The information contained herein is, as far as we are aware, true and accurate. However, no representations or warranties, either express or implied, whether of merchantable quality, fitness for any particular purpose or of any other nature are hereby made in respect of the information contained in this presentation or the product or products which are the subject of it. In providing this material, no license or other rights, whether express or implied, are given with respect to any existing or pending patent, patent application, trademarks, or other intellectual property right.

AZ® 15nXT (450 CPS) Photoresist

Negative Acting Thick Resist for Cu RDL, TSV, and other plating & etch applications

Lithographic and Plating Performance Comparison at 10 µm FT on Cu wafers

January 2009

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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MEMS /Ink Jet

FT: >30 µm

Lift-off TSV / EtchImplant, Plating

Copper/UBMPlating

Gold Plating Solder /Metal Plating

FT: 2-10 µm FT: 3-15 µm FT: 5-30 µm FT: 10-30 µm FT: >30 µm

DUVTFRH/ImplantFT: 3 - 8 µm

AZ’s Thick Film Photoresist Roadmap

<<------------------ AZAZ® EXP 100 EXP 100 ---------------->>

Materials under development

AZ® LExp 600

<---AZ® 12XT Series--->

<------------------------- AZ® 125nXT Series ------------------------->Materials in sampling(all products)

Commercialized materials

AZ® nLOFSeries

<------------------------- P4620 ----------------------->

AZ® N4000

AZ® TX 1311AZ® VS-01HJ<------------ AZ® 9200 ------------> AZ®

PLP30/PLP40

<------------ AZ® 50XT ---------->

<---AZ® 15nXT--->

<---------AZ® 40XT-11D-------->

<------------ AZ® 10XT ------------>

AZ® TXVS-02HJ

AZ® 4562

Red=Neg, Blue =Pos; nLOF, N4000, 5nXT/15nXT, 12XT, 40XT = chemically amplified; 125nXT = photopolymer; 10XT, 9200, P4620, PLP, 50XT, 4500 = DNQ

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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Through-Silicon-Via (TSV)Advantages to Use a Negative Photoresist

Coat positivepositive photoresist

Expose

Develop

Coat negativenegative photoresist

Expose

Develop

Unexposed resist remains in via due to insufficient exposure;Overdevelopmentdoes not clean via

Insufficiently exposedresist remains in via;Large overexposuremay solubilize resist

No exposure neededto solubilize resist

in via

Insoluble resistfills via

Soluble resistfills via

Clean viafor seed layer

or plating

Drill/etch hole

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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Chemically Amplified Negative Resist

The original photo-event generates a catalyst for crosslinking (typically a proton). The photo-event is amplified by the number of cycles each proton catalyzes.

Fragmentshν

H+

H+Autocatalytic Generation

PAG

Soluble polymer & X-linker InsolublePEB

[Δ]

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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AZ® 15nXT (450 CPS)Process Conditions

Substrate: Si wafer for photospeed testingCu wafer for images

Film Thickness: 10µm by single coat

Softbake: 110°C / 180 seconds

Exposure tool: ASML (i-line)Dose = 400 ± 50 mJ/cm2; Focus: 1 ± 0.5 µm

PEB: 120°C / 60 seconds

Develop: AZ 300 MIF (2.38% TMAH); 3 x 50 second puddles

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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AZ® 15nXT (450 CPS) Optical Parameters

n & k Values at different wavelength

365 nm: n = 1.6807 k = 0.0027633 nm: n = 1.6063 k = 0.0034

Cauchy coefficients (A, B, C) fit the following Cauchy equation: n = A + B/λ2 + C/λ4

A = 1.5754B = 0.013242 μm2

C = 0 μm4

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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4

6

8

10

12

14

16

18

20

22

24

500 1000 1500 2000 2500 3000 3500 4000 4500

Casting Speed (RPM)

Film

Thi

ckne

ss ( μ

m)

Opti-Trak Coat and BakeHand dispense on 150 mm siliconSpin 1000-4000 rpm for 30 secSB: 110°C/ 3 minutes

