Automotive power module packaging Review...The progress of electric and hybrid electric vehicles...

©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 1

22 Bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Automotive Power Module Packaging Comparison 2018

A Cost Oriented Technical Analysis Review

Power Semiconductor report by Farid HamraniJuly 2018 - Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT


SUMMARY

Overview 3

o Executive Summary

o Reverse Costing Methodology

o Analyzed devices

Introduction 7

o Power Module Market

Physical and Manufacturing Cost Analysis 11

o Bosch

Company Profile

T-PM

o Infineon

Company Profile

HybridPACK 2

HybridPACK Drive

HybridPACK Double Side Cooling

CoolIR

o Mitsubishi

Company Profile

J serie T-PM

o Semikron

Company Profile

SKiM

o ST Microelectronic

Company Profile

Tpak

o Toshiba

Company Profile

Case module

o Toyota

Company Profile

Molded DSC

Comparison 110

o o Cost breakdown

o o Cost by Power

o o Cost by Switch

o o Cost by Surface and Volume

Feedback 117

System Plus Consulting services 119


Overviewo Executive Summaryo Reverse Costing

Methodologyo Analyzed devices

Introduction

Physical & Cost Analysis

Comparison

Feedback

About System Plus

Executive Summary

The most recent market forecast by Yole Développement shows the global rise of power devices. The market for power module devices will follow that trend, with a 10.2% compound annual growth rate (CAGR) over the next five years. This will impact the power module packaging market, which will see a 9.5% CAGR, reaching a value of almost $1.8B.

The progress of electric and hybrid electric vehicles (EV/HEVs) is imposing new standards in terms of electrical equipment, pushing electronic components to work in non-conventional environments for longer. That poses the electronics industry new challenges regarding both performance and reliability. To meet these requirements, electronic systems have to be improved at both design and industrialization levels.

Power modules have come a long way since the early stages of car electrification. They are now playing a key role in the power modulation through all EV/HEVs, from inverters to bi-directional converters. Packaging these modules has become critical due to several technical aspects. They must combine good thermal and electrical efficiency while keeping low mass and volume. Also, to remain competitive in an open market, power module makers must deliver high reliability while remaining cost efficient.

In this report we analysed the physical composition and cost of ten modules for automotive applications from seven different manufacturers. We reviewed the different topologies and techniques used for the module packaging in such applications. We describe opening the modules, provide measurements and cross-sections, along with scanning electron microscope (SEM) and optical pictures. We analyse and simulate the cost of manufacturing and compare it to a summary panel.

This report includes comparison of the structures and costs of the different technological choices made by key manufacturers of the automotive industry.


Overviewo Executive Summaryo Reverse Costing

Methodologyo Analyzed devices

Introduction


Comparison

Feedback

About System Plus

Analyzed Devices

The components analyzed are listed it against.

Manufacturer

Bosch T-PM

Infineon

HybridPACK 2 FS600R07A2E3

HybridPACK Drive FS820R08A6P2B

HybridPACK DSC FF400R07A01E3

CoolIR

Mitsubishi T-PM CT300DJG060

Semikron SKiM SKiM306GD12E4

STMicroelectronics TPak

Toshiba Case module

Toyota Prius Molded DSC


Overview

Introductiono Packaging technologyo Power Module Market


Comparison

Feedback

About System Plus

Market Evolution

• This Market forecast by Yole Developpment is showing the rise of the global power market devices.

• It also shows that the market for the Power Module devices will follow that trend with an estimated XXXincrease in the next five years.

Source: Yole Développment

http://www.yole.fr/index.aspx


Overview

Introduction

Physical & Cost Analysiso Bosch

T-PMo Infineono Mitsubishio Semikrono ST Microelectronicso Toshibao Toyota

Comparison

Feedback

About System Plus

Inverter Module – Views and Dimensions

Xx mm

Bottom ViewTop View

Xx m

m


Overview

Introduction

Physical & Cost Analysiso Boscho Infineon

HybridPACK 2 HybridPACK Drive HybridPACK DSC CoolIR

o Mitsubishio Semikrono ST Microelectronicso Toshibao Toyota

Comparison

Feedback

About System Plus

Infineon Hybridpack 2 – Cross Section

Package Cross-section – MEB View

• With two xxxxµm thick copper plates and an xxxx layer of xxxxµm the total thickness of the DBC is xxxxµm.

• We can see that the copper baseplate and the DBC are connected together by with solder joint of xxxxµm.


Overview

Introduction




Comparison

Feedback

About System Plus

HybridPACK DSC – Assembly Cost Analysis

Module Assembly Process Flow


Overview

Introduction




Comparison

Feedback

About System Plus

CoolIR – Assembly Cost Analysis

Module Assembly Process Flow

• The total price for the parts & assembly of this module adds to a grand total of $XX.

• This Includes $XXX of external parts (XX% of final price) and $XX of assembly. The losses during the assembly operations come down to $XX.


Overview

Introduction

Physical & Cost Analysiso Boscho Infineono Mitsubishio Semikrono ST Microelectronicso Toshiba

Case Module o Toyota

Comparison

Feedback

About System Plus

Case Module – Cross-Section

Module detail - cross-section view


Overview

Introduction


Comparisono Technical Categorieso Cost Breakdowno Price per Powero Price per Volumeo Price per Surface

Feedback

About System Plus

Package Cost Breakdown Comparison

Above is a representation of the cost breakdown evolution for each studied module packages classified by packaging technologies We can see the impact of external parts (housing leadframes…) the added value (labor, machine cost…) and the cost of losses.The impact of the external parts have can interfere with the final prices. Especially the PinFin baseplate on the modules from Infineon. But this choice from the German manufacturer is to combine this baseplate/radiator for the best thermal efficiency. An additional costthat as to be added at system level for the other configurations.


