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DLR-RF-PS-STD-006 Issue 1 April 2010 Assembly and Test Houses: Discrete Semiconductor Components Generic Specification No. 5200 Issue 1 Deutsches Zentrum German für Luft- und Raumfahrt e.V. Aerospace Center .
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Transcript of Assembly and Test Houses: Discrete Semiconductor ... · PDF fileDiscrete Semiconductor...

  • DLR-RF-PS-STD-006 Issue 1

    April 2010

    Assembly and Test Houses:

    Discrete Semiconductor Components

    Generic Specification No. 5200

    Issue 1

    Deutsches Zentrum German fr Luft- und Raumfahrt e.V. Aerospace Center .

  • 38 Assembly and Test Houses:

    Discrete Semiconductor Components

    Generic Specification No. 5200 DLR-RF-PS-STD-006

    2

    Copyright 2005 German Aerospace Center - DLR. All rights reserved. Copyright in this document is owned by German Aerospace Center - DLR. Any person is hereby authorized to view, copy, print, and distribute this document subject to the following conditions:

    The document may be used for informational purposes only. The document may only be used for non-commercial, non-profit purposes. Any copy of this document thereof must include this Copyright notice.

    This document is provided "as is", and copyright holders make no warranties, including, but not limited to, warranties of merchantability, fitness for a particular purpose, non.infringement; that the contents of the document are suitable for any purpose; nor that the implementation of such contents will not infringe any third party patents, copyrights, trademarks or other rights. Copyright holders will not be liable for any direct, indirect, special or consequential damages arising out of any use of the document or the performance or implementation of the contents thereof. For permission requests, questions, or further information, please contact Dr. Andreas Jain - DLR - Quality and Product Assurance, +49 (2203) 601 - 2954.

  • 38 Assembly and Test Houses:

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    TABLE OF CONTENTS

    1. INTRODUCTION................................................................................................................... 9 1.1 SCOPE ..................................................................................................................................................... 9 1.2 APPLICABILITY ........................................................................................................................................ 9 2. APPLICABLE DOCUMENTS............................................................................................... 9 2.1 ESCC SPECIFICATIONS ......................................................................................................................... 9 2.2 DLR SPECIFICATIONS ............................................................................................................................ 10 2.3 OTHER (REFERENCE) DOCUMENTS .................................................................................................... 10 2.4 ORDER OF PRECEDENCE ..................................................................................................................... 10 3. TERMS, DEFINTIONS, ABBREVIATIONS, SYMBOLS AND UNITS ................................. 10

    4. REQUIREMENTS ................................................................................................................. 11 4.1 GENERAL................................................................................................................................................. 11 4.1.1 Specifications ............................................................................................................. 11 4.1.2 Conditions and Methods of Test ................................................................................. 11 4.1.3 Assembly and Test Houses Responsibility for Performance of Tests and Inspections11 4.1.4 Inspection Rights........................................................................................................ 11 4.1.5 Pre-encapsulation Inspection Witnessing ................................................................... 12 4.2 CAPABILITY APPROVAL AND CAPABILITY APPROVAL MAINTENANCE REQUIREMENTS ON A

    ASSEMBLY AND TEST HOUSE.......................................................................................................... 12 4.3 DELIVERABLE COMPONENTS............................................................................................................... 12 4.3.1 Lot Failure .................................................................................................................. 12 4.4. MARKING ................................................................................................................................................. 12 4.5 MATERIALS AND FINISHES.................................................................................................................... 13 4.6 RADIATION TESTING .............................................................................................................................. 13 4.7 PROCUREMENT OF DISCRETE SEMICONDUCTOR WAFERS/DICE .................................................. 13 4.7.1 General ...................................................................................................................... 13 4.7.2 Supplier Selection ...................................................................................................... 14 4.7.3 Selection of Discrete Semiconductor Dice.................................................................. 14 4.7.4 Procurement Specifications for Discrete Semiconductor Dice .................................... 14 4.7.5 Conditions and Methods............................................................................................. 14 4.7.6 Production Lot ............................................................................................................ 15 4.7.7 Traceability................................................................................................................. 15 4.7.8 Control of Changes .................................................................................................... 15 4.7.9 Incoming Inspection ................................................................................................... 15 4.7.10 Handling and Storage of discrete semiconductor dice .......................................... 16 4.7.11 Documentation ....................................................................................................... 16 5. PRODUCTION CONTROL ................................................................................................... 16 5.1 GENERAL................................................................................................................................................. 16 5.1.1 Rebonding.................................................................................................................. 16 5.2 WAFER LOT ACCEPTANCE.................................................................................................................... 16 5.2.1 Process Monitoring Review ........................................................................................ 16 5.2.2 Scanning Electron Microscope ( SEM ) Inspection ..................................................... 17 5.2.3 Total Dose Radiation Testing ..................................................................................... 17 5.2.4 Documentation ........................................................................................................... 17 5.3 SPECIAL ASSEMBLY CONTROLS.......................................................................................................... 17 5.3.1 Process Monitoring Review ........................................................................................ 17 5.3.2 Pre-encapsulation Inspection ..................................................................................... 17 5.3.3 Dimension Check ....................................................................................................... 18 5.3.4 Weight........................................................................................................................ 18

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    5.3.5 Documentation ........................................................................................................... 18 6. SCREENING TESTS ............................................................................................................ 18 6.1 GENERAL................................................................................................................................................. 18 6.2 FAILURE CRITERIA ................................................................................................................................. 18 6.2.1 Environmental and Mechanical Test Failure ............................................................... 18 6.2.2 Parameter Drift Limits................................................................................................. 19 6.2.3 Parameter Limit Failure .............................................................................................. 19 6.2.4 Other Failures ............................................................................................................ 19 6.3 Failed Components .................................................................................................... 19 6.4 LOT FAILURE........................................................................................................................................... 19 6.4.1 Lot Failure during 100% Testing................................................................................. 19 6.4.2 Lot Failure during Sample Testing.............................................................................. 19 6.5 DOCUMENTATION ......