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ATLAS ITk - INFN Genovagemmec/talks/ITK_Talk_CSN1_V1.pdf · 2017-04-30 · room di dispositivi...
Transcript of ATLAS ITk - INFN Genovagemmec/talks/ITK_Talk_CSN1_V1.pdf · 2017-04-30 · room di dispositivi...
Feb. 6, 2017 G.-F. Dalla Betta
ATLAS ITk CSN1 Meeting – Roma, 6 Febbraio 2017
Gian-Franco Dalla Betta1, Claudia Gemme2
1 University and TIFPA INFN / Trento 2 INFN Genova
On behalf of RD_FASE2: ATLAS Pixel BO, CS, GE, MI, TN, UD
Overview of the Phase-II Pixel upgrade ü The project is now accelerating significantly given the schedule for the
Pixel TDR (Dec 2017).
2
• PossibilitytohavetwoFEsubmissionsisincludedintheschedule.Moduleop:miza:oncanstartwithfirstchip.
• Moduleproduc:onandloading:~27-33months
ü The project is now accelerating significantly given the schedule for the Pixel TDR (Dec 2017).
Overview of the Phase-II Pixel upgrade
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Zoom in 2017: • Layout definition will allows groups to take
commitments on parts of detector. • and preliminary design of the local supports.
• RD53-A will be submitted in spring 2017à technological demonstrator of the 65 nm technology and module prototypes with small pixel size.
• Bump bonding marker survey. • Sensors: identify the baseline designs to be used in
the detector. A preliminary design of the data transmission and power distribution scheme will be included in the TDR.
• Start of ATLAS chip design.
Feb. 6, 2017 G.-F. Dalla Betta
INFN Contribution to ITk & R&D’s – 3DPixelSensors→ RD_FASE2–(commonwithCMS)
• InpartnershipwithFBK(Trento)• BaselinetechnologyinLayer0(maybealsoL1andRing0)
– Bump-bonding→ RD_FASE2(inpartcommonwithCMS)• Indiumthermo-compressionprocesswithLeonardo(exSelex)
– PixelR/Ochip(RD53)→ common CHIPIX65projectofCSN5– Pixelmoduleassembly/tes:ng→ RD_FASE2– CMOSsensors(withSTM)→ HVR_CCPDprojectofCSN5– Mul:moduleR/O&DAQ→ RD_FASE2– Localsupport/CO2cooling→ RD_FASE2– Simula:on&tracking
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Several topics also co-funded by EU AIDA2020
Mai
n ta
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he R
&D
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Feb. 6, 2017 G.-F. Dalla Betta
A3vità Descrizione BO CS GE MI TN UD TOT
3DSvilupposensoriconFBK(inclusisubstra:,etc.)
- - 65 - 38.5 - 103.5
BBBumpbondingdimodulipersensori&QualificazioneBumpbondingadaltadensita’suW.12”
- - 62 110 - - 172
MODULI Assemblaggiomoduli,test,irraggiamen:,etc. - 7 22 2 8.5 2 41.5
READ-OUTSvilupposistemaREAD-OUTmul:modulo
42.5 - - - - - 42.5
MECCANICAECOOLING
QAsuppor:localiecontributoalCoolingSystemITk - 8 26 57 - - 91
TotalperGroupGrandTotal
42.5 15 175 169 47 2 450.5
450.5
Assegnazioni RD_FASE2 a ITk 2014-2017 (inclusi items comuni con CMS)
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Feb. 6, 2017 G.-F. Dalla Betta 6
Data Descrizione % Note
31-05-2014 Presentazione documenti relativi alle attivita' di R&D, pianificazione temporale e gruppi coinvolti
100
20-12-2014 Realizzazione batch sensori planari a FBK con prove tecniche di foratura
100
Milestones 2014
Milestones 2015
Data Descrizione % Note
31-07-2015 Verifica batch FBK n. 2 pixel planari su wafer DWB 6". Se positiva seguono test di moduli single ROC con pixel planari
100
30-11-2015 Qualifica della prima produzione di pixel 3D single side FBK
0 Riportata al 2016
Feb. 6, 2017 G.-F. Dalla Betta 7
Data Descrizione % Note
31-07-2016 Pixels, Caratterizzazione in clean room di dispositivi planari e 3D
100
30-11-2016 Pixels, test in laboratorio di moduli 3D 100
30-11-2016 Pixels,Definizione Layout per pixel 3D e planari compatibili con i prototipi del chip di lettura previsto per RD53
100
Milestones 2016