AZ® 15nXT (450 CPS)Spin Speed Curve

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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AZ® 15nXT (115 CPS) and AZ® 15nXT (450 CPS)Spin Speed Curves

Opti-Trak Coat and BakeHand dispense on 150 mm siliconSpin 1000-4000 rpm for 30 secSB: 110°C/ 3 min for 15nXT 110oC/2 min for 5nXT

0

2

4

6

8

10

12

14

16

18

500 1000 1500 2000 2500 3000 3500 4000 4500

Casting Speed (RPM)

Film

Thi

ckne

ss ( μ

m)

AZ® 15nXT (450 CPS)AZ® 15nXT (115 CPS)

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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0.0 μm

0.5 μm

1.0 μm

1.5 μm

2.0 μm

2.5 μm

10µm 5µmAZ® 15nXT (450 CPS)Depth of Focus

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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3.6 µm

10 µm 4.5 µm5 µm

4 µm3.4 µm

400 mJ/cm2, F = 1 µm

AZ® 15nXT (450 CPS)Linearity, Resolution

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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300 mJ/cm2 350 mJ/cm2

400 mJ/cm2

450 mJ/cm2500 mJ/cm2550 mJ/cm2

250 mJ/cm2

Film Thickness: 10μmOpti Track Coat and BakeSB: 110°C/3 minutesASML i-Line Stepper, F= +1.0μmOpti Track PEB/DevelopPEB: 120°C/ 60 SecondsAZ 300 MIF/ 3x50sec Spray/Puddle @23°C

AZ® 15nXT (450 CPS) - Exposure LatitudeFT = 10 μm, Focus = 1.0 μm, 5.0 μm L/S on Cu Wafers

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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4

4.5

5

5.5

6

150 175 200 225 250 275 300 325 350 375 400 425 450 475 500Exposure Dose (mJ/cm2)

Mea

sure

d Li

ne W

idth

(µm

)

AZ® 15nXT (450 CPS) - Exposure LatitudeFT = 10 μm, Focus = 1.0 μm, 5.0 μm L/S on Cu Wafers

Film Thickness: 10μmOpti Track Coat and BakeSB: 110°C/3 minutesASML i-Line Stepper, F= +1.0μmOpti Track PEB/DevelopPEB: 120°C/ 60 SecondsAZ 300 MIF/ 3x50sec Spray/Puddle @23°C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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AZ® 15nXT (450 CPS)L/S Linearity @ 300 mJ/cm2, F = +1.0 μm

0.00.51.01.52.02.53.03.54.04.55.05.56.06.57.07.58.08.59.09.5

10.0

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10

Nominal CD (µm)

Mea

sure

d C

D (µ

m)

Film Thickness: 10μmOpti Track Coat and BakeSB: 110°C/3 minutesASML i-Line Stepper, F= +1.0μmOpti Track PEB/DevelopPEB: 120°C/ 60 SecondsAZ 300 MIF/ 3x50sec Spray/Puddle @23°C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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AZ® 15nXT (450 CPS)Coating Uniformity Wafer Maps (3 mm Edge Exclusion)

1000 rpm 17.8μm/4.49%RSD 1500 rpm 13.5μm/1.36%RSD 2000 rpm 10.8μm/1.49%RSD

2500 rpm 9.0μm/0.78%RSD 3000 rpm 7.8μm/0.70%RSD

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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AZ® 15nXT (450 CPS)Edge-Bead Coating Study (200 mm wafer)

AZ EXP 15nXT Coating StudyEffects of Spin speed on Edge-Bead Profile

0.00

5.00

10.00

15.00

20.00

25.00

30.00

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

mm in from Wafer Edge

Film

Thi

ckne

ss (µ

m)

3000 rpm 2500 rpm 2000 rpm 1500 rpm 1000 rpm

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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AZ® 15nXT (450 CPS), FT=10.0 μm Coat to Exposure Delay on Copper; 5 μm L/S

4.5

4.75

5

5.25

5.5

0 2 4 6 8 10 12 14 16 18 20 22 24

Coat to Expose Delay Time (Hours)

