Automotive and AI: System Integration & Innovation in IC ...
Transcript of Automotive and AI: System Integration & Innovation in IC ...
Nicole Tien, Sr. Application Engineering ManagerASE Europe, ASE GroupMay-13th-2019
Automotive and AI: System Integration & Innovation in IC Packaging
Opportunity and Challenge for automotive IC- Global auto electronics revenue reached $134B in 2018 and is expected to grow at 6% CAGR in the next
few years. Powertrain and ADAS are the 2 fastest growing applications, driven by electrification, EV, and autonomous driving mega trend.
- Both ATV OEM and Tier-1 are facing increasing margin pressure due toautomotive market slow down, high tech R&D and capex requirement fornew technologies like
ADAS and EV.
Source: I’HS Gartner, *ASE Estimation 2017
Autonomous Driving Drives Architecture Shift
- Autonomous vehicle car semi TAM will reach >$5Bn by 2022
- Processor content from $100 (ADAS) to $1000 in autonomous vhicles
Processor37%
Optical28%
RF13%
Others22%
ADAS Semi Rev Breakdown - 2025
Source: Mckinsey
Human Interact Centralized Computer
GPUCPUMCU
EV/HEV Drive Power Semiconductor Accelerating pure EV growth due to regulation
Innovative packaging/ module solution
Zero Defect manufacturing
Source: Infineon, Strategic Analytics
17
300
0
200
400
600
800
1,000
ICE HEV/PHEV
US$ drivertrain power semi
drivertrain non-power semi
other features
Semi Content Per Vehicle
‒ Driving Force: Electrification, Autonomy, connectivity, Comfort.‒ 7% CAGR for automotive sales. Around 30% growth for OSATs used in automotive packaging.‒ Power applications need more power in the same footprint, thus development of a higher
power density is crucial, and so thermal management becomes more important.‒ For many applications, electronic devices are outside of the cabin in a harsher working
environment e.g. high temperature and high humidity, and so reliability becomes a critical factor.
Source: Yole, 2019
Package Need in Automotive
Body• Climate Sensor Control• Remote Keyless Entry• Lighting Control• Position / Angle Sensors• Electronic Control Units
ADAS• ADAS Control Module• Camera Modules• Sensor Modules• V2X Communications
Chassis• Antilock Braking (ABS)• Stability Control• Tire Pressure Monitoring• Steer/Brake-by-Wire
Instrumentation• Instrument Cluster• Head-Up Display
Aftermarket• Portable Navigation Devices• Audio Head Units• Video Recorders
Powertrain• Engine Control Module• Transmission Control ModuleSafety
• Airbag Control Module• Airbag Crash Sensors• Event Data Recorder
Infotainment• Fixed Navigation Systems• Rear Seat Entertainment• NFC BT Pairing• Wireless Charging
SOP LQFP, TQFP SQFN aQFN Wettable QFN BGA Open Cavity
Grade
0
Grade 0 Grade 1 Grade 2 Grade 1 Grade 1 QFN 1
ASE Group Product coverage in AutomotiveElectronics
Body, 31%Chassis / Safety, 31.40%
Infotainment,16%Others,
0.10%
Aftermark
et, 21.30%
FCCSPGrade 1
Modularization/SiP Trend
Infotainment Body ADAS
Audio Head Units
Fixed Nav.System
InfotainmentHead Units
Rear SeatEntertainment
Climate Control
RemoteKeyless Entry
LightingElectronic
Control Units
ADAS Control Module
CameraModules
SensorModules
V2XCommunication
Automotive System-in-Package
ASEATVSiP
Emerging Technologies – Maturity
Less than 2 years 2 to 5 years 5 to 10 years More than 10 years
Impact
Years to Mainstream Adoption
Flying Autonomous Vehicles
Volumetric Displays
4D PrintingBrain-Computer
InterfaceAutonomous Driving
Mixed RealityAugmented RealityBlockchain for Data
SecurityConnected Home
IoT PlatformSmart Fabrics
BlockchainEdge AI
Conversational AI Platform
Neuromorphic HardwareSmart Workspace
Deep LearningVirtual Assistant
5GNeural Network
ASICs
Source: Priority Matrix for Emerging Technologies 2018, Gartner
IoT and Cloud create the need for edge computing where data collecting &
processing occurs in part at the network edge, rather than completely in the cloud.
Edge devices must manage complex operations, including sensing, compute, power management, and localized AI.
Edge compute can address latency, battery life, bandwidth costs, security, privacy, to
allow timely decision & 1st level data analysis.
Heterogeneous integration provides a platform for multiple die from multiple
sources to be packaged together, offering huge performance, power and footprint
advantages.
At the Edge: rising demand for integrated solutions
Heterogenous SiP
Power delivery innovation is needed to address increasing SOC / AI accelerators &
power consumption: optical solutions provide high bandwidth bridge within AI
solutions.
Processor memory integration saddled by memory bandwidth bottleneck: possible
solution is SOC HBM packages such as CoWoS, EMIB, 2.5D.
AI accelerators such as TPUs and neural ASICs enable the industry to have a
comprehensive AI ecosystem.
Skyrocketing data volume demands dramatic increase in processing power and
performance, achievable through new innovation in technology integration.
At the Core: growing need for processing power
HPC
HPC Package Integration Solutions
• Interconnection through silicon• D2D Interconnection: ~100K• L/S 0.4/0.4• HBM; Hetero/ Homogeneous die
partition• Interposer: 1400mm2• Available on cavity lid, stiffener and
molded
2.5D• Interconnection through substrate• D2D Interconnection: ~1K• L/S 10/10• Max qualified pkg size: 75x70 FCBGA• Min die to die gap: 60 um
FCBGA MCM• Interconnection through fanout
RDL• D2D Interconnection: ~10K• L/S 2/2• Max fanout die size: 26x33• ASIC+HMB: Engineering• Chip last solution for > 3 die fanout
FOCoS
Smartest package solution for IoT, mobile, ATV etc… !
Group Synergies Leading to Disruptive Innovation
SiP / SiM with HD integration
Advanced packaginfor semiconductor IC
PCBA, module assemblyand system assembly
Device Package
ModuleSystem
3D IC APU, Memory
2.5D IC FPGA, GPU, NPU
RF / FEMWiFi/BLE
CameraTouch Sensor
BiometricSmartWatch
Fitness
PMU
SSD
Optical
IoT
VR Headset
SiP Module
Silicon Centric
Component Centric
SoC
Device Integration: Bridging OSAT & EMS
Enabling Technologies for SiP/SiM
ASE SiP Package Solution Focus
Food for Thought: Supply Chain Consolidation
ICSuppliers
Car OEM
Tier-1
InnovationManufacturing
Partners
OSAT
Thank Youw w w. a s e g l o b a l . c o m