Milestones 2017 Data Descrizione % Note
31-07-2017 Prove su fascio di rivelatori a pixel 3D con chip di lettura FEI4 e PSI46dig
100
31-10-2017 Caratterizzazioni in laboratorio di sensori a pixel planari con pitch 50x50um e 25x100um
Confidenti di soddisfare pienamente
Italian R&Ds à 3D sensors ü Achieved so far:
• Feasibility of small-pitch 3D demonstrated, tested with large pitch read-out • Extensive testing of 3D modules under way with good results
• Very promising results also from irradiated test structures
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Preliminary test beam results
Italian R&Ds à 3D sensors ü Achieved so far:
• Feasibility of small-pitch 3D demonstrated • Extensive testing of 3D modules under way with good results
• Very promising results also from irradiated test structures
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ü Towards the TDRà Qualify FBK as a 3D vendor • Need to qualify sensors for extreme radiation
hardness. • proceed with irradiations of FE-I4 modules, looking
forward to RD53A ROCs (~fall 2017)
• One 3D batch being launched now (funded by AIDA 2020), another one (already funded by RD_FASE2) to be produced, essential to finalize this R&D, still waiting for the new agreement with FBK for pixel sensors.
3D wafer: New layout
Italian R&Ds à Bump-Bonding@Leonardo
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ü Achieved so far: • Bump bonded FBK 3D and planar sensors. • High bump density deposition (50x50 µm2 over 2x2 cm2) validated with
electrical and visual QA on 6” wafers with dummy chains.
• Started validation of high density BB on 12” wafer. So far just bump deposition on bare Silicon.
Source scan of a 3D sensor bump bonded to a +FEI4 by Leonardo
Bump R of dummy chains
High density Bumps X-ray
Italian R&Ds à Bump-Bonding@Leonardo
ü Achieved so far: • Bump bonded FBK 3D and planar sensors. • High bump density deposition (50x50 µm2 over 2x2 cm2) validated with
electrical and visual QA on 6” wafers with dummy chains.
• Started validation of high density BB on 12” wafer. So far just bump deposition on bare Silicon.
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ü Towards the TDRà Qualify Leonardo as a BB vendor • Next step is to deposit bumps on 12” wafer with
resistive chains. If successful to be used for RD53A wafer in Fall 2017
• For the TDR and beyond: Qualify Leonardo to do high density In bump deposition on 12” wafers and maybe part of the flip-chip.
• Deposited wafers may be flip-chipped by users in the collaboration (BCN, Moscow, Glasgow, Geneva, etc...).
12” dummy chain wafer
Italian R&Ds à Read-out ü Profiting of IBL (and Pixel Layer 2/1 on-going upgrades) experience
in Read-Out Card design/production/qualification. ü The idea is to produce a table top card, replacing the ROC+BOC
current pit implementation: • Manpower: 2 FTE with electronics Workshop in Bologna • For the TDR: qualify the system for the detector offline readout.
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Italian R&Ds à Mechanics/Cooling
ü Participation to the ITK cooling system with the design, construction and tests of the splitting box (Genova): • Prototypes to be ready in
summer for QA at CERN.
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8 Pump
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3 2
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Staves
Transfer line
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PP2 PP1 Plant in USA15
Chiller
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PP1 Splitting box
Italian R&Ds à Mechanics/Cooling
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ü CO2 evaporative system with recycle now available for ATLAS and LHCb in Milano.
