Bosch IMU in iPhone X - System Plus Consulting€¦ · Bosch IMU in iPhone X IMU Sensor MEMS report...

©2018 by System Plus Consulting | IMU Bosch in iPhone X 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Bosch IMU in iPhone XIMU SensorMEMS report by Audrey LAHRACHJanuary 2018


Table of Contents

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 6

o Bosch Sensortec

o Apple iPhone X, iPhone 8, and Watch Series 3 Teardown

Physical Analysis 16

o Synthesis of the Physical Analysis 17

o Package 19

View & Dimensions

Opening

Wire Bonding Process

Cross-Section

o ASIC Die 32

ASIC Die View & Dimensions

ASIC Delayering & Main Blocs

ASIC Die Process

ASIC Die Cross-Section

ASIC Die Process Characteristic

o MEMS Accelerometer Die 47

MEMS Die View & Dimensions

MEMS Die Cross-Section

MEMS Accelerometer Process

MEMS Accelerometer Characteristics

o MEMS Gyroscope Die 83

MEMS Die View & Dimensions

MEMS Die Cross-Section

MEMS Gyroscope Process

MEMS Gyroscope Characteristics

o Physical Comparison 115

Bosch IMU Sensor Evolution

Comparison with InvenSense and STMicroelectronics’ 6-Axis IMUs

Sensor Manufacturing Process 118

o ASIC Die Front-End Process & Fabrication Unit

o MEMS Accelerometer Process & Fabrication Unit

o MEMS Gyroscope Process & Fabrication Unit

o Final Test & Packaging Fabrication unit

Cost Analysis 142

o Synthesis of the cost analysis 143

o Yields Explanation & Hypotheses 145

o ASIC Component 147

Die Front-End Cost/Probe Test, Thinning & Dicing

ASIC Component Cost

o MEMS Accelerometer Die 151


Sensor Die Cost

o MEMS Gyroscope Die 159


Sensor Die Cost

o LGA Packaged Component 167

LGA Packaging Cost

Back End: Final Test

Component Cost

Selling Price 172

Company services 177


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Bosch Accelerometer.

This new Bosch Sensortec component is likely a custom 6-axis IMU made specifically for Apple. It is exactly the samecomponent found inside the iPhone 8, iPhone X, and Apple Watch Series 3. One major improvement is the incredibly thinprofile achieved by Bosch, with a total thickness of only 0.6mm compared to 0.9mm for the industry standard. This thicknesswas probably an Apple request in order to fit with the small form factor of the Apple Watch Series 3’s cellular functionality. Toachieve this low profile, Bosch changed the packaging structure used for its preceding product, the BMI160.

On the design side, Bosch Sensortec made significant changes - particularly for the accelerometer, where the old single-massstructure was abandoned for a new structure achieving better sensing properties. The micromachining manufacturing process,unchanged by Bosch Sensortec for many years, was also revised, with a new process for both accelerometer and gyroscope.Finally, a new ASIC die was designed to fuse the data from the accelerometer and gyroscope, and probably to deliver evenlower current consumption and other functionalities.

This report includes a detailed physical analysis, with process description and manufacturing cost analysis. A completecomparison with Bosch Sensortec’s BMI160 is also provided, along with a comparison with InvenSense and STMicroelectronics’latest 6-axis IMUs.


Overview / Introduction


Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison


Cost Analysis


About System Plus

iPhone X Teardown

iPhone X Main Board (Front Side) (2 PCB Assembled)©2018 by System Plus Consulting

iPhone X Main Board (Disassembly)©2018 by System Plus Consulting

1

2

IMU 6-Axis Bosch©2018 by System Plus Consulting






Cost Analysis


About System Plus

Package Views & Dimensions

Package:

o Type: 16-pin LGA

o Dimensions: 3.0 x 3.0 x 0.6mm

o Pitch: 0.5mm

Package Top View (Watch 3, iPhone 8, iPhone X)©2018 by System Plus Consulting

Package Side View©2018 by System Plus Consulting

Package Bottom View©2018 by System Plus Consulting

3.0

mm

3.0 mm

0.6

mm

Marking: (Watch 3) (iPhone 8) (iPhone X)

