Areospace and defence deceber 15

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Welcome to

your Digital Edition of

Aerospace & DefenseTechnology

December 2015

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3-Phase Single-Step Power Factor Correction in MilAero Systems

Using Sensor Technology to Combat Legacy Issues in Defense Avionics

Counterfeit Electronics in the DOD Supply Chain

Sandwich Cores for the Future

How Avionics Developments are Changing Life in the Cockpit

Supplement to NASA Tech Briefs

December 2015

© Copyright 2015 COMSOL. COMSOL, COMSOL Multiphysics, Capture the Concept, COMSOL Desktop, COMSOL Server , LiveLink, and Simulation for Everyone are either registered trademarks or trademarks of COMSOL AB. All other trademarks are the property of their respective owners, and COMSOL AB and its subsidiaries and products are not affi liated with, endorsed by, sponsored by, or supported by those trademark owners. For a list of such trademark owners, see www.comsol.com/trademarks

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3-Phase Single-Step Power Factor Correction in MilAero Systems

Using Sensor Technology to Combat Legacy Issues in Defense Avionics

Counterfeit Electronics in the DOD Supply Chain

Sandwich Cores for the Future

How Avionics Developments are Changing Life in the Cockpit

Supplement to NASA Tech Briefs

December 2015

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http://www.abpi.net/ntbpdfclicks/l.php?201512ADTPHOME

A recent study conducted for the aerospace industry showed that more than 29 percent of microwave assemblies fail during installation, and aircraft manufacturers

have accepted the practice of simply replacing them. However, with the need to decrease costs, they can no longer afford the total cost associated with assemblies that cannot withstand the installation process and the extreme conditions of aerospace. Manufacturers need assemblies that provide the same level of electrical performance before and after installation as well as throughout their service life.

Performance Testing with an Installation Simulator

W. L. Gore & Associates (Gore) has designed a simulator to evaluate the stress of installation on microwave airframe assemblies. The simulator has several features that replicate minimum bend radius conditions, routing guides that induce torque, and an abrasion bar to simulate routing across sharp edges or through access holes in the airframe structure.

The simulator enables Gore not only to evaluate the electrical performance of various cable assemblies after

installation but also to design products that meet real application challenges. Testing electrical characteristics such as insertion loss and VSWR before and after routing

withstand the rigorous challenges of installation – resulting in lower total costs and longer service life.

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Performance That Meets the Challenge

Gore has engineered new ruggedized, lightweight and vapor-sealed airframe assemblies that withstand the challenges of aerospace. These assemblies – known as GORE-FLIGHT ™ Microwave Assemblies, 6 Series – improve system performance with:

• Outstanding signal integrity with lowest insertion loss before and after installation

• Lower installation costs due to fewer failures and reduced aircraft production delays

• payload with lightweight assembly

• Longer system life and reduced downtime due to mechanically robust construction

• Less RF interference among electronic systems due to superior shielding effectiveness

• Proven compliance with MIL-T-81490 requirements

When compared to other leading airframe assemblies, the 6 Series maintain lower insertion loss, more reliable VSWR performance, and consistent impedance of 50 ± 1 Ohms, eliminating insertion loss stack-up issues when routing through airframe bulkheads.

With GORE-FLIGHT ™ Microwave Assemblies, 6 Series, a

most cost-effective solution that ensures mission-critical system performance for military and civil aircraft operators.

A recent study conducted for the aerospace industry showed that more than 29 percent of microwave assemblies fail during installation, and aircraft manufacturers

hahavve accepted the practice of simply replacing them. However, with the need to decrease costs, they can no longer afford the total cost associated withassemblies that cannot withstand the installationprocess and the extreme conditions of aerospace. Manufacturers need assemblies that provide the same level of electrical performance before and after installation as well as throughout their service life.

Performance Testing with an Installation Simulator

W. L. Gore & Associates (Gore) has designed a simulator to evaluate the stress of installation onmicrowave airframe assemblies. The simulator has several features that replicate minimum bend radius conditions, routing guides that induce torque, and anabrasion bar to simulate routing across sharp edges or through access holes in the airframe structure.

The simulator enables Gore not only to evaluate theelectrical performance of various cable assemblies after

installation but also to design products that meet realapplication challenges. Testing electrical characteristics such as insertion loss and VSWR before and after routing

withstand the rigorous challenges of installation – resulting in lower total costs and longer service life.

GORE-FLIGHT™ Microwave

Performance Th Meets the Cha

Gore has engineered new vapor-sealed airframe assthe challenges of aerospaassemblies – known as GOMicrowave Assemblies, 6 improve system performa

• Outstanding signal intlowest insertion loss bafter installation

• Lower installation costfewer failures and redproduction delays

•payload with lightweig

• Longer system life andmechanically robust c

• Less RF interference asuperior shielding effe

• Proven compliance wit

When compared to other l6 Series maintain lower inperformance, and consisteliminating insertion lossthrough airframe bulkhea

With GORE-FLIGHT ™ Micr

most cost-effective solutiosystem performance for m

Alternative Airframe Assembly VSWR

Proven Performance of GORE-FLIGHT™ Microwave Assemblies

gore.com/simulator


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2 Aerospace & Defense Technology, December 2015Free Info at http://info.hotims.com/55596-757

Aerospace & Defense Technology

ContentsFEATURES ________________________________________

4 Power Supplies4 3-Phase Single-Step Power Correction in MilAero Systems

10 Test & Measurement10 Using Sensor Technology to Combat Legacy Issues in Defense

Avionics

14 Designing with FPGAs14 Counterfeit Electronics in the DOD Supply Chain

17 Avionics17 Touch and Go — Avionics Developments are Changing Life in

the Cockpit

22 Materials22 Sandwich Cores for the Future

26 RF & Microwave Technology26 Making AESA Radar More Flexible29 Developing Secondary Surveillance Radar Automated Test

Equipment

31 Tech Briefs31 Structural Composites with Tuned EM Chiralty32 Advanced, Single-Polymer, Nanofiber-Reinforced Composite

33 Quantitative Diagnostics of Multilayered Composite Structureswith Ultrasonic Guided Waves

34 Reactive, Multifunctional, Micellar, Composite Nanoparticlesfor Destruction of Bio-Agents

DEPARTMENTS ___________________________________

36 Technology Update39 Application Briefs41 New Products44 Advertisers Index

ON THE COVER ___________________________________

An illustration depicting what a PreliminaryResearch Aerodynamic Design to Land on Mars(Prandtl-m) aircraft might look like flying abovethe surface of Mars. To learn more about thisunique project, read the Technology Updatearticle on page 38.

(Photo courtesy of NASA/Dennis Calaba)

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4 www.aerodefensetech.com Aerospace & Defense Technology, December 2015

As OEMs seek advantages inSize, Weight, Power andCost (SWaP-C), focus isshifting to advancements in

power electronics. Gaining an advan-tage requires close attention not onlyto performance requirements such aspower factor and current distortion,but also size, weight, efficiency andcost. This is no small feat, given thatpower solutions must seamlessly han-dle the multi-step regulation and isola-tion of electronic circuits, a costly andcomplex process commonly requiredfor AC to DC conversion in high-per-formance power applications.

Existing power electronics solutionshighlight the challenge; based on auto-transformer rectification units (ATRUs)or Vienna rectifiers, these systems canbe heavy, overly complicated and in-flexible as power needs evolve during

long-term system deployment. Thelandscape is evolving to address this,and today includes a new circuit topol-ogy that achieves three-phase activepower factor correction, power regula-tion and electrical isolation in a singleconversion step. The resulting high-power conversion efficiency solves along list of potential design challenges,helping drive advancements in militaryplatforms, shipboard systems and com-mercial aircraft.

High Performance Power ConversionThree-phase AC power must rou-

tinely be converted to DC voltage forsafe and ready use in military and in-dustrial applications. Typical devices forconverting a three-phase power input toan adjustable DC output generally re-quire two steps: 1) a rectification stagefor converting AC input into DC out-put, followed by 2) a DC-DC conversionstage for regulating and isolating theDC output voltage. The DC-DC conver-sion stage may be capable of raising orlowering the DC voltage level, or both,depending on the particular features ofa given device.

At the same time, this type of ad-vanced power solution must pose alow technical risk, reducing the threatof failure as well as the cost of design-ing, manufacturing and maintainingthe circuitry. The resulting circuitrymust be operable in applications sup-

plied by high-frequency power, suchas the 115V 400Hz AC power com-monly used for aircraft. Ultimately,the goal of rectification is to provideisolated, regulated DC output, free ofinput harmonics and with a unitypower factor.

Power Electronics Design LandscapeExisting rectification options in-

clude passive power factor correction,ATRUs, single phase x3, and Viennasolutions – each requiring a multi-stepapproach. The addition of a single-step solution is unique; developed byMarotta Controls, this topology en-ables power electronics engineers toachieve extremely efficient circuit per-formance and eliminate wastedpower, weight, volume and cost asso-ciated with a second DC-DC conver-sion. Achieving regulation and isola-tion in one conversion simplifiescomplicated circuitry; systems have atangible design advantage with re-duced size and weight, improved per-formance based on low harmonics(<3%), and unity power factor of oneat both full and partial loads. Lookingat the primary features of contrastingsolutions illustrates the value and de-sign challenges of each option.

Passive Power Factor Correction (PPFC)Passive power factor correction keeps

costs down with the absence of active

Phase Single-StepPower Correctionin MilAero Systems

Figure 1. This graph illustrates unwanted powerperformance, with extreme disparity between per-fect sine wave voltage and current waveform.(Marotta Controls)

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Power Supplies

components, but requires increased in-ductance and capacitance. Solutions areheavy, not inherently smart, and limitedto low-power applications ranging from akilowatt to ~1500W. Output power is lim-ited to ~2kW of voltage and power factoris only achieved at upper-end loads. Fre-quency is usually around 400Hz; for mili-tary and industrial applications in therange of 60Hz, the device would be toolarge for practical deployment.

ATRUsNo regulation or isolation is available

in PPFCs or ATRUs, leading to a moredifficult second step DC-DC conver-sion. ATRU topologies do have an ad-vantage over PPFCs, as they can handlehigher power and achieve power factorthrough the entire load. Yet solutionsremain costly and impractically heavyfor SWaP-conscious, high-performanceapplications. ATRU power density is just444 watts per pound, while a single steptopology may be as high as 930 wattsper pound.

Single Phase x3Using three lines of single-phase

power is an option; however, this re-sults in no isolation, step-up voltageonly, and not one but two stages of DCDC conversion to yield convertedpower. The solution is risky and intri-cate, requiring nine independent con-

trol circuits working together – one foreach of three DC converters, DC-DCconverters, and load share circuits.Power factor is achieved through theentire load as well as low current totalharmonic distortion (THD), althoughoverall efficiency is reduced based on acomplicated, costly and heavy design.The device is opened up to greater en-gineering requirements and additionalpoints of failure, while cost, weightand space are added to the design.

Vienna RectifiersVienna rectifiers are complex, with

three switch-controlled rectifier circuits.A single control circuit uses heavy calcu-lations to determine a separate controlinstruction set for each rectifier. Outputvoltage may only be stepped up and notdown, a drawback that limits Vienna de-vices to high voltage output. The systemoffers no isolation and can regu-late only to 350 volts and abovewithout a second DC-DC conver-sion. When a particular applica-tion requires something lower,perhaps 270 volts, the output isactually lower than the line volt-age. The Vienna solution wouldrequire a second DC-DC conver-sion to accommodate down-con-version, adding unwanted costand technical risk, as well as in-creased weight and space.

Single Step TopologyThe single-step topology includes a

rectifier circuit for rectifying three-phase power input into a plurality ofrectified outputs, a converter circuit forconverting each of the rectified outputs,and a control circuit for generating thecontrol signal based at least in part onthe single DC output.

Because regulation and isolation arehandled in one step, total power effi-ciency is maintained at 96% or equiv-alent efficiency at 100%. Ideal powerfactor of one is achieved through theentire load; output is regulated andisolated without a second DC-DC con-version and can be stepped up ordown depending on the needs of theapplication. Load sharing occurs auto-matically with one converter thatdoes not require current sensing. As aresult, the device can scale by linking

Single Step Power Topologies in ContextPower systems deployed onboard military vehicles and aircraft, naval ships, or civil aircraft must meet a range of industry cer-

tifications to ensure military and commercial performance standards. For example MIL-STD-461 defines performance for all elec-tronic, electrical and electromagnetic equipment and subsystems procured and used by all branches of the Department of Defense(DoD), while validation to MIL-STD-1399 further ensures the circuit meets the required characteristics for shipboard equipmentusing AC electric power. Further, conducted emissions (CE101) validation ensures that low frequency conducted emissions are prop-erly controlled by the circuit, and that its harmonics do not conflict with any operational requirements of related systems. Singlestep power topologies are poised to play an important role here, meeting these standards while ensuring high power conversionefficiency and power factor of one, reducing cost and size, and minimizing moving parts and complex control circuits.

For shipboard systems, inherently difficult harmonics distortion and power factor requirements commonly dictate thatany application over 1500 Watts requires an active power factor solution; however traditional solutions can be too large forshipboard deployment. Applications often include switch-mode power supplies, for example running a large bank of elec-tronics equipment, which present a difficult load that does not appear resistant. Using a 60Hz application as an example,a single step topology offers a size and performance advantage in contrast to a magnetics-based solution such as an ATRUor Vienna device containing large inductors.

Airborne electronics have similar stringent requirements, defined in the RTCA-DO160 specification, a key section of theindustry’s DO160 standard for power quality requirements. Commercial aircraft have numerous power converters onboard;the engine generates three phase power which must in most cases be converted to DC to be used safely. When these sys-tems run AC motors, they also require an intervening device to control the power factor. In addition to its own set of con-ducted emissions ratings, RTCA-DO160 assures avionics safety and reliability by requiring very low current harmonic dis-tortion and high power factor of one, or close to it.

Figure 2. This graph illustrates the power performance ideal,with current following voltage and power factor of one.(Marotta Controls)

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multiple 3kW modules to achieve6kW, 9kW, 12kW, 15kW performanceand more.

Engineering Challenges In power rectification, design issues

related to power factor correction, electrical isolation, and input current

distortion often consume the most engineering resources.

Power Factor CorrectionIn many applications, and particu-

larly high-power applications, powerconversion circuitry ideally providespower factor correction (PFC) to mini-

mize the input current. PFC is requiredto reduce overall current for a givenpower requirement, and prevents inputcurrent distortion. As a result, bothinput voltage and current waveformsare kept in phase and maintain an ac-ceptable power factor of the three-phasepower input.

Electrical IsolationElectrical isolation protects circuits,

equipment and operators from shocksand short circuits occurring in the sys-tem. In some applications, output volt-age must be electrically isolated fromthe input, creating infinite resistancebetween the two. The single-step powerdesign enables complete isolation be-tween output and input; if a short cir-cuit occurs at the output, the functionstops and the system is safe.

Input Current DistortionA fullwave rectifier is often used to

convert three-phase AC to DC voltage.This type of device incorporates sixdiodes in a full bridge configuration.However, this topology allows justtwo of three phases to provide powerat one instant, while the third phaseis inactive. The resulting current dis-continuity causes problems in realiz-ing ideal harmonics and power factor.To overcome this, all three phasesmust provide power simultaneouslyand the load must appear resistive forall three phases.

