APG40C Reserved for R11

800mm

Figure 4 Two BSCs back to back. BSC, BSC/TRC and TRC nodes must be configured according to one of the floor plans as indicated above. Double row is the preferred method. Cabinets and corresponding engineering related documentation will come numbered as indicated.

Description 29 (41)

221 03-FAP 130 550 R1A Uen


7.2.2 Compact Floor Plans

Note that there has to be at least 800mm of free space between a cabinet front or back with doors and the nearest wall.

APZ 212 33C

600mm

800mm


800mm

800mm


1200mm 300 mm

optionalCabinet

Figure 5 Double Row floor plan

APZ 212 33C

1200mm


800mm

400mm


1200mm 300 mm

OptionalCabinet

Figure 6 Single Row floor plan

Description 30 (41)

221 03-FAP 130 550 R1A Uen


8 Site Products

Site products contain equipment related to the installation of the Product Package. The mandatory equipment will always be delivered as part of the Base Configurations. It is then possible to add further equipment as Optional Packages.

All cabinets come with basic mechanics including doors and grounding sets. I/O comes with Alarm Panel.

All necessary documentation can be found at the CPI Store (Customer Product Information). The documents can be downloaded, ordered on CD-copies or ordered on paper. To facilitate installation, a paper version of the G-module can be ordered together with the node.

8.1 Node Related Site Products (NRSP)

Site products that are related to a specific node and that should be possible to configure, order and deliver together with the node.

For information about relevant Node Related Site Products, see Appendix B.

8.2 Site Related Site Products (SRSP)

Site products that are related to the site and common for several nodes and should be possible to configure, order and deliver separately from the nodes.

For information about relevant Site Related Site Products, see Appendix C.

8.3 Optional Spares

To support the node, either Spare Kit(s) or Spare Part Management Services can be purchased. For Spares information, please contact Local Ericsson personnel.

Description 31 (41)

221 03-FAP 130 550 R1A Uen


9 Appendix A - Environmental Characteristics

9.1 General Operating Conditions

Ericsson has reduced the environmental impact due to carbon dioxide by making low power-consuming and compact products. This makes the products lifetime more cost efficient, which means low premises rental cost and low power cost.

The BSC, BSC/TRC and TRC Product Packages works under the following operating conditions:

Climatic Environment

Normal Operating Condition

Exceptional Operating Condition

Temperature +5 to +40°C 5 to +50°C

Relative Humidity 5 to 85 % 5 to 90 %

Absolute Humidity 1 to 25 g/m3 1 to 25 g/m3

Temperature Change 0,5 °C /min 0,5 °C /min

Table 5 Operating Conditions

The system is designed to work continuously within the range of Normal Operating Condition. It will also work outside the Normal Operating Condition but inside the range of Exceptional Operating Condition but for a limited time of not more than 96 consecutive hours and not more than 15 days in a one-year period. The system is designed to remain operational when exposed to seismic vibrations corresponding to requirements in EN ETSI 300 019-2-3 and the Telcordia Generic Requirement GR-63-CORE, zone 4, any floor level

9.2 Conformity with EU Directives

Conforms with the following EU directives:

• The EMC directive, 89/336/EEC as amended.

• The Low Voltage Directive, 73/23/EEC as amended.

9.3 Electromagnetic Compatibility (EMC)

Electro-Magnetic Compatibility (EMC) is the ability of equipment to coexist with other equipment as regards their common electromagnetic environment. The EMC emission and immunity in BYB 501 hardware complies with EEC directives and ITU-T requirements for high-speed systems, which is a prerequisite for the location of switches in commercial offices. The EMC requirements are as follows:

• EN 300 386

Description 32 (41)

221 03-FAP 130 550 R1A Uen


• FCC part 15 subpart B

• CISPR 22

• CISPR 24

• The EMC shield is fulfilled on subrack level. Each circuit board must provide EMC tightness i.e. unused board positions in any subrack must be equipped with dummy boards/fronts.