.FY .FY .FY

LEH LEF LEE

E3E ETJ EEX






Cost Analysis


About System Plus

Package Opening

Package Opening Overview – SEM View©2018 by System Plus Consulting

o Wire Bonding number: xx

o Material: xxxxx

o Diameter: xxµm

o Wire Bonding number: xx (xxxx)

Bonding nb between ASIC & Package: xx

Bonding nb between ASIC & MEMS Gyro xx

Bonding nb between ASIC & MEMS Accelero xx






Cost Analysis


About System Plus

Package Cross-Section – Accelerometer Overview

Cross-Section Plane

Package total thickness: xxx mm

o Package Molding thickness above MEMS: xxxx mm

o MEMS Accelerometer thickness (with adhesive): xxxx mm

o ASIC thickness (with adhesive): xxxx mm

o PCB Substrate thickness: xxxx mm

Wire Bonding

Package Cross-Section Overview – SEM View©2018 by System Plus Consulting

MEMS(Accelerometer sensor)

ASIC

xxxµm

PCB Substrate (xxx)






Cost Analysis


About System Plus

xxxmm

ASIC View & Dimensions

ASIC Die Overview - Optical View©2018 by System Plus Consulting

o Pad number: xx

o Connected: xx

o Die Area: xxx mm²(xxx x xxxmm)

o Nb of PGDW per x-inch wafer: xxxxxxm

m






Cost Analysis


About System Plus

ASIC Process – Technology Node

o The process uses CMOS transistors

o MOS transistor gate length: xxxµm

o Technology node: xxxµm

MOS Gate Length Measurement - SEM View©2018 by System Plus Consulting

CMOS Transistors - SEM View©2018 by System Plus Consulting

xxxµm

ASIC Die Main Blocks©2018 by System Plus Consulting






Cost Analysis


About System Plus

MEMS Accelerometer View & Dimensions

xxxm

m

xxxmm

MEMS Die Overview – Optical View©2018 by System Plus Consulting

o Die Area: xxxmm²(xxx x xxxmm)

o Nb of PGDW per x-inch wafer: xxxxx

o Pad number: x- Connected: x






Cost Analysis


About System Plus

MEMS Accelerometer Cap Removed

Cap Removed – Optical View©2018 by System Plus Consulting

MEMS Cap






Cost Analysis


About System Plus

MEMS Accelerometer Sensing Area

MEMS Sensing Area – Overview©2018 by System Plus Consulting

Proof mass

Movable Electrodes

Fixed Electrode

Movable Electrodes

Fixed Electrode

Proof mass

MEMS Sensing Area Details – Overview©2018 by System Plus Consulting

MEMS Sensing Area Details – Overview©2018 by System Plus Consulting






Cost Analysis


About System Plus

MEMS Gyroscope View & Dimensions

xxxm

m

xxxmm

MEMS Die Overview – Optical View©2018 by System Plus Consulting

o Die Area: xxxmm²(xxx x xxxmm)

o Nb of PGDW per x-inch wafer: xxxx

o Pad number: xx- Connected: xx






Cost Analysis


About System Plus

MEMS Gyroscope Cap Removed

Cap Removed – SEM View©2018 by System Plus Consulting

MEMS SensorMEMS Cap

Cavity






Cost Analysis


About System Plus

MEMS Gyroscope Cross-Section

MEMS Cap Cross-Section Overview – Optical View©2018 by System Plus Consulting

MEMS Cap

Xxxx

Cavity

MEMS Sensor

xxxµm

MEMS Cross-Section Overview©2018 by System Plus Consulting

xxxxxxxx

The sealant between MEMS cap andsensor is an xxxxxxx.

xxxxxxx




Physical Analysis

Manufacturing Process Flowo Overviewo ASIC Processo MEMS Accelero Processo MEMS Gyro Processo Packaging Process

Cost Analysis


About System Plus

MEMS Accelerometer – Sensor Process Flow (1/3)




Physical Analysis


Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Accelero Die Costo MEMS Gyro Die Costo Packaging Costo Back-end Costo Component Cost


About System Plus

ASIC Front-End Cost

• The unprobed wafer cost is estimated at $xxx for mediumyield hypothesis.

