ASHRAE Thermal Guidelines_ SVLG 2015

7/26/2019 ASHRAE Thermal Guidelines_ SVLG 2015

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1

ASHRAE Thermal Guidelines



2

Agenda

• ASHRAE and TC9.9

•

Thermal Guidelines (Third Edition)

• Air-cooling

• Liquid-cooling

•

Air-cooling thermal guidelines in practice•

Performance

• Reliability



3

ASHRAE and TC 9.9

•

ASHRAE• American Society of Heating, Refrigeration and Air-

Conditioning Engineers

•

Technical Committee 9.9• Technical Committee 9.9 – Mission Critical Facilities, Data

Centers, Technology Spaces, & Electronic Equipment(http://tc99.ashraetcs.org/index.html)

•

Environment – thermal, structural, design, testing of datacenters and technology spaces for IT equipment

•

Committee Members• IT equipment manufacturers

•

Environmental equipment manufacturers

•

Data center designers

• End users



4

TC 9.9 Datacom Book Series

1. Thermal Guidelines for Data Processing Environments 3rd Edition

2.

Datacom Equipment Power Trends & Cooling Applications 2nd Edition(2012)

3.

Design Considerations for Datacom Equipment Centers (2006)

4. Liquid Cooling Guidelines for Datacom Equipment Centers 2nd Edition(2014)

5. Structural & Vibration Guidelines for Datacom Equipment Centers(2008)

6.

Best Practices for Datacom Facility Energy Efficiency (2008)7.

High Density Data Centers – Case Studies & Best Practices (2008)

8. Particulate & Gaseous Contamination in Datacom Environments (2009)

9. Real-Time Energy Consumption Measurements in Data Centers (2009)

10. Green Tips for Data Centers (2011)



Thermal Guidelines for Data ProcessingEnvironments

Chapter 1 – IntroductionChapter 2 – Environmental Guidelinesfor Air-Cooled Equipment

Chapter 3 – Environmental Guidelinesfor Liquid-Cooled Equipment

Chapter 4 – Facility Temperature & HumidityMeasurement

Chapter 5 – Equipment Placement & AirflowPatterns

Chapter 6 – Equipment Manufacturers Heat& Airflow Reporting



Air-Cooled IT Equipment Class Ranges

•

Allowable Range – ITE designed to function within thisrange

• Recommended Range – Guidance from ITEmanufacturers for high reliability, minimal powerconsumption (of ITE) and maximum performance

•

Operating Range – Actual limits for an individualdatacenter

• Can begin with the recommended range

• Dependent upon datacenter operator’s evaluation of

ITE factors described in the whitepaper incombination with knowledge of the datacenterdesign



2011 ASHRAE Thermal Guidelines

!"#$%%"&'"'



Operating

Envelope

ITE

AllowableEnvelope

ITE

Corrosion

ITE

AcousticalNoise

ITEReliability

ITE Power

ITE

Performance

ITE Cost

ITEAirflow

Datacenter

operationalknowledge

Operating Envelope



Liquid-Cooling Environments

IT EquipmentFacility

Atmosphere Building Room Aisle Rack System Board Chip

ReferencePoint



2011 ASHRAE Liquid-Cooled Guidelines

Classes Main Cooling

Equipment

SupplementalCooling

Equipment

FacilitySupply Water

Temp (°C)

W1

Chiller/Cooling Tower

Water-sideEconomizer

(w/ drycooler orcooling tower)

2 – 17

W2 2 – 27

W3 Cooling Tower Chiller 2 – 32

W4

Water-side Economizer(w/ drycooler orcooling tower)

N/A 2 – 45

W5 Building heating system Cooling tower > 45



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Optimize Performance, Power, Acoustics

ITE Thermal Design

DamageLimit Shutdown

FunctionalLimit

Performance

and PowerManagement

Reliability

Limit

Manage

Cooling C o m

p o n e n t T

e m p e r a t u r e



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Damage Protection

Turbo

Design

P o w e r S a v i n g ,

L o w e r F r e q u e

n c y

PO

P1

P2

Pn

•

•

•

CPU Performance – Light Load

21°C

A 4 W o r k l o

a d - t u n e d

35°C

A 2 s e r v e r

45°C

A 4 s e r v e r

A 2 s e r v e r

T

A 4 W o r k l o

a d - t u n e d

A 4 s e r v e r

A 2 s e r v e r

A 4 W o r k l o

a d - t u n e d

A 4 s e r v e r

Unpredictable performance, memory follows a similar trendalthough throttling mechanism is different



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Damage Protection

PO

P1

P2

Pn

•

•

•

Turbo

Design

P o w e r S a v i n g ,

L o w e r F r e q u e

n c y

CPU Performance – Heavy Load

A 4 W o r k l o

a d - t u n e d

A 2 s e r v e r

A 2 s e r v e r

T

Performance – dependent on adequacy of thermal design

A 2 s e r v e r

A 4 W o r k l o

a d - t u n e d

A 4 s e r v e r

A 4 s e r v e r

A 4 W o r k l o a d - t u n e d

A 4 s e r v e r

21°C 35°C 45°C



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Reliability ‘X-Factor’

"##$%&# '()*)$($# +, - ./ - 0123 (4&56*() 789: ;5< =$>? @&%4A 69 B@C 8)>&9A



15

Server Reliability Trend vs. Ambient Temperature(cont.)

! 2010 dry bulb temp for Chicago with air mixing to maintain 59°F min. temp.



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! Cross referencing the hardware failure rates with the dry bulb data forChicago, we can establish the Net X-Factor across the whole year.

Application of X-Factor (Chicago example)

)*" +", -./0#,$1 2$1 3& 4*3#05$ 6) *01'701" 203891" 73,* #$%:1";;$1.8";;

#$$83&5 0&' 0 <0130=8" '0,0 #"&,"1 ,"%:"10,91" 3; 08%$;, ">0#,8? ,*" @ABC

0; 32 ,*" '0,0 #"&,"1 70; $:"10D&5 0, 0 D5*,8? #$&,1$88"' ,"%:E $2 FGH/E



17

! Average Net Failure Rate Comparison for Air-sideEconomization (US Cities)

City Comparison: Reliability



18

! Chiller Hours Per Year for Air-side Economization (US Cities)

City Comparison: Chiller Hours



19

Backup



20

ETSI

i l l



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ASHRAE Environmental Classes2011 2008 Applications IT Equipment Environmental Control

A1 1

Datacenter

Enterprise servers, storage

productsTightly controlled

A2 2 Volume servers, storage products,

personal computers, workstations Some control

A3 NA Volume servers, storage products,


A4 NA Volume servers, storage products,


B 3 Office, home,

transportable

environment, etc.

Personal computers,

workstations, laptops, and

printers Minimal control

C 4 Point-of-sale,

industrial,

factory, etc.

Point-of-sale equipment,

ruggedized controllers, or

computers and PDAs No control



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2011 Thermal Guidelines – Power and Airflow

–

Power – ITE thermal management drives air movers to cool components

–

Air movers, some silicon devices consume more power with elevated temperature

–

Airflow required not linear with temperature

Ambient Tem erature - C

10 15 20 25 30 35 40

S e r v e r P o w e r I n c r e a s e - x f a c t o r

1.00

1.05

1.10

1.15

1.20

1.25

S e r v e r P o w e r I n c r e a s e - x f a c t o r

Ambient Tem erature - de rees C

10 15 20 25 30 35

S e r v e r A i r F l o w r a t e I n c r e a s e

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

2.6

2.8@"1<"1 I$7"1 @"1<"1 A31J$7

ASHRAE Thermal Guidelines_ SVLG 2015

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