Figure 1 demonstrates the problem,showing essentially a perfect voltagesine wave (yellow) but extremely dis-torted current waveform (blue). Whencurrent waveform is distorted, powergeneration is disrupted because thecircuit must conduct greater amountsof current where there is insufficientvoltage. Designers must guard againstcircuits that draw power in this way.To ensure reliability and optimal per-formance, current waveform must bedirectly coincident with voltage wave-form. Because the single-step topol-ogy draws power continuously fromall phases, it meets this need and cre-ates a perfect sine wave current inphase with voltage. In contrast to Fig-ure 1, Figure 2 illustrates ideal resist-ance; current follows voltage andpower factor is one.

8 Aerospace & Defense Technology, December 2015

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Power Supplies

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Power Electronics AdvancementsSingle-step topologies are evolving

power electronics design – providingunity power factor correction at full andpartial loads, as well as rectification ofthree-phase AC input, regulation of DC

output, and isolation of DC outputfrom AC input, all in a single conver-sion step. Technical risk is low, size andweight are minimized, and costs are re-duced for both development and long-term performance.

With rectification and power factorcorrection occurring in a single conver-sion stage, the device achieves an over-all high power conversion efficiency ofup to 96% including current harmonicdistortion at 3% or less, automatic loadsharing, and modular scalability. Theseattributes solve a cascade of costlyproblems for the power conversion en-gineer: no power is wasted, no heat isadded to the conversion process, andno cooling equipment is needed tomitigate thermal impact. By realizingcomprehensive improvements inpower factor, harmonics, weight, andcost, OEMs can distinguish their ownsystems and equipment – capitalizingon high power conversion efficiency asa new opportunity for competitiveedge and design innovation.

This article was written by JosephYoussef, Senior Electrical Engineer, MarottaControls (Montville, NJ). For more infor-mation, visit http://info.hotims.com/55596-500.


Power Supplies

Design options for power electronics offer a range of advantages and drawbacks in the quest for lighter,less costly circuitry. For example, passive power factor correction is low risk but applicable only to lowerperformance applications, while a single-step solution offers low risk, high performance, and applicabilityto a wider range of rugged applications. (Marotta Controls)

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to Combat Legacy Issues in Defense Avionics

Using Sensor Technology

Reliance on aging military plat-forms has become a globalconcern and military aircrafttoday are expected to remain

in service for longer than their originallife cycles. This is partly as a result of apost-Cold War slowdown in purchasingof new material in the late 1990s, aswell as cuts in defense spending. In-deed, the current USAF fleet is the old-est in its history, with the average age ofaircraft being 26 years.

Moreover, the rising cost of newweapon systems, juxtaposed with theneed to ensure mission capability and ef-fectiveness, has made the maintenancecycles of aging military fleets an issue ofcritical importance. To solve this, themilitary must extensively source, reman-ufacture and upgrade components, notonly to maintain availability and reliabil-ity, but also to improve their mission-ca-pability and superiority.

Extending Service LifeThe useful life expectancy of aging mil-

itary platforms may be extended signifi-cantly using customized high-perfor-mance electronic sensors to enhanceexisting systems, or to replace obsoleteitems with those manufactured embody-ing the latest sensor technology. Theoret-ically, engineers could sustain aircraft al-most indefinitely through modernizationand maintenance. The iconic B-52 oper-ated by the U.S. Air Force (USAF) for ex-ample, first flew in 1952 and entered mil-itary service in 1954, while the F-5’sinitial flight took place in 1963. Bothhave undergone extensive retrofits andcontinue to fly missions today.

In 2005, the USAF initiated a four-year program to upgrade the B-52’scommunications system, its first majorupgrade since the Kennedy administra-tion. The upgrades included softwareand hardware, such as the ACR-210Warrior (beyond-line-of-sight softwarecompatible with radio and able to trans-mit voice) and LINK-16, a high-speeddigital data link for transmitting target-ing and Intelligence, Surveillance, andReconnaissance (ISR) information.

Upgrading Platform PerformanceThe military employ defense applica-

tions where ‘situational awareness’ is crit-ical. Sensors provide critical informationto enable the systems into which they areincorporated to take the most appropriateaction. Today, sensors play a crucial role

in enabling this situational awarenessand, as a result, there has been a huge in-crease in the volume of information be-coming available to military personnel.

The scope of sensor applications foravionics in defense aircraft is extensive,and all demand the highest levels ofprecision, repeatability, ruggedness, andreliability. Indeed, the need to consis-tently deliver measurement precisionand repeatability continues to drive theneed for further customization of sen-sors. Often these devices must functionin the harshest operating conditions,and frequently in space restricted areas;thus sensors are constantly evolving inorder to fully address the specific re-quirements of the application.

The RAF’s IDS (interdictor strike) air-craft, the Tornado, for example, hasbeen the principal strike weapon em-ployed by the UK, Germany, and Italyfor over three decades. It has an ex-pected life-span of 40 years. The Mid-Life Update (MLU) program that tookplace between 1998 and 2003 has beenvital to ensuring its longevity, upgrad-ing 142 Tornados to a new variant, des-ignated Tornado GR4/4A, with ad-vances in systems, stealth technology,and avionics at a cost of £943 million.

Compared to the Tornado GR1, theGR4 has Forward-Looking Infra-Red(FLIR), a wide angle Heads-Up Display(HUD), improved cockpit displays, Night-Vision Goggle (NVG) compatibility, newavionics and weapons systems and up-

Royal Air Force PanaviaTornado F3 fighter jet

Sensors typical of the type used to counteractlegacy issues in aging avionics systems.

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Test & Measurement

dated computer software. The GR4’s up-graded navigation systems include aGlobal Positioning System (GPS), BAE Sys-tems Terprom digital terrain mapping sys-tem and a Honeywell H-764G laser Iner-tial Navigation System (INS).

Sourcing Spare PartsMilitaries increasingly rely on sustain-

ing and modernizing aging aircraft thatform the bulk of their fleets but thiscomes with two key challenges. Firstly,they must confront the issue of how tosource essential parts which have becomeobsolete. Secondly, maintaining theseaging planes is increasingly divertingfunds that could be used to design a newgeneration of aircraft for the costs ofMaintenance, Repair, and Operations(MRO) services for the legacy fleet.

A common issue is that the originalstrategy for sustainment and replace-ment of sensors, based on the originalprojected life, becomes redundant. Tocombat this, each aircraft requires ex-tensive repair and remanufacture, com-ponent by component, in order tomaintain airworthiness, mission capa-bility and effectiveness. Subsequently,there are unique issues for sourcingparts that both fit the aging platformmodel and conform to contemporaryquality standards – for example, at-tempting to integrate a digital systeminto a platform built in the analog era.

Often the desired spare parts are outof production as the original manufac-turers may have become bankrupt,closed down, or been absorbed into alarger organization. More often thannot, the low demand is simply not com-mercially viable. Cannibalising partsfrom other aircraft, either permanentlygrounding the aircraft or renderingthem no longer mission capable, maybe the only option open.

Sustainable Maintenance StrategiesWhilst replacing obsolete parts does

extend service life and upgrade per-formance, the life cycle of a commercialoff-the-shelf (COTS) part may only beabout 18 months. An aircraft’s servicelife is measured in decades. As such, inthe long-term, it is vital that this ap-proach, dictated by the short refreshcycle of technology advancements, is

managed effectively, otherwise it canexacerbate the problem.

Military equipment ages in two basicways: redundant hardware or softwarethat renders the equipment insupport-able; and inadequate performance thatrenders the equipment unable to fulfil itsmission. There are also two distinct typesof aging: chronological and cyclic. Theformer is driven by factors such as systemobsolescence, corrosion, environmentaldamage and general wear. The latter is de-termined by the way the aircraft, vehicle,or vessel is operated and includes fatigue,thermal and stress damage.

Both chronological and cyclicevents affect the rising cost of main-taining an aging fleet. Aging can causeflaws to develop earlier than predictedin the original strategy for replace-ment of parts, while extended usagecan accelerate their growth. Aggressiveenvironments can also accelerate thedevelopment of flaws faster than whatwas initially predicted.

Maintenance cycles based on the fa-tigue life of structures or the mean timebetween failures (MTBF) are determinedthrough rigorous testing. This is to deter-mine when failures become prevalent, orthe function of the system becomes com-promised. Maintenance cycle inspec-tions are, therefore, timetabled regularlyto ensure safety and parts are replaced orrepaired accordingly.

The USAF implements two majorstrategies for its maintenance work:Condition Based Maintenance + Prog-nostics (CBM+), and Reliability Cen-tred Maintenance (RCM). The formerperforms maintenance when there isevidence from sensor data, or from off-line trend monitoring. The latter uses

reliability tools and techniques toschedule maintenance to balancesafety, schedule and risk by consider-ing the probability of parts failure.

The Pathway Forward Sensors are a crucial component in

many significant defense applications in-cluding fire control systems, naval com-munications and vehicle systems. Mis-sion capability drives this trend becausepersonnel need to have ever more pre-cise and diverse information about theenvironments in which they operate.

Given the rapid pace of developmentin sensor technologies, it is essentialthat any replacement sensors are form,fit, and function compatible with theoriginal product. They should also bemanufactured by a high quality organi-sation that understands the require-ments of military systems, and by onethat has the relevant approvals.

As a result, the sensors industry willcontinue to further develop sensor tech-nologies so legacy aircraft can adapt toever more stringent military require-ments. In most cases, this pathway willbe more cost effective than developing,testing and fielding a new technologicalsolution, a process which typically takesmany years. Precise, robust and envi-ronmentally protected sensors thereforeoffer core capabilities which can meetoperational demands. They are one cru-cial solution to the challenge of ensur-ing legacy fleets are mission capable andeffective for present and future service.

This article was written by JonathanTinsley, VP of Sales & Marketing, SherborneSensors (Wyckoff, NJ). For more informa-tion, visit http://info.hotims.com/55596-501.

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Counterfeit semiconductor de-vices entering the Depart-ment of Defense (DOD) sup-ply chain continue to pose

risks to many of our country’s most so-phisticated aerospace and defense sys-tems. However, considerable progress isbeing made by the DOD, industry andacademia in developing approaches tohelp eliminate these devices before theyare put into critical systems.

Supply and DemandA short review of how we have arrived

at this point in the counterfeit battle willhelp put these new approaches in per - spective. As with any market in the world,there must be both supply and a demandfor counterfeit devices. In this case themajority of the supply comes from an un-intended source – electronic waste. An un-fortunate side effect of the effort to recyclethe millions of tons of obsolete e-wastegenerated each year is that it has created anearly unlimited supply of very inexpen-sive semiconductors that can be easily re-moved from e-waste printed circuitboards and cosmetically refurbished, re-marked and resold as authentic material.

The demand side of this market ex-ists because many of the DOD’s most

sophisticated systems have productlifetimes that far exceed the lifetimeof a typical commercial semiconduc-tor device. Defense systems can haveuseful lifetimes of 30 years or moreand can be prohibitively expensive toredesign and requalify. Meanwhile,commercial semiconductor produc-tion is dominated by devices intendedfor the consumer electronics market,where lifetimes can be as short as 3-5years. With a nearly unlimited and in-

expensive supply of obsolete semicon-ductor devices in the world and aDOD long term demand for thesesame obsolete semiconductors, thecounterfeiters will find a way to bringthat supply and demand into balance.

At this stage in the battle with coun-terfeiters, the defense industry, theirsuppliers and leading test labs have be-come adept at screening out the rela-tively unsophisticated counterfeit de-vices that have made up the majority of


Counterfeit Electronicsin the DOD Supply Chain

Initial Screening Technique What it can determine

Paperwork Inspection (if any exists). If a verifiable paper chain of ownership exists,it can bolster the likelihood parts are genuine.

Gross and Fine Visual Inspection Can identify bent leads, package cracks, etc.that may indicate that the parts were pulledfrom recycled systems.

Re-mark/Resurface Solvent Testing. Can identify a re-marked device, butcounterfeiters are becoming increasinglyadept at re-marking.

Standard X-Ray Can determine if a die is present in thepackage and if it is the correct shape.

X-Ray Fluorescence Can determine if there are any foreignelements present on the package or leads.

Device Decapsulation Can verify die manufacturer and die partnumber marking, but is a destructive test andcan only be performed on a sample basis.

Table 1. Initial Counterfeit Mechanical Screening Techniques

Electrical testing of a counterfeit IC. One of the surest ways to detect counterfeit IC’s is to perform full electrical testing.

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the initial wave of counterfeits washingover our supply chain. These initialscreening techniques tend to be me-chanically oriented tests but have beeneffective at identifying these relativelyunsophisticated counterfeits (Table 1).

As good as these techniques havebeen at catching the initial waves ofcounterfeits, the counterfeiters con-tinue to develop more refined and dif-ficult to detect counterfeits. In partic-ular, the counterfeiter’s ability toremark devices has become so goodthat it can be impossible to differenti-ate them from an authentic device.

Today’s more sophisticated counter-feits are taking advantage of the factthat many semiconductor devicescome from families of devices derivedfrom the identical die design. For in-stance, a single microprocessor designwill typically yield a range of perform-ance characteristics as a natural conse-quence of the variability of the under-lying wafer fabrication process uponwhich it is built. The manufacturerwill test these devices and “grade”them according to their performancecharacteristics such as speed and func-tionality over temperature.

The parts are marked according tothis grading process and sold into dif-ferent applications for differentprices. For instance, a slower speed de-vice could be sold to a consumer elec-tronics manufacturer for five dollars,while a high speed device may be soldto an Air Force contractor for a highperformance application for twenty-five dollars. All that is needed to cre-ate a very difficult to detect counter-feit is to re-mark the poorerperforming device as the higher per-forming one. Re-marking, as statedabove, is one process the counterfeit-ers are getting very good at. Sinceboth of these parts have the exactsame die in them and come in thesame package, the traditional counter-feit detection techniques of Table 1will not be able detect them.

The only way to reliably screenthese more sophisticated counterfeitsis to perform full electrical testingacross the device’s entire specifiedtemperature range. This is the sametype of test ing the orig ina l

manufacturer performed and will beable to verify the “grading” markedon the device. Table 2 lists some ofthese more sophisticated counterfeittypes that require full e lectrica ltesting to detect.

The second entry in Table 2, where acommercial temperature range device isre-marked as a military temperaturedevice, is particularly problematic. Inthis circumstance, the device willperform all of its intended functions atfull rated speed across the narrowercommercial temperature ranges – just notat the wider military temperature range.Making detection of these counterfeittypes even more difficult is that there isnormally only a one-character differencein the way the device is marked. Unlessfull electrical testing across the entiremilitary temperature range is performed,this counterfeit type might not bediscovered until it’s in the fieldattempting to operate at full load and/orin extreme temperature conditions.