ü Slim longeron (Support of the inclined solution) • Manufacturing of the Al moulding. • Thermo mechanical FEA: stress in the cell critical interfaces and thermal
radiation effect studies.
• Planned CO2 tests of cooling circuits with the 2PACL Traci unit. • Planned measurement of the cell solder/tim interfaces before and after
cooling/pressure cycles.
SLIM Local Support for Inclined Layout
Al mould short prototype
Cell FEA studies
E cosa costruiamo? ü We are discussing if to take responsibility of building one End-cap,
so far uncovered. • The other one is built by UK colleagues. • Building the innermost barrel layers - as originally proposed to better
match our sensor interests - seems to be difficult as there is a strong US interest and our design and engineering capabilities are limited.
• This is not expected to damage our interest and leadership in the 3D sensors as the pixel production model decouples the module production&test from their installation on detector.
ü Meeting in Genova on Feb 8/9 to discuss the current status of the activities, push them to be relevant in the Pixel TDR and discuss if to take the responsibility to deliver the End-cap.
ü This is an ambitious project (2.5 m length, 60 cm diameter, 2.5 m2 surface) but may be a big opportunity to boost the Italian contribution: • New groups have shown interests in this opportunity (Lecce, Frascati).
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Aggiornamenti in un paio di mesi
Production organization for the pixel detector
PoolofQualifiedSupports
(Staves,Half-Rings)
PoolofQualifiedModules
(3D,planar…)
EC Loading Sites receive QA Half-rings + QA modules
Barrel Loading Sites receive QA Staves + QA module
Lab1Lab1Lab3LabN
Lab1Lab2LabM Modules and
Supports QA sites are not necessarily correlated to the Loading sites
Module Loading: Robot, Survey Loaded supports QA: HW setup, source, cold box
A possible model for Italy
ü Module Assembly e QA: • Assembly e QA dei 3D (~1 m2 /2 vendors ) – per paragone 0.04 m2 sono i
3D installati in IBL. • Altro se necessario per il nostro share.
à Coinvolgere piu’ lab: almeno 2 per module assembly, 4-5 per module QA. à E’ MOLTO importante per il formare competenze per l’operazione negli
anni futuri!
ü Module Loading and QA: • A Genova montati in passato ~ 40 staves (~500-600) moduli.
• Procedura lenta , va sicuramente ottimizzata.
à1/2 siti per il Loading (Genova/xx) à Almeno 2 siti per la QA dei moduli sui supporti.
Aggiornamenti in un paio di mesi
ü Integration: • To be defined.
Feb. 6, 2017 G.-F. Dalla Betta 18
Riassunto FTE 2017
Sez. RD_FASE2 HVR_CCPD CHIPIX65 AIDA2020
BO 1.00 0.40 - -
CS 0.80 - - -
GE 3.70 1.20 - 0.15
MI 2.12 1.20 1.50 0.35
TN 3.30 - - 1.00
UD 1.30 - - -
Total 12.22 2.80 1.50 1.50