9.4 Product Safety

Product Safety requirements set limits on surface temperatures, voltages, fire protection, etc. in order to ensure that the equipment does not involve any unnecessary risks for the maintenance personnel. The product safety requirements that the product complies with are as follow:

• EN 60950

• UL 60950

• CAN/CSA-C22.2 No. 950-95

• IEC 60950

9.5 Power Requirements

The node is fed from 48 Volt (V) high ohmic power supply with the following requirements on Voltage:

Normal value 48 54.5 V

Mains voltage failure or transients Minimum 40.5 V

On reloading of batteries Maximum 57.0 V

During maximum 10 seconds Maximum 60 V

Never to exceed 60 V

9.6 Dissipated heat

Dissipated heat is equal to power consumption.

Description 33 (41)

221 03-FAP 130 550 R1A Uen


10 Appendix B Node Related Site Products (NRSP)

Tables below show the valid Node Related Site Products (NRSP) that can be supplied as optional parts in the new node delivery. Included are the Commercial Product Numbers for these packages.

10.1 AXE Operation and Maintenance, O&M

AXE operation and Maintenance, O&M, equipment includes products from IO to terminal end equipment, for example LAN kit, extra alarm displays, inverter kit, WinFIOL and Tools licences.

The LAN solution for I/O O&M equipment is used as a replacement for a modem solution at an old node. The LAN solution including switch should be used when no switch (hub) is available at site. LAN solution including slave switch should be used for expanding the number of ports when a switch is available at site. LAN solution excluding switch should be used when there is enough switch capacity at site.

External Exrang enables additional external alarms from customer equipment to be connected to AXE I/O.

Connection box (Kep box) enables test instruments to be connected to AXE.

Service kit and spare part cables contain products such as, shrink tubes, jointing sleeve, sofix cables and strap boards.

Maintenance tool kit contains tools such as screwdriver, side-cutting Pliers, electric torch and wrist strap.

Cables to OSS connection includes V36 cables for point to point connection

Description

Option Product Number

Mandatory Alarm Display No option. Mandatory for APG40C

FAH 107 725/2

LAN solution including switch FAH 107 297/1

LAN solution including slave switch

FAH 107 297/2

I/O O&M Equipment

LAN solution excluding switch FAH 107 297/3

120V / 125VA FAH 107 056/1

120V / 375VA FAH 107 056/2

230V / 125 VA FAH 107 056/3

230V / 375 VA FAH 107 056/4

Inverter for 125 VA is used for printer and switch.

375 VA is used for PC

230V UK / 125 VA FAH 107 056/5

Description 34 (41)

221 03-FAP 130 550 R1A Uen


230V UK / 375 VA FAH 107 056/6

License and HW for 6.3 (SSH included)

FAH 107 413/1

FAH 107 413/5

WinFIOL and Tools

License and HW for 6.3 (SSH excluded)

FAH 107 413/3

FAH 107 413/6

External Exrang For additional alarms to I/O FAH 107 054/9

Service kit, spare part cables Simple service kit FAH 107 129/11

Maintenance toolset Simple toolset FAH 107 63/1

Cables for OSS Connection

V36 Point to Point FAH 107 313/1

For more information see Product Package Description for O&M equipment 221 03-FAN 101 179.

10.2 External Cables

Description


15M FAH 107 016/1

30M FAH 107 016/2

45M FAH 107 131/1

60M FAH 107 131/2

75M FAH 107 016/4

Coax cable 75Ω M4 Male

100M FAH 107 016/5

15M FAH 107 015/1

30M FAH 107 015/2

45M FAH 107 130/1

60M FAH 107 130/2

75M FAH 107 015/4

Coax Cable 75Ω Open End

100M FAH 107 015/5

Description


15M FAH 107 129/1 Twisted Pair Cable 120Ω Open End

30M FAH 107 129/2

Description 35 (41)

