ASSY Process Introduction
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Transcript of ASSY Process Introduction
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Assembly Process Flow
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DIP
(Dual In Line Package)
SRAM, ROM, EPROM, EEPROM,
FLASH, Microcontroller
SOP
(Small Outline Package)
Linear, Logic, DRAM, SRAMPLCC
(Plastic Leaded Chip Carrier)
SRAM, ROM, EPROM, EEPROM,FLASH, Microcontroller
SOJ
(Small Outline Package)
Linear, Logic, DRAM, SRAM
QFP
(Quad Flat Package)
Microprocessor
BGA
(Ball Grid Array)
SRAM, ROM, EPROM, EEPROM,
FLASH, Microcontroller
TSOP
(Thin Small Outline Package)
DRAM, SRAM, SDRAM, FLASH
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MCP
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IBM1960
IC
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BGA
TSOP
()
()
()()
Wafer process:,,
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IC
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Trench BGA
Trench BGA topside
Trench BGA
Trench BGA backside
Solder ball
Compound Body
Substrate
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Body
(compound)
Solder ball
Glass fiber
Substrate
Solder mask
Trench BGA
Trench BGA lateral
Solder mask
Solder mask
BTBT
Glass fiber
Complex resin
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Wafer Grinding Wafer MountTapingWafer
Saw
Substrate curing Screen Print Post Cure Die Bond
Wire Bond Molding Laser Marking
Post Mold Cure Ball Mount Singulation Visual Inspection
Post Cure
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Wafer Grinding De-tapingTapingWafer
Mount
Wafer Saw Die Bonding Wire Bonding Molding
Post Mold CureLaser
MarkingDejunk/ Tr im Solder Plating
Forming/
SingulationLead ScanVisual Inspection
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TapingInput Output
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GrindingInput Output
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Auto MountInput Output
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Wafer SawInput Output
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Screen PrintInput Output
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Die BondInput Output
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Wire BondInput Output
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Molding
Input Output
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Laser Marking
Input Output
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Ball MountInput Output
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Singulation
Input
Output
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Epoxy Die Bonder
LOC Die Mounter
Epoxy
Top Side Back Side
Die Bon d
LOC Pkg
Con. Pkg
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Die BondInput Output
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Wire BondInput Output
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Molding
Input Output
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Laser Marking
Input Output
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DejunkInput Output
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Solder plating
Input Output
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Trim Forming
Input
Output
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