• The main part of the wafer cost is due to the xxxxx with xx%.




Physical Analysis




About System Plus

ASIC Die Cost

• The number of good dies per wafer is estimated toranges from xxxx to xxxx according to yield variations,which results in a die cost of $xxxx for medium yield.

Cost Breakdown Cost Breakdown Cost Breakdown

Low Yield Medium Yield High Yield




Physical Analysis




About System Plus

MEMS Accelerometer FE Cost per Process Steps (MEMS Sensor 1/2)




Physical Analysis




About System Plus

MEMS Accelerometer Die Cost

The number of good dies per wafer is estimated to rangesfrom xxxxx to xxxxx according to yield variations, whichresults in a die cost ranging from $xxxx to $xxxx accordingto yield variations.






Physical Analysis




About System Plus

MEMS Gyroscope Front-End Cost

The front-end cost for the MEMS Gyroscope ranges from $xxxto $xxx according to yield variations.

The largest portion of the manufacturing cost is due to thexxxxxx at xx%.




Physical Analysis




About System Plus

MEMS Gyroscope Die Cost

The number of good dies per wafer is estimated to rangesfrom xxxx to xxxx according to yield variations, whichresults in a die cost ranging from $xxxx to $xxx accordingto yield variations.






Physical Analysis




About System Plus

Package Cost

The packaging cost is estimated to $xxxx accordingto yield variations.

The largest portion of the manufacturing cost isdue to xxxxxxx cost at xx%.




Physical Analysis




About System Plus

Bosch IMU Component Cost

The component cost ranges from $xxx to $xxx according to yieldvariations.

The ASIC die manufacturing represents xx% of the module cost.

The MEMS Accelerometer die represents xx% of the module cost.

The MEMS Gyroscope die represents xx% of the module cost.

The package assembly represent xx% of the module cost.

Final test and yield losses account for xx% of the module cost.




Physical Analysis


Cost Analysis

Selling Price Analysiso Definitions of Priceo Manufacturer Financial

Ratioso Manufacturer Price

About System Plus

Bosch IMU Estimated Selling Price Evolution

• We estimate that Bosch Sensortecrealizes a gross margin of xx% on thecomponent, which results in a finalcomponent price ranging from $xxxx to$xxxx.

• This corresponds to the selling price forlarge volume to OEMs.

Low Yield Medium YieldHigh Yield #REF! #REF!


Component cost $0.544 $0.534 $0.525

Bosch Gross Profit $0.362 +40% $0.356 +40% $0.350 +40%

Component price $0.906 $0.891 $0.876





Physical Analysis


Cost Analysis


About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

MEMS & SENSORS• Status of the MEMS Industry 2017• MEMS Packaging 2017

MEMS & SENSORS• InvenSense ICM-20789• MEMS Packaging: Reverse Technology Review• STMicroelectronics LSM6DSM 6-Axis IMU• InvenSense 6-Axis OIS IMU• InvenSense ICM-30630 6-Axis Sensor Hub• Bosch Sensortec BMF055 9-Axis Sensor Hub• Fairchild FIS1100• STMicroelectronics LSM6DS3 6-Axis IMU• Bosch Sensortec BMI160 6-Axis IMU

https://www.i-micronews.com/category-listing/product/the-status-of-the-mems-industry-2017.html

https://www.i-micronews.com/category-listing/product/mems-packaging-2017.html

http://www.systemplus.fr/fr/reverse-costing-reports/invensense-icm20789-6-axis-motion-sensor-and-pressure-sensor-combo/

http://www.systemplus.fr/fr/reverse-costing-reports/mems-packaging-reverse-technology-review/

http://www.systemplus.fr/fr/reverse-costing-reports/6-axis-ois-imus-invensense-imu-in-iphone-7-plus-and-stmicroelectronics-lsm6dsm/

