Silicone Materials for Photovoltaic Module Assembly (Fall 2010)

Barry Ketola, Dow Corning

Internal evaluations at Dow Corning and with select external partners have shown that highly efficient

solar cells using silicones as the encapsulant can be assembled with very good reliability. This

presentation focuses on the key properties of silicones both initially and after accelerated aging.

Performance measurements are also addressed.

Opportunities Trends & Drivers in the Medical Adhesives Market (Fall 2010)

Joseph Luizzi, GlaxoSmithKline

Rapidly growing emerging markets, consolidations and mergers, an aging population, and increasing

regulation will provide challenges to the medical adhesives market, but also present economic reward to

those who understand the changes and the role their companies can play.

Opportunities in Alternate Energy Markets: Solar (Fall 2010)

Dave Nick, DPNA International, Inc.

The development of alternate energy sources has become a hot topic. The most discussed is wind turbine

electrical generation. A close second to wind is solar-generated electrical power. Both are consumers of

adhesives and sealants and offer a growing market opportunity to formulators and raw material

suppliers. The presentation will cover typical adhesive and sealant products, “Who’s Who” in the

industry, and the fabrication needs for primarily photovoltaic panels.

Protective Layers for Photovoltaic Modules (Fall 2010)

Dr. Monica Tisack, DuPont

Long-life photovoltaic modules require durable materials that can withstand a wide variety of

environmental conditions. Individual material choices and changes can affect both adjacent and

nonadjacent components of the module, which, in turn, can impact the performance. This presentation

will include discussion on the importance of material choices and describe the various DuPont materials

that are used in module protection.

Offshore Wind Energy Turbine Foundation (Spring 2011)

Peter Gorlitz, ITW WindGroup

Over the past 10 years, wind power has become an important factor in power production. In addition,

offshore wind power is 30 percent more efficient than on shore. During the first decade of this century,

Europe installed more than 2500 MW and development is increasing. This session will present an

overview into the different structures, methods of installation and securing the structures to the seabed,

based on a broad experience in this field. The presentation will also address logistical challenges, vessels

used, driving aggregates, drills, lifting, grout installation, UHPC grout material and grout seals.

Development Partnering for Improved Wind Energy Products (Spring 2011)

Kevin Lambrych, Ashland Performance Materials

Today’s utility-scale wind turbine blades are made from a variety of reinforcements, thermoset resins,

adhesives and coatings. All of these materials must work well together for required blade performance,

safety and longevity. As the wind market matures, more is known about factors that lead to successful

blade design. This opens the door for leveraging technologies that optimize performance while lowering

costs to the fabricator and OEM. This presentation will focus on the importance of building effective

partnerships along all aspects of the wind blade value chain for adoption of new technology while

minimizing risk.

Opportunities in the Wind Energy Supply Chain – A National Perspective (Spring 2011)

Tom Maves, American Wind Energy Association

Mr. Maves focuses on the current state of the U.S. wind energy industry and the opportunities for

component and material suppliers to enter the wind energy supply chain.

Pressure-sensitive Tape Focus on Wind Energy (Spring 2011)

Cindy Stoner, Intertape Polymer Group

IPG is a leading manufacturer of a comprehensive range of tape and film based products designed for the

composites industry. The program will review the specialty tape development based around various

products used in the production of wind turbines. IPG will highlight its focus on developing products that

work in conjunction with value add products such as semi-permanent release agents. IPG will provide an

overview of its research and development alliances, which offer value from a solution standpoint to a

cost reduction option.

Adhesive & Sealant Application Technologies to Reduce Costs of Photovoltaic (PV) Module Assembly

Dave Deibel, Nordson Corporation (Fall 2011)

This presentation will review and update developments since our original ASC solar technology

presentation in fall 2008 regarding application technologies for adhesives and sealants to meet the

challenge of reducing production costs for photovoltaic (PV) modules. Various assembly applications will

be examined – encapsulation, glass-to-glass bonding, edge sealing, junction box attachment, framing –

as well as automated means to enable applied materials more creatively, precisely, efficiently and cost-

effectively. As has been experienced in other industries, an evolving assembly process that implements

lower cost, bulk quantities of various adhesives and sealants utilizing more automated application

technologies will further the goal to make solar energy use more affordable.

Future Trends of Roof-Mounted PV (Fall 2011)

Rob Haddock, Metal Roof Advisory Group, Ltd.