221 03-FAP 130 550 R1A Uen


45M FAH 107 129/3

60M FAH 107 129/4

75M FAH 107 129/5

100M FAH 107 129/6

30M FAH 107 298/1

60M FAH 107 298/2

Twisted Pair Cable 100Ω Open End

75M FAH 107 298/3

30M FAH 107 299/1

60M FAH 107 299/2

Twisted Pair Cable 100Ω Plenum

75M FAH 107 299/3

15M FAH 107 048/1

30M FAH 107 048/2

45M FAH 107 048/3

60M FAH 107 048/6

75M FAH 107 048/4

STM-1/OC-31 Optical Fibre Cable SC-SC

100M FAH 107 048/5

15M FAH 107 048/7

30M FAH 107 048/8

45M FAH 107 048/9

60M FAH 107 048/10

75M FAH 107 048/11

STM-1/OC-31 Optical Fibre Cable SC-FC/PC

100M FAH 107 048/12

15M FAH 107 048/13

30M FAH 107 048/14

45M FAH 107 048/15

60M FAH 107 048/16

75M FAH 107 048/17

STM-1/OC-31 Optical Fibre Cable SC-E2000

100M FAH 107 048/18

Description 36 (41)

221 03-FAP 130 550 R1A Uen


10.3 Conversion of STM-1/OC-3

All the Base Configurations are offered with protected (MSP 1+1) optical 155 Mb/s interfaces. The STM-1/OC-3 solution is superior to PDH and thus should always be used if possible.

If 2 Mb/s (E1) or 1.5 Mb/s (T1) Interfaces are required then the following conversion package can be ordered:

• STM-1 or OC-3 interfaces converted into blocks of 63 E1 or 84 T1 interfaces

If an electrical STM-1/OC-3 interface is required the following conversion package can be ordered:

• STM-1/OC-3 optical interface converted to STM-1/OC-3 electrical interface

Option pack Base 1 2 3 4 5 6 7 8 9 10 Total number of E1/T1 Interfaces No. of STM-1/OC-3 interfaces to be converted

0

0

63

1

126/168

2

189/252

3

252/336

4

315/420

5

378/ 504

6

441/588

7

504/672

8

567/756

9

630/840

10

Option Pack Commercial Product Number STM1/OC3 optical to 63 E1/84 T1 conversion / STM1/OC3 optical to STM1/OC3 electrical conversion

FAH 107 422/1

The chosen commercial object must be specified for each 155 Mb/s interface to be converted.

Example If three 155 Mb/s interfaces are to be converted, 3 x FAH 107 422/1 should be specified when ordering.

Ericsson recommends that the additional cabinet(s) required to support the conversion of the 155 Mb/s interfaces are not positioned within the node footprint, as these would lead to problems with future expansions of the node configuration.

Ericsson recommends a second row or preferable, near or next to the transmission equipment.

For further information refer to: Product Package Description for ET4-1 221 03 FAN 101 170.

It is mandatory to choose the length of the optical cable between the node and the ET4-1. One cable per protected ET4-1 system is applicable.

Description 37 (41)

221 03-FAP 130 550 R1A Uen


External Cables

Component: Option 15M: Option 30M: Option 45M: Option 60M: Option 75M: Option 100M:

Multifib. Cable 4SC-4SC

FAH 107048/1 FAH 107048/2 FAH 107048/3 FAH 107048/6 FAH 107048/4 FAH 107048/5

10.3.1 External Cables Associated with the Conversion Option

This chapter shows the external cables that must be considered when the conversion option is chosen.

External Cables

Component: Option 15M:

Option 30M:

Option 45M:

Option 60M:

Power cable Default component, delivered on drums from 10M to 70M in steps of 5M. No separate price object.