http://www.systemplus.fr/fr/reverse-costing-reports/invensense-mp67b-2/

http://www.systemplus.fr/fr/reverse-costing-reports/invensense-icm-30630/

http://www.systemplus.fr/fr/reverse-costing-reports/bosch-sensortec-bmf055/

http://www.systemplus.fr/fr/reverse-costing-reports/fairchild-fis1100/

http://www.systemplus.fr/fr/reverse-costing-reports/stmicroelectronics-lsm6ds3-6-axis-imu/

http://www.systemplus.fr/fr/reverse-costing-reports/bosch-sensortec-bmi160/








COMPANYSERVICES




Physical Analysis


Cost Analysis



Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis


Cost Analysis



Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve LAFERRIEREPhoenixUSA(310) [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

KOREAYOLE

ORDER FORM

Performed by

DELIVERY on receipt of payment:

By credit card:Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__|

Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__|

By bank transfer:HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain FranceBIC code: CCFRFRPP

In EURBank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439

In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797

Return order by: FAX: +33 2 53 55 10 59MAIL: SYSTEM PLUS CONSULTING

21 rue La Nouë Bras de Fer44200 Nantes – France

Contact: EMAIL: [email protected]: +33 2 40 18 09 16

BILLING CONTACT

ABOUT SYSTEM PLUS CONSULTING

Name (Mr/Ms/Dr/Pr):......................................................................................Job Title:......................................................................................Company:......................................................................................Address:......................................................................................City: State:......................................................................................Postcode/Zip:......................................................................................Country:......................................................................................VAT ID Number for EU members: ......................................................................................Tel:......................................................................................Email:.....................................................................................

Date:.......................................................................................Signature:......................................................................................

First Name: ..................................................................Last Name: ...................................................................Email:............................................................................Phone:...........................................................................

SHIP TO PAYMENT

Please process my order for “Bosch’s 6-Axis IMU in the Apple iPhone X” Report

Full Reverse Costing report: EUR 3,490*

Annual Subscription (including this report as the first of the year):

System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling price of a product is available.

Our services:

TECHNOLOGY ANALYSIS - COSTING SERVICES - COSTING TOOLS - TRAININGS

www.systemplus.fr - [email protected]

o 3 reports EUR 8 400*o 5 reports EUR 12 500*

o 7 reports EUR 16 000*o 10 reports EUR 21 000*o 15 reports EUR 27 500*

*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT

*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: January 2018

Ref.: SP18382

http://www.systemplus.fr/

mailto:[email protected]

http://www.systemplus.fr/

TERMS AND CONDITIONS OF SALES

1.INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System Plus Consultingexcept in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.

2.PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros and workedout without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will be charged onthese initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the company commitsitself in invoicing at the prices in force on the date the order is placed.

3.REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted according to thenumber of orders placed by the Buyer, or other specific conditions. No discount is granted in case of early payment.

4.TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in the case of aparticular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting a penaltyfor late payment the amount of which is three times the legal interest rate. The legal interest rate is the current one on thedelivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoice deadline. This penalty issent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the totalinvoice amount when placing his order.

5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.

6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed. Consequentlyany reasonable delay in the delivery of services will not allow the buyer to claim for damages or to cancel the order.

7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when the shipment takesplace. Without any specific requirement, insurance terms for the return of goods will be the carrier current ones(reimbursement based on good weight instead of the real value).

8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties described inthe current terms and conditions if these are the result of a force majeure case. Therefore, the force majeure includes allexternal event unpredictable and irresistible as defined by the article 1148 of the French Code Civil?

9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.

10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect damage,financial or otherwise, that may result from the use of the results of our analysis or results obtained using one of our costingtools.

11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.

Performed by

Bosch IMU in iPhone X - System Plus Consulting€¦ · Bosch IMU in iPhone X IMU Sensor MEMS report...

Documents

Transcript of Bosch IMU in iPhone X - System Plus Consulting€¦ · Bosch IMU in iPhone X IMU Sensor MEMS report...