Overview

Introduction


Comparison

Feedback

About System Pluso Company serviceso Related reportso Contacto Legal

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

POWER• Tesla Model 3 Inverter with SiC Power Module from

STMicroelectronics• Infineon FF400R07A01E3 Double Side Cooled IGBT Module• Infineon FS820R08A6P2B HybridPACK Drive IGBT Module

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

POWER• Power Electronics for EV/HEV 2018• Tesla Model 3 Inverter with SiC Power Module from

STMicroelectronics

http://www.systemplus.fr/reverse-costing-reports/tesla-model-3-inverter-with-sic-power-module-from-stmicroelectronics/

http://www.systemplus.fr/reverse-costing-reports/infineon-ff400r07a01e3-double-side-cooled-igbt-module/

http://www.systemplus.fr/reverse-costing-reports/infineon-fs820r08a6p2b-hybridpack-drive-igbt-module/

https://www.i-micronews.com/category-listing/product/power-electronics-for-ev-hev-2018.html

https://www.i-micronews.com/category-listing/product/tesla-model-3-inverter-with-sic-power-module-from-stmicroelectronics.html

The most recent market forecast by Yole

Développement shows the global rise of power

devices. The market for power module devices

will follow that trend, with a 10.2% compound

annual growth rate (CAGR) over the next five

years. This will impact the power module

packaging market, which will see a 9.5% CAGR,

reaching a value of almost $1.8B.

The progress of electric and hybrid electric

vehicles (EV/HEVs) is imposing new standards

in terms of electrical equipment, pushing

electronic components to work in non-

conventional environments for longer. That

poses the electronics industry new challenges

regarding both performance and reliability. To

meet these requirements, electronic systems

have to be improved at both design and

industrialization levels.

Power modules have come a long way since

the early stages of car electrification. They are

now playing a key role in the power modulation

through all EV/HEVs, from inverters to bi-

directional converters. Packaging these

modules has become critical due to several

technical aspects. They must combine good

thermal and electrical efficiency while keeping

low mass and volume. Also, to remain

competitive in an open market, power module

makers must deliver high reliability while

remaining cost efficient.

In this report we analyzed the physical

composition and cost of ten modules for

automotive applications from seven different

manufacturers. We reviewed the different

topologies and techniques used for the module

packaging in such applications. We describe

opening the modules, provide measurements

and cross-sections, along with scanning

electron microscope (SEM) and optical

pictures. We analyze and simulate the cost of

manufacturing and compare it to a summary

panel.

This report includes comparison of the

structures and costs of the different

technological choices made by key

manufacturers of the automotive industry.Title: Automotive Power Module Packaging Comparison 2018

Pages: 110

Date: July 2018

Format: PDF & Excel file

Price: EUR 4,490

Automotive Power Module PackagingComparison 2018

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY

A cost-oriented review of power module packaging technologiesfor the automotive market.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

COMPLETE TEARDOWN WITH

• Detailed photos

• Precise measurements

• Manufacturing process flow

• Manufacturing cost analysis

• Technological and cost comparison

AUTOMOTIVE POWER MODULE PACKAGING COMPARISON 2018

TABLE OF CONTENTS

Overview/Introduction

• Executive Summary

• Reverse Costing Methodology

• Analyzed Devices

• Power Module Market

Physical and Manufacturing Cost Analysis

• Bosch

Company profile

T-PM

• Infineon

Company profile

HybridPACK 2

HybridPACK drive

HybridPACK double side cooling

CoolIR

• Mitsubishi

Company profile

J serie T-PM

AUTHORS

• Semikron

Company profile

SKiM

• ST Microelectronics

Company profile

Tpak

• Toshiba

Company profile

Case module

• Toyota

Company profile

Molded DSC

• Module Comparison

• Cost Breakdown

• Cost by Power

• Cost by Switch

• Cost by Surface and Volume

Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicsThe first SiC power module in commercialized electric vehicles.June 2018 - EUR 3,490*

Infineon FF400R07A01E3 Double Side Cooled IGBT ModuleDiscover Infineon‘s first double sided cooling power module for automotive. January 2018 - EUR 3,490*

Infineon FS820R08A6P2B HybridPACK Drive IGBT ModuleThe newest HybridPACK Drive power module from Infineon with EDT2 IGBT technology.June 2017 - EUR 3,490*

RELATED REPORTS

Farid Hamranijoined SystemPlus Consulting in2016 as a systemcost engineer.

He’s in charge of systems reversecost analysis with a focus onembedded systems. He pre-viously worked in the high-reliability packaging field. Faridholds a master degree inmicroelectronics and materialfrom the University of Nantes.

Véronique LeTroadec has joinedSystem Plus Con-sulting as a labora-tory engineer.

Coming from Atmel Nantes, shehas extensive knowledge in failureanalysis of components and indeprocessing of integratedcircuits.

tory of System Plus Consulting.He previously worked during 25years in Atmel NantesTechnological Analysis Labor-atory as fab support in physicalanalysis, and 3 years at HirexEngineering in Toulouse, in aDPA lab.

Yvon Le Goff hasjoined System PlusConsulting in2011, in order tosetup the labora-

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Automotive power module packaging Review...The progress of electric and hybrid electric vehicles...

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