Clones and TrojansAnother particularly difficult to detect

counterfeit device type from Table 2 is the“Clone.” A cloned device is one that is ac-tually redesigned and remanufacturedusing todays semiconductor technologyin order to meet the original manufac-turer’s performance specifications. Byusing current semiconductor technology,these cloned devices often perform muchfaster and with more device operatingmargin than the original device. The onlyway to catch these devices is to performfull electrical testing over the entire oper-ating temperature range, as discussed pre-viously, but in this case take the testingone step further. Instead of only testing tomake sure it at least meets its performance

specs, the actual device performance mustbe measured to see if it statistically ex-ceeds its performance specification. Thisactual performance testing will determineif the device is ‘too good” and is, there-fore, a potential counterfeit.

When discussing clones, the questionis inevitably asked that if a cloned de-vice has even better electrical perform-ance than the original device, why can’tit just be used in place of the original?The answer is that while it is relativelyeasy to redesign a simple device to elec-trically function like an old one, it ismuch more difficult to make that newdevice with the same quality and relia-bility as the original manufacturer. Re-member that the counterfeiters are outto make money by doing as little as pos-sible to get someone to buy parts andare not likely to employ the same rigor-ous military qualification processes overthe entire operating temperature rangethat the original manufacturer did.

Another important category ofcounterfeit devices is the “Trojan.” ATrojan is generally defined as the in-troduction of malicious hardware orsoftware into a device such that it canbe activated by some external event orafter a predetermined amount of time.

Trojans, if designed well, can be ex-tremely difficult to detect. Today, thereare no commercially available ways to as-sure your device doesn’t contain a Tro-jan. On the other hand, a good Trojan iseven more difficult to engineer than aClone, so it is less likely that the older,common industry devices (that make upthe bulk of today’s counterfeit devices)would include a Trojan.

But as the counterfeit device supplyissue moves from the hands of relativelyunsophisticated e-waste recyclers and

Aerospace & Defense Technology, December 2015 www.aerodefensetech.com 15

Designing with FPGAs

Table 2. Counterfeit Types Requiring Full Electrical Test Screening

Counterfeit Types Requiring Full Electrical Test Screening for Detection

Substitution of one speed device for another.

Substitution of one temperature grade device for another.

Substitution of one die revision for another.

Substitution of a low power device for a high power one.

"Walking Wounded" devices that have been electrically damaged from mishandling.

Cloned devices – redesigned exact copies of the original device.

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into the hands of establishments orgovernments with malicious intent, theresources and desire to create Trojansincreases significantly. This is com-pounded by the fact that most newsemiconductor fabrication is done out-side the United States where designsand mask sets could be more easilycompromised to introduce Trojans.

One solution to limiting the Trojanthreat is to use the DOD Defense Micro-electronics Activity (DMEA) “Trusted”source program. This program accreditsUS based semiconductor manufacturinglocations that have proven high levelsecurity processes and procedures inplace. Numerous other solutions arebeing studied by the DOD and acade-mia, but so far none of the publishedapproaches can be considered a univer-sally viable solution.

There is some good news in the in-dustry when it comes to identifyingand eliminating counterfeit semicon-

ductor threats. There is a growingawareness in the industry with anabundance of technical conferencesand papers proposing solutions. Aca-demic institutions are studying tech-niques to guarantee newly fabricateddevices can be authenticated. Finallythe DOD is sponsoring defense indus-try research programs in numerouscounterfeit related areas.

One such program is sponsored bythe Missile Defense Agency (MDA) andtargets the development of new andmore effective counterfeit screeningtechniques for Field ProgrammableGate Arrays (FPGA’s). FPGA’s are usedextensively in the defense industry be-cause of their flexibility and widerange of available functions. They areoften the “brains” of the system theyare designed into, where failurescaused by counterfeit devices couldlead to catastrophic consequences.

Another is DARPA’s Supply ChainHardware Integrity for Electronics De-fense (SHIELD) program. The goal ofDARPA’s SHIELD program is to elimi-nate counterfeit integrated circuits fromthe electronics supply chain by makingcounterfeiting too complex and time-consuming to be cost-effective. SHIELDaims to combine NSA-level encryption,sensors, near-field power and communi-cations into a microscopic-scale chip ca-pable of being inserted into the packag-ing of an integrated circuit.

Although the industry is doingmuch more to thwart the incursion ofcounterfeit semiconductors into theDOD supply chain than ever before,there is no realistic end in sight. Con-tinued diligence is required in employ-ing the initially developed mechanicalcounterfeit detection techniques aswell as the even more effective com-prehensive electrical test techniques.The counterfeiters will be relentless –it will take the combined efforts of theDOD, academia, the original semicon-ductor manufacturers and independ-ent test labs to ultimately bring thisthreat under control.

This article was written by Joseph LHolt, Vice President, Integra TechnologiesLLC (Wichita, KS). For more informa-tion, visit http://info.hotims.com/55596-502.


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Designing with FPGAs

Counterfeit Example. Identically marked partscontain different die revisions. They both functionthe same, but the counterfeit consumes muchmore power.

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Since the digital revolutionchanged forever the pilot’sworking environment, inno-vators and suppliers of cockpit

systems have strived to provide a con-tinuous stream of new developmentsand products that offer increasingly au-tomated solutions to what has to bedone to fly and land an airplane safely.

As the first “glass” cockpits with CRT-type displays were introduced in the1980s, there was understandably muchopposition from many within the activeflying community as these revolution-ary devices removed at a stroke all thosescores of instruments that were so fa-miliar and which all seemed absolutelyessential at the time.

Airbus made the first strategic leap incommitting to a cockpit with primarydisplays projected on a glass screen,starting with its A310, and with the all-new A320 provided almost all its instru-mentation in this form, and went evenfurther with a highly automated fly-by-wire flight control system, featuringfighter-style side stick controllers.

There was an outcry from flight crewswhen increased computerization ledAirbus to conclude that the new tech-nologies could completely eliminate theneed for a flight engineer in the cockpit.But with all essential onboard systems,plus all navigational and flying infor-mation available and in clear view, orjust a flick of a switch or press of a but-ton away, the change to digital becamea headlong rush.

Human FactorsFollowing recent high-profile aircraft

losses and other flight incidents, somecritics have suggested that industry hasmade the profession of flying too easyand too relaxed. When an aircraft’s keyintegrated flight data inputs are suppos-edly protected by five separate com-puter systems and a series of fail-safeflight control recovery modes, and yetthe crew become confused as the com-puters become overwhelmed by con-flicting information returns, there is aneed for quick and decisive, but appro-priate, corrective action.

Human factors are often the key toanalyzing what has gone wrong and sothe onward march of cockpit automa-tion and component miniaturization,which has led to even very small execu-tive jets and general aviation aircraftbeing fitted with highly automated dis-plays, now has to seriously consider ifenough scope is being allowed for pilotsto actually fly the aircraft and not justassume it will fly itself—even though itusually does!

All the leading cockpit system suppli-ers are now well advanced in designingand bringing to market what appear tobe approaching the ultimate in user-friendly displays. Even quite recentlysome of these developments have lookedmore like science-fiction inventions, butthe availability of new materials and newmanufacturing processes that can embedtouch-sensitive switches and controlsinto large wraparound transparent pan-els, have been made possible by adoptingmuch technology that has come fromthe gaming and CGI sector as well as theGrand Prix car racing sector.

Avionics developments are changing life inthe cockpit and at airborne work stations.

Touch and Goby Richard Gardner

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Avionics

Making these applications robustenough for safe everyday use in life-criti-cal aviation use is more time-consumingfrom a regulatory angle, as ease of use hasto be balanced by sufficient tactile interac-tion between man and machine so thatthere is no loss of authority or confidenceon the part of the pilot, who ultimatelymust remain in charge.

HUD AdvancesThe day when civil air passengers will

fly in commercial aircraft that have nohuman pilots on board could happen

very soon, technically, but it won’t, as noairline, and few customers, would want totake the risk. However, an identical flight,with two crew in the cockpit as monitorsand who could take control in an emer-gency, will probably be the most likelyway forward, with little difference in de-livery and presentation to today’s opera-tions. Truly disruptive advanced avionicstechnology will more likely appear first inthe military sector.

One development that certainly has itsorigins in military aviation but which hasnow taken pilot situational awareness

(SA) to new levels in the commercial mar-ket is the head-up display (HUD). Certi-fied by Airbus this year, Thales has nowintroduced a twin HUD configurationthat enables all the projected informationto be seen by both pilots simultaneously.

With eyes focused outside, viewingthe presentation of the flightpath, ac-celeration, visual glideslope angle, andthe runway aim point, both crewmembers can achieve greater precisionand SA at all times and can interactwith one another with the same infor-mation during the most critical phasesof the flight, especially in bad weatherand low light conditions.

In late September, Thales announcedthat its latest dual HUD system hadbeen selected by China Southern Air-lines for use aboard its 30 new A320s. Itis a significant order as it’s the first dualHUD to be ordered by a Chinese airlineand the country’s Civil Aviation Au-thority (CAAC) has made it mandatoryfor all Chinese registered aircraft to beequipped with HUDs.

As China’s skies become more con-gested, HUDs are fast becoming a main-stay for pilots and the country is leadingthe world in adopting this technology.China has progressed in under twodecades from operating some of theworld’s oldest airline fleets, flying largelyRussian-designed aircraft, to having someof the world’s youngest airline fleets, fly-ing the latest models from Airbus, Boe-ing, Bombardier, and Embraer. As well asplacing orders for thousands of newWestern aircraft, China is developing itsown indigenous aircraft and in duecourse will no doubt design and buildmore of its own avionics systems in placeof buying Western products.

Helmet-Mounted Display CaseTaking the avionics progress story

on the SA theme back into the militarysector, the latest developments go be-yond HUDs with ever more sophisti-cated helmet-mounted displays(HMDs). Recently BAE Systems pre-sented its latest, fifth-generationHMD, the Striker II, which incorpo-rates features that were developed togive pilots flying aircraft such as the F-35 and Typhoon a comprehensive,game-changing capability.

Current standard of airline cockpit—the latest Boeing 787-900. (Richard Gardner)

Cockpit display of the future? ODICIS wraparound touchscreen. (Richard Gardner)

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Avionics

The F-35 is presently unique in newcombat aircraft in so far as it doesn’thave a HUD but depends on an HMD toprovide all the key target and flyingcues and data ahead of the pilot’s nor-mal vision. During the F-35’s lengthydevelopment phase BAE's Striker wasused as an interim alternative while theincumbent supplier solved image vibra-tion issues. In the meantime the Strikerhas been proven operationally in usewith Typhoon and Gripen fighter air-craft and has now been enhanced bymaking it an all-digital solution. In ad-dition the helmet has been fitted withan integral night vision camera.

The key to exploiting HMD usage inmodern combat aircraft is to give thepilot minimal interference or restric-tions in operation, while remaininglightweight and comfortable. This iseasier described than solved as such asystem has to not only provide crystalclear imagery under all environmental

The Thales AMASCOS Multi-Mission display console with touchscreens and integrated target identificationsystem. (Thales)

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Avionics

conditions, by day or night,but must not result in creat-ing any blind spots or caus-ing extra strain on the neckand upper torso.

The new Striker II enablesthe HMD to show imageryfrom any source and adds newlevels of functionality. As wellas projecting night vision im-agery and standard weapons-aiming and flight symbology,the digital architecture allows azooming function and the abil-ity to present picture-within-picture imagery and even im-ages from external (off-board)sensors that could aid the pilotin target identification. Thisnew comprehensive digital ca-pability can incorporate sensormixing to increase SA signifi-cantly, and this work is underactive development.

Although the HMD isaimed primarily at use on-board fighters and attack helicopters,the system architecture is adaptable toallow it to be integrated into almost anyaircraft. An analog converter has beendeveloped so the helmet can be com-patible with older systems as well. Theaddition of an embedded night visioncamera replaces the traditional night vi-sion goggles (NVGs) that are clippedonto a helmet in front of the visor.

With NVGs the pilot’s ability tolook around from the cockpit is usu-ally restricted and they also upset thenatural mass balance of the helmet as-sembly. If a pilot wears NVGs for sometime then this can cause neck fatigueas well as leading to restrictions onthe g-limits being imposed on the air-craft, not a good feature with combatagility an important requirement forall military fast jets.

On the Striker II helmet the nightvision function can be switched on oroff through a hands-on throttle andstick control. Trials and feedback fromoperations indicate that this newfunction will be particularly valuableat dawn or dusk when a pilot mayhave some difficulty deciding whethervisibility is better with or without thenight vision imagery. Another benefit

from the new helmet is an advancedhead-tracker system that supplementsthe aircraft’s optical tracker. This givesincreased tracking accuracy and con-tinues to track the helmet in positionsin which some of the optical trackingis lost.

Multi-Mission FunctionalityThe evolution of digital avionics is

taking many other paths in addition torevolutionizing the pilot’s cockpit. Agood example is the new functionalitythat can be applied to the displays andcontrols needed aboard multi-missionaircraft. The traditional interior of amulti-engine military sensor platformaircraft has rows of display consoles,each faced by an operator who is allo-cated specialist tasks collecting, search-ing for or analyzing data that isstreamed into the aircraft.

On aircraft such as the Boeing E-3Sentry or other electronic communica-tions and signals intelligence plat-forms, the specialist crews onboard cannumber around 30 and have bespokedisplay stations with operational man-agers keeping the data flows movingand helping to set priorities. So muchdata can be collected on these missions

that information overload is a realchallenge. Although automated datafiltration systems can narrow downsome of the input so operators includ-ing signals specialists can focus on mis-sion priorities or unusual data, it ishighly skilled personnel who ulti-mately identify, track, and deal withsuspect information and then distrib-ute it accordingly.

In the case of maritime patrol andsurveillance air platforms, the aircraftcabins are also filled by displays andoperator desks. Major defense systemcompanies, such as Raytheon,Northrop Grumman, L-3, Boeing,Lockheed Martin, Thales, and Selex ESare all engaged in the developmentand supply of integrated mission sys-tems for specialist air platforms.Thales has just introduced AMASCOS,a new airborne mission system formaritime and ground surveillance air-craft that may have a similar designimpact to that which accompanied thefirst Airbus glass cockpit.

The main feature that sets AMASCOSapart in a very competitive market is theinnovative operator screen display config-uration, which is particularly user-friendly, thanks to easy-to-learn interac-

Close up of an AMASCOS display.

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tive touchscreens, which are part of a flex-ible networked integrated system. Itmakes maximum use of the latest displaytechnologies and is linked to the latestgeneration of sensors, including radar,laser, and electro-optical systems and isbuilt around a tactical command system.

With its modular architecture, thenetwork centric system can be config-ured to optimize the crew task sharingfor either a lightweight version for sim-ple surveillance tasks (such as coastal orborder patrol in a small twin turbopropplatform) right up to full-function anti-submarine or surface warfare versions(for an MPA aircraft such as P-8 or P-3size platform), with typically up to fiveconsoles controlling radar, IFF, EO/IRsensors, electronic intelligence,acoustics, magnetic anomaly detection,datalinks, sonobuoys, and weapons.

This formula allows the system to be in-tegrated onto an optimized platform forcustomer requirements, offering a widerange of multi-mission capabilities. Theoperator workload is kept to efficient lev-els as a result of the high level of systemautomation. This includes data fusion,identification, and classification. There isa large data base in support of sensorswith both an onboard library and accessthrough secure datalinks to additional li-brary databases.