Twisted Pair 120Ω FAH 107 244/1 FAH 107 244/2 FAH 107 244/3 FAH 107 244/4

Twisted Pair 100Ω FAH 107 244/5 FAH 107 244/6 FAH 107 244/7 FAH 107 244/8

Twisted Pair 100Ω Plenum FAH 107 244/19

FAH 107 244/20

FAH 107 244/21

FAH 107 244/22

Coax Cable 75Ω Open End FAH 107 244/13

FAH 107 244/14

FAH 107 244/15

FAH 107 244/16

Electrical 155Mb cable FAH 107 317/1

FAH 107 317/2

FAH 107 317/3

FAH 107 317/4

Component: Option 15M:

Option 30M:

Option 50M:

Option 75M:

Option 100M:

Fan alarm cable, non-plenum

FAH 107 254/1

FAH 107 254/2

FAH 107 254/3

FAH 107 254/4

FAH 107 254/5

Fan alarm cable, plenum

FAH 107 316/1

FAH 107 316/2

FAH 107 316/3

FAH 107 316/4

FAH 107 316/5

For more information see Product Package Description for ET4-1.

ET155 ET4-1Optical link

PDH network

Description 38 (41)

221 03-FAP 130 550 R1A Uen


11 Appendix C Site Related Site Products (SRSP) supporting BSC, BSC/TRC and TRC R10

The SRSP does not relate to a specific node but is common for several nodes on the same site. SRSP are included in separate product packages and should also be configured, ordered, delivered and priced separately.

11.1.1 Power Supply

Power systems are available for high-ohmic distribution (HOD) and low-ohmic distribution (LOD) for applications up to 60 kW. For applications up to 15 kW the power system can be earthquake reinforced with batteries included in the cabinet.

For more information see Product Package Description for ACTURA power up to 60 kW (221 03-FAN 101 172) or Small Power up to 15 kW (221 03-FAN 101 173).

11.1.2 Power Distribution

The Power Distribution is a supplementary system for high-ohmic distribution of 48V DC power. The system is intended for use in applications where a power plant with low-ohmic distribution provides DC power to critical equipment, such as AXE equipment.

For more information see Product Package Description for Power Distribution Unit (221 03-FAN 101 174) or Power Distribution Frame (221 03-FAN 101 175).

11.1.3 AXE Operation and Maintenance (AXE O&M)

AXE Operation and Maintenance, O&M, equipment includes products from IO to terminal end equipment, for example LAN kit, extra alarm displays, inverter kit, WinFIOL and tools licences.

The AXE O&M shall primarily be ordered together with the node, but the content can also be supplied in this separate product package as extension to new nodes or previous ordered nodes.

For more information see Product Package Description for AXE O&M equipment (221 03-FAN 101 179)

11.2 Mobile PBN The Mobile PBN design describes inter-site backbone connectivity and intra-site connectivity design for all Core Network CS and PS nodes, MSCs, GSNs, MGws, etc. M-PBN also includes the connectivity of these nodes to internal and external networks; GSM-GPRS and UMTS access networks, O&M network, ISPs, PSTN, ISDN, Service Network etc.

For more information please refer to the Solution Status Information Card (SISC) for Mobile PBN.

Description 39 (41)

221 03-FAP 130 550 R1A Uen


11.2.1 Distribution Frames (DF)

The DF product package consists of Digital DF (DDF), Optical DF (ODF), Flexfield and Main DF (MDF).

The Digital Distribution Frame (DDF) is the interface to be used when twisted pair or coaxial cables have to be terminated, organised or cross-connected in long-distance transport networks or in access networks. The DDF product package is housed in BYB 501 cabinets and includes cables to connect E1 and T1 to external equipment.

The Optical Distribution Frame (ODF) is the interface between the transmission equipment and the optical network. The main function is to organise and terminate fibre at this point. The ODF product package is housed in BYB 501 cabinets or in a wall-mounted cabinet and includes cables for optical connection to external equipment.

Flexfield is a modular system built on separate modules housed in sub racks. The sub racks can be mounted in 19 racks, as well as on walls. All termination points are accessible from the front. Due to its modularity, it is possible to have a mix of coaxial and twisted pair cable interfaces, as well as optical interfaces, in the same sub rack. The primary usage and the most cost effective usage of Flexfield is in cases where it is required to terminate low and medium number of optical or electrical, or mixed optical and electrical cables.

The Main Distribution Frame (MDF) connects the exchange with the copper pair cables of the outdoor network. The MDF in the DF product package is housed in BAB 326 for max 1590 lines per cabinet or BYB 501 for max 1050 lines per cabinet. The BYB 501 is an earthquake proof design.