Sezione First+Name Family+Name Ruolo RD_FASE2+ HVR_CCPD CHIPIX65 AIDA2020BO Federica Fabbri PhD 0,20 1 1 1BO Davide3 Falchieri Tecn.3Cat.3D 0,20 1 1 1BO Alessandro3 Gabrielli RU 0,20 1 1 1BO Carla Sbarra RIC 1 0,20 1 1BO Antonio Sidoti RIC 0,20 0,20 1 1BO Maximiliano Sioli PA 0,20 1 1 1CS Anna Mastroberardino RU 0,50 1 1 1CS Daniela Salvatore Assegnista 0,30 1 1 1GE Giovanni Darbo DR 0,60 0,30 1 1GE Andrea Favareto Assegnista 0,30 1 1 1GE Andrea Gaudiello PhD 0,50 0,30 1 1GE Claudia Gemme RIC 0,20 0,10 1 0,15GE Silvia Miglioranzi Assegnista 0,20 1 1 1GE Paolo Morettini 11RIC 0,60 0,20 1 1GE Hideyuki Oide Borsa 0,40 1 1 1GE Leonardo Rossi DR 0,20 0,10 1 1GE Cecilia Rossi Tecn. 0,30 1 1 1GE Mario3 Sannino PA 0,40 0,20 1 1MI Gianluca Alimonti RIC 0,50 1 1 0,20MI Attilio Andreazza PA 1 0,30 1 1MI Mauro Citterio D1TEC 1 0,10 1 1MI Simone Coelli Tecn. 0,40 1 1 1MI Luca Frontini PhD 1 1 0,60 1MI Danilo Giugni P1TEC 0,50 1 1 1MI Valentino Liberali PA 1 0,20 0,40 1MI Chiara Meroni DR 0,25 0,30 1 0,15MI Francesco Ragusa PO 0,10 0,30 1 1MI Seyedruhollah Shojali Assegnista 1 1 0,50 1MI Clara Troncon 11RIC 0,37 1 1 1TN Maurizio Boscardin RIC 0,10 1 1 1TN Gian1Franco Dalla3Betta PO 0,50 1 1 1TN Mostafa El3Khatib PhD 0,50 1 1 1TN Roberto Iuppa RTD1A 0,10 1 1 1TN David Macii PA 0,70 1 1 1TN Roberto Mendicino PhD 1 1 1 1,00TN D3M3S Sultan PhD 0,70 1 1 1TN Giovanni Verzellesi PO 0,70 1 1 1UD Mario3Paolo Giordani RU 0,30 1 1 1UD Gilberto Giugliarelli RU 1,00 1 1 1
Total 39 12,22 2,80 1,50 1,50
Total for the 4 R&D of interest for ITk - 39 persons (same as in 2016) - 18 FTE (was 16.2 in 2016)
Aggiornamenti in un paio di mesi
Lecce e Frascati hanno dimostrato serio interesse a partecipare; altri laboratori potrebbero aumentare il loro contributo à FTE>25 nei prossimi anni
Feb. 6, 2017 G.-F. Dalla Betta
Itk Money Matrix
GRAND TOTAL = 6282,60 kCHF
Pixel Contributions Italy
Common Item Contribution Italy
Final Message
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ü 2017 important steps:
• Contribute to the TDR!
• Test 3D sensor at very high fluence and produce new batches for test and assembly with RD53A.
• Qualify the high density bump deposition on 12” wafers.
• Choose a detector part to built and contribute with our expertize there.
Feb. 6, 2017 G.-F. Dalla Betta 21
Back-Up Slides
• Funding 2014-2017 • General ITK • Sensors • Bump Bonding • Mechanics • ITk Cooling • Electronics
Feb. 6, 2017 G.-F. Dalla Betta 22
RD_FASE2: Assegnazioni 2017
Fund
ing
Feb. 6, 2017 G.-F. Dalla Betta
RD_FASE2: Assegnazioni 2016
1) In corso ordine congiunto GE-MI a Selex per BB (40 kEuro) + residuo ~12 kEuro per lavorazione wafer 12’’
2) In attesa di riattivazione convenzione per ordine a FBK 3) Include contributo 2016 a Baby Demo
1 2
3
23 Fu
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Feb. 6, 2017 G.-F. Dalla Betta
A3vità Descrizione BO CS GE MI TN UD
3D
6"Waferprocurement(SOI,waferbonding,epi) - - - - 10.0 -PicoScope6407Digi:zerwith1.5GHzprobesandaccessories. - - - - 8.5 -
BB
6"dummywafers-testdeposi:onon6"andhigh-densitybumps(150k-bumps/chip) - - - 20.0 - -
BBfor3Dsensortest - - 24.0 - - -
MODUpgradeR/OSystems - 2.0 2.0 2.0 - 2.0
Moduleassemblyandirradia:on,RDonflex - - 10.0 - - -
MM-R/O Mul:moduleR/O 15.0 - - - - -
CO2/µCH Developµ-channelcooling - - - 10.0 - -
TotalrequestedbyATLAS15.0 2.0 36.0 32.0 18.5 2.0
105.5
RD_FASE2: Assegnazioni 2015
Fund
ing
Feb. 6, 2017 G.-F. Dalla Betta
2014: CSN1 funded (Feb and May) R&D Phase 2 activities for ATLAS & CMS inner trackers.
