Bonn Module Testing Plans - RD53A Testing Meeting€¦ · 10.02.20 [email protected] 16...

[email protected]

*

Bonn Module Testing Plans

RD53A Testing Meeting

M. Frohne*, F. Hinterkeuser,M. Daas, M. Hamer, F. Hügging, H. Krüger

10.02.20 [email protected] 2

Outline

● Module readout with BDAQ53– Multi-chip (single module) readout– Multi-module readout

● Test setups & experience– Dual-chip modules [Hybridization M/S]– Quad-chip modules [RD53A/ITkPix QC]– SP Quad-chip modules [Serial Powering Tests]

[email protected]

Module readout with BDAQ53


Multi-chip readout with BDAQ53

● So far:Readout one RD53A chip onsingle-chip card (SCC)in four-lane mode

● Could use BDAQ readout boardwith up to 7 Aurora lanes



● So far:Readout one RD53A chip onsingle-chip card (SCC)in four-lane mode

● Could use BDAQ readout boardwith up to 7 Aurora lanes



● Multi-chip firmware/software implemented in BDAQ53(not released, module_support branch)

● Working multi-chip readout@ 1.28 Gbps– Up to four SCCs @ 1-lane– One quad-chip module @ 1-lane

● 4-lane readout of one chip stillpossible with different firmware


Multi-module readout with BDAQ53

● Multi-module readout not possible with BDAQ board– Only 7 MGTs on KX2 FPGA board– Limited amount of DP connectors

● Different plans for different module types– M/S dual modules:

● 4 BDAQ boards– SP quad modules:

● Readout one module with BDAQ board● Switch between modules via cross-point switch on end-of-stave card

– Common ITkPix quad modules:● New revision of BDAQ board, built-in cross-point switches


Multi-module readout – Duals


Multi-module readout – SP quads


Multi-module readout – common quads

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Test setups


Dual-chip modules

● Produce O(200) dual-chip modulesfor hybridization M/S

● Flex with two Samtec connectorsfor LV / HV / CMD / 2*RX / HitOr

● Accessible via „flex adapter“● Testing:

4 modules → 4 BDAQ boards● Glued to square aluminum plate,

fits FE-I4 cooling block


Dual-chip modules – Testbox


Dual-chip modules – Testbox

● Wooden box with removable top cover

● Filled with insulating foam and lead shielding

● Flooded with nitrogen● Cooling block for 4 duals● Chiller: Julabo FP-50● Temperature tests pending


Dual-chip modules – First tests

● Have two digital dual modules readout testing● Sucessfully tested first module last year (@ 640 Mbps)

→ In principle everything was working● No communication possible with first module anymore

– Some SMD solder joints/pads on flex are broken, could not re-solder– One chip seems broken

● Also issues with second digital module (fixed impedance adapter)– Could talk to only one chip, readout o.k., tuning o.k. (@ 640Mbps)– No Aurora sync @ 1.28Gbps– Same problem with broken solder joints (hand-soldered!)– Samtech connectors unreliable, Aurora/CMD sometimes passes with pressure only

● Other issues– Flex connectors very tight fitting, hard to unplug


Quad-chip modules (common hybrid)

● Will build testbox similar to the dual module testbox– Choose cooling, shielding, insulation based on

experience with dual module setup● Should fit 8 quad modules

– Two separate cooling blocks à 4 modules,recess with shape of module carrier

– One source mount per cooling block● Box wall openings on each side for LV / HV / pigtails● One readout board & multi-module stave adapter per block,

both to be developed


Quad-chip modules (serial powering)

● Bonn serial powering prototype will feature up to 8 RD53 quad modulesper local support

– Flex and services designed by Hans– For now only digital modules (without sensor)

● Goal of this prototype: Investigate the electrical behaviour of RD53A based modulesin a serial powering chain

– Need to provide additional test points not needed for the final detector● Stave readout using BDAQ53

Type-0 services

Cooling jigDigital quad To EoS-cardSense contacts, test points


Quad-chip modules (serial powering)

● Quad modules on dedicated module flexes– 3 layer flex with ~10 cm pigtail,

2 links / FE (only 1 link used on type-0)● Provide additional testpoints:

sense lines, Shunt-LDO reference circuit (VRext)

Digital quad module on assembly tooling after wirebonding

19

https://indico.cern.ch/event/838117/contributions/3525272/attachments/1891744/3119931/08082019_itkpixmodules_mhamer.pdfhttps://indico.cern.ch/event/838117/contributions/3525272/attachments/1891744/3122815/Addendum_-_Power_Simulation_of_Flex.pdf

M. Hamer

Voltage drop simulation for SP quad flex(Iin = 6A)- ~ 30 mV over

flex body- ~ 125 mV

including pigtail

VINmainly bottom layer

Voltage drop

https://indico.cern.ch/event/838117/contributions/3525272/attachments/1891744/3119931/08082019_itkpixmodules_mhamer.pdfhttps://indico.cern.ch/event/838117/contributions/3525272/attachments/1891744/3119931/08082019_itkpixmodules_mhamer.pdfhttps://indico.cern.ch/event/838117/contributions/3525272/attachments/1891744/3119931/08082019_itkpixmodules_mhamer.pdfhttps://indico.cern.ch/event/838117/contributions/3525272/attachments/1891744/3122815/Addendum_-_Power_Simulation_of_Flex.pdfhttps://indico.cern.ch/event/838117/contributions/3525272/attachments/1891744/3122815/Addendum_-_Power_Simulation_of_Flex.pdfhttps://indico.cern.ch/event/838117/contributions/3525272/attachments/1891744/3122815/Addendum_-_Power_Simulation_of_Flex.pdf


Current status

● First digital module assembled,wirebonded and integrated on structure,electrical testing ongoing

– Chips for more modules available,but assembly currently halted

● Showstopper (bug) in EoS-Card delayed stave commissioning– Hardware fix successfully applied, EoS-Card now operational

● Communication with module not yet successful● Module input IV curve looks ok, but slope higher than expected:

– FE2: current through Rext,A ~ factor 10 too small,looks like high-ohmic SLDO failure

– Likely caused by an accidental short during testing/debugging● Debugging of setup and remaining 3 FEs still ongoing

Expected from wafer probing data:Reff = 0.103 OhmVofs = 0.95 V

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Thank you!

[email protected]

[email protected]

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Backup


Serial powering

● Type-0 PCB provides power supply and data routing● Module slots can be shorted / bypassed as needed● Modules placed on Al-stave fixed to a cooling structure

– Rather easily assembled, accessed and maintained

Type-0 services

Cooling jigDigital quad To EoS-cardSense contacts, test points

Digital quad module on local support connected to type-0 services

Type-0 services

Sense contacts, test points


Serial powering

● End-of-Structure (EoS) card provides interface to the DAQ system● Two crosspoint switches (XPTs) for up-/downlinks● XPTs and GPIO configured via I2C

– I2C backend included in BDAQ firmware

Type-0 services

GPIOs

XPT

HV configuration

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Bonn Module Testing Plans - RD53A Testing Meeting€¦ · 10.02.20 [email protected] 16...

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