CD

@ re

fere

nce

E-N

omin

al (u

m)

F=0.5 F=1.0 F=1.5

Film Thickness: 10.0 µmOptitrac coat and BakeSB: 110°C/ 180 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 120°C/ 60 sec ContactAZ 300 MIF 3x50 sec spray puddles @ 23 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

17

Film Thickness: 10.0 µmOptitrac coat and BakeSB: 110°C/ 180 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 120°C/ 60 sec ContactAZ 300 MIF 3x50 sec spray puddles @ 23 °C

AZ® 15nXT (450 CPS) , F = +1.0 µm, FT=10.0 μm Coat to Exposure Delay on Copper (hr:mm); 5 μm L/S

4.0

4.3

4.5

4.8

5.0

5.3

5.5

5.8

6.0

150 200 250 300 350 400 450 500 550

Dose (mJ/cm2)

Mea

sure

d C

D ( μ

m) 23:35 Hrs

17:25 Hrs12:00 Hrs6:30 Hrs3:35 Hrs1:00 Hrs0:30 hrs0:01 Hrs

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

18

AZ® 15nXT (450 CPS) , FT=10.0 μm Exposure to PEB Delay on Cu Wafers; 5 μm L/S

4.5

4.75

5

5.25

5.5

0 30 60 90 120 150 180 210 240 270 300 330 360 390 420

Expose to PEB Delay Time (min)

CD

@ R

efer

ence

E-N

omin

al (u

m)

F=0.5 F=1.0 F=1.5

Film Thickness: 10.0 µmOptitrac coat and BakeSB: 110°C/ 180 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 120°C/ 60 sec ContactAZ 300 MIF 3x50 sec spray puddles @ 23 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

19

Film Thickness: 10.0 µmOptitrac coat and BakeSB: 110°C/ 180 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 120°C/ 60 sec ContactAZ 300 MIF 3x50 sec spray puddles @ 23 °C

AZ® 15nXT (450 CPS), F = +1.0 µm, FT=10.0 μmExposure to PEB Delay on Cu Wafers (Hr:mm); 5 μm L/S

4.0

4.3

4.5

4.8

5.0

5.3

5.5

5.8

6.0

150 200 250 300 350 400 450 500 550

Dose (mJ/cm2)

Mea

sure

d C

D ( μ

m)

7:00 Hrs

3:20 Hrs

1:00 Hrs

0:30 Hrs

0:15 Hrs

0:00 Hrs

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

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AZ® 15nXT (450 CPS)Exposure and PEB Delays on Cu Wafers

300 mJ/cm2 , FT=10.0 μm, 5μm Features @ F= +1.0

NoDelays

Exposure+ 23 Hours

PEB/Develop+ 7 Hours

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

21

Ni Plating solution: Enthone Microfab Ni-100Process condition:

Electrical density: 3.2 ASDPlating current: 0.103 A Stirring rate: 120 rpmTemp: 50°CPlating time: 3 min 12 sec

AZ® 15nXT (450 CPS)Ni/Cu Plating Compatibility

Cu Plating solution: Enthone Microfab Cu 200Process condition:

Electrical density: 3.2 ASDPlating current: 0.103 A Stirring rate: 120 rpmTemp: 25°C (Room Temp)Plating time: 4 min 48 sec

Stripping: AZ® Kwik Strip at 70 oC for 3 min

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

22

AZ® 15nXT (450 CPS)F=1µm; 400 mJ/cm2

3.6 µm

10 µm

4.5 µm

5 µm

4 µm

3.4 µm

AZ® 15nXT (450 CPS) Plated Ni/Cu Lines

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.

23

AZ® 15nXT (450 CPS)Summary

Compatible on Cu type substrates and other metals.Very good lithographic throughput; very competitive photospeed and develop time.Excellent adhesion, no underplating.Vertical sidewall profiles.Wide compatibility to plating solutions, including Cu, Ni, and Au.Easily strips after plating; stripped completely in AZ Kwik Strip at 70°C for 3 min.Very good stability and shelf lifeThinner version available for lower FT range; 15nXT (115 CPS).