For more information see Product Package Description for Distribution Frames (221 03-FAN 101 176).

11.2.2 Raised Floor

Usage of raised floor is generally recommended by Ericsson and must be used when under floor cabling is chosen. The product package for raised floor is available in standard heights and the floor plates are pre-holed for BYB 501 cabinets.

For more information see Product Package Description for Raised Floor and Mechanics (221 03-FAN 101 177).

11.2.3 External Mechanics

External mechanics are used for cabling between the node and other site elements. The mechanics are available for under floor and overhead cabling.

For more information see Product Package Description for Raised Floor and Mechanics (221 03-FAN 101 177).

Description 40 (41)

221 03-FAP 130 550 R1A Uen


11.2.4 Earthquake Reinforcements

The product package for earthquake reinforcement contains earthquake frames with mounting set for raised floor or mounting set for concrete floor. The reinforcement is available in the same standard heights as for raised floor.

For more information see Product Package Description for Raised Floor and Mechanics (221 03-FAN 101 177)

11.2.5 GPS Synchronisation Clock

The GPS Synchronisation Clock works as a primary reference clock and provides Network Synchronisation and Time of Day. The GPS Synchronisation Clock product package is housed in a BYB 501 cabinet and includes a GPS antenna.

For more information see Product Package Description for Network Synchronisation (221 03-FAN 101 178).

11.2.6 DataCom cabinet

The DataCom cabinet is based on BYB 501 building practise. The double deep BYB 501 cabinet is adjusted to have more space for DataCom equipment that requires side-to-side airflow.

For more information see Product Package Description for DataCom Cabinet (221 03-FAN 101 180).

Description 41 (41)

221 03-FAP 130 550 R1A Uen


12 Appendix D Terminology

ANSI AMERICAN NATIONAL STANDARDS INSTITUTE

BAS1 ONE OF THE GENERAL BSC TRAFFIC MODELS

BSC BASE STATION CONTROLLER

BTS BASE TRANSCEIVER STATION

BYB BUILDING PRACTICE

C7 COMMON CHANNEL SIGNALLING (CCITT NO. 7)

CS CODING SCHEME

DDF DIGITAL DISTRIBUTION FRAME

ETC EXCHANGE TERMINAL CIRCUIT

ET155 EXCHANGE TERMINAL 155 MBIT/S SDH TERMINATION

ETSI EUROPEAN TELECOMMUNICATIONS STANDARDS INSTITUTE

GA GENERAL AVAILABILITY

GEM GENERIC ERICSSON MAGAZINE

GOS GRADE OF SERVICE (PERCENTAGE OF CALLS THAT ARE

BLOCKED DUE TO CONGESTION)

GPRS GENERAL PACKET RADIO SERVICES GS GROUP SWITCH

GSM GLOBAL SYSTEM FOR MOBILE COMMUNICATION

HSCSD HIGH SPEED CIRCUIT SWITCHED DATA

HSL HIGH SPEED SIGNALLING LINK

IE INSTALLATION ENGINEERING

LMU LOCATION MEASUREMENT UNIT

ODF OPTICAL DISTRIBUTION FRAME

PCU PACKET CONTROL UNIT

PPD PRODUCT PACKAGE DESCRIPTION

RBS RADIO BASE STATION

RPG REGIONAL PROCESSOR GS INTERFACE

RPP REGIONAL PROCESSOR POWER PC

RTED REAL TIME EVENT DATA

RTU RIGHT TO USE

SDH SYNCHRONOUS DIGITAL HIERARCHY

SMPC SERVING MOBILE POSITIONING CENTER

SRS SUBRATE SWITCH

SS7 SIGNALLING SYSTEM NO.7 (ANSI)

TRA TRANSCODER & RATE ADAPTER

TRC TRANSCODER & RATE ADAPTER CONTROLLER

TRH TRANSCEIVER HANDLER

TRX TRANSCEIVER

BSS R10 PPD

Documents

Transcript of BSS R10 PPD