All the data available can be shared be-tween single or multiple operators asneeded, and the touchscreen layout al-lows “saved” tracking information andsituational maps and radar pictures to becontinuously updated in real time withsub-displays dragged across to anotherdisplay so the operator can investigate orcarry out actions with the maximumawareness of all relevant information infront of him or her, and without havingto look away to operate another screenand its controls. The operational picturecan thus be as simple or as complex asneeds demand. The compact design of thedisplays and their utility enables a smallerplatform aircraft, with a smaller numberof crews, to carry out the mission with noloss of capability.

This new system is not the onlyproduct on the market, but as state-of-the-art avionics for maximizing ex-ploitation of the new technologieswhile keeping volume, crew demands,

and costs affordable, it shows the wayahead. The old convention of operat-ing many different surveillance air-craft types in small numbers for spe-cialist roles is becoming unaffordableand very demanding on training infra-structure. Introducing more flexible

multi-mission aircraft that are adapt-able to different ISTAR (intelligence,surveillance, targeting, and reconnais-sance) tasks is now a more practical so-lution, thanks to the availability ofavionics solutions that allow fewer todo more with less.

Aerospace & Defense Technology, December 2015 21

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Avionics

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Materials

The search for lighter weight,stronger materials to constructairplanes and spacecraft re-mains as important as ever.

But it takes a long time for new materi-als in aerospace structures to make theirway into production designs. Capital isone reason; it is harder to take riskswhen it costs so much to develop newcomposites. Another is the long ap-proval process from regulatory agenciesdue to safety constraints.

“Aerospace is an interesting case be-cause there is a lot that you can do withcomposites that is being done in [just] afew cases today,” explained AnthonyVicari, Lead Analyst for Advanced Mate-rials for Lux Research, in an interviewwith Aerospace & Defense Technology.

One of those materials that is well es-tablished but arousing increasing atten-

tion in the aerospace industry is sand-wich materials, according to Vicari.

“A sandwich panel design can be usedto avoid local buckling in panels loaded inshear and Euler buckling in panels withcompressive in-plane loads, which simpli-fies the structure and structural analysis. Itis also particularly suitable to stiffen apanel that is subjected to out-of-planeloading or torsional loads,” Malcolm Fos-ter, Chief Engineer for GKN Aerospace,explained to A&DT.

Foster went on to explain some ofthe disadvantages. One is that sand-wich cores can absorb water vapor,and condensation accumulates in thecell under constant cycling of air pres-sure and temperature that aircraftstructures are exposed to. “It is possi-ble to seal the cores to prevent this,but this adds weight that [may] offset

the benefits of core over a monolithiclayup,” he said.

The sealed air inside the honeycombcells exerts a pressure in the reducedambient pressure at altitude, leading topotential cycle fatigue. Manufacturingissues may include inability to handlefull 100-psi autoclave pressure as well astelegraphing issues with honeycomband co-cured skins, among others. Hon-eycomb does not play well with resin-infusion processes.

“Honeycomb is an added expense. Itrequires careful placement in thelayup, and the layup is complicated byhaving to fit around the core. All ofthis is difficult to integrate with auto-mated fiber deposition processes and,therefore, it drives you towards man-ual processes,” he said.

However, sandwich composites maywell get a boost as a number of compa-nies are looking to exploit new manu-facturing technologies to expand therange of cores and skins alike, overcom-ing some of these problems to getlighter and stronger structures.

Sandwich Construction Innovations“At GKN Aerospace we are working on

new ways to create custom cores forcomplex shapes that would not nor-mally be possible to form from a pre-fab-ricated sheet,” explained Foster. “There isstill a lot of innovation in foam cores—for example, in-mold foaming (IMF) ofstructural foams has the potential to

Sandwich Cores for the FutureDecreasing weight while increasing strength is always critical, from airliners to future spacemissions to Mars. Research in sandwich cores today may lead to radical improvements in the future.

Researchers have developed membranes that can significantly reduce aircraft noise when inserted intothe honeycomb structures used in aircraft design. (Dr. Yun Jing)

by Bruce Morey

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allow greater design freedom and wideruse of foam. Previously, IMF was onlyavailable for non-structural cores such asexpanded polystyrene.”

NASA announced in April 2015 the se-lection of three proposals to develop andmanufacture ultra-lightweight core(ULWC) materials for future aerospace ve-hicles and structures. All three focus onadvanced sandwich construction.

“Standard composites gives us 30%weight savings, but for the Mission toMars we really need to find a way to fur-ther lightweight our vehicles and struc-tures—our ultimate goal is to achieve 40%weight savings, even 50% weight savingsover conventional aerospace materialssuch as aluminum,” John Vickers, Associ-ate Director for Materials Processing forNASA, told A&DT. “Sandwich cores havea very widespread applicability to spacesystems. Sandwich construction in ouropinion is the most weight optimal, espe-cially in crew habitats.”

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Materials

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He believes industry can developsandwich construction that can handlestructural loads as well as the conven-tional metal skin and stringer designsoften found in aerospace.

“The criteria for evaluation of the threeapproaches over conventional ones, andagainst each other, include weight sav-ings, crush strength, and mechanicalstructure test,” explained Azlin Biaggi-Labiosa, Project Manager for the Nan-otechnology project at NASA, underwhich these contracts are implemented.

The three companies selected for con-tracts include HRL Laboratories, ATKSpace Systems, and Dynetics, Inc. Phase Iawards of the solicitation are valued up to$550,000, providing awardees with fund-ing for 13 months to produce 12×12×1-inultra-lightweight core panels. Technolo-gies selected to continue to Phase II willdemonstrate the ability to scale up to 2-ftby 2-ft by 1-in and ultimately to produce10-ft by 11-ft by 1-in ULWC panels, withNASA providing up to $2 million peraward for up to 18 months.

As with most new technologies, weshould not expect these to be flyinganytime soon. NASA does expect appli-cations outside of space flight.

“The work that we are talking abouttoday, with the ultra-lightweight core, isat a low technology readiness level(TRL),” explained Vickers.

“This technology, if it goes all theway to Phase II [including] our groundtesting, would be at TRL 6,” added Bi-aggi-Labiosa, referring to the nine stepsNASA uses to rate maturity of a technol-ogy. A TRL of 9 means the technologyhas actually flown in space.

Adapting the Proven for the NewThe approach taken by one of those

winners is a case study in adapting proventechnologies in new ways. The proventechnology that HRL Laboratories is ex-ploiting is UV curing of polymers. UVlight is used to solidify a liquid resin pointby point to create highly complex pat-terns (of plastic). Stereolithography 3Dprinters use the same underlying tech-nique, but HRL uses a self-propagatingwaveguide process that enables the coresto be made 100 to 1000 times faster.

A template in plastic is formed andthen coated with a metal such as nickel by


Materials

Quieting CoresWhile sandwiched honeycomb

structures make for strong, light-weight aircraft, they are particularlybad at blocking low-frequency noise,like aircraft engines, according to Dr.Yun Jing, Assistant Professor ofMechanical and AerospaceEngineering at North Carolina StateUniversity.

Working with the MassachusettsInstitute of Technology, Jing helpedpioneer an approach unique in itssimplicity—add a sound-insulatingrubber membrane. Using a thin light-weight membrane covering one sideof the honeycomb structure, like theskin of a drum, soundwaves bounceoff rather than passing through.

According to Jing, at low frequen-cies—sounds below 500 Hz—the hon-eycomb panel with the membraneblocks 100 to 1000 times moresound energy than the panel with-out a membrane. His team hasmeasured sound transmission loss-es (STL) consistently greater than45 dB up to 50 dB.

“This research was prompted bythe needs of the airline industry,” saidJing in an interview with A&DT. Healso noted that it might be difficult toretrofit existing aircraft. “I think it hasto be considered when a new aircraftdesign is started,” he said. “We are inconversations with several compa-nies [examining] the possibility ofcommercializing this technique andare actively looking for partners tocommercialize it.”

Anthony Vicari, Lead Analyst for AdvancedMaterials for Lux Research, notes that overallprogress in developing new aerospace materials isa continuing series of incremental advances.Expect to see that with sandwich composites.

Azlin Biaggi-Labiosa, Project Manager at NASA,explained that the evaluation criteria for the con-tract for new sandwich composites includeweight savings, crush strength, and mechanicalstructure test.

The HRL technique allows for easy creation of curved shapes.

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electroplating. The template is thenetched away, leaving the final core. Thekey is order and structure at small scales.

“These are structured, cellular materialsor architected materials in a micro-latticestructure,” Dr. Tobias Schaedler, the leadresearcher from HRL on the NASA con-tract, explained to A&DT.

He noted that sandwich structures pro-vide high torsional and bending rigidityat low weight, resisting forces perpendicu-lar to the surface. “But there are only twotypes of cores, honeycomb and foam,” hesaid. Foam is cheaper, but not as stiff orstrong. That leaves honeycomb as theonly choice today for high-performancesandwich composites.

The lattice distributes stress in manydirections where a honeycomb can onlydo it normal to the face-sheet. HRLdemonstrated that making the coreusing a truss lattice structure makes fora stronger material, especially in shear.This means it is better than honeycombcore in resisting sliding forces along thesurface of a material and in bending, ac-cording to Schaedler. Currently, HRLlattice cores are made from nanocrys-talline nickel faced with carbon-fiber-re-inforced plastic (CFRP).

“The performance of the material is acombination of the structure, wherehoneycomb and foam would be inferior,with the increased strength of the mate-rial the truss lattice is actually made of,”he said. The NASA project will use anunspecified but lighter and strongernanocrystalline metal.

Schaedler was quick to point out otherdistinct advantages using what is, at itsheart, a 3D-printing technique to formcores. “The technique can grow com-pound shapes and curves because you cangrow the structure into the shape de-sired,” he explained.

No machining is needed. Also, thedensity of the lattice can be adapted tomatch local stress – less dense where lessstrength is needed, higher densitywhere it is needed.


Materials

Dr. Tobias Schaedler is one of a group ofresearchers at HRL that adapted 3D-printing tech-niques for cores with a lattice structure that dis-tributes forces better and is easier to make intocomplex shapes.

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RF & Microwave Technology

Until recently, AESA radar was uti-lized almost exclusively by prime

aerospace contractors within theirown proprietary systems. These cus-tomized solutions were relativelycostly and time-consuming to manu-facture, and not reconfigurable to al-ternative uses.

Meanwhile, growing requirementssuch as border security have punctuatedthe need for a modular, building-blockapproach that expands the use of AESAradar technology to a wide array of ap-plications including naval, airborne, ve-hicle-mounted, and ground-based sys-tems; coastal and harbor security; airtraffic control; foreign object detection(FOD) for airport runways; satellites;and data links.

AESA radar systems contain multipletransmit/receive modules (TRMs) thattransmit and receive high-power radiowaves of varying frequencies, scanningrates, and radiation patterns on demandto provide highly agile beam steering. Bygenerating unpredictable scan patterns,AESA radar systems can track multiple tar-gets simultaneously. These scan patternsare also difficult to detect by radar warn-ing receivers (RWRs) – particularly oldersystems – thus providing high jammingresistance. These systems can also operatein a receiver-only mode to track thesource of jamming signals, or to act as aradar warning receiver. AESA radar canalso serve as a high-speed data link able tosupport peer-to-peer networking by com-bining data from multiple platforms

while also delivering expanded radar cov-erage and enhanced resolution.

AESA radar does have its limitations;the highest field of view (FOV) achievablefor a flat phased array antenna is generallybetween 90 to 120 degrees. Wider cover-age can be obtained through multiple an-tenna faces or two rotating antenna faces.Similarly, an X-band array mounted ontothe nose of an aircraft can expand its FOVthrough the use of a mechanical gimbal.

Thermal management is also requiredto dissipate heat generated by the poweramplifiers (PAs) that are distributed acrossthe antenna face. The cooling systemmust fit within the limited space envelopebetween the elements.

A Modular, Stackable Approach A recently introduced Active Antenna

Array Unit (AAAU) consists of modularQuad Transmit Receive Module (QTRM)sub-arrays (Figure 1), which are alsoavailable as a standalone product or asscalable planks. The typical plank isconstructed from four QTRMs, alongwith an integrated, linear, 16-elementantenna array; liquid cooling withquick-release, non-drip connections;and distribution networks to provide RFand DC control signals to each QTRM.The Planks are designed to plug intoslots in the main array structure to cre-ate a 2D array solution.

Each QTRM module (Figure 2) consistsof four T/R channels, each containing apower amplifier (PA), a low-noise ampli-fier with receiver protection, along withdigitally controlled phase and gain con-

Making AESA Radar

Figure 1. The “roadmap” to an Active Array Antenna Unit (AAAU).

A modular, building-block approach brings greater design flexibility to Active ElectronicallyScanned Array (AESA) radar technology, simplifying system integration, and permitting rapidfirst-line repair with no downtime using standard off-the-shelf components.

More Flexible

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trol elements to reduce undesirable side-lobes. QTRM modules also feature localDC power supply conditioning, a built-inlogic interface for serial control and BITEpower supply monitoring, and a protec-tive thermal shutdown facility.

The QTRMs are supplied factory-cali-brated and individually addressed forplug-and-play installation and rapid inte-gration. The system integrator simply pro-grams in adjustments for external systemloss, antenna offsets, and phase offsets.

A key performance attribute is gracefuldegradation, as each T/R channel is indi-vidually controlled, so the failure of anyindividual T/R channel will not impactthe rest of the module. By contrast, legacyradar systems can become inoperable dueto a single Point of Failure (PoF), such asthe loss of the travelling wave tube (TWT)power amplifier.

Modular, stackable QTRMs use stan-dard commercial off-the-shelf (COTS)components, and are designed as Line Re-placeable Units (LRUs) to reduce first-linerepair costs. Individual QTRMs haveunique address codes so individual mod-ules can be swapped out anywhere withinthe overall array without incurring anysystem downtime. By contrast, with older,non-modular AESA systems, the entireplatform needs to be taken off-line inorder to perform routine repairs, mainte-nance, and upgrades.

Choosing the Right Frequency RangeModular, stackable QTRMs are available

at X-band and C-band, along with a DualTransmit Receive Module (DTRM) at S-band (Figure 3). Dual-module S-band sys-tems are ideal for long-range applicationssuch as seaborne surveillance and track-ing, where higher output power per ele-ment and lower atmospheric attenuationmust be achieved. S-band systems utilizeSilicon LDMOS or GaN discrete transistorsfor the output stage of the PA.

C-Band radar is most commonly uti-lized in short- and medium-range mobilebattlefield surveillance and missile controlapplications where rapid relocation anddeployment are required. Higher-fre-quency C-band radar systems permit theuse of a smaller antenna while also im-proving accuracy and resolution, thus en-abling radar systems to be mounted ontomobile platforms.

Use of the X-band frequency rangepermits even greater miniaturizationand resolution enhancement, as over1,000 elements can be concentratedwithin a square meter. Theseminiaturized systems are commonlyused by aircraft for intercept and

attack of enemy fighters and groundtargets, and also as high-speed datalinks. X-band systems are also idealfor short-range applications,including border surveillance, as theircompact size permits man-portabilityand fast deployment.



