INTRODUCTION TO IC ASSEMBLY AND

PACKAGING PROCESS

By EZAD RAZIF B AHMAT ROZALI

LEARNING OUTCOMES

• Explain the importance of IC assembly and packaging process

• Identify some of the IC packages

• State some of factors considered in today’s trend of packaging

INTRODUCTION

• IC assembly is the most important first step in the use of an IC which will go through a number of process steps before it can be used in an electronic system.

• Nowadays, assembly process is working towards developing smaller, cheaper, more reliable and more environment-friendly packages.

WHAT IS IC ASSEMBLY

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WHAT is IC ASSEMBLY???

• The 1st process step after wafer fabrication & test

• IC assembly is defined as the process of electrically connecting I/O bond pads on the IC to the corresponding bond pads on the package.

WHAT is IC ASSEMBLY???

• Three interfaces:(1) Metallurgical bond pad interface on the IC

(2) Metallurgical bond pad interface on the package

(3) Electrical interconnection between these two interfaces

PURPOSE of IC ASSEMBLY

• Enable an IC to be electrically interconnected to the package, and to allow that IC to be handled, tested and “burnt-in” to guarantee the quality of the IC.

• PRIMARY purpose – enable ICs to be interconnected with rest of the system;cell phone, computer, industrial controller..

PURPOSE of IC ASSEMBLY

• 3 Primary functions of IC assembly:i. To provide signal and power distribution of the

packaged IC to the system.

ii. To provide mechanical support and robustness to fragile IC

iii. To provide environmental protection of the IC

IC ASSEMBLY and PACKAGING PROCESS

IC PACKAGES

TRENDS in PACKAGING• 1st Generation – LEADFRAME packaging

• 2nd Generation – Wirebond Ball Grid Array(BGA)

• 3rd Generation – Flip Chip and 3D SiPs

• 4th Generation – Combine with wireless, optical and MEM devices

Future trends are focus on smaller, reliable, higher thermal dissipation capability and environment friendly packaging

Find the picture of

all trends???

UNIT 2IC ASSEMBLY

PROCESS FLOW

IC ASSEMBLY PROCESS FLOW