COMPLETE TEARDOWN

WITH:

• Detailed photos

• Precise measurements

• Materials analysis

• Comparison between FLIR and ULIS microbolometers, and with consumer products

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Estimated sales price

Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 Microbolometer

Title: Autoliv Night Vision System and FLIR’s ISC0901BO

Pages: 98 (Sensor) + 105 (System)

Date: June 2017

Format: PDF & Excel file

Price: Full report: EUR 3,490

Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology

complex optical system and powers its night vision using sophisticatednumerical processing based on an Altera field-programmable gate array (FPGA)and custom algorithm.

The Autoliv night vision camera consists of two modules, the camera and a remoteprocessing unit. The system is made very compact and easy to integrate for carmakers.

The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized forautomotive applications. Based on vanadium oxide technology, the ISC0901microbolometer features a 336x256 resolution wafer level package, achieving anincredibly compact design.

The ISC0901 is the automotive version of a surveillance microbolometer. By usingwafer level package technology to encapsulate the microbolometer FLIR offers thebest price performance ratio.

This report is divided into two parts, one focused on the microbolometer and thesecond on the other systems. It is based on a complete teardown analysis of thenight vision camera and the associated electronic control unit. Using this, itprovides the bill-of-material (BOM) and manufacturing cost of the infrared camera.The report also offers a complete physical analysis and manufacturing costestimate of the infrared module, including the lens module and themicrobolometer itself.

The report’s final component is a comparison between the characteristics of theFLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparisonhighlights differences in technical choices made by the companies.

Based on a high definit ion ISC0901microbolometer from FLIR, the Autoliv nightvision infrared camera targets the high-endautomotive market using two FLIR cores.Based on the solid first design from 2009, themicrobolometer offers better performance indefinition and frame rate. The camera alsoembraces the quality approach with a

AUTHORS:

TABLE OF CONTENTS

SYSTEM REPORT

Overview / Introduction

Company Profile

Physical Analysis• Views and Dimensions • System Opening • Electronic Board Top side – global view, high definition

photo, components markings and identification

Bottom side – other component identification

• Sealing Glue EDX Analysis• Sensor Unit Module Disassembly• NV3 Core Board• NV3 Personality Image Sensor• Microbolometer Board• Optical Element Cross-Section

Cost Analysis

• Accessing the BOM• PCB and CIS Cost• BOM Cost – Electronic Board and

Camera Module• Housing Parts – Estimation• BOM Cost – Housing• Material Cost Breakdown by

Component Category• Accessing the Added Value (AV)

cost• Electronic Board Manufacturing

Flow• Details of the Electronic Board,

System Assembly, Housing AV Cost• Manufacturing Cost Breakdown for

500k and 1M units

Estimated Price Analysis

System Plus Consulting offerspowerful costing tools to evaluatethe production cost and sellingprice from single chip to complexstructures.

MEMS CoSim+Cost simulation tool to evaluate thecost of any MEMS process ordevice: From single chip to complexstructures.

SYSCost+It provides all component costsestimation including PCB, housingand connectors, and a simulationof the assembly cost and testprocess at the board and systemlevel

IC Price+The tool performs the necessarycost simulation of any IntegratedCircuit: ASICs, microcontrollers,DSP, memories, smartpower…

ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+, SYSCOST+ AND IC PRICE+

IC Price+

SYSCost+

MICROBOLOMETER REPORTOverview / Introduction

Company Profile

Physical Analysis• Package Package views, dimensions, opening, wire

bonding process, cross-section• Window View, dimensions, cross-section, Au/Sn

Eutectic bonding• Microbolometer CIS view, dimensions, pixels, main blocks and

cross-section• Illumination Module View, dimensions and markings, active pixels,

compensation pixels, cross-section, process characteristics

• ROIC• Comparison

Manufacturing Process Flow• ROIC Front-End Process• ROIC Wafer Fabrication Unit• Microbolometer Process Flow• Window Wafer Fabrication Unit• Packaging Process Flow

Cost Analysis• ROIC • Microbolometer MEMS front-end cost and cost by process step

• Window• Component Bonding front-end cost IR sensor wafer and die cost Back-end: final test cost Microbolometer component cost

Estimated Price Analysis

Farid Hamrani

Farid is focused ons y s t e m r e v e r s ecosting analysis. Heh a s w o r k e d f o r

Tronico in the field of hightemperature electronic assemblyand qualification and holds amaster's degree in micro-electronics.

previously worked for 25 years atAtmel Nantes TechnologicalAnalysis Laboratory and for threeyears at Hirex Engineering.

Yvon Le Goff (Lab)

Yvon joined SystemPlus Consulting in2011 to set up itsl a b o r a t o r y . H e

MEMS CoSim+

years of experience in powerdevice manufacturing cost analysisand has studied a wide range oftechnologies.

Sylvain Hallereau

Sylvain is in charge ofcosting analyses forIC, power and MEMS.He has more than 10

Thermal Expert Infrared

Camera for Smartphones

and i3system I3BOL384_17A

Microbolometer

Opgal Therm-App Infrared

Camera & Ulis IR

Microbolometer

Seek Thermal Infrared Camera & Raytheon IR

Microbolometer

The highest resolution thermalcamera for smartphones at 384 x288 pixels, using a micro-bolometer with 17µm pixels fromthe South Korea’s i3system.

The highest resolution thermalcamera for smartphone, 384 x288 pixels using amicrobolometer with 17µm pixelfrom Ulis.

The highest resolution thermalcamera for smartphone, 156 x 206pixels, using a microbolometerwith 12 µm pixel from Raytheon,compatible with Android and IOS.

Pages: 170Date: August 2016Full report: EUR 3,490*

Pages: 163Date: July 2015Full report: EUR 3,490*

Pages: 166Date: January 2015Full report: EUR 3,490*

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