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Additional Technical ConsiderationsApplication-specific requirements

dictate the frequency, which, in turn,influences the available space enve-lope, the circuit topology, and the cir-cuit technology.

The available space envelope is dic-tated by the need to maintain a half-wavelength (or less) antenna spacing inorder to reduce undesirable gratinglobes, and by the array configuration,with total power output limited by themodule’s size, frequency, and heat dissi-pation requirements. Multiple modulesare packaged into a single housing –typically four per module for the higherfrequencies (C-band and above), andtwo per module for S-band – providingsufficient space for full digital function-ality, local power supply conditioning,and a single, all-encompassing environ-mental seal rather than multiple chan-nel-to-channel seals.

For circuit topology, the functionalbuilding blocks of a typical T/R channelremain the same regardless of overall sys-tem requirements. For C-band frequen-cies and above, a MMIC core chip is likelyutilized along with a low-noise amplifierMMIC in the receive path, and a poweramplifier MMIC in the transmit path.The MMICs are typically designed as a

chip set, with the power amplifier beingdriven directly from the core chip.

The typical core chip consists of a digi-tal phase shifter and an attenuator, alongwith low-noise and medium-power amp -lifiers that interface directly with the re-ceive and transmit path MMICs. Switcheswithin the core chip allow the attenuatorand phase shifter functions to be utilizedin both transmit and receive paths, thusforming a common leg circuit. The sys-tem’s minimum detectable range (MDR)can be reduced by minimizing T/R switch-ing speed, limiter recovery time, and DCsupply gating circuit requirements.

A limiter circuit in the LNA protects thedevice from high-power RF signals gener-ated from the transmit side or from exter-nal sources. The antenna port feed to theT/R channel usually passes through a fer-rite circulator, often with a ferrite isolatorto protect the power amplifier, or occa-sionally with a high-power T/R switchthat can terminate the receive path with aload during the transmit pulse cycle.

Lower-frequency designs can utilize acombination of discrete surface mountMMIC devices to realize the core chipfunctionality, along with discrete highpower transistors with external matchingcircuits for the power amplifier. Combin-ing a low-noise receive channel with high

output power extends the signal transmis-sion range. Adjacent T/R channels alwaysneed to be isolated using channelizedgrounded cavities or metal covers.

The circuit technology is influenced bythe frequency band, which, in turn, dic-tates the available space envelope. Lower-frequency designs lend themselves to asingle-layer RF PCB design mounted ontoa backplane, with SMT packaged MMICs,and drop-in devices such as circulators orpackaged discrete transistors. Higher-fre-quency designs have a smaller space enve-lope, making it difficult to fit all the re-quired RF functionality and associatedinterconnects onto a single layer, and pro-hibits the use of packaged devices. There-fore, a chip and wire approach is requiredusing a highly integrated MMIC chip set.A multilayer approach can also be consid-ered using either LTCC packaging or amixed-media multilayer board.

ConclusionThe development of a modular, stack-

able approach to AESA radar enables thistechnology to be quickly and cost-effec-tively adapted to a wide variety of applica-tions. This modularized approach reducesthe total cost of ownership by using COTScomponents and MMIC technology, andby simplifying installation and integra-tion. Once installed, these modularizedsystems are also relatively inexpensive tomaintain, offering graceful degradationreducing single points of failure (PoF), andpermitting in-field TRM replacement(LRU) without having to take the entiresystem off-line.

This article was written by MarkHoward, Chief Engineer at API Mi-crowave Ltd., Philadelphia, PA.For more information, visit http://

info.hotims.com/55596-541.

Figure 3. A Quad Transmit Receive Module(QTRM)

Figure 2. An X-band sub-array face

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Unlike primary radars, SecondarySurveillance Radar (SSR) calculates

the range and azimuth of a target,such as an aircraft, using a bidirec-tional communication link to gatherinformation. Engineers use SSR inboth military and civil aviation, withthe former incorporating an identify-ing friend-or-foe system.

SSR works in different modes to ob-tain information from the target. Thesystem sends interrogating pulses fromthe radar in a bidirectional rotating an-tenna at 1030 MHz. If a target detectsinterrogation, the transponder of thetarget replies with a frame of pulses at1090 MHz. Radar at the ground stationgenerates interrogating pulses and re-quests information such as identity, al-titude, or country code from the targetrepresented as mode-A/3A, mode-C, ormode-S. Based on the interrogation an-swers, the aircraft replies with a stan-dard reply pulse format. The system cal-culates range and azimuth based on thespeed-to-distance relation and rotaryantenna position with respect to northor the heading direction.

Today’s radars need rigorous testingbefore they are deployed in military orcivil aviation. An automated test equip-ment (ATE) system was developed usingNI PXI modular instruments from Na-tional Instruments (Austin, TX) to facil-itate the functionality tests of the radarand physical parameters test of the re-ceiver (Rx) and transmitter (Tx), includ-ing Rx bandwidth, Rx sensitivity, Txpower, and Tx pulse parameters. Func-tionality tests included a target simula-tor to the radar at 1090 MHz, video sig-nal detection, and radar scan converterdisplay using synthetic transistor-tran-sistor logic (TTL) video signal and LANcommunication. Reply pulses in the tar-get and multitarget simulators were sta-tionary and trajectory motion.

The system was composed of an NIPXI-1042 eight-slot chassis and an NIPXI-8196 embedded controller. Theradar was kept either in transmittingmode or receiving mode to test the Txand Rx functionality. External antennasignals north and azimuth count pulses(ACPs) were generated and simu lated

through an FPGA board. Target replypulses were generated through an NIPXI-5671 vector signal generator (VSG)at 1090 MHz. The system acquired de-modulated video signals from the re-ceiver through an oscilloscope card forRx functionality tests. High-powertransmitted RF pulses were acquiredthrough an NI PXI-5661 vector signalanalyzer (VSA) to measure Tx signalpower and pulse parameters. The syn-thesized video at the TTL level gener-ated from the radar processing unit wasacquired through FPGA digital input,and used for a radar scan converter todisplay the target on a polar plot withits range and azimuth position, infor-mantion code, altitude, and countrycode.

Each trigger and sync pulse was syn-chronized with the interrogating RFpulse of the SSR. To protect the instru-ments, the radar transmitter wasswitched off during the Rx tests becausethe radar had a built-in TR module.Both Tx and Rx ports shared the samephysical port, which connected to anantenna. The VSA and VSG connected

to this same physical port, replacing theantenna, and generating and acquiringRF signals at 1090 MHz and 1030 MHz.

Tx out of the radar is connected tothe VSA of the ATE with an attenuator.

Rx in the radar is received by the RFpulses generated through the VSG,which was synchronized with atrigger/sync pulse. Each sync pulse wassynchronized with the interrogatingpulse. After receiving a sync pulse to thetrigger port of the VSG and FPGA, theRF pulse out was generated through theVSG. The Rx video out was connectedto the oscilloscope card to measure re-ceiver sensitivity, bandwidth, dynamicrange, and frequency stability; phasedifferential; reception chain operationalsensitivity; and reception chain sidelobe suppression.

In the functional test, the system gen-erated the antennal simulation signals,such as north and ACP. It simulatedmultiple targets at different azimuthsand ranges in both stationary and tra-jectory motion, and represented thetransponder’s azimuth and range in aradar scan conversion application.

Developing Secondary Surveillance Radar Automated Test Equipment

Figure 1. Overall architecture of the ATE to test the SSR.

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Proper functional testof an Rx can be con-ducted through targetsimulation using theVSG based on syncpulses. In this case, theATE acts as a target sig-nal generator comingfrom the antenna. Eachinterrogation is synchro-nized by a trigger pulseconnected to both theVSG trigger and theFPGA. Users can config-ure the range and az-imuth to simulate withthe target. When a targetis ready for simulation,the VSG generates thereply RF pulses of a target after the azimuth count isreached in the FPGA and the next sync trigger is receivedfrom the radar. The user can select reply code and mode,and scripted pulses are generated at the specified range andazimuth. Targets are simulated for stationary and trajectory

motion. A user config-ures moving paths atdifferent trajectories.The system can simu-late multiple targets atdifferent ranges andazimuths from thesame VSG.

A modular, editablesequence of tests wasdeveloped in LabVIEWto test total function-ality. Users can selecteither automatic ormanual mode for indi-vidual parameter test.With a diagnostic pan -el, users can access theindividual PXI instru-

ments for loop-back or self-test. This article was written by Vishwanath Kalkur and Mondeep

Duarah of Captronic Systems Pvt Ltd. using National Instruments products. For more information, visit http://info.hotims.com/55596-542.

Figure 2. The radar scan converter display decoded through the FPGA.

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Tech Briefs

Work on structural composites withtunable chiral elements has pro-

duced electronically tunable overall chi-ral composites, mechanically tunablechiral composites, flat lenses with softhyperbolic focusing due to indefiniteoverall permittivity, a tunable flat lensbased on chiral elements with ad-justable focal spot based on applied me-chanical deformation, and a three- phaseperiodic composite that demon stratespositive and negative refraction, de-pending on the input frequency andangle of incidence. A MATLAB code di-rectly computes the group velocity andpass bands for a given set of wave vec-tors, and generates an intuitive plot forquick, but thorough analysis.

A broadening application range hasincreased the demand for advanced RFcontrol. Recent research has identifiedseveral metamaterials to provide thiscontrol. This work seeks to expand thisidea through several novel metamateri-als with enhanced electromagneticproperties. First, copper wires braidedwith Kevlar and nylon to form conduc-tive coils were woven among structuralfiber to create a fabric. This yielded acomposite with all coils possessing thesame handedness, producing a chiralmaterial. The measured scattering pa-rameters showed considerable chiralitywithin the 5.5- 8 GHz frequency band,agreeing with simulation results.

Simulation modeled the materialusing a fullwave adaptive solution forthe 1- 12 GHz frequency band with anincidence angle between 0 and 90 de-grees. Experiments are underway with athree- layer sample consisting of anarray of hollow glass tubes in a Rexolitematrix. Thicker samples may be testedthrough the addition of extra layers.The sample is placed in a polycarbon-ate- fiberglass test fixture that is adjustedfor the desired angles of incidence. A 3Dscanning robot scans the desired testvolume, and the vector analyzer (VNA)sends and receives the field response inthe form of S- parameters for the 7- 12GHz frequency band (see figure).

Electronic chirality tuning is investi-gated by integrating varactor diodesinto an array of helical elements on aprinted circuit board. Applying a var-ied reverse bias voltage across the sam-ple effectively tunes the chiral behav-ior of the material. Chirality can be

further tuned mechanically throughthe deformation of an array of conduc-tive coils. Parallel, metallic helices em-bedded in a polyurethane matrix aresubjected to mechanical stretching forpitch adjustment. This change in pitchdirectly affects the overall chirality of

Structural Composites with Tuned EM ChiralitySeveral metamaterials show promise in providing advanced radio frequency control.

Air Force Office of Scientific Research, Arlington, Virginia

Schematic of the test configuration (top) and the actual test setup (bottom). Note: Schematic is not to scale.

Source:Horn Antenna

ParabolicReflector

Sample

Dipole Detector

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Tech Briefs

the composite. Repeatable elastic de-formation is achieved up to 50% axialstrain. Over the 5.5- 12.5 GHz fre-quency range, an increase of 30% axialstrain yields an ~18% change in axialchirality.

Hyperbolic microwave focusing is ex-plored through an indefinite mediumwith anisotropic permittivity. An arrayof 12- gauge brass wires is embedded inStyrofoam and scanned over the 7- 9GHz frequency band to establish focus-ing patterns. A soft- focusing spot is ob-served at 7.6 GHz with a relative gain of~7dB over averaged background.

Tests of the fixture with and withoutthe sample(s) will be normalized with re-spect to air. The measured S- parameterswill indicate the stop and pass bands inthe frequency range, and will be corre-lated with the numerical predictions.

Applying an axial refractive gradientto a coil composite creates a lens capableof fine adjustment in the microwaverange. The gradient required to achievesharp focusing, and the extent of this ef-fect, is calculated through an anisotropicray- tracing analysis. A composite is cre-ated using coils of opposite handednessto minimize chiral effects. Through ex-

tension of these coils, the refractiveindex can effectively be fine- tuned toachieve the desired result. Measurementsand fullwave simulations confirm a gainof 6- 8 dB over averaged background atthe predicted focal frequencies.

This work was done by Siavouche NematNasser of the University of California SanDiego for the Air Force Office of Scientific Research. For more informa-tion, download the Technical SupportPackage (free white paper) atwww.aerodefensetech.com/tsp underthe Materials & Coatings category.AFOSR-0010

Advanced, Single-Polymer, Nanofiber-Reinforced CompositeContinuous nanofibers provide unique advantages for future structural nanocomposites.

Air Force Office of Scientific Research, Arlington, Virginia

Astrategic goal of the U.S. Air Forceis to be able to deliver munitions

to targets anywhere around the globein less than an hour. This will requirevery high speeds and novel lightweightand temperature-resistant materials.Nanocomposites are promising emerg-ing materials for structural and func-tional applications due to unique prop-erties of their nanoscale constituents.However, the currently availablenanocomposites based mostly onnanoparticles lack the high strengthand stiffness required for structural applications.

The goals of this research were to es-tablish feasibility of manufacturing andevaluate performance of novel continu-ous polyimide nanofibers and theirnanocomposites. The main objectiveswere to demonstrate feasibility of fabri-cation of continuous nanofibers from arange of specially synthesized solublepolyimides, characterize their mechani-cal behavior and properties, and fabri-cate and characterize polyimidenanofiber-reinforced composites.

A new class of nanoscale reinforce-ment, i.e. continuous polyimidenanofibers, was explored and developedfor the first time. Continuousnanofibers were produced from a range

of specially designed and synthesizedpolyimides (PIs).

Strength of structural materials andfibers is usually increased at the ex-pense of strain at failure and tough-ness. Recent experimental studies havedemonstrated improvements in modu-lus and strength of electrospun poly-mer nanofibers with reduction of theirdiameter. Nanofiber toughness has notbeen analyzed; however, from the clas-sical materials property tradeoff, onecan expect it to decrease. By analyzinglong (5-10 mm) individual poly-acrilonitrile (PAN) nanofibers, it wasshown that nanofiber toughness alsodramatically improved. Reduction offiber diameter from 2.8 micrometers to~100 nanometers resulted in simulta-neous increases in elastic modulusfrom 0.36-48 GPa, true strength from15-1750 MPa, and toughness from0.25-605 MPa with the largest in-creases recorded for the ultrafinenanofibers smaller than 250 nanome-ters. The observed size effects showedno sign of saturation. Structural inves-tigations and comparisons with me-chanical behavior of annealednanofibers allowed us to attributeultra-high ductility (average failurestrain stayed over 50%) and toughness

to low nanofiber crystallinity resultingfrom rapid solidification of ultrafineelectrospun jets.

Several families of soluble polyimidessuitable for electrospinning were pro-duced. The focus was on chemical con-trol of solubility that is essential forcontrol of both PI synthesis and subse-quent electrospinning of continuousnanofibers from solutions. Control ofnanofiber structure formation duringelectrospinning via altering liquid crys-talline state of the solution was also ad-dressed.