– Developmentof3DandAc:veEdgesensorswithFBK–3Batches(ATLAS/CMS)– Bump-bonding:developmentofIndiumbumps(6”sensors)andproduce
modules– Developatechnologyforpixeldetectorhybridiza:onusingC(dielectric)instead
ofR(bump-bonding)coupling– Comple:onofCO2testplant(combinedATLAS/LHCb)
Assignedon Sezione Category ATLAS/CMS/COMMON Assigned DescripVon
Feb2014 GE 3D COMMON 21000 Waferfor3Dsensors(commonwithCMS)
Apr2014 GE 3D COMMON 44000 3processesatFBK:2commipedwithMEMS3
May2014 GE HV ATLAS 13000 HV-CMOSHybridiza:on+3FE-I4Bwafers
May2014 MI BB ATLAS 27000 BBof3D(IBLdesignon6")+3FE-I4Bwafers
May2014 MI CO2/µ-CH ATLAS 20000 TRACI:co-fundedwithLHCb
125000
RD_FASE2: Assegnazioni 2014
Fund
ing
Itk Layout à strip TDR
2608/05/2015 RoadmaptoLayoutWorkshop
Strip
Pixel
One layout for strip; two concepts for pixel.
Gen
eral
ITk
The ITK Pixel detector: FullyInclined
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Outer Barrel
End cap
Innermost: Barrel + endcap
Same Endcap in both layouts, optimized for the Extended
Gen
eral
ITk
The ITK Pixel detector: Extended
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Outer Barrel
End cap
Innermost: Barrel + endcap
Gen
eral
ITk
Same Endcap in both layouts, optimized for the Extended
performance
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Gen
eral
ITk
Surfaces
Una Endcap à 3.3 m2 ma in processo di ottimizzazione, si potrebbe ridurre del 30% Il Pixel detector oggi e’ 1.9 m2
Gen
eral
ITk
Bump-bonding: Selex à Leonardo ü Requirements/challenges:
• 5x bump density of current IBL à 120 k-bumps/chip FEI4 size • Optimize the process on dummies (produced by FBK), studying bump height, size
and the process parameters as pressure and temperature. • Visual, mechanical and electrical test of the parts and assemblies.
• Bump deposition on 12-inch electronics and 8-inch sensors wafers (was 8” and 6”)
• Optimize the process on dummy supports • Wafers and deposition masks procured: test uniformity of bumps deposition.
• Handling of thin electronics (100 µm has been achieved for few FEI4 test
modules). • Indium bumps have an easier process that does not need temporary support
wafer à competitive for innermost layers
• 10x total surface (14-18 m2 vs current pixel of 1.7): • Need to optimize production flows and reduce bottle-necks as Flip-chip à
outsourcing ?
ü We are working with Leonardo for the R&D phase and to qualify it as vendor.
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Bum
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Bump-bonding@Leonardo: resistive chains
ü Very promising results from first resistive chain tests on 6”: • Bumps resistivity as expected • No open among 64k bumps (3 chips) • No indication of shorts (either by X-rays or R measurement) • Mechanical tests with thermal cycles on module-like structure are fine. • Flip-chip planarity needs to be improved.
ü Next steps: • Resistive chain QA with 12” wafers • … until high pitch density is available with real sensors/RD53A
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Bump-bonding@Leonardo: 12” deposition
ü Bump deposition on 12” bare wafer (just Si, no pattern) with several bumps openings under test • Wafer has been visually analyzed and bumps height measured with a
profilometer • preliminary results on bump height (~10 µm) uniformity good (~1 µm) if
opening is larger than 16 µm. • Some problems at the photoresist lift-off due to low number of bumps
(bump density is nominal but only in spots uniformly distributed over the wafer surface).
ü Next steps on daisy chains: • More tests needed with high bumps density all over the wafer and
daisy chains to measure bump resistivity. • Resistive chains layout on 12” is a common layout for all the groups. • In fabrication nowà BB in March.
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Bump-bonding@Leonardo: 12” deposition
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SLIMLONGERONPROTOTYPEPRODUCTION:MANUFACTURINGOFALUMINUMMOULDS
MODELOFTHEMOULDINTERNALCOMPONENTSWITHCRITICALMACHINING
DETAILOFTHECARBONFILAMENTSCORNERCROSSING(THEVOLUMEFIBERNEEDSTOBEMAINTAINEDCONSTANT)
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STRUCTUREALUMINUMMOULDSFOR:• TESTPROTOTYPES• FULLLENGTH
COMPONENTS
FORTHEPRODUCTIONOFTHECARBONFIBERLONGERON
Mec
hani
cs
STAINLESSSTEELMOULD
ALUMINUMMOULDSHORTPROTOTYPE(200mm)PRODUCEDINMILANOMECHANICALWORKSHOPSENTTOCERNTOTESTTHEDE-MOULDINGPROPERTIES
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WORKINPROGRESS:MANUFACTURINGSTUDIESFORALUMINUMFULLASSEMBLYMOULD,LENGTH400mm
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EXAMPLESOFCARBONFIBERLONGERONSTRUCTURESUNDERTEST
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SLIMCELLCRITICALINTERFACESUSEOFADVANCEDMATERIALS(NOALLDATAAREAVAILABLE)• SOLDERING(BRAZING)
BETWEENPIPEANDCOOLINGBLOCK
• PHASE-CHANGE-THERMALINTERFACE-MATERIAL
MATERIALCTEANDYOUNGMODULESUNDERINVESTIGATIONFEACALCULATIONOFTHESTRESSINTHEINTERFACES
BARRELCELL
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THERMO-MECHANICALFEA:EVALUATIONOFTHESTRESSINTHECELLCRITICALINTERFACES
TILTEDCELL
ISO-GRAPHITEBLOCK
Sn-37PbSOLDER
PHASE-CHANGETHERMALINTERFACEMATERIAL
TPGPLATE
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cs
41
FEASTUDY:EFFECTOFTHETHERMALRADIATIONONTHETHERMALFIGUREOFMERIT
THERMALRADIATIONEFFECTMODEL:CELLINACLOSEDCYLINDERENVELOPETOSIMULATETHEENERGYEXCHANGEWITHTHESURROUNDINGENVIRONMENTDUETOTHEINFRAREDRADIATIONEMISSIVITYCASESSTUDIED• Ɛ=1(BLACKBODY)• Ɛ=0.5(GRAYBODY)
Mec
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EFFECTOFTHETHERMALRADIATIONHEATEXCHANGEWITHASURROUNDINGENVIRONMENTAT20°C,FORBOTHTHEBARRELANDTILTEDSLIMCELLS:THETHERMALFIGUREOFMERITCHANGESWITHTHECOOLINGTEMPERATURE,WITHTHEEMISSIVITYOFTHEFACINGOBJECTS=>INCREMENTOFTHE6TO9%OFTHETFOMDUETOTHERMALRADIATIONEXCHANGE
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cs
COLDBOXFORSLIMCELLSOLDERING/THERMALINTERFACE
THERMALTESTBEFOREANDAFTERTHERMAL/PRESSURECYCLING
DEDICATEDCOLDBOXDESIGNCOMPLETEDCONSTRUCTIONWORKINPROGRESSDRY-AIRFLUXEDCHAMBERWITHINTERNALDEWPOINTMEASUREMENTCO2COOLINGSUPPLYFROM2PACLTRACICOOLINGUNITARMAFLEXINSULATIONTEMPERATUREPROBESATTACHEDTOTHESYSTEMUNDERTESTPOWERSUPPLYFORHEATERDUMMYLOADSLIMBARREL/TILTEDCELLUNDERTESTPRE-QUALIFICATIONUSINGADUMMYPROTOTYPE
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TESTPLAN:1. MEASUREMENTOFTHETHERMALFIGUREOFMERIT,APPLYINGPOWERWITHHEATERS
ANDMEASURINGTHETEMPERATURES,COOLINGTHECELLUSINGTHECO2SUPPLYFROMTHETRACIUNIT
2. CYCLETHEPROTOTYPE(100)TIMESBETWEENAMBIENTANDCOLDTEMPERATURE(-40°C)
3. POST-MEASUREMENTOFTHETHERMALFIGUREOFMERITAFTERTHECYCLES
CLIMATICCHAMBERTHERMALTEST
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CO2FLUID-DYNAMICCHARACTERIZATION
0
0.5
1
1.5
2
2.5
3
3.5
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
ORIFICE
PRE
SSURE
DRO
P-ba
r
MASSFLOWRATE-g/s
SWAGELOKFLOWRESTRICTORCALIBRATEDORIFICE=0,25mm(0,01")
CO2T,P(OUTLETFLOWRESTRICTOR)=-20°C,20barA
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CO2TESTOFCOOLINGCIRCUITCRITICALCOMPONENTSWITH2PACLTRACIUNIT
SOLVEDTHEPROBLEMSFOUNDINTHEPUMP:NEWGASKETTOWITHSTANDEXPLOSIVEDE-COMPRESSIONUNDERFINALCOMMISSIONINGATCERN
MILANOCOOLINGLAB.2PACLTRACIV.3UNIT
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NEXTFEATASKS:ANSYSACPFINITEELEMENTANALYSIS
EXAMPLE OF OPTIMIZATION PROCESS FOR THE TILTED CELL COOLING BLOCK
SLIM LONGERON FEA PERFORMANCE. RIGIDITY, VIBRATION FREQUNCIES, THERMO-MECANICAL STABILITY, MOUNTING FIXATIONS AND DETAIL STUDIES
46
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ITkCoolingsystemGenovaisinvolvedinthesplizngboxprojectandproduc:on.
3Dmetallicprintedprototypebysummer:me.
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Plant →PP1 • Common Mechanics group (Lukasz Zwalinski, Paolo Petagna, … ) • DEMO & BABY DEMO
PP1→Detector• Pixelside(DaniloGiugni,…)
8 Pump
1 4
7
3 2
9
Staves
Transfer line
5 6
PP2 PP1 Plant in USA15
Chiller
7
Splitting Box Splitting Box
ITK
Cool
ing
SchedaPixel_ROD
Features• 7-seriesXilinx®FPGAs
ü Kintex®7XC7K325Tfortriggeranddataprocessingü Zynq®Z020withphysicaldual-coreARMCortex-A9
• 1xPCIeExpressinterface(4GB/stowardsthePCmemory)• 16xGTX@10Gb/s
ü 1x10-Gb/slink(GBTx)• 1xHPC(400-pin)HS(HalfpairBOC-ROD)• 2xLPC(160-pin)HSdifferen:allinesManPower(anyoneWelcome!!)• INFN(Lab.Elepronica)
• G.Balbi,D.Falchieri,G.Pellegrini• DIFA:A.Gabrielli+studen:
• G.D’amen(XXXPhD12-2017)• N.Giangiacomi(XXXIPhD12-2018)• F.Alfonsi(Magistrale06-17)• C.Pre:(Magistrale03-17)
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