PV is no longer just a fad. It is a burgeoning industry with falling prices, rising efficiencies, public policies

and financial incentives that ensure a steep growth curve. The next several years will see these new

technologies refined for cost-effectiveness and durability. This means that interface with rooftops will

become a science that is increasingly sustainable for both PV and rooftop, increasing focus on the

compatibility and real service life of both PV and roof. PV design will drive decisions in roofing types.

What PV technologies really “fit” for rooftop arrays and why? What roofing technologies really “fit” for

solar rooftops and why? How will these factors change the way rooftop PV systems are deployed?

PV Industry Trends and New Encapsulation Technology (Fall 2011)

John Naumovitz, Dow Chemical Company

The PV Industry has experienced tremendous growth in recent years and is expected to achieve 25%

CAGR in the future. Industry trends will be reviewed and several technology drivers for the industry will

be discussed. Lastly, a new polyolefin-based encapsulant film for use in Photovoltaic Modules enabling

improved performance will be discussed.

Photovoltaic (PV) Material Safety Certification Requirements (Fall 2011)

Crystal Vanderpan, Underwriters Laboratories Inc.

Polymeric materials play an important role in the safety performance of PV modules. PV material

compliance with established standards is essential for manufacturers who aim to have their modules

certified by Underwriters Laboratories. Learn about the UL and IEC requirements for polymeric materials

in PV modules, the preselection program, and more, which will help you get your PV polymeric materials

to market faster.

The Road Ahead for Consumer Electronics (Spring 2012)

Chris Ely, Manager, Industry Analysis, Consumer Electronics Association

This presentation will focus on key trends surrounding the U.S. consumer electronics industry, including

shipment volumes and revenue trends. The presentation will also highlight consumer and retail trends as

they relate to the purchase of consumer electronics.

Adhesive Advantages in Mobile Electronics Assembly (Spring 2012)

Larry Saidman, Chief Technologist, Nordson Corporation

Mobile electronic devices, including smartphones and tablet computers, are one of the fastest growing

global consumer market segments. Annual growth rates as high as 245% have been reported for the new

tablet market, while the more established smartphone market is still growing in the range of 42% – 52%.

The need for devices to exhibit small size, light weight, and drop resistance creates unique drivers for

adhesives to replace mechanical fasteners in mobile electronics assembly. Very short product life cycles

with high volume and flexible production result in specialized assembly process requirements. This paper

focuses on the distinct relationship of the OEM design firm, the contract manufacturer, adhesive supplier

and adhesive application equipment supplier to meet the needs of this demanding and fast-paced

market.

Clear Encapsulants for Electronic Applications (Spring 2012)

Robert Wallach, Product Development Manager, Polysciences, Inc.

A range of chemical technologies are used for electronic component encapsulating. Specific

classes of these products are used for their clear and colorless properties. These products must

have all the needed requirements of good encapsulating products along with clarity. This

presentation will focus primarily upon the dominant technologies such as epoxy, silicone, and

acrylic. Within each of these general classes there is a wide range of product types. Also,

discussed will be the distinct performance and processing, as well as the advantages and

limitations of each technology.

A Manufacturers Perspective on the Electronics Market (Fall 2013)

Douglass Dixon, Marketing Manager, Henkel Electronic Materials LLC

The electronics world has been driven by constant change, but there is a prevailing trend

throughout the industry and can be summed up as follows: smaller, faster, and more functional.

The capability of many digital devices is strongly linked to Moore’s law: processing speed,

memory capacity and functionality. Moore’s law simple states: The numbers of transistors on an

IC will double every 2 years. This exponential improvement has dramatically enhanced the impact

of digital devices. This presentation takes a macro look at the effect of Moore’s law on

electronics devices and some of the challenges these changes are creating.

Overview of Markets and Trends from the 2012-2015 ASC Market Reports (Fall 2013)

David Nick, President/CEO, DPNA International, Inc.

Two new market studies are now available from the ASC for 2013. The first is an analysis and

outlook for the North American adhesive and sealant industry with a special, more in depth look

at the USA electronics market and discussion of the BRICS’ influence on the marketplace. The

second market study is an overview and report on our industry’s outlook in the fast growing Asia

Pacific region. This presentation will be highlights from each regional report and where

opportunities may be found for both new and existing participants. Both reports are structured

to be of value to formulators and raw material suppliers alike.