Modeling-based approaches to con-trol nanofiber diameter, deposition, andalignment were utilized. Samples of in-dividual nanofilaments and alignedsheets of nanofibers were fabricated. Bymodifying the conditions of electro-spinning, nanofiber diameter could bemodulated in a very broad range. Newinsights into the jet motion and poly-mer structure formation in the presenceof solvent evaporation allowed furtherrefinement of the process. In addition,this new coupled 3D continuum modelof the process provided better under-standing of macromolecular orientationwithin the nanofibers.

Variations of the measured strength,modulus, strain at failure, and tough-

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Tech Briefs

Quantitative Diagnostics ofMultilayered CompositeStructures with UltrasonicGuided WavesThis nondestructive methodology inspects asound-absorbing composite structural systemconsisting of polymeric and metallic materials.

Air Force Research Laboratory, Edwards AFB,California

Aging infrastructure has a major impact on safety, increas-ing the need to assess damage severity. Machinery, sys-

tems, and components such as airplanes, cars, pumps, andpipes in the oil and chemical industry are subject to varyingcyclic service loading and environmental influences. Some-times multilayered coatings are used, requiring a high-resolu-tion inspection to confirm the presence of a defect such as adelamination, and accurately locate and quantify its size.Highly attenuating materials may significantly increase theinspection time while limiting defect observability. Guidedwaves have been recognized as having excellent potential fornondestructive inspection. However, the presence of vis-coelastic coatings used for corrosion protection is one of themajor obstacles for guided wave inspection.

The presence of sound absorbing viscoelastic rubber-likematerials in multilayered structures can cause significant chal-lenges for conventional nondestructive inspection methods.During the current investigation, an ultrasonic guided-wave-based pitch-catch scanning system was developed specifically

ness with diameter of individual as-spun PI nanofibers wereplotted and analyzed. The results showed extraordinary in-creases in strength and modulus as nanofiber diameter de-creased. The highest strength and modulus values measuredwere on par with strengths and moduli of commercial car-bon fibers. Such high values of modulus and strength inpolymers are usually achieved at the expense of strain atfailure. Remarkably, the high strength of the ultrafine PInanofibers was achieved without statistically noticeable re-duction of their failure strain. These unique simultaneousincreases in modulus, strength, and strain at failure led to adramatic increase of toughness. The highest recordedtoughness was an order of magnitude higher than tough-ness of the best existing advanced fibers, and exceededtoughness of spider silk.

This work was done by Yuris Dzenis of the University of Ne-braska for the Air Force Office of Scientific Research. For more in-formation, download the Technical Support Package (freewhite paper) at www.aerodefensetech.com/tsp under the Ma-terials & Coatings category. AFRL-0239

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Tech Briefs

to detect internal delaminations inplate- and tube-like multilayered com-posite structures.

The goal of this study was to investi-gate the feasibility of applying ultra-sonic guided waves to detect internaldelaminations inside multilayered com-posite structures. A secondary objectivewas to develop light, low-profile inter-digitated transducers (IDTs) for interro-gating entire targeted sections of multi-layered composite structures byselectively exciting only one mode ofguided waves in these structures.

Ultrasonic measurements were per-formed initially on multilayered flatplate having aluminum and carbonfiber outer skin. These measurementswere repeated on multilayered cylindri-cal half-tubes with the same aluminumand carbon fiber skin. The first sym-metric mode S0 of Lamb waves in plates

and tubes was excited selectively bymeans of specially designed IDT sen-sors. These IDT sensors were fabricatedfrom thin wafers of piezoelectric leadzirconate titanate (PZT) substratesusing a pulse laser micromachiningprocess to etch interdigitated electrodepatterns on the surface.

While successfully demonstratingthat the presence of internal delamina-tions can be detected reliably by measur-ing changes in the energy of the re-ceived signals, it is estimated that thepitch-catch ultrasonic system developedfor the current investigation can detect adelamination as small as 1 mm wide.Similarly, in the half-tubes, small delam-inations were also detectable in bothaluminum and composite structures.

To inspect the carbon fiber compositestructures, approximately four timesmore energy was required due to a

higher attenuation property of theouter composite casing layer. Addition-ally, the received energy was four timeslower than the aluminum multilayeredplate case. The portable system wasfound to be effective for both alu-minum and carbon fiber compositestructures, even though the carbon fibercomposite plate exhibited higher signalattenuation. Yet, both defects in thefirst and second bondline interfaceswere successfully detected.

An IDT sensor-based guided wave in-spection methodology is thought tohave a high potential as a field-deploy-able inspection tool for complex multi-layered structures. Among many advan-tages, the main benefit is that they canpropagate long distances with mini-mum distortions and decays. From thecurrent investigation, it is concludedthat guided wave signals are sensitiveenough to detect the presence of delam-inations at the bond lines of multilay-ered structures.

This work was done by Gheorghe Bungetand Fritz Friedersdorf of Luna InnovationsInc., and Jeong K. Na of Edison Welding In-stitute for the Air Force Research Labora-tory. For more information, downloadthe Technical Support Package (freewhite paper) at www.aerodefensetech.com/tsp under the Manufacturing &Prototyping category. AFRL-0240

Reactive, Multifunctional, Micellar, CompositeNanoparticles for Destruction of Bio-AgentsComposite nanoparticles are promising biocides that can be prepared in various forms and easily stored.

Defense Threat Reduction Agency, Fort Belvoir, Virginia

Multifunctional composites havebeen investigated for destruction of

bio-agents. These materials’ uniqueproperties at the nano scale, includingtheir abrasive character and high surfacearea leading to very close contact withcells, and their unusual surface mor-phology leading to high surface reactiv-ity, make them promising biocides.Nanoparticles can also be prepared in avariety of forms such as powders, slur-ries, pellets, and membranes, makingthem more convenient and widely appli-

cable for bio-agent destruction. Addition-ally, nanoparticles can generally be easilystored, which increases their flexibility.

Although metal oxide nanoparticlesperform well in destroying vegetativebacteria, the reactivity of the pure metaloxide nanoparticles may not be strongenough to destroy non-vegetative bacte-ria (e.g., spores) that would be more vul-nerable to additional attack. Therefore,formation of efficient agents for destruc-tion of bio-agents necessitates incorpo-rating strong conventional biocides that

synergistically function with metaloxide nanoparticles. This concept be-comes very important in the case ofspores, where a combination of twoagents is usually much more efficientthan one agent alone, and very oftennecessary. Ideal nanoparticle-based bio-cides should be equipped with desirablemultifunctionality including the abilityto deliver large amounts of biocides, effi-cient co-encapsulation of one or moreagents, and reactive or energetic destruc-tion of bio-agents.

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Side cross-sectional schematic view of the composite multilayered structure of the plate/tube-like specimensused for the current investigation.

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Tech Briefs

The objective of this research is to develop a new, efficientbio-agent neutralizer or destructor based on multifunctionalcomposite nanoparticles in large scale; and to gain a funda-mental understanding of the basic science of how structure,surface chemistry, and catalytic species affect chemical absorp-tion and deactivation of bio-agents by dissecting structure-property-performance relationships of these materials, and byunderstanding their synthesis and resulting structure and com-position of the materials.

Reactive and multifunctional porous metal oxide-silicacomposite nanoparticles (ZnO-SiO2 nanoparticles) were devel-oped for efficient destruction or neutralization of targeted bio-molecules (chemical warfare agents, bio-agents, and other tox-ics) by aero-oxidation, electro-oxidation, or photo-catalyticoxidation. In the composite nanoparticles, metal oxides cross-link surfactant or polymer into core-shell micellar compositenanoparticles. The surface of the porous silica is covalentlybonded with an organic functional group through silanechemistry.

Finally, reactive and multifunctional porous silicon (PSi)-Ti-tania (TiO2) or PSi-silver (Ag) heterojunctions were developed.There materials have efficient destruction and neutralization oftargeted biomolecules (chemical warfare agents, bio-agents,and other toxics) by combined effects of aero-oxidation, elec-tro-oxidation, photo-catalytic oxidation and absorption. Thereactive and multifunctional porous silicon (PSi)-Titania (TiO2)or PSi-silver (Ag) heterojunctions were synthesized. In thecomposite nanoparticles, Titania and/or silver nanodots weredispersed on the surface of silicon particles instead of the core-shell structure to utilize mass transmission.

This project focused on synthesis and characterization of mul-tifunctional composite nanoparticles, such as micellar Au-metaloxide core-shell nanoparticles, metal oxide (ZnO)-silica compositenanoparticles, porous silicon (PSi)-Titania (TiO2), and PSi-silver(Ag) heterojunctions.

This work was done by Donghai Wang of Pennsylvania StateUniversity for the Defense Threat Reduction Agency. For more in-formation, download the Technical Support Package (freewhite paper) at www.aerodefensetech.com/tsp under the Ma-terials & Coatings category. DTRA-0003

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Technology Update

Signal Compression Technology Enables E-Fan's Flight, Potential Enhanced 'Black Box' Possibilities

V-Nova Ltd. demonstrated thecapabilities of its PERSEUS data

compression technology foraerospace applications as part ofAirbus’ all-electric E-Fan technologydemonstrator aircraft’s flight acrossthe English Channel.

During the flight, PERSEUS enabledup- and downstream HD (high-defini-tion, 720p 25 frames/sec) video teleme-try over standard, publically accessible3G mobile networks, with a more than80% bandwidth reduction compared totraditional technology under similarconditions, says V-Nova.

This made it possible to transmit ter-restrial HD video to the cockpit, and al-lowed personnel aboard the chase air-craft and on the ground to view theE-Fan’s flight progress, as offline con-tent and camera feeds from the crossingwere down-linked, encoded, and dis-tributed in real time via 3G networks toAndroid- and iOS-connected devices.

“Streaming HD-quality live videoover existing 3G networks under de-manding ‘real-life’ aerospace conditionsis completely new,” said Dr. Jean Botti,Airbus Group Chief Technical Officer.“There are significant opportunities for

this technology tosupport the aero-space industry’s digi-tal transformation.”

PERSEUS provideshigh-quality, high-compression encod-ing and decoding ofdata—at significantlyfaster speeds and thesame or lower latencythan traditional tech-nology—using com-mercial-off-the shelf(COTS) hardware.

The successfulvideo telemetry for E-Fan’s flight demon-strated a wide range

of potential aerospace industry uses forthe PERSEUS technology, including trans-mission of high-quality video content be-tween the ground and aircraft, the han-dling of flight-critical data for trendmonitoring and aircraft optimization,wireless distribution of in-flight enter-tainment throughout commercial jetlinercabins, and other potential bonuses.

“PERSEUS’ effective data compressionalso opens opportunities for additionalservices, such as an ‘enhanced or vir-tual’ black box that could store moredata, or provide real-time critical infor-mation via the cloud,” said Eric Acht-mann, V-Nova Executive Chairman &Co-Founder. “Another possible applica-tion could be for continuous live videoobservation of the cockpit or cabin forsecurity purposes, with this hierarchicalsoftware enabling users to adjust thelevel of video quality and bandwidth re-quired ‘on-the-fly’ as situations evolve.”

PERSEUS has been developed andtested over the past five years within anopen innovation, interoperable coalitionof over 20 global industry leaders, includ-ing Broadcom, Dell, Encompass, Hitachi,Intel, Sky Italia, TataSky, VisualOn, andWyPlay, to name a few. The PERSEUS soft-ware currently is offered in the form ofbundled hardware, embedded software,codec plug-ins, and silicon IP.

Jean L. Broge

V-Nova's PERSEUS data compression technology enabled HD video teleme-try for Airbus's E-Fan technology demonstrator's crossing of the EnglishChannel. With its 74-km flight from Lydd, England to Calais in France in July,the E-Fan became the first all-electric two engine aircraft taking off by itsown power to successfully cross the English Channel. (Airbus)

TRB Turns Composites Focus to Aerospace Sector

TRB Lightweight Structures Ltd. re-cently released an aerospace-grade

lightweight honeycomb composite paneldesigned for interior applications, ex-panding the application areas for its rangeof composite flat panels.

Cellite 840 panels are manufacturedfrom woven glass with a phenolic resinand a Nomex honeycomb core, bondedwith high-performance adhesive. Thewoven glass prepreg skins are 0.5 mmthick. Standard panels are 2500 mm wide(±4 mm) by 1250 mm long (±3 mm).Other panel sizes are available upon re-

quest, the Cambridgeshire, U.K.-basedcompany notes. Overall thickness is percustomer request, ±0.25 mm.

The new design extends the range ofTRB’s composite flat panels, whichhave been used for years to manufac-ture bonded assemblies, lightweightstructures, and composite componentsfor rail, defense, marine, and motor-sports industries.

This product development builds onTRB’s recent AS9100 (BS EN 9100) aero-space accreditation, adding to the IRIS(International Railway Industry Standard)

and ISO 9001 certifications already inplace. AS9100 is an industry-recognizedstandard of quality and risk managementfor the aerospace and defense industryaimed at improving service standards andproduct reliability.

Obtaining AS9100 is part of TRB’slong-term strategic investment in theaerospace sector, both in the U.K. andglobally. Additional new capacity andcapabilities in the design and manu-facture of composite materials havebeen made over the past year to helpsecure new business. Recent invest-

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Technology Update

ments for manufacturing compositesinclude the procurement of a new 3- x1.5-m autoclave system.

“As specialists in the design and engi-neering of lightweight composite solu-tions, we enjoy the challenges that theaerospace industry provides,” saidRichard Holland, Managing Director ofTRB. “Obtaining AS9100 now allows us toextend our expertise as an end-to-endservice provider further into the heart ofthis demanding industry, as well as im-proving our service to existing customersin aerospace and defense.

“In the last 12 months, in addition toputting in place additional compositescapabilities, we’ve been on a journeythat has seen us implement many im-provements across the business to raisequality and drive down costs,” Hollandcontinued. “A key focus on productionefficiency means that we are now ableto offer significantly reduced lead times.As a result, we’re currently in theprocess of negotiating new contracts

with a number of aerospace customers,and we expect more to come on boardnow that we are AS9100 approved.”

Procured in June 2015, the new auto-clave system for the manufacturing ofhigh-performance composite compo-nents is 3 m long and has a process massincluding tooling of up to 500 kg. Thevessel is designed to meet the require-ments of PD 5500 with a design pressurecapability of 10 bar at 250°C.

The autoclave system complementsTRB’s existing range of machines for com-posite manufacture that includes ovens,computer-controlled multi-daylightheated platen presses for high-perfor-mance material bonding, and a 4000-ft²ISO 14644 class clean room.

“The autoclave system is an impor-tant step in the continued develop-ment of our business,” said AndrewDugmore, Sales Director at TRB. “[It]enhances our current in-house capabil-ity, ensuring we maintain control ofcosts, lead times, and quality.”

He added, “This has resulted in newcontracts for key customers includingthe manufacture of a complex, light-weight backing structure for use in anRF Mock-Up of a new microwave instru-ment for Airbus, and a complete car-bon-fiber floor system for a high-perfor-mance racing yacht for Green Marine.”

Ryan Gehm

Cellite 840 panels from TRB are manufacturedfrom woven glass with a phenolic resin and aNomex honeycomb core, bonded with high-perfor-mance adhesive.

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Technology Update

With its eye on Mars, NASA Arm-strong has been working on a

prototype it refers to as the PreliminaryResearch Aerodynamic Design to Landon Mars, or Prandtl-m, which is “a fly-ing wing aircraft with a twist.” It isplanned to be ready for launch from ahigh-altitude balloon later this yearand will be released at about 100,000ft. That altitude will allow it to operatein similar flight conditions as the Mar-tian atmosphere, according to Al Bow-ers, NASA Armstrong Chief Scientistand Prandtl-m Program Manager.

Testing is expected to lead to modifi-cations that will allow the aircraft tofold and deploy from a 3U CubeSat inthe aeroshell of a future Mars rover. ACubeSat is a miniature satellite used forspace research that is usually about 4-inin each dimension; a 3U is three ofthose stacked together.

Bowers describes the aircraft as beingpart of the ballast that would be ejectedfrom the aeroshell that takes the Marsrover to the planet. It would be able todeploy and fly in the Martian atmos-phere and glide down and land. “ThePrandtl-m could overfly some of the pro-posed landing sites for a future astronautmission and send back to Earth very de-tailed high-resolution photographic mapimages that could tell scientists about thesuitability of those landing sites,” he said.

Because the Prandtl-m could ride in aCubeSat as ballast aboard theaeroshell/Mars rover piggyback stackgoing to Mars in 2022-2024, the addi-tional weight would not add to the mis-sion’s cost, he said. Once in the Martianatmosphere, the Prandtl-m wouldemerge from its host, deploy, and beginits mission.

“It would have a flight time of rightaround 10 minutes. The aircraft wouldbe gliding for the last 2000 ft. to the sur-face of Mars and have a range of about20 miles,” Bowers said.

But first, “We’re going to build somevehicles and we are going to put them invery unusual attitudes and see if they willrecover where other aircraft would not.Our expectation is that they will recover.As soon as we get that information, wewill feel much better flying it from ahigh-altitude balloon,” said Bowers.

“The actual aircraft's wingspan when itis deployed would measure 24-in andweigh less than a pound,” Bowers said.“With Mars gravity 38% of what it is onEarth, that actually allows us up to 2.6 lb.and the vehicle will still weigh only 1 lb.on Mars. It will be made of compositematerial, either fiberglass or carbon fiber.We believe this particular design couldbest recover from the unusual conditionsof an ejection.”

The Flight Opportunities Program,which is managed at NASA Armstrong,will fund two balloon flights during thenext several years and potentially asounding rocket flight following that todemonstrate how the flier would workon Mars. The flights will be at one oftwo locations–Tucson, Arizona, orTillamook, Oregon.

“We are going to use GPS initially,but obviously there is no GPS on Mars,so later on we will have to find some-thing else for navigation,” Bowerssaid. “But the little autopilot that pro-vides the waypoint navigation, that’sone of the things we’re going to exer-cise on a research vehicle and then onthe prototype that flies on a futureballoon flight.”

The flight test could also includesome scientific research that will applyto a Mars mission.

“We could have one of two small sci-ence payloads on the Prandtl-m on thatfirst balloon flight,” Bowers said. “Itmight be the mapping camera, or onemight be a small, high-altitude ra-diometer to measure radiation at veryhigh altitudes of Earth’s atmosphere.Eventually the aircraft may carry bothof them at the same time.”

A second research flight from a bal-loon is planned for next year and wouldfeature an aircraft capable of returningto the launch site on a flight that couldbe as long as five hours as it glides backto Earth, he said.

Success could lead to a third missionthat is already being discussed becausethe Flight Opportunities Program has ac-cess to a sounding rocket capable ofgoing to very high altitudes, Bowers said.

“That mission could be to 450,000 ft.and the release from a CubeSat atapogee,” he said. “The aircraft would fallback into the Earth's atmosphere and as itapproaches the 110,000- to 115,000-ft. al-titude range, the glider would deploy justas though it was over the surface of Mars.

“If the Prandtl-m completes a450,000-ft. drop, then I think the proj-ect stands a very good chance of beingable to go to NASA Headquarters andsay we would like permission to ride toMars with one of the rovers.”

Jean L. Broge

Preparing for First Flight on Mars

TRB’s new autoclave system for the manufacturingof high-performance composite components is 3 mlong and has pressure capability of 10 bar at250°C.

Jonathan Zur, from left, Alexandra Ocasio, DerekAbramson, Red Jensen, Etan Halberg and KeenanAlbee wait for data to download from a Prandtl-dflight. (NASA/Ken Ulbrich)

An illustration depicting what a PreliminaryResearch Aerodynamic Design to Land on Mars(Prandtl-m) aircraft might look like flying abovethe surface of Mars. (NASA/Dennis Calaba)

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Application Briefs

Aircraft Casting AlloyIBC Advanced Alloys Corp. Wilmington, MA855-237-2522www.ibcadvancedalloys.com

IBC Advanced Alloys Corp. will continue production ofcomponents for Lockheed Martin's F-35 Lightning II

Electro-Optical Targeting System (EOTS). The Electro-Optical Targeting System (EOTS) is the

world's first sensor that combines forward-looking in-frared (FLIR) and infrared search and track (IRST) func-tionality. The high-performance, lightweight, multi-func-tion system provides precision air-to-air and air-to-surfacetargeting capability in a single package. Through EOTS, pi-lots have access to high-resolution imagery, automatictracking, IRST, laser designation and range-finding, and laserspot tracking at greatly increased standoff ranges. The low-drag, stealthy EOTS is integrated into the F-35 Lightning II'sfuselage with a durable sapphire window and is linked to theaircraft's integrated central computer through a high-speedfiber-optic interface.

The EOTS azimuth gimbal housing is manufactured usingBeralcast®, IBC Advanced Alloys Corporation’s proprietaryberyllium-aluminum casting alloy. The targeting system,produced by Lockheed Martin, is integrated on all F-35variants. IBC will deliver near-net-shape castings directly toLockheed Martin, which will then separately contract the

finishing and final machining processes. To ensure continuedproduction, Lockheed Martin has agreed to a long-lead-timeprocurement provision for essential materials.

The F-35 Lightning II, a 5th generation fighter, combinesadvanced low-observable stealth technology with fighterspeed and agility, fully fused sensor information, network-en-abled operations, and advanced sustainment. Three distinctvariants of the F-35 will replace the A-10 and F-16 for the U.S.Air Force, the F/A-18 for the U.S. Navy, the F/A-18 and AV-8BHarrier for the U.S. Marine Corps, and a variety of fighters forat least 10 other countries.

For Free Info Visit http://info.hotims.com/55596-507

War-Game Simulation SoftwareMASA GroupParis, France+33 1 55 43 13 20www.masagroup.net

M ilitary training tools must work effectively with re-duced staff numbers and simulate a large variety of

situations. Following 12 years of collaboration, theFrench Armed Forces have expanded their use of SWORD,

a constructive simulation software package developed byMASA Group.

SWORD is an automated war game that is powered by arti-ficial intelligence technology, enabling simulated units to actaccording to the Army's doctrine validated by subject matterexperts. This unique capability means large-scale exercises areconducted in the most realistic way possible, while minimiz-ing the combined operating costs and animation effort.

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Application Briefs

VPX Chassis for Missile System

VerotecManchester, NH603-821-9921www.verotec.us

Using a hit-to-kill approach, a US Army anti-ballistic mis-sile system called Terminal High Altitude Area Defense

(THAAD) is designed to shoot down short, medium, and inter-mediate ballistic missiles in their terminal phase. The inter-ceptor missile, developed by Lockheed Martin, carries no war-head, but relies on the kinetic energy of the direct impact todestroy the incoming threat.

Verotec has supplied Lockheed with a custom 4U, 750-mm-deep, 19-inch VPX chassis that houses a signal integrity test-

ing subsystem, the reconfigurable and analogue Self Test Sub-system (STS). The STS chassis validates the signal outputs fromother parts of the control system to ensure signal integrity.

Signals enter the STS through four high-density circular con-nectors in the front panel. The signals are initially processedthrough FPGA-based cards, which are cooled by one of two in-tegral high-performance fan trays mounted in the base of theunit. The top and base of the chassis are fitted with high-per-foration covers to maximize airflow through the cards. Theprocessed signals from the FPGA cards are propagated to a 3U9 Slot VPX (VITA 46) system at the rear of the unit, which ishoused in a heavy-duty KM6-HD card cage, powered from a300 Watt pluggable PSU and cooled by the second dedicatedfan system. The rear panel also provides cut-outs for DIN, USB,and RJ45 connectors. Signals exit the VPX section of the sys-tem to a DMM and oscilloscope, generating external data that

allows the operating personnel to confirmtheir integrity against reference values as partof the pre-launch sequence.

A typical THAAD battery consists of fourmain components:

Launcher: Truck-mounted, highly-mo-bile, able to be stored; interceptors can befired and rapidly reloaded.

Interceptors: Eight per launcher. Radar: Army Navy/Transportable Radar

Surveillance (AN/TPY-2) – Largest air-trans-portable x-band radar in the world searches,tracks, and discriminates objects and providesupdated tracking data to the interceptor.

Fire Control: A communication and data-management backbone, the fire control sys-tem links THAAD components together; linksTHAAD to external Command and Controlnodes and to the entire BMDS; and plans andexecutes intercept solutions.


Preparing military staff for action is made much more effi-cient by training in a realistic operational environment, withjoint forces and allies, in a variety of different battlefield sce-narios. SWORD provides an immediate solution to SOULT(the simulation program for Combined Forces and GroundLogistics Units’ Operations), for the operational preparationof combined forces at division, brigade, and battle group com-mand posts. SWORD's simulations also target specialist train-ing areas, including engineering, intelligence, logistics, orCBRN-Chemical. Large-scale exercises are conducted in realis-tic ways, minimizing operating costs and animation efforts.

The Centre of Expertise for Information validation and SIM-ulation (CEISIM), which oversees simulation and digitizationwithin the French Armed Forces, will manage the simulationprogram for SOULT and its assimilation into the Army. TheSOULT program will be rolled out gradually, beginning with

the Training Centre for Command Posts (CEPC), to ensure thecontinued service of the current SCIPIO system, which al-ready operates with previous versions of SWORD and hasbeen deployed and used operationally by the CEPC since2006. SOULT will also progressively replace the JANUS soft-ware -which is currently used in several training centers forFrench and foreign command units, as it comes to the end ofits lifecycle. The CEISIM has already tested SWORD's capacityto engage in the exercise, traditionally undertaken by JANUSsoftware, at the Armed Forces Engineering School in Angers.

Training centers, brigades and regiments will steadily beequipped beginning in 2016, giving them their first decen-tralized capability for self-training and allowing them tomake the best use of their training sessions in force readi-ness centers.


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New Products

SIP DC-DC ConvertersPremier Magnetics (Lake

Forest, CA) has announcedadditions to its PDCS fam-ily of self-contained, sin-gle-in-line-package (SIP)DC-DC converters for dis-tributed power applica-tions. The additions to thePDCS product family in-clude two three-pin series.

The first is the PDCS01x series, which contains nine modelsfeaturing regulated power outputs from 0.75 to 15 watts.They also offer nominal input ranges of 12 VDC and 24VDC, outputs ranging from 1.5 to 15 VDC, and all are of-fered with a maximum output current of 500mA. Also beingintroduced is the three-pin PDCS04x series that includes 10devices offering a similar range of input and output voltagesas the PDC01x series, but with a maximum output currentof 1000mA.

The new four-pin series added to the PDCS family contains 49models of 0.25W-rated devices featuring 1000 VDC isolationand with input voltages from 1.8 to 24 VDC. For each inputvoltage, the devices are offered with an unregulated output volt-age (±10%) ranging from 1.8 to 24 VDC.


5-Slot 3U Mission Computer Curtiss-Wright Corporation (Ashburn, VA) announced that

its Defense Solutions division has introduced a new fully inte-grated 5-slot 3U OpenVPX™ rugged mission computer de-signed to quickly deploy computer power on defense and aero-space platforms. The MPMC-9355-0002 Multi-PlatformMission Computer can be readily configured with up to four2.1 GHz VPX3-1257 3U OpenVPX™ single board computers(SBCs), each of which features a quad-core 3rd GenerationIntel® Core™i7 processor. The MPMC’s SBCs are flexibly con-nected using a fully managed Layer 2 Ethernet switch and aPCIe backplane infrastruc-ture. The integral VPX3-652Ethernet switch supports upto eight external Gigabit Eth-ernet (GbE) connections forinter-system communication.

This flexible mission com-puter can be “personalized”with a wide array of moduleoptions via each of the SBC’sonboard PMC/XMC expan-sion sites. The MPMC-9355-0002 can also be configured tosupport high performance graphics displays by integrating anoptional VPX3-716 graphics engine that can drive up to fourindependent displays. Power is provided by a 3-phase 115VAC power supply.


Contactless Connectivity SystemTE Connectivity’s (TE) (Berwyn, PA) new ARISO Contactless

Connectivity system, available from Mouser Electronics (Mans-field, TX), is a hybrid interconnect system that allows for bothpower and data to be sent over short distances without any me-chanical contact between the two couplers. This permits easyconnectivity through materials such as walls, fluids, dust, andharsh atmospheric condi-tions. Power transfer of up to12W along with eight PNPchannels can be sent be-tween the couplers, whichcan move at an angle and besubjected to intense vibra-tion without losing signals.

Each coupler containstwo transmission mecha-nisms. On the outside ofeach coupler is a tightly wrapped circular coil, providing theinductive transfer of power across short distances to a secondcoupler. On the inside of the circular coil is a loop antennawhich allows the transfer of data between the two couplers.Behind each coupler are electronics that manage the transfersand provide an interface to the external devices that are attached to each coupler. The system allows for the transmis-sion of power and data over a distance of 7mm and allows fora misalignment of up to 5mm between the two couplers.


Micro System-on-ModuleInforce Computing®,

Inc. (Fremont, CA) hasannounced the ultra-small Inforce 6501™

Micro System-on-Mod-ule (SOM). The Inforce6501 Micro SOM ispowered by the Qualcomm® Snapdragon™ 805 processor. TheSnapdragon 805 processor with 2.7 GHz CPUs features the Qual-comm® Adreno™ 420 GPU, Qualcomm® Hexagon™ DSP v50,and dual image signal processors, supporting a comprehensiveencoding and decoding Ultra HD (4K) video solution, and deliv-ers high-resolution video and imaging for embedded devices. TheInforce 6501 Micro SOM comes with up to 3GB of PoP LPDDR3RAM on a 2×64-bit high-bandwidth memory bus to provide fastand seamless multitasking.

Measuring just 28mm × 50mm, the Inforce 6501 Micro SOMtargets space constrained embedded systems applications that re-quire 4K HD video and graphics, low power consumption, andhigh-end CPU, GPU, and DSP compute performance. Androidfunction and peripheral support with a KitKat 4.4 BSP that in-cludes drivers for GbE, SDIO, Wi-Fi, BT 4.1, GPS, and video accel-eration up to 4K resolution, cameras up to 55MP resolution, andhighly flexible power management.


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New Products

Carbon-Graphite BushingsMetallized Carbon Corporation (Ossining, NY) has an-

nounced Metcar® carbon- graphite bushings for use in gearpumps that pump aviation fuel for aircraft engines. The car-bon-graphite bushings are used to support both the drive gearshaft and the idler gear shaft.

Metcar carbon-graphite bushings are preferred for this appli-cation because they can use aviation fuel as the bushing lubri-

cant. Aviation fuel is alow viscosity liquid thatproduces only an ex-tremely thin hydrody-namic film, too thin toprovide adequate lubri-cation for traditionalmetallic bushings. Butsince Metcar’s carbon-graphite material has noatomic attraction to a

metallic shaft, the thin fuel film is sufficient to lubricate metal-lic shafts running in the carbon-graphite bushings.

A second major advantage of carbon-graphite bushings isthat they are self-lubricating—they can run dry for short peri-ods of time without catastrophic pump failure or significantwear. In addition, Metcar carbon-graphite bushings are dimen-sionally stable, which permits the close bushing to shaft run-ning clearances that are required in gear pump applications.


Small Form Factor Systems4DSP (Austin, TX) has an-

nounced two new additionsto its Compact EmbeddedSystem (CES) line. TheCES820 and the ruggedizedCESCC820 variant both fea-ture an upgraded XilinxKintex UltraScale FPGA andsupport for the new SDAccel devel-opment environment. These standalone, smallform factor systems are complete and generic processing plat-forms for data acquisition, signal processing, and communica-tion. The powerful UltraScale FPGA provides a flexible process-ing backbone for interfacing to the FMC site, CPU, and externalDDR3 SDRAM.

The CES820 enclosure measures about five inches per sideand weighs less than 1 Kg. Designed with Size, Weight andPower (SWaP) in mind, this system provides a quad-core, low-power Atom CPU that is tightly coupled to the UltraScaleFPGA and FPGA Mezzanine Card (FMC - VITA 57.1).

The ruggedized CESCC820 version features a slightly larger,more robust, and vibration-resistant chassis which offers con-duction cooling and space for additional FMC modules. It op-tionally offers a dual 10Gb Ethernet port for high-bandwidthapplications in the military and aerospace markets.


XMC Modules Acromag’s (Wixom,

MI) new XMC-7A200 isa XMC mezzanine mod-ule enhanced with Xil-inx® Artix® -7 FPGA forlow-power consumptionand exceptional 128M× 16-bit Quad DDR3SDRAM processing per-formance. Reconfigurable Artix-7 FPGA is possible via a directdownload into the Flash configuration memory over the PCIebus or the JTAG port. Four-lane high-speed serial interface onrear P15 connector for PCI Express Gen 1/2 (standard), SerialRapidI/O, and Xilinx Aurora implementations are supported.Rear I/O provides 8-lane high-speed serial interface on the P16XMC port. SelectI/O or LVDS pairs plus global clock pairs di-rect to FPGA via rear P4 or P16 port. The FPGA serves as a co-processor applying custom logic and algorithms to streams ofremote sensor data.

Build options include XC7A200T FPGA device with plug-in I/O or conduction-cooled for extended temperature. Anengineering design kit provides user with basic informationrequired to develop a custom FPGA program. Software sup-port packages are available for VxWorks® 32-bit, Windows®

DLL, and Linux™.For Free Info Visit http://info.hotims.com/55596-516

Flow TransmitterThe AS-FT Flow Transmitter from FCI Aerospace (San

Marcos, CA) features a rugged, highly reliable thermal dis-persion technology sensor design that is ideal for mission-critical air, gas and fluid monitoring systems on commer-cial and military aircraft.

Highly versatile, the FCI AS-FT flow transmitters measureair from 0.25 SFPS to 1000 SFPS [0,07 NMPS to 305 NMPS].Measurement of fuel, hydraulic fluid or coolant is availablefrom 0.01 SFPS to 10SFPS [0,003 MPS to 3MPS]. The measure-ment range for waterand ethylene glycol(EGW) is from 0.01SFPS to 5 SFPS [0,003MPS to 1,5 MPS]. Ac-curacy for measure-ment is ± 2 % of fullscale; higher accu-racy optionally available. Temperature accuracy is ± 1 °F [± 1 °C] over the specified range.

With their rugged design, the FCI AS-FT flow transmit-ters operate from -40 °F to 250 °F [-40 °C to 121 °C]. Theyare proof pressure tested up to 2000 psig [138 bar (g)] orgreater as required by application. Certifications include:MIL-STD-810, MIL-STD-461 and RTCA / DO-160.


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New Products

VPX Embedded ComputerKontron (Augsburg, Germany) introduced its next-

generation StarVX high performance embedded com-puting (HPEC) system based on the company’sVX3058 3U VPX single board computer (SBC). Lever-aging the processing power of the advanced 8-coreversion Intel® Xeon® D-1540 (Broadwell DE), the StarVX packs server-class silicon andhighly ruggedized technologies in a compact 3U blade footprint. Each blade is con-nected to two 10 Gigabit Ethernet (GbE) and high bandwidth PCI Express (PCIe) 3.0through the system backplane, while the processor uses high speed DDR4 memory tomeet increased sensor data processing needs. Kontron’s VXFabric™ API provides aTCP/IP protocol over the PCI Express infrastructure.

Ruggedized for harsh environments, the OpenVPX-based air and conduction cooledStarVX offers extended operating temperature and is shock, vibration, humidity and alti-tude tested. It is also optimized for reduced size, weight, power and cost (SWaP-C) require-ments and offers central health and power management capabilities. The StarVX also of-fers a 24 port 10 Gigabit Ethernet switch as well as a PCIe switch.


Flat Cable AssembliesCicoil's (Valencia, CA) flat cable assemblies are

designed for use in targeting pods, thermographiccamera and infrared sight systems typically uti-lized in multi-role fighter aircraft, attack helicop-ters and maritime surveillance vessels where cablefailure is not an option. The compact, Flexx-Sil™encased flat cable solutions are engineered to pro-vide consistent electrical characteristics, space &

weight savings, EMI/RFI suppression, and optimum cable flexibility. Unlike Teflon or Polyurethane cables, Cicoil utilizes an exclusive process of encapsulat-

ing individual components in a shock absorbing jacket that renders them unaffected by re-peated exposure to severe vibration, G-Forces, flames (UL 94V-0), ice, fog, ozone, steam,humidity, extreme temperatures (-65°C to +260°C), harsh weather, salt corrosion, opera-tional stress, chemicals, and the rigors of turbulent flight. Each Cicoil flat cable can incor-porate a variety of components including power conductors, controlled impedance pairs,shielded control wires, video conductors, multi-layer shielding options and Cicoil'spatented StripMount™ fastening strip.


Aerospace Gimbals Test ServiceA new test service introduced by Bal Seal Engineering, Inc.

(Foothill Ranch, CA) offers OEMs verified performance resultsfor Bal Seal spring-energized rotary/face seals used in aero-space and defense gimbal applications. Bal Seal Engineering’sgimbal seal test equipment measures friction and leak rateusing customer-defined hardware tolerances and operatingconditions, including pressure and speed.

Fixtures can accommodate seals up to 22 in. OD, and canbe modified for larger seal dimensions. The fixtures can pro-duce a wide range of pressures and exert specific frictionalforces to accurately simulate a seal’s performance under real-world conditions. Rotatingplates on the fixtures are connected to digital force testers, which measure the frictionof rotation. A vacuum tester simulates air flow over the gimbal during flight. The testerpulls a vacuum across the plates, creating suction inside the seal to measure the leak rateacross its surface. Both friction and leak rate are measured simultaneously.






COMSOL MULTI-PHYSICS 5.2COMSOL redefined the engi-neering simulation marketwith the release of COMSOLMultiphysics® software version5.2, featuring the new and rev-olutionary ApplicationBuilder. COMSOL users can

now build applications for use by engineering andmanufacturing departments, expanding accessibilityto their expertise and to cutting edge simulationsolutions. See how at comsol.com/5.2

COMSOL, Inc.

NICKELCONDUCTIVEEPOXYADHESIVESYSTEM

Master Bond EP76MHT is a two component, nickelfilled, electrically conductive epoxy for high perform-ance bonding, sealing and coating. EP76MHT fea-tures a paste like consistency with a mix ratio of one toone by weight or volume. It has an exceptionally longworking life and cures readily at ambient tempera-tures. http://www.masterbond.com/tds/ep76mht

Master Bond

WIRELESSCOMMUNICA -TION PLANNINGSOFTWARE Wireless InSite is site-spe-cific radio propagationsoftware for the analysis ofwireless communication

systems, wireless networks, sensors, radars, and otherdevices that transmit or receive radio waves. The new version allows import of KMZ and COLLADAgeometry files, making it easy to add single struc-tures, such as bridges, high resolution buildings, ornew construction, to a scene. Learn more atwww.remcom.com/wireless-insite.

Remcom

Product Spotlight


A WORLD OF FIBER OPTIC SOLUTIONS

• T1/E1 & T3/E3 Modems, WAN• RS-232/422/485 Modems and Multiplexers• Profibus-DP, Modbus• Ethernet LANs• Video/Audio/Hubs/Repeaters• USB Modem and Hub• Highly shielded Ethernet, USB (Tempest Case)• ISO-9001http://www.sitech-bitdriver.com

S.I. Tech

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Ad IndexFor free product literature, enter advertisers’ reader service num-bers at www.techbriefs.com/rs, or visit the Web site beneath theirad in this issue.

Reader ServiceCompany Number Page

ACCES I/O Products . . . . . . . . . . . . . . . . . .770 . . . . . . . . . . . .27

Advanced Torque Products LLC . . . . . . . .774 . . . . . . . . . . . .35

Aurora Bearing Co. . . . . . . . . . . . . . . . . . . .773 . . . . . . . . . . . .33

Boyd Coatings Research Co., Inc. . . . . . . .769 . . . . . . . . . . . .25

C.R. Onsrud, Inc. . . . . . . . . . . . . . . . . . . . . .763 . . . . . . . . . . . . .11

Coilcraft CPS . . . . . . . . . . . . . . . . . . . . . . . .758 . . . . . . . . . . . . .3

COMSOL, Inc. . . . . . . . . . . . . . . . . . . . .777, 782 . . . .43, COV IV

Cornell Dubilier . . . . . . . . . . . . . . . . . . . . . .760 . . . . . . . . . . . . .7

Crane Aerospace & Electronics . . . . . . . .757 . . . . . . . . . . . . .2

CST of America, Inc. . . . . . . . . . . . . . . . . . .781 . . . . . . . .COV III

Dawn VME Products . . . . . . . . . . . . . . . . . .767 . . . . . . . . . . . .21

Dexmet Corporation . . . . . . . . . . . . . . . . . .775 . . . . . . . . . . . .35

Evans Capacitor . . . . . . . . . . . . . . . . . . . . . .761 . . . . . . . . . . . . .8

Master Bond Inc. . . . . . . . . . . . . . . . . .772, 778 . . . . . . . .33, 43

Mini-Systems, Inc. . . . . . . . . . . . . . . . . . . . .771 . . . . . . . . . . . .30

Opto Diode Corporation . . . . . . . . . . . . . .766 . . . . . . . . . . . .19

Photon Engineering . . . . . . . . . . . . . . . . . .762 . . . . . . . . . . . . .9

Proto Labs, Inc. . . . . . . . . . . . . . . . . . . . . . .756 . . . . . . . . . . . . .1

Remcom . . . . . . . . . . . . . . . . . . . . . . . . . . . .779 . . . . . . . . . . . .43

S.I. Tech . . . . . . . . . . . . . . . . . . . . . . . . . . . .780 . . . . . . . . . . . .43

SME - AeroDef Manufacturing . . . . . . . . .764 . . . . . . . . . . . .13

Specialty Coating Systems, Inc. . . . . . . . .768 . . . . . . . . . . . .23

Tube Hollows International . . . . . . . . . . . .765 . . . . . . . . . . . .16

Ulbrich Stainless Steels & Special Metals, Inc. . . . . . . . . . . . . . . . . . . .776 . . . . . . . . . . . .37

VPT, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . .759 . . . . . . . . . . . . .5

W.L. Gore & Associates . . . . . . . . . . . . . . .755 . . . . . . . .COV II

Publisher . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Joseph T. PrambergerEditorial Director – TBMG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Linda L. BellEditorial Director – SAE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Kevin JostEditor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bruce A. BennettManaging Editor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Jean L. BrogeManaging Editor, Tech Briefs TV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Kendra SmithAssociate Editor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Billy HurleyAssociate Editor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ryan GehmProduction Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Adam SantiagoAssistant Production Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Kevin ColtrinariCreative Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Lois ErlacherSenior Designer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ayinde FrederickGlobal Field Sales Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Marcie L. HinemanMarketing Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Debora RothwellMarketing Communications Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Monica BondDigital Marketing Coordinator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Kaitlyn SommerAudience Development Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Marilyn SamuelsenAudience Development Coordinator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Stacey NelsonSubscription Changes/Cancellations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [email protected]

TECH BRIEFS MEDIA GROUP, AN SAE INTERNATIONAL COMPANY261 Fifth Avenue, Suite 1901, New York, NY 10016(212) 490-3999 FAX (646) 829-0800Chief Executive Officer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Domenic A. MucchettiExecutive Vice-President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Luke SchnirringTechnology Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Oliver RockwellSystems Administrator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Vlad GladounWeb Developer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Karina CarterDigital Media Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Peter BonavitaDigital Media Assistants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Keith McKellar, Peter Weiland, Anel GuerreroDigital Media Audience Coordinator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Jamil BarrettCredit/Collection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Felecia LaheyAccounting/Human Resources Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Sylvia BonillaOffice Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Alfredo VasquezReceptionist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Elizabeth Brache-Torres

ADVERTISING ACCOUNT EXECUTIVESMA, NH, ME, VT, RI, Eastern Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ed Marecki . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tatiana Marshall . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(401) 351-0274CT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Stan Greenfield . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(203) 938-2418

NJ, PA, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .John Murray . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (973) 409-4685Southeast, TX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ray Tompkins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(281) 313-1004NY, OH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ryan Beckman . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(973) 409-4687

MI, IN, WI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Chris Kennedy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(847) 498-4520 ext. 3008MN, ND, SD, IL, KY, MO, KS, IA, NE, Central Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bob Casey . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(847) 223-5225Northwest, N. Calif., Western Canada Craig Pitcher (408) 778-0300

CO, UT, MT, WY, ID, NM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tim Powers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(973) 409-4762S. Calif., AZ, NV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tom Boris . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (949) 715-7779S.

Europe — Central & Eastern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Sven Anacker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49-202-27169-11Europe — Western . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Chris Shaw . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44-1270-522130Hong Kong . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Mike Hay

852-2369-8788 ext. 11China . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Marco Chang . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86-21-6289-5533 ext.101Taiwan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Howard Lu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .886-4-2329-7318Integrated Media Consultants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Patrick Harvey . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (973) 409-4686 Angelo Danza (973) 874-0271 Scott Williams (973) 545-2464 Rick Rosenberg (973) 545-2565 Todd Holtz (973) 545-2566Corporate Accounts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Terri Stange . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (847) 304-8151Reprints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Jill Kaletha . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(866